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중소 반도체 장비 제조업체의 틈새시장과 전략

Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies

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발행일 2021년 03월 상품 코드 122068
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중소 반도체 장비 제조업체의 틈새시장과 전략 Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies
발행일 : 2021년 03월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

중소 반도체 장비 제조업체의 동향과 전략에 대해 분석하여 300mm 웨이퍼 가공의 틈새 시장, SUB 300mm 웨이퍼 장비 틈새 시장 동향, 분야별 향후 전망과 과제 등에 대해 전해드립니다.

    제 1 장 서론
    제 2 장 300mm 웨이퍼 가공의 틈새시장
    • 서론
    • 웨이퍼 레벨 프로세싱
      • 서론
      • 플립칩(Flip Chip)/WLP 가공상의 과제와 동향
      • 리소그래피(Lithography)상의 과제와 동향
      • UBM 에치의 과제와 동향
      • 금속피복(Metallization)의 과제와 동향
      • 시장 분석
    • 3-D TSV
      • 중요과제와 검증
      • 비용 구조
      • 중요 가공기술
      • 주요 개발 분야별 평가
      • TSV 장비 예측
    • 비휘발성 메모리 MRAM, RRAM, FeRAM
      • MRAM 가공요건
      • RRAM 가공요건
      • FeRAM 가공요건
      • 상품화를 위한 로드맵
    • 초박형 웨이퍼(Ultrathin Wafers)
      • 초박형 웨이퍼의 응용
      • 기판 박막화
      • 기판 후면 금속피복 요건
      • 표면 스트레스 제거
      • 초박형 웨이퍼 시장
    제 3 장 SUB 300mm 웨이퍼 장치 틈새 시장
    • 서론
    • MEMS
      • 시장 인프라
      • 응용과 시장예측
      • 장치 및 재료 공급자 시장
    • 고휘도 LED (HG-LED)
      • 고휘도 LED 기술 및 응용의 최근 진전
      • 가공장치
      • 유기EL 제조
      • 세계의 유기EL 시장 전망
      • 세계의 고휘도 LED 시장 전망
    • 화합물 반도체
      • GaA 장치
      • 장치동향
      • 웨이퍼 사이즈
      • GaA IC 시장 예측
      • SiGe 와의 경쟁
    • HDD용 박막 리드(Thin Film Read)/기록헤드(Write Heads)
      • HDD 동향
      • 레코딩 헤드 시장 예측
      • 헤드 가공
      • 헤드 제조
      • CMP 과제
      • 리소그래피 과제
    • 벌크 초음파(Bulk Acoustic Wave : BAW)
      • 벌크 초음파 장치의 기본구성
      • AIN 레이어 품질요건
      • 벌크 초음파 및 FBAR 필터 장치 요건
      • 벌크 초음파 시장
    도표
cyj 10.07.07

List of Tables

  • 2.1 Common UBM Stacks For Solder And Gold Bumping
  • 2.2 Solder Bumping Guidelines
  • 2.3 ITRS Pin Counts For Different Applications
  • 2.4 Pillar-WLP CSP Guidelines
  • 2.5 Pad Redistribution Guidelines
  • 2.6 UBM Film Etchants
  • 2.7 Common UBM Stacks For Gold And Solder Bumping
  • 2.8 WLP Demand By Device (Units)
  • 2.9 WLP Demand By Device (Wafers)
  • 2.10 Forecast Of TSV Devices By Wafers
  • 3.1 MEMS Device Markets
  • 3.2 MEMS System Markets
  • 3.3 MEMS Equipment Markets
  • 3.4 Color, Wavelength Material Of LED
  • 3.5 Comparison of LED, HB-LED, UHB-LED Characteristics
  • 3.6 Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
  • 3.7 Process Control Metrics
  • 3.8 Production Method for Various LEDs
  • 3.9 GaAs IC Market Forecast
  • 3.10 Comparison Of Piezoelectric Materials For BAW Applications

List of Figures

  • 2.1 Solder Bumping Process 2-6
  • 2.2 Pillar-WLPCSP Process 2-13
  • 2.3 Pad Redistribution Process
  • 2.4 Via First (iTSV) Cost Of Ownership
  • 2.5 Via First (iTSV) Cost Of Ownership Front And Back Side
  • 2.6 Via First (iTSV) Process Flow
  • 2.7 iTSV Versus pTSV Cost Of Ownership
  • 2.8 Effect Of TSV Depth And Diameter On Cost
  • 2.9 Illustration Of Bosch Process
  • 2.10 Process And Equipment Flow For EMC3D Consortium Members
  • 2.11 Various TSV Integration Schemes
  • 2.12 Forecast OF TSV Devices By Wafers
  • 3.1 Operation of LED
  • 3.2 Market drivers for LED Biz and Applications
  • 3.3 SSL vs. Classical Technologies
  • 3.4 LED Performance vs. Traditional Light Sources
  • 3.5 Pareto Analysis Of SSL Manufacturing Costs
  • 3.6 Nanoimprint Lithography System
  • 3.7 Regular LED (white) Front-End Steps
  • 3.8 Schematic of AMOLED
  • 3.9 Active Matrix OLED Capacity and Demand Forecast
  • 3.10 LED Market by Sector
  • 3.11 Worldwide LED Market Forecast
  • 3.12 Schematic of GaAs MESFET
  • 3.13 Schematic of GaAs HEMT Device
  • 3.14 Schematic of GaAs HBT Device
  • 3.15 Schematic of GaAs HBT Device
  • 3.16 pHEMT MMIC Process Flow Chart
  • 3.17 0.15 Micron 3MI Process Cross Section
  • 3.18 InGaP HBT Process
  • 3.19 Worldwide SiGe Market Forecast
  • 3.20 Hard Disk Drive Roadmap
  • 3.21 Decrease In Average Price Of Storage
  • 3.22 Heads Per Drive
  • 3.23 Increase In Areal Density
  • 3.24 Market Forecast Of Recording Head Consumption
  • 3.25 Heads Per Drive Forecast
  • 3.26 Thin Film Head Structure
  • 3.27 Critical Features In Thin Film Head Structure
  • 3.28 Spin Valve Head Structure
  • 3.29 Cross-Sectional View TFH Stacks
  • 3.30 Cross-Sectional View Of A TFH Design
  • 3.31 CMP Slurry System For Tfh Wafer Polishing
  • 3.32 Critical Feature Trends In Thin Film Heads
  • 3.33 Application Space For Rf Filters
  • 3.34 FBAR Diagram
  • 3.35 BAW-SMR Diagram
  • 3.36 RF Front-End Filters In Mobile Devices

In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers.

The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

Table of Contents

Chapter 1 Introduction

Chapter 2 Niche Markets for PROCESSES for 300mm Wafers

  • 2.1 Introduction
  • 2.2 Wafer Level Processing (WLP)
    • 2.2.1 Introduction
    • 2.2.2 Flip Chip/WLP Processing Issues and Trends
      • Wafer Bumping
      • Wafer Level Packaging
      • Pad Redistribution
      • Wafer Bumping Costs
    • 2.2.3 Lithography Issues And Trends
    • 2.2.4 UBM Etch Issues And Trends
    • 2.2.5 Metallization Issues and Trends
      • Gold Bumping Metallization
      • Solder Bumping Metallization
    • 2.2.6 Analysis of WLP Market
  • 2.3 3-D TSV
    • 2.3.1 Insight Into Critical Issues
    • 2.3.2 Cost Structure
    • 2.3.3 Critical Processing Technologies
    • 2.3.4 Evaluation Of Critical Development Segments
    • 2.3.5 TSV Device Forecast
  • 2.4 Non-volatile Memory Devices MRAM, RRAM and FeRAM
    • 2.4.1 Processing Requirements for MRAMs
    • 2.4.2 Processing Requirements for RRAMs
    • 2.4.3 Processing Requirements for FeRAMs
    • 2.4.4 Roadmap for Commercialization
  • 2.5 Ultrathin Wafers
    • 2.5.1 Applications for Ultrathin Wafers
    • 2.5.2 Substrate Thinning
    • 2.5.3 Backside Metallization Requirements
    • 2.5.4 Surface Stress Relief
    • 2.5.5 Ultrathin Wafer Market

Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers

  • 3.1 Introduction
  • 3.2 MEMs
    • 3.2.1 The MEMS Market Infrastructure
    • 3.2.2 Forecast Of The Key Applications And Markets
      • MEMS Device Market Forecast
      • MEMS System Market Forecast
    • 3.2.3 Markets for Equipment and Materials Suppliers
  • 3.3 HB-LEDs
    • 3.3.1 Recent Progress in High Brightness LED Technology and Applications
    • 3.3.2 Processing Equipment
    • 3.3.3 Materials of Construction
    • 3.3.4 OLED Manufacturing
    • 3.3.5 Outlook for the Worldwide OLED Market
    • 3.3.6 Outlook for the Worldwide HB-LED Market
  • 3.4 Compound Semiconductors
    • 3.4.1 GaAs Devices
    • 3.4.2 Equipment Trends
    • 3.4.3 Wafer Sizes
    • 3.4.4 GaAs IC Market Forecast
    • 3.4.5 Competing Against SiGe
  • 3.5 Thin Film Read/Write Heads for HDD
    • 3.5.1 Trends in HDDs
    • 3.5.2 Recording Head Market Forecast
    • 3.5.3 Head Processing
    • 3.5.4 Head Fabrication - CMP, Deposition, Lithography
    • 3.5.5 CMP Challenges
    • 3.5.6 Lithography Challenges
  • 3.6 Bulk Acoustic Wave (BAW)
    • 3.6.1 Basic Elements of the BAW Device
    • 3.6.2 AlN Layer Quality Requirements
    • 3.6.3 Equipment Requirements for BAW and FBAR Filtering Devices
    • 3.6.4 Bulk Acoustic Wave (BAW) Market
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