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IC 최신 동향 : 인공지능(AI), 5G, CMOS 영상 센서(CIS) 및 메모리 칩 시장 분석

Hot ICs: A Market Analysis of AI, 5G, CMOS Image Sensors, and Memory Chips

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발행일 2021년 03월 상품 코드 805202
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IC 최신 동향 : 인공지능(AI), 5G, CMOS 영상 센서(CIS) 및 메모리 칩 시장 분석 Hot ICs: A Market Analysis of AI, 5G, CMOS Image Sensors, and Memory Chips
발행일 : 2021년 03월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

인공지능(AI), 5G, CMOS 영상 센서(CIS) 및 메모리 칩(DRAM, NAND, NVM) 등 IC를 사용하는 각 기술 시장과 그 용도에 대해 분석했으며, 시장 예측, 시장 점유율 및 IC 제조업체 개요 등을 제공합니다.

제1장 주요 요약

제2장 CMOS 영상 센서(CIS)

  • CMOS 센서 기술과 동향
  • 용도
    • 자동차/첨단 운전자 보조 시스템(ADAS)
    • 스마트폰
    • 기타
  • 시장 분석
    • 서론
    • 자동차
    • 스마트폰
    • 기타
  • CMOS 영상 센서 공급업체의 제품과 개요
    • Canon
    • Galaxycore
    • Hanamatsu
    • LG Electronics
    • Newsight Imaging
    • ON Semiconductor
    • Omnivision
    • Pixelplus
    • Samsung Electronics
    • SK Hynix
    • Sony
    • TowerJazz Panasonic

제3장 5G

  • 5G 칩 기술과 동향
  • 용도
    • 모바일 단말기
    • 학제간 교류(Interdisciplinary Connections)
  • 시장 분석
    • 시장 예측
    • 중국의 모바일 캐리어
    • 일본의 모바일 캐리어
    • 미국의 모바일 캐리어
  • 5G 칩 공급업체의 제품과 개요
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • On Semiconductor
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconduc

제4장 인공지능(AI)

  • 인공지능(AI) 기술과 동향
    • 클라우드 AI 컴퓨팅
    • 엣지 AI 컴퓨팅
  • 용도
    • AI의 산업 용도
    • AI 탑재 디바이스
  • 시장 분석
    • 서론
    • 중국의 AI 계획
    • AI 칩 매출 예측
  • AI 칩 기술
    • Graphics Processing Unit(GPU)
    • Field Programmable Gate Array(FPGA)
    • Application Specific Integrated Circuits(ASIC)
    • 뉴로모픽 칩
  • AI 칩 공급업체의 제품과 개요
    • IC 벤더
    • 클라우드 프로바이더 : 기술 리더
    • IP 벤더
    • 세계의 스타트업
    • 중국의 스타트업

제5장 메모리 칩

  • 메모리 칩 기술과 동향
    • DRAM
    • NAND
    • NVRAM - MRAM, RRAM 및 FERAM
  • 용도
    • DRAM
    • NAND
  • 시장 분석
  • 메모리 칩 공급업체의 제품과 개요
    • Fujian
    • Innotron
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip
    • Samsung Electronics
    • SK Hynix
    • Toshiba
    • Western Digital
    • Winbond
    • YMTC
KSM 19.03.25

LIST OF FIGURES

  • 2.1. Five Levels of Autonomous Driving
  • 2.2. Average Semiconductor Content Per Car by Level of Automation
  • 2.3.. Automotive Imaging Segments
  • 2.4. Market Shares of CMOS Image Sensor Manufacturers
  • 2.5. Semiconductor Market Forecast for ADAS
  • 2.6. IC Content Used in ADAS Systems - 2015
  • 2.7. Market Shares of Automotive CMOS Image Sensor Manufacturers
  • 2.8. CMOS Image Sensor Market Forecast For Smartphones
  • 2.9. CMOS Image Sensor Market Forecast For Other Applications
  • 3.1. RF Chip Market Forecast by Network Generation
  • 4.1. Performance Comparison of TPU, GPU, and CUP
  • 4.2. AI Training and Inference
  • 4.3. AI Training and Inference Chip Forecast - Revenue
  • 4.4. AI Training and Inference Chip Forecast by Type - Units
  • 5.1. DRAM Scaling
  • 5.2. DRAM Memory Shrink Roadmap
  • 5.3. Quadruple Patterning Technology
  • 5.4. Ultra-Thin Dielectric Layer Deposition
  • 5.5. Proprietary Circuit Design Technology
  • 5.6. 3D-NAND Memory Shrink Roadmap
  • 5.7. 3D-NAND Generation by Manufacturer
  • 5.8. Transition from SLC to QLC NAND
  • 5.9. Comparison Of Non-Volatile Ram Write Times
  • 5.10. Competition In Dissipation Speed And Memory Capacity
  • 5.11. Comparison Of Non-Volatile RAM Technology
  • 5.12. Total Available Market for SST MRAM
  • 5.13. Total Available Market for Toggle MRAM

