미국의 반도체 조립 및 패키징 장비 시장 규모, 점유율, 동향 분석 보고서 : 제품별, 최종 용도별, 부문 예측(2025-2033년)

U.S. Semiconductor Assembly And Packaging Equipment Market Summary

The U.S. semiconductor assembly and packaging equipment market size was estimated at USD 440.7 million in 2024 and is projected to reach USD 772.5 million by 2033, growing at a CAGR of 6.6% from 2025 to 2033. The growing adoption of advanced packaging solutions such as 2.5D/3D ICs, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) is significantly driving market demand in the U.S.

These technologies enhance performance, reduce form factor, and improve power efficiency vital for artificial intelligence (AI), IoT, and 5G applications. Strong federal backing through initiatives like the CHIPS and Science Act is catalyzing domestic semiconductor manufacturing and packaging infrastructure. Substantial funding incentives are encouraging companies to establish or expand advanced packaging facilities in the U.S. This support reduces reliance on overseas providers and enhances supply chain resilience. The push toward localized production is especially critical amid rising geopolitical tensions and global supply disruptions.

U.S. Semiconductor Assembly And Packaging Equipment Market Report Segmentation

This report forecasts revenue growth at the U.S. level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. semiconductor assembly and packaging equipment market report based on packaging type,end use, and product:

• Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
• Flip Chip Packaging Equipment
• Wafer Level Packaging (WLP) Equipment
• Fan-Out Packaging Equipment
• System-in-Package (SiP) Equipment
• 3D/2.5D Packaging Equipment
• Others
• End Use Outlook (Revenue, USD Million, 2021 - 2033)
• IDMs (Integrated Device Manufacturers)
• OSAT (Outsourced Semiconductor Assembly and Test)
• Product Outlook (Revenue, USD Million, 2021 - 2033)
• Dicing Equipment
  • Scriber
  • Dicer
  • Wafer Mounting Equipment
• Bonding Equipment
  • Die Bonder
  • Wire Bonder
  • Others
• Packaging Equipment
  • Molding Equipment
  • Solder Plating Equipment
  • Deflasher
  • Others
• Others

Table of Contents

Chapter 1. Methodology and Scope

• 1.1. Market Segmentation & Scope
• 1.2. Market Definition
• 1.3. Information Procurement
  • 1.3.1. Purchased Database
  • 1.3.2. GVR's Internal Database
  • 1.3.3. Secondary Sources & Third-Party Perspectives
  • 1.3.4. Primary Research
• 1.4. Information Analysis
  • 1.4.1. Data Analysis Models
• 1.5. Market Formulation & Data Visualization
• 1.6. Data Validation & Publishing

Chapter 2. Executive Summary

• 2.1. Market Snapshot
• 2.2. Segment Snapshot
• 2.3. Competitive Landscape Snapshot

Chapter 3. U.S. Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope

• 3.1. Market Concentration & Growth Prospect Mapping
• 3.2. Industry Value Chain Analysis
  • 3.2.1. Raw Material/Component Outlook
  • 3.2.2. Manufacturer Outlook
  • 3.2.3. Distribution Outlook
  • 3.2.4. End User Outlook
• 3.3. Regulatory Framework
• 3.4. Technology Overview
• 3.5. Market Dynamics
  • 3.5.1. Market Driver Analysis
  • 3.5.2. Market Restraint Analysis
  • 3.5.3. Market Challenges Analysis
  • 3.5.4. Market Opportunity Analysis
• 3.6. Economic Mega-Trend Analysis
• 3.7. Industry Analysis Tools
  • 3.7.1. Porter's Five Forces Analysis
  • 3.7.2. Macro-environmental Analysis

Chapter 4. U.S. Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis

• 4.1. End Use Movement Analysis & Market Share, 2024 & 2033
• 4.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
• 4.3. IDMs (Integrated Device Manufacturers)
  • 4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 4.4. OSAT (Outsourced Semiconductor Assembly and Test)
  • 4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. U.S. Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis

• 5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
• 5.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Distribution Channel, 2021 to 2033 (USD Million)
• 5.3. Flip Chip Packaging Equipment
  • 5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.4. Wafer Level Packaging (WLP) Equipment
  • 5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.5. Fan-Out Packaging Equipment
  • 5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.6. System-in-Package (SiP) Equipment
  • 5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.7. 3D/2.5D Packaging Equipment
  • 5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.8. Others
  • 5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. U.S. Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis

• 6.1. Product Movement Analysis & Market Share, 2024 & 2033
• 6.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
• 6.3. Dicing Equipment
  • 6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.3.2. Scriber
    • 6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.3.3. Dicer
    • 6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.3.4. Wafer Mounting Equipment
    • 6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.4. Bonding Equipment
  • 6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4.2. Die Bonder
    • 6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4.3. Wire Bonder
    • 6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4.4. Others
    • 6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.5. Packaging Equipment
  • 6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.2. Molding Equipment
    • 6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.3. Solder Plating Equipment
    • 6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.4. Deflasher
    • 6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5.5. Others
    • 6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.6. Others
  • 6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. U.S. Semiconductor Assembly and Packaging Equipment Market: Competitive Landscape

• 7.1. Recent Developments & Impact Analysis, By Key Market Participants
• 7.2. Company Categorization
• 7.3. Company Dashboard Analysis
• 7.4. Vendor Landscape
  • 7.4.1. List of Key Raw Material/Component Providers
  • 7.4.2. List of Key Manufacturers
  • 7.4.3. List of Key Distributors
• 7.5. Company Market Share Analysis, 2024
• 7.6. Company Positioning Analysis, 2024
• 7.7. Company Heat Map Analysis, 2024
• 7.8. Strategy Mapping
• 7.9. Company Profiles
  • 7.9.1. Applied Materials
    • 7.9.1.1. Participant's overview
    • 7.9.1.2. Financial performance
    • 7.9.1.3. Product benchmarking
    • 7.9.1.4. Recent developments
  • 7.9.2. ASM Pacific Technology
    • 7.9.2.1. Participant's overview
    • 7.9.2.2. Financial performance
    • 7.9.2.3. Product benchmarking
    • 7.9.2.4. Recent developments
  • 7.9.3. Besi
    • 7.9.3.1. Participant's overview
    • 7.9.3.2. Financial performance
    • 7.9.3.3. Product benchmarking
    • 7.9.3.4. Recent developments
  • 7.9.4. Disco Corporation
    • 7.9.4.1. Participant's overview
    • 7.9.4.2. Financial performance
    • 7.9.4.3. Product benchmarking
    • 7.9.4.4. Recent developments
  • 7.9.5. Kulicke & Soffa Industries, Inc. (K&S)
    • 7.9.5.1. Participant's overview
    • 7.9.5.2. Financial performance
    • 7.9.5.3. Product benchmarking
    • 7.9.5.4. Recent developments
  • 7.9.6. Lam Research Corporation
    • 7.9.6.1. Participant's overview
    • 7.9.6.2. Financial performance
    • 7.9.6.3. Product benchmarking
    • 7.9.6.4. Recent developments
  • 7.9.7. Nikon Corporation
    • 7.9.7.1. Participant's overview
    • 7.9.7.2. Financial performance
    • 7.9.7.3. Product benchmarking
    • 7.9.7.4. Recent developments
  • 7.9.8. Plasma-Therm
    • 7.9.8.1. Participant's overview
    • 7.9.8.2. Financial performance
    • 7.9.8.3. Product benchmarking
    • 7.9.8.4. Recent developments
  • 7.9.9. Rudolph Technologies, Inc.
    • 7.9.9.1. Participant's overview
    • 7.9.9.2. Financial performance
    • 7.9.9.3. Product benchmarking
    • 7.9.9.4. Recent developments
  • 7.9.10. SCREEN Semiconductor Solutions Co., Ltd.
    • 7.9.10.1. Participant's overview
    • 7.9.10.2. Financial performance
    • 7.9.10.3. Product benchmarking
    • 7.9.10.4. Recent developments