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세계의 MEMS 디바이스 및 재료 시장 : 벤더 및 파운드리를 위한 예측 및 전략

The Global MEMs Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries

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발행일 2021년 03월 상품 코드 75586
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세계의 MEMS 디바이스 및 재료 시장 : 벤더 및 파운드리를 위한 예측 및 전략 The Global MEMs Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries
발행일 : 2021년 03월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

세계의 MEMS 디바이스 및 재료 시장에 대해 간략히 설명하고, 공급사 동향, 파운드리의 성공 요인, 팹리스 기업의 기회, 시장 과제 등을 전해드립니다.

    제1장 서론
    제2장 주요 용도 및 시장 예측
    • MEMS 디바이스 시장 예측
      • 잉크젯 헤드
      • 압력 센서
      • 실리콘 마이크로폰
      • 가속도계
      • 자이로스코프
      • MOEMS
      • 마이크로디스플레이
      • 마이크로 유체
      • RF MEMS
      • 마이크로 연료전지
      • 새로운 용도
    • MEMS 시스템 시장 예측
    제3장 디바이스 및 재료 공급사 시장
    • 서론
    • MEMS 설비 시장
      • 조립
      • 접착
      • 세정
      • 증착
      • 다이싱
      • 에칭
      • 레이저 미세가공
      • 리소그래프
      • 검사
      • 시험
      • 열처리
      • 웨이퍼 가공
    • MEMS 재료 시장
      • 화학물질
      • 포토마스크
      • 기판
    제4장 MEMS 파운드리
    • 파운드리 프로파일 및 전략
    • 세분화
    제5장 파운드리 성공 요인
    제6장 MEMS에 관한 중요 사항
    • 3D 인터커넥트 및 패키징
    • 웨이퍼 사이즈
    • MEMS 시험
    • 팹리스 기업의 기회
    도표
LSH 08.12.17

List Of Tables

  • 4.1. Top MEMS Foundries by Revenues

List of Figures

  • 2.1. MEMS Markets
  • 2.2. Ink Jet Head Sales Forecast
  • 2.3. Pressure Sensor Sales Forecast
  • 2.4. Silicon Microphone Sales Forecast
  • 2.5. Accelerometer Sales Forecast
  • 2.6. Gyroscope Sales Forecast
  • 2.7. Micro Display Sales Forecast
  • 2.8. Other MOEMS Sales Forecast
  • 2.9. Microfluidics Sales Forecast
  • 2.10. RF MEMS Sales Forecast
  • 2.11. Digital Compass Sales Forecast
  • 2.12. Inertial Sensor Sales Forecast
  • 2.131. Emerging Applications Sales Forecast
  • 2.12. Automotive System Sales Forecast
  • 2.15. Aeronautics System Sales Forecast
  • 2.16. Consumer System Sales Forecast
  • 2.17. Defense System Sales Forecast
  • 2.18. Industrial System Sales Forecast
  • 2.19. Medical System Sales Forecast
  • 2.20. Telecom System Sales Forecast
  • 3.1. Discrete Assembly of MEMS
  • 3.2. Assembly Equipment Sales Forecast
  • 3.3. Bonding Equipment Sales Forecast
  • 3.4. Cleaning Equipment Sales Forecast
  • 3.5. Deposition Equipment Sales Forecast
  • 3.6. Dicing Equipment Sales Forecast
  • 3.7. Schematic Of DRIE
  • 3.8. Etching Equipment Sales Forecast
  • 3.9. Laser Micromachining Equipment Sales Forecast
  • 3.10. Driving Principle Of The MOR (a) Parallel State (B) Tilted State
  • 3.11. Lithography Equipment Sales Forecast
  • 3.12. Metrology/Inspection Equipment Sales Forecast
  • 3.13. Testing Equipment Sales Forecast
  • 3.14. Thermal Treatment Equipment Sales Forecast
  • 3.15. Wafer Thinning Equipment Sales Forecast
  • 3.16. Chemicals Sales Forecast
  • 3.17. Photomasks Sales Forecast
  • 3.18. Substrates Sales Forecast
  • 3.19. Wafer Starts By Substrate Size
  • 6-1. Process For Capping MEMS
  • 6-2. Examples Of Thermoplastic Cavity Packages
  • 6.3. Fluidic Packaging System
  • 6.4. Forecast of Wafer Size
  • 6-5. Fluidic Packaging System

This vision of MEMS whereby microsensors, microactuators and microelectronics and other technologies, can be integrated onto a single microchip is expected to be one of the most important technological breakthroughs of the future. A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography.