LIST OF TABLES

  • 2.1. Levels of Autonomous Driving
  • 2.2. Market Forecast of CMOS Image Sensors by Application
  • 2.3. Aotomotive Image Sensor Market by Application
  • 2.4. Forecast of ADAS Market by Systems
  • 3.1. Feature Comparison of Smartphone Power Amplifiers by Generations
  • 3.2. Smartphone Subscription Forecast by Geographic Region
  • 3.3. Smartphone Subscription Forecast by Technology
  • 3.4. 5G Smartphone Subscription Forecast by Geographic Region
  • 3.5. 5G Smartphone Plans by Geographic Region
  • 3.6. 5G Smartphone Mobile Semiconductor Forecast
  • 3.7. 5G Semiconductor Total Available Market Forecast. 3.
  • 3.8. 5G Smartphone Shipment By Major OEMs
  • 3.9. 5G Smartphone Shipment By Country
  • 3.10. Incremental Cost For 5G Phone Vs 4G
  • 3.11. Top Wireless Carriers
  • 4.1. Smart Speaker Products
  • 4.2. AI Training and Inference Chip Forecast
  • 4.3. AI Chip Forecast by Chip Type
  • 4.4. Characteristics of CPU, FPGA, CPU, and ASIC
  • 4.5. Characteristics of CPU, FPGA, CPU, and ASIC
  • 5.1. DRAM Bit Growth Supply Forecast by Company
  • 5.2. DRAM Bit Growth Demand Forecast by Application
  • 5.3. DRAM Wafer Capacity Forecast by Fab - Wafers
  • 5.4. DRAM Market Shares
  • 5.5. DRAM Capex Forecast by Company
  • 5.6. NAND Bit Growth Supply Forecast by Company
  • 5.7. NAND Bit Growth Demand Forecast by Application
  • 5.8. NAND Wafer Capacity by Company Fab
  • 5.9. 3D NAND Wafer Capacity Forecast by Fab
  • 5.10. NAND Capex Forecast by Company
  • 5.11. DRAM Content of Chinese Smartphones
  • 5.12. NAND Content of Chinese Smartphones

Not only are these ICs the "hottest" part of the highest growing technology sectors, they are, in fact, interrelated.

Advanced driver-assistance systems (ADAS) are ubiquitous in autonomous vehicles. ADAS uses CMOS Integrated Sensors, memory, processing, and networking to detect road conditions and provide feedback to drivers-and in some cases to drive the vehicle off the road if there are unsafe conditions.

Besides powering ADAS and autonomous vehicles, AI is also a key enabler of voice recognition technologies, smart cities, and the Internet of Things (IoT). AI alongside the development of greater universal connectivity will enable new services that can benefit consumers in many ways.

Real-world fleets of autonomous vehicles are now ready for commercial deployment and many auto companies already provide some level of autonomous vehicle technology in their latest models. It is likely that on the show floor and in conference presentations we will see new uses for these AI-driven vehicles. We'll also see how possible problems are being tackled before the technology moves more into the consumer space.

The growth in mobile and personal devices, and their need for energy-efficient electronics, will lead to new ways to store information for immediate processing as well as long-term storage. The report details storage and memory products including those using traditional (NAND and DRAM) memories and emerging memories, such as phase change memory (PCM), magnetic random access memory (MRAM) or resistive random access memory. With the end of Moore's-law computer-lithography scaling, there is also a move to more specialized processing capability, tied to particular applications.

This report examines in detail Artificial Intelligence (AI), 5G, CMOS Image Sensor, and Memory Chips (DRAM, NAND, NVM). Markets for the ICs and their applications are forecast to 2025, and market shares given in each sector.

Table of Contents

1.0. Executive Summary

2.0. CMOS Image Sensors (CIS)

  • 2.1. CMOS Sensors Technology and Trends
  • 2.2. Applications
    • 2.2.1. Automotive/Advanced Driver Assistance Systems (ADAS)
    • 2.2.2. Smartphones
    • 2.2.3. Others
  • 2.3. Market Analysis
    • 2.3.1. Introduction
    • 2.3.2. Automotive
    • 2.3.3. Smartphones
    • 2.3.4. Others
  • 2.4. CMOS Image Sensor Supplier Products and Profiles
    • Canon
    • Galaxycore
    • Hanamatsu
    • LG Electronics
    • Newsight Imaging
    • ON Semiconductor
    • Omnivision
    • Pixelplus
    • Samsung Electronics
    • SK Hynix
    • Sharp
    • Sony
    • TowerJazz Panasonic

3.0. 5G

  • 3.1. 5G Chip Technology and Trends
  • 3.2. Applications
    • 3.2.1. Mobile Handsets
    • 3.2.2. Interdisciplinary Connections
  • 3.3. Market Analysis
    • 3.3.1. Market Forecasts
    • 3.3.2. New Components For 5G vs 4G
      • 3.3.2.1 5G Modem Chip Overview
      • 3.3.3.2 5G Chip
      • 3.3.2.3 mmWave Modules
      • 3.3.2.4 Traditional MIMO Antennas
    • 3.3.3. China Mobile Carriers
    • 3.3.4. Japan Mobile Carriers
    • 3.3.5. U.S. Mobile Carriers
  • 3.4. 5G Chip Supplier Products and Profiles
    • Analog Devices
    • Anokiware
    • Apple
    • Broadcom
    • Huawei
    • Infineon
    • Intel
    • Inphi
    • Microchip
    • MediaTek
    • Marvell
    • M/A-Com
    • NXP Semiconductor
    • On Semiconductor
    • Qualcomm
    • Qorvo
    • Samsung Electronics
    • Sivers IMA
    • Skyworks Solutions
    • STMicroelectronics
    • Teradyne
    • Texas Instruments
    • Win Semiconductors
    • Xilinx

4.0. Artificial Intelligence (AI)

  • 4.1. AI Technology and Trends
    • 4.1.1. Cloud AI Computing
    • 4.1.2. Edge AI Computing
  • 4.2. Applications
    • 4.2.1. Industry Applications of AI
      • 4.2.1.1 Smart Healthcare
      • 4.2.1.2 Smart Security
      • 4.2.1.3 Smart Finance
      • 4.2.1.4 Smart Grid
      • 4.2.1.5 Smart Hone
    • 4.2.2. AI-Powered Devices
      • 4.2.2.1 Smart Speakers
      • 4.2.1.2 Drones
      • 4.2.1.3 Intelligent Robots
  • 4.3. Market Analysis
    • 4.3.1. Introduction
    • 4.3.2. China's AI Plan
      • 4.3.2.1 Driverless Vehicles
      • 4.3.2.2 Computer Chips
      • 4.3.2.3 Financial
      • 4.3.2.4 Facial Recognition
      • 4.3.2.5 Retail
      • 4.3.2.6 Robots
    • 4.3.3. AI Chip Revenue Forecast
  • 4.4. AI Chip Technology
    • 4.4.1. Graphics Processing Unit (GPU)
    • 4.4.2. Field Programmable Gate Array (FPGA)
    • 4.4.3. Application Specific Integrated Circuits (ASIC)
    • 4.4.4. Neuromorphic Chips
  • 4.5. AI Chip Supplier Products and Profiles
    • 4.5.1. IC Vendors
      • AMD
      • HiSilicon
      • IBM
      • Intel
      • MediaTek
      • Nvidia
      • NXP
      • Qualcomm
      • Rockchip
      • Samsung Electronics
      • STMicroelectronics
      • Xilinx
    • 4.5.2. Cloud Providers - Tech Leaders
      • Alibaba
      • Alibaba Cloud
      • Amazon
      • Apple
      • Baidu
      • Facebook
      • Fujitsu
      • Google
      • Huawei Cloud
      • Microsoft
      • Nokia
      • Tencent Cloud
      • Tesla
    • 4.5.3. IP Vendors
      • ARM
      • CEVA
      • Imagination
      • VeriSilicon
      • Videantis
    • 4.5.4. Startups Worldwide
      • Adapteva
      • aiCTX
      • AImotive
      • AlphaICs
      • BrainChip
      • Cerebras Systems
      • Cornami
      • DeepScale
      • Esperanto Technologies
      • Graphcore
      • GreenWaves Technology
      • KAIST
      • Kalray
      • Kneron
      • Knowm
      • Koniku
      • Mythic
      • SambaNova Systems
      • Videantis
      • Wave Computing
    • 4.5.5. Startups in China
      • AISpeech
      • Bitmain
      • Cambricon
      • Chipintelli
      • DeePhi Tech
      • Horizon Robotics
      • NextVPU
      • Rokid
      • Thinkforce
      • Unisound

5.0. Memory Chips

  • 5.1. Memory Technology and Trends
    • 5.1.1. DRAM
    • 5.1.2. NAND
    • 5.1.3. NVRAM - MRAM, RRAM, and FERAM
  • 5.2. Applications
    • 5.2.1. DRAM
      • 5.2.1.1 Server
      • 5.2.1.2 PC
      • 5.2.1.3 Graphics
      • 5.2.1.4 Mobile
      • 5.2.1.5 Consumer
    • 5.2.2. NAND
      • 5.2.2.1 SSD
      • 5.2.2.2 PC
      • 5.2.2.3 TV
      • 5.2.2.4 Mobile
      • 5.2.2.5 USB
  • 5.3. Market Analysis
  • 5.4. Memory Chip Supplier Products and Profiles
    • CXMT
    • Fujian
    • GigaDevice Semiconductor
    • Intel
    • Micron Technology
    • Nanya
    • Powerchip Technology
    • Samsung Electronics
    • SK Hynix
    • Toshiba (Kloxia)
    • Tsinghua Chongqing
    • Western Digital
    • Winbond
    • YMTC
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