CMP 장비 및 소모품 : 시장 분석 및 예측

Driving Forces

The Chemical Mechanical Planarization (CMP) market, encompassing both the equipment and slurry sectors, is currently experiencing a dynamic period of growth and innovation, driven by the escalating demands of the semiconductor industry. As the complexity of semiconductor devices continues to increase, with the push towards smaller nanometer processes and the integration of more functions per chip, the role of CMP in the manufacturing process has become more critical than ever. This precision material removal process is essential for ensuring the planarity of wafer surfaces between successive lithography and etching steps, a requirement that becomes increasingly challenging as device geometries shrink.

The CMP equipment market is witnessing significant technological advancements aimed at improving the efficiency, accuracy, and consistency of the planarization process. Manufacturers are focusing on developing equipment that can accommodate the increasing size of wafers and the need for finer control over material removal rates. This includes enhancements in pad conditioning techniques, head and carrier technologies, and the integration of more sophisticated endpoint detection systems to prevent over-polishing. The emphasis on automation and software integration is also prominent, with CMP equipment increasingly featuring advanced monitoring and adjustment capabilities to minimize human error and adapt to varying process conditions in real time.

Simultaneously, the CMP slurry market is evolving in tandem with equipment advancements to meet the stringent requirements of new materials and complex structures found in advanced semiconductor devices. Slurry formulations are becoming more diverse and specialized, tailored to specific material removal needs, such as copper, tungsten, or dielectric materials.

The development of slurry involves a delicate balance between abrasive particle size, concentration, and chemical additives to achieve the desired removal rate and surface finish, while minimizing defectivity. Environmental considerations are also coming to the forefront, with a push towards developing more eco-friendly slurry compositions that reduce waste and are safer for workers.

Market growth is being fueled by the burgeoning demand for consumer electronics, highperformance computing platforms, and data storage solutions, all of which require advanced semiconductor chips. Additionally, the automotive sector's increasing reliance on electronic components for electric vehicles and driver assistance systems is contributing to the expansion of the CMP market. The rise of 5G technology and the Internet of Things (IoT) further compounds the demand for semiconductors, indirectly driving the need for more efficient and capable CMP processes.

However, the CMP market faces challenges, including the high cost of equipment and materials, the need for continual innovation to keep pace with semiconductor evolution, and the management of supply chain complexities. The global nature of the semiconductor industry also exposes the CMP market to geopolitical tensions and trade disputes, which can impact material sourcing, manufacturing, and sales.

In conclusion, the CMP equipment and slurry market is at a critical juncture, with opportunities and challenges in equal measure. As the semiconductor industry continues to push the boundaries of technology, the importance of CMP in manufacturing advanced devices will only grow. The market's ability to adapt to rapid technological changes, along with its capacity to innovate in both equipment and consumables, will be key factors in meeting the future demands of the semiconductor manufacturing process.

About This Report

This 225-page report provides an overview of the current market size and growth trajectory for CMP equipment and slurry markets. Include historical data, forecasts, and factors driving market expansion or contraction.

It discusses the latest trends shaping the CMP equipment and slurry markets, such as advancements in semiconductor technology, materials diversity, environmental sustainability, automation, and global market expansion.

Key Players operating in the CMP equipment and slurry markets and analyzed and forecast, along with their market share, key product offerings, and competitive strategies. Slurry markets are analyzed by slurry type and slurry supplier:

Oxide slurry

• ILD Slurry
• STI Slurry,

W Slurry

Copper slurry

• Cu Barrier Slurry
• Cu Slurry Step 1

This report identifies key challenges facing the CMP equipment and slurry markets, such as rising production costs, technological barriers, geopolitical tensions, and competitive pressures. It provides insights into the future outlook for CMP equipment and slurry markets, including anticipated growth opportunities, emerging technologies, potential disruptors, and strategic recommendations for stakeholders.

Table of Contents

Chapter 1. Introduction

Chapter 2. Executive Summary

• 2.1. Introduction
• 2.2. Market Opportunities

Chapter 3. Planarization Methods

• 3.1. Need for Planarity
  • 3.1.1. Lithography
  • 3.1.2. Deposition
  • 3.1.3. Etching
• 3.2. Applications
  • 3.2.1. Dielectrics
  • 3.2.2. Metals
• 3.3. Planarization Techniques
  • 3.3.1. Local Planarization
    • 3.3.1.1. Deposition-Etchback
    • 3.3.1.2. ECR
    • 3.3.1.3. Oxide Reflow
    • 3.3.1.4. Spin-on-Glass
    • 3.3.1.5. TEOS-Ozone
    • 3.3.1.6. Laser
  • 3.3.2. Global Planarization
    • 3.3.2.1. Spin-On Polymer
    • 3.3.2.2. Polyimide Coating
    • 3.3.2.3. Isotropic Etch
    • 3.3.2.4. Spin Etch Planarization
    • 3.3.2.5. Electropolishing
• 3.4. CMP
  • 3.4.1. Background
  • 3.4.2. Research Efforts
  • 3.4.3. Advantages and Disadvantages
  • 3.4.4. Process Parameters
    • 3.4.4.1. STI Planarization
    • 3.4.4.2. Copper CMP
    • 3.4.4.3. Low-K Integration
    • 3.4.4.4. Defect Density
    • 3.4.4.5. Metrology
  • 3.4.5. Device Processing Parameters
    • 3.4.5.1. Memory Devices
    • 3.4.5.2. Logic Devices

Chapter 4. CMP Consumables

• 4.1. Slurries
  • 4.1.1. Types
  • 4.1.2. pH Effects
  • 4.1.3. Oxidizers
  • 4.1.4. Particle Morphology Effects
  • 4.1.5. Chemical Distribution Management
  • 4.1.6. Slurry Supplier Profiles
  • 4.1.7. Abrasive Suppliers
• 4.2. Post-CMP Clean
• 4.3. Polishing Pads
  • 4.3.1. Types
  • 4.3.2. Performance
  • 4.3.3. Slurryless Pads

Chapter 5. CMP Equipment

• 5.1. Single-Head Approach
  • 5.1.1. Advantages
  • 5.1.2. Disadvantages
• 5.2. Multi-Head Approach
  • 5.2.1. Advantages
  • 5.2.2. Disadvantages
• 5.3. Equipment Profiles
  • 5.3.1. Applied Materials
  • 5.3.2. Ebara
  • 5.3.3. Strasbaugh
  • 5.3.4. Novellus
  • 5.3.5. Nikon
  • 5.3.6. Doosan Mecatec
  • 5.3.7. Other Entrants
• 5.4. Clustered Tools
• 5.5. Competitive Non-CMP Tools

Chapter 6. User Issues

• 6.1. Cost of Ownership
• 6.2. User Requirements
• 6.3. Benchmarking a Vendor
  • 6.3.1. Pricing
  • 6.3.2. Vendor Commitment and Attitudes
  • 6.3.3. Vendor Capabilities
  • 6.3.4. System Capabilities
• 6.4. User-Supplier Synergy
  • 6.4.1. Feedback During Equipment Evaluation
  • 6.4.2. Feedback During Device Production
• 6.5. Reliability
• 6.6. Equipment Maintainability

Chapter 7. Market Forecast

• 7.1. Introduction
• 7.2. Market Forecast Assumptions
• 7.3. Equipment Market
  • 7.3.1. Introduction
  • 7.3.2. CMP Polisher Market
• 7.4. Consumable Market
  • 7.4.1. Slurry
  • 7.4.2. Pads