미국의 유기 기판 패키징 재료 시장 규모, 점유율, 동향 분석 보고서 : 기술별, 용도별, 부문별 예측(2025-2033년)

U.S. Organic Substrate Packaging Material Market Summary

The U.S. organic substrate packaging material market size was estimated at USD 2.16 billion in 2024 and is expected to reach USD 3.62 billion by 2033, growing at a CAGR of 5.9% from 2025 to 2033. Surging electronics and semiconductor applications, especially due to EVs, autonomous vehicles, data center chips, and e commerce packaging needs that favor sustainable substrates, thus driving the market growth.

One of the primary drivers of the organic substrate packaging material market is the growing demand for advanced semiconductor packaging technologies such as System-in-Package (SiP), Flip Chip, and Fan-Out Wafer Level Packaging (FOWLP). These advanced technologies demand high-performance substrates capable of supporting greater I/O densities, miniaturization, and faster signal transmission. Organic substrates-primarily composed of resin-coated copper, BT resin, and Ajinomoto Build-up Film (ABF) have emerged as a cost-effective and reliable solution for next-generation chipsets. For example, the growing deployment of 5G base stations and AI accelerators has led companies like Samsung and Intel to increasingly adopt organic substrates for multi-die packaging.

Furthermore, the rapid growth of consumer electronics and mobile devices, particularly in emerging markets, is driving the expansion of the organic substrate market. Devices such as smartphones, tablets, wearables, and smart home technologies are incorporating increasingly compact and complex integrated circuits, necessitating high-layer-count organic substrates. As Apple continues to integrate custom SoCs like the M-series chips and Android manufacturers focus on AI-enabled processors, the demand for compact, thermally resilient, and cost-efficient substrate materials continues to rise. These trends are compelling substrate manufacturers to expand production capacity and invest in advanced materials like ABF.

The automotive electronics sector also represents a major growth area, especially with the shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS). Automotive applications require substrates that are robust, thermally stable, and reliable-making organic substrates well-suited for use in Electronic Control Units (ECUs), battery management systems, and infotainment systems. Leading automotive OEMs and Tier-1 suppliers are increasingly collaborating with semiconductor packaging firms to obtain organic substrates designed for demanding environments. Companies such as Bosch and Continental are helping to propel demand by focusing on EV powertrain electronics and autonomous driving systems, thereby indirectly accelerating growth in the organic substrate market.

U.S. Organic Substrate Packaging Material Market Report Segmentation

This report forecasts revenue growth at the country level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. organic substrate packaging material market report based on technology, and application:

• Technology Outlook (Revenue, USD Million 2021 - 2033)
• SO packages
• GA packages
• Flat no-leads packages
• Others
• Application Outlook (Revenue, USD Million 2021 - 2033)
• Consumer Electronics
• Automotive
• Manufacturing
• Healthcare
• Others

Table of Contents

Chapter 1. Methodology and Scope

• 1.1. Research Methodology
  • 1.1.1. Market Segmentation
  • 1.1.2. Market Definition
• 1.2. Research Scope & Assumptions
• 1.3. Information Procurement
  • 1.3.1. Purchased Database
  • 1.3.2. GVR's Internal Database
  • 1.3.3. Secondary Sources & Third-Party Perspectives
  • 1.3.4. Primary Research
• 1.4. Information Analysis
  • 1.4.1. Data Analysis Models
• 1.5. Market Formulation & Data Visualization
• 1.6. Data Validation & Publishing
• 1.7. List of Abbreviations

Chapter 2. Executive Summary

• 2.1. Market Snapshot, 2024 (USD Million)
• 2.2. Segmental Snapshot
• 2.3. Competitive Landscape Snapshot

Chapter 3. U.S. Organic Substrate Packaging Material Market Variables, Trends, and Scope

• 3.1. Market Lineage Outlook
  • 3.1.1. Parent Market Outlook
  • 3.1.2. Relatable Market Outlook
• 3.2. Penetration & Growth Prospect Mapping
• 3.3. Industry Value Chain Analysis
• 3.4. Regulatory Framework
• 3.5. Market Dynamics
  • 3.5.1. Market Driver Analysis
  • 3.5.2. Market Restraint Analysis
  • 3.5.3. Market Opportunity Analysis
  • 3.5.4. Market Challenge Analysis
• 3.6. Business Environment Analysis
  • 3.6.1. Porter's Five Forces Analysis
  • 3.6.2. PESTEL Analysis

Chapter 4. U.S. Organic Substrate Packaging Material Market: Technology Estimates & Trend Analysis

• 4.1. Key Takeaways
• 4.2. Technology Movement Analysis & Market Share, 2024 & 2033
  • 4.2.1. SO packages
    • 4.2.1.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
  • 4.2.2. GA packages
    • 4.2.2.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
  • 4.2.3. Flat no-leads packages
    • 4.2.3.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
  • 4.2.4. Others
    • 4.2.4.1. Market estimates and forecasts, 2021 - 2033 (USD Million)

Chapter 5. U.S. Organic Substrate Packaging Material Market: Application Estimates & Trend Analysis

• 5.1. Key Takeaways
• 5.2. Application Movement Analysis & Market Share, 2024 & 2033
  • 5.2.1. Consumer Electronics
    • 5.2.1.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
  • 5.2.2. Automotive
    • 5.2.2.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
  • 5.2.3. Manufacturing
    • 5.2.3.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
  • 5.2.4. Healthcare
    • 5.2.4.1. Market estimates and forecasts, 2021 - 2033 (USD Million)
  • 5.2.5. Others
    • 5.2.5.1. Market estimates and forecasts, 2021 - 2033 (USD Million)

Chapter 6. Competitive Landscape

• 6.1. Key Players & Recent Developments & Their Impact on the Industry
• 6.2. Company Categorization
• 6.3. Company Market Position Analysis
• 6.4. Company Heat Map Analysis
• 6.5. Strategy Mapping
  • 6.5.1. Expansions
  • 6.5.2. Mergers & Acquisitions
  • 6.5.3. Collaborations
  • 6.5.4. New Application Launches
  • 6.5.5. Others

Chapter 7. Company Listing (Overview, Financial Performance, Applications Overview)

• 7.1. Amkor Technology Inc
• 7.2. Kyocera Corporation
• 7.3. Microchip Technology Inc.
• 7.4. Texas Instruments Incorporated
• 7.5. Simmtech Co., Ltd
• 7.6. Onto Innovation Inc.
• 7.7. LG Innotek Co.Ltd
• 7.8. AT&S
• 7.9. Daeduck Electronics Co.,Ltd