This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

Table of Contents

Chapter 1: The MEMS Market Infrastructure

Chapter 2: Forecast Of The Key Applications And Markets

  • 2.1. MEMS Device Market Forecast
    • 2.1.1. Ink Jet Head
    • 2.1.2. Pressure Sensor
    • 2.1.3. Silicon Microphone
    • 2.1.4. Accelerometer
    • 2.1.5. Gyroscope
    • 2.1.6. Micro Display
    • 2.1.7. Other MOEMS
    • 2.1.8. Microfluidics
    • 2.1.9. RF MEMS
    • 2.1.10. Digital Compass
    • 2.1.11. Inertial Sensor
    • 2.1.12. Emerging Applications
  • 2.2. MEMS System Market Forecast
    • 2.2.1. Automotive Systems
    • 2.2.2. Aeronautics Systems
    • 2.2.3. Consumer Systems
    • 2.2.4. Defense Systems
    • 2.2.5. Industrial Systems
    • 2.2.6. Medical/Life Sciences Systems
    • 2.2.7. Telecom Systems

Chapter 3: Markets for Equipment and Materials Suppliers

  • 3.1. Introduction
  • 3.2. MEMS Equipment Markets
    • 3.2.1. Assembly
    • 3.2.2. Bonding
    • 3.2.3. Cleaning
    • 3.2.4. Deposition
    • 3.2.5. Dicing
    • 3.2.6. Etching
    • 3.2.7. Laser Micromachining
    • 3.2.8. Lithography
    • 3.2.9. Metrology/Inspection
    • 3.2.10. Testing
    • 3.2.11. Thermal Treatment
    • 3.2.12. Wafer Thinning
  • 3.3. MEMS Material Markets
    • 3.3.1. Chemicals
    • 3.3.2. Photomasks
    • 3.3.3. Substrates

Chapter 4: MEMS Foundries

  • 4.1. Foundry Profiles and Strategies
    • 4.1.1. Advanced Microsensors
    • 4.1.2. Agiltron
    • 4.1.3. Asia Pacific Microsystems
    • 4.1.4. Beijing First MEMS
    • 4.1.5. Bosch
    • 4.1.6. China Resources Semiconductor
    • 4.1.7. Colibrys
    • 4.1.8. C2V
    • 4.1.9. Dai-Nippon Printing
    • 4.1.10. Dalso
    • 4.1.11. Freescale
    • 4.1.12. GLOBALFOUNDRIES
    • 4.1.13. Honeywell MEMSplus
    • 4.1.14. Infineon Technologies SensoNor As
    • 4.1.15. Institute of Microelectronics
    • 4.1.16. Innovative Micro Tech
    • 4.1.17. Integrated Sensing Systems Inc. (ISSYS)
    • 4.1.18. LioniX
    • 4.1.19. MEMS Engineering and Material
    • 4.1.20. MEMSCAP
    • 4.1.21. Micralayne
    • 4.1.22. Micrel
    • 4.1.23. Midwest MicroDevices, LLC
    • 4.1.24. Nanostructures Inc
    • 4.1.25. Norcada Inc.
    • 4.1.26. Olympus
    • 4.1.27. Omron
    • 4.1.28. Proton Mikrotechnik
    • 4.1.29. Semiconductor Manufacturing International Corporation
    • 4.1.30. SEMEFAB
    • 4.1.31. Silex Microsystems
    • 4.1.32. Sony
    • 4.1.33. ST Microelectronics
    • 4.1.34. Taiwan Semiconductor Manufacturing Co Ltd (TSMC)
    • 4.1.35. Texas Instruments
    • 4.1.36. Touch Microsystems
    • 4.1.37. Tronics Microsystems
    • 4.1.38. X-Fab
  • 4.2. Small-Mid-Sized Companies

Chapter 5: Factors for Foundry Success

  • 5.1.1. Achieving Economies Of Scale
  • 5.1.2. Competitive Advantages
  • 5.1.3. Core Strengths
  • 5.1.4. Employee Commitment
  • 5.1.5. Expansion Plans
  • 5.1.6. Financial Objectives:
  • 5.1.7. Groundbreaking MEMS Solutions
  • 5.1.8. In- House Expertise in MEMS Testing And Reliability
  • 5.1.9. Leadership in Technology
  • 5.1.10. Manufacturing Excellence
  • 5.1.11. Manufacturing Process
  • 5.1.12. Mastering Process and Production Technology
  • 5.1.13. Patent Protection
  • 5.1.14. Partnerships
  • 5.1.15. Products
  • 5.1.16. Proprietary Development Processes
  • 5.1.17. Sales Organization
  • 5.1.18. Sales Process and Customer Base
  • 5.1.19. Strong Customer Relations
  • 5.1.20. Vision and Goal

Chapter 6: Critical MEMS Issues

  • 6.1. 3-D Interconnects and Packaging
  • 6.2. Wafer Size
  • 6.3. MEMS Testing
  • 6.4. Opportunities For Fabless MEMS Companies
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