세계의 반도체 업계 발전 동향과 신규 용도

※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

세계에서 칩의 수요 증가에 수반하여 세계의 반도체 매출은 2021년에 급증했으며, 2022년에도 계속 성장할 것으로 추정됩니다. 한편, 세계의 반도체 공장은 생산능력을 확대하고 있으므로 칩의 공급 부족은 2022년 후반/2023년에는 완화될 것으로 예상됩니다.

세계의 반도체 시장과 대만의 반도체 업계 하위 부문(IC 설계, IC 제조, IC 패키징·테스트)의 발전에 대해 조사분석했으며, 수급 불균형의 원인, AI 칩, 자동차용 일렉트로닉스, 와이드 밴드갭 반도체(WBS) 등의 신규 용도도 포함한 정보를 정리하여 전해드립니다.

목차

제1장 반도체 업계의 동향과 수급 역학

• 세계 및 대만의 반도체 업계 동향
• 수급 불균형과 지역의 공급망 재구축

제2장 신규 용도가 반도체 수요를 촉진

• IoT 칩에 AI를 통합하여 다양한 용도에 대응
• 자동차용 일렉트로닉스가 자동차용 칩의 수요를 촉진
• 신규 용도용 와이드 밴드갭 반도체(WBS)
• 결론

List of Topics

• Development of the global semiconductor market, touching on market value forecast for the period 2021-2022 and market share by application for the period 2015-2023; market share by product type and IC type during 2018-2021

• Development of three major semiconductor sub-industry sectors, including IC design, IC manufacturing, and IC packaging and testing; Taiwanese semiconductor industry shipment value during 2014-2021;

• Root causes behind the supply-demand imbalance, touching on the geopolitics and climate risks, rising demand for automotive chips; includes the regional joint development between the U.S. and Korea, and the U.S. and Japan, as well as the impact of China’s policies such as the "Dual Control System.”

• Emerging applications associated with AI chips, automotive electronics, and wide bandgap semiconductors, and includes global GaN and SiC component supply chains and major players.

Companies covered

• Actron
• Allwinner
• Alter Technology
• Amazon
• AMD
• Amkor Technology
• Analog Devices
• Andes Technology
• ApexