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시장보고서
상품코드
1473282
Applied Materials : 서비스 대상 시장 경쟁 분석Applied Materials: Competitive Analysis of Served Markets |
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소개
Applied Materials는 경쟁이 치열한 반도체 제조 장비 업계에서 기술 리더십, 전략적 시장 포지셔닝, 최신 반도체 제조 과제에 대한 종합적인 접근 방식에 있어 독보적인 입지를 구축하고 있습니다. 반도체 산업이 노드 미세화 및 디바이스 아키텍처의 복잡성 증가에 따라 Applied Materials의 에칭, 증착, CMP, 계측 및 이온 주입 장비의 혁신은 차세대 전자 장치 구현에 필수적인 역할을 할 것입니다. Applied Materials는 끊임없는 혁신과 전략적 선견지명을 통해 반도체 기술과 제조의 미래를 개척하고, 각 시장에서 경쟁사들과 어깨를 나란히 하며 선도하고 있습니다.
에칭 및 증착 기술
Applied Materials는 반도체 소자 제조의 기반이 되는 에칭 및 증착 공정에 강점을 가지고 있습니다. 이 회사의 에칭 장비는 실리콘 기판의 나노 스케일 특성을 정의하는 데 중요한 플라즈마 공정을 정밀하게 제어합니다.
증착은 화학적 증착(CVD), 물리적 증착(PVD), 원자층 증착(ALD) 솔루션을 제공합니다. 이러한 기술은 반도체 소자의 다양한 박막 층을 형성하는 데 필수적이며, 정확성, 공정 효율성 및 진화하는 산업 요구 사항에 대한 적응성에 중점을 두고 있습니다.
CMP 장비
CMP(화학적 기계적 연마) 장비는 제조 공정 간 웨이퍼 표면의 평탄도를 보장하는 Applied Materials의 주력 분야이며, Applied Materials의 CMP 장비는 제조 워크플로우에 통합되어 처리량을 최적화하고 불량률을 감소시켜 반도체 산업의 목표에 부합합니다. 이는 제조 수율과 비용 효율성을 향상시켜 반도체 업계의 목표에 부합합니다.
측정 및 검사 장비
측정 및 검사 장비는 웨이퍼의 특성에 대한 중요한 데이터를 제공하여 공정 조정 및 결함을 조기에 발견할 수 있도록 돕습니다. 이러한 종류의 장비는 품질 관리에 필수적이며, 장치가 점점 더 복잡해짐에 따라 제조업체는 높은 수준의 제품 수율과 작업 효율을 유지할 수 있습니다.
이온 주입 장비
Applied Materials는 반도체 재료의 도핑에 필수적인 이온 주입 기술도 전문으로 하고 있습니다.
이 회사의 임플란터는 도펀트 종, 에너지, 도즈 양을 정밀하게 제어하여 반도체 디바이스에서 원하는 전기적 특성을 구현하는 데 필수적입니다.
이 보고서에 대하여
본 보고서는 세계 반도체 제조 장비 시장의 Applied Materials 실적 동향을 분석했으며, 전체적인 기술개발, 제조, 공급 동향(2012-2023년), 제품 종류별 시장 규모와 점유율, 주요 경쟁사의 전략, 제품, 실적 등의 정보를 정리하여 전해드립니다.
목차
제1장 소개
제2장 Applied Materials 전략
- 시장 전략
- 제조 장비 수요 촉진
- 국제적인 프레전스
- 고객 요구를 충족
- 신CEO의 전략
- 사업 전략
- Silicon Systems Group
- Applied Global Services
- 디스플레이
- 에너지·환경 솔루션
- 기술 전략
- 제품 전략
- 인수 전략
- 법적 전략
- 재무 분석
제3장 시장 예측
- 시장 성장 촉진요인
- 반도체 시장
- 기술 동향
- 경제 동향
- Applied Materials : 세계 시장 리더(2019년까지)
- 시장 규모와 시장 점유율
- 화학 증착
- 물리 증착
- 드라이 에칭
- 급속 열처리/산화/확산
- 실리콘 에피택시
- CMP(화학 기계 평탄화)
- 측정 및 검사
- 이온 주입
제4장 경쟁 환경
- 소개
- Lam Research
- Tokyo Electron Limited
- KLA
- ASM International
- Axcelis
- Canon Anelva
- Ebara
- Eugene Technology
- Hitachi High-Technologies
- Hitachi Kokusai Electric
- Jusung Engineering
- KC Tech
- Lasertec
- Nissin Ion Equipment
- NuFlare Technology
- Screen Semiconductor Solutions
- SEMES
- SEN
- TES
- Ulvac
- Wonik IPS
Introduction
In the competitive realm of semiconductor manufacturing equipment, Applied Materials stands out for its technological leadership, strategic market positioning, and comprehensive approach to addressing the challenges of modern semiconductor fabrication. As the industry moves towards smaller nodes and more complex device architectures, Applied Materials' innovations in etch, deposition, CMP, metrology, and ion implant equipment will continue to play a critical role in enabling the next generation of electronic devices. Through continuous innovation and strategic foresight, Applied Materials is not just competing but leading in the markets it serves, shaping the future of semiconductor technology and manufacturing.
Applied Materials' market leadership is supported by continuous innovation and a strategic approach to addressing semiconductor manufacturing challenges. The company's investment in research and development ensures its technologies meet current demands and anticipate future industry shifts.
As semiconductor fabrication evolves towards more advanced nodes and explores novel materials and architectures, Applied Materials is poised to play a central role. Its comprehensive technology portfolio, covering etch, deposition, CMP, metrology/inspection, and ion implant, positions the company as a key enabler of next-generation semiconductor devices.
Etch and Deposition Technologies
Applied Materials excels in etch and deposition processes, foundational to semiconductor device fabrication. The company's etch systems offer precise control over plasma processes, crucial for defining nanoscale features on silicon substrates. These systems enable the creation of intricate device structures required for current computing and memory applications.
In deposition, Applied Materials provides solutions across Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), and Atomic Layer Deposition (ALD). These technologies are critical for forming the various thin-film layers in semiconductor devices, with a focus on precision, process efficiency, and adaptability to evolving industry requirements.
CMP Systems
CMP equipment is another area of focus for Applied Materials, ensuring the planarity of wafer surfaces between fabrication steps. The company's CMP systems integrate with fabrication workflows, optimizing throughput and reducing defectivity. This contributes to improved manufacturing yields and cost efficiencies, aligning with the semiconductor industry's goals.
Metrology/Inspection Equipment
Metrology and inspection equipment from Applied Materials provides critical data on wafer properties, facilitating process adjustments and early defect identification. This category of equipment is vital for quality control, enabling manufacturers to uphold high standards of product yield and operational efficiency amid increasing device complexity.Ion Implant Equipment
Applied Materials also specializes in ion implantation technology, essential for doping semiconductor materials. The company's implanters deliver high precision in dopant species, energy, and dose control, critical for achieving desired electrical characteristics in semiconductor devices.
About This Report
This report addressed the Served Available Markets that Applied Materials competes. Namely:
- Chemical Vapor Deposition
- Physical Vapor Deposition
- Dry Etch
- Rapid Thermal Processing/Oxidation/Diffusion
- Silicon Epitaxy
- Chemical Mechanical Planarization
- Metrology and Inspection
- Ion Implantation
It presents forecasts for each sector and market shares for each equipment type between 2012 and 2023.
Table of Contents
Chapter 1. Introduction
Chapter 2. Applied's Strategies
- 2.1. Market Strategies
- 2.1.1. Driving Demand for Processing Equipment
- 2.1.2. A Global Presence
- 2.1.3. Meeting Customer Needs
- 2.1.4. New CEO's Strategy
- 2.2. Business Strategies 2.
- 2.2.1. Silicon Systems Group
- 2.2.2. Applied Global Services
- 2.2.3. Display
- 2.2.4. Energy and Environmental Solutions
- 2.3. Technology Strategies
- 2.4. Product Strategies
- 2.5. Acquisition Strategies
- 2.6. Legal Strategies
- 2.7. Financial Analysis
Chapter 3. Market Forecast
- 3.1. Market Drivers
- 3.1.1. Semiconductor Market
- 3.1.2. Technical Trends
- 3.1.3. Economic Trends
- 3.2. Applied Materials - Global Market Leader Until 2019
- 3.3. Market Size and Market Shares
- 3.3.1. Chemical Vapor Deposition
- 3.3.2. Physical Vapor Deposition
- 3.3.3. Dry Etch
- 3.3.4. Rapid Thermal Processing/Oxidation/Diffusion
- 3.3.5. Silicon Epitaxy
- 3.3.6. Chemical Mechanical Planarization
- 3.3.7. Metrology and Inspection
- 3.3.8. Ion Implantation
Chapter 4. Competitive Environment
- 4.1. Introduction
- 4.2. Lam Research
- 4.2.1. Strategies
- 4.2.2. Products
- 4.2.3. Financial Analysis
- 4.3. Tokyo Electron Limited
- 4.3.1. Strategies
- 4.3.2. Products
- 4.3.3. Financial Analysis
- 4.4. KLA
- 4.4.1. Strategies
- 4.4.2. Products
- 4.4.3. Financial Analysis
- 4.5. ASM International
- 4.5.1. Strategies
- 4.5.2. Products
- 4.5.3. Financial Analysis
- 4.6. Axcelis
- 4.6.1. Strategies
- 4.6.2. Products
- 4.6.3. Financial Analysis
- 4.7. Canon Anelva
- 4.7.1. Business Sectors Covered In The Market Analysis Chapter
- 4.7.2. Company Profile
- 4.7.3. Company Financials
- 4.8. Ebara
- 4.8.1. Business Sectors Covered In The Market Analysis Chapter
- 4.8.2. Company Profile
- 4.8.3. Company Financials
- 4.9. Eugene Technology
- 4.9.1. Business Sectors Covered In The Market Analysis Chapter
- 4.9.2. Company Profile
- 4.9.3. Company Financials
- 4.10. Hitachi High-Technologies
- 4.10.1. Business Sectors Covered In The Market Analysis Chapter
- 4.10.2. Company Profile
- 4.10.3. Company Financials
- 4.11. Hitachi Kokusai Electric
- 4.11.1. Business Sectors Covered In The Market Analysis Chapter
- 4.11.2. Company Profile
- 4.11.3. Company Financials
- 4.12. Jusung Engineering
- 4.12.1. Business Sectors Covered In The Market Analysis Chapter
- 4.12.2. Company Profile
- 4.12.3. Company Financials
- 4.13. KC Tech
- 4.13.1. Business Sectors Covered In The Market Analysis Chapter
- 4.13.2. Company Profile
- 4.13.3. Company Financials
- 4.14. Lasertec
- 4.14.1. Business Sectors Covered In The Market Analysis Chapter
- 4.14.2. Company Profile
- 4.14.3. Company Financials
- 4.15. Nissin Ion Equipment
- 4.15.1. Business Sectors Covered In The Market Analysis Chapter
- 4.15.2. Company Profile
- 4.15.3. Company Financials
- 4.16. NuFlare Technology
- 4.16.1. Business Sectors Covered In The Market Analysis Chapter
- 4.16.2. Company Profile
- 4.16.3. Company Financials
- 4.17. Screen Semiconductor Solutions
- 4.17.1. Business Sectors Covered In The Market Analysis Chapter
- 4.17.2. Company Profile
- 4.17.3. Company Financials
- 4.18. SEMES
- 4.18.1. Business Sectors Covered In The Market Analysis Chapter
- 4.18.2. Company Profile
- 4.18.3. Company Financials
- 4.19. SEN
- 4.19.1. Business Sectors Covered In The Market Analysis Chapter
- 4.19.2. Company Profile
- 4.19.3. Company Financials
- 4.20. TES
- 4.20.1. Business Sectors Covered In The Market Analysis Chapter
- 4.20.2. Company Profile
- 4.20.3. Company Financials
- 4.21. Ulvac
- 4.21.1. Business Sectors Covered In The Market Analysis Chapter
- 4.21.2. Company Profile
- 4.21.3. Company Financials
- 4.22. Wonik IPS
- 4.22.1. Business Sectors Covered In The Market Analysis Chapter
- 4.22.2. Company Profile
- 4.22.3. Company Financials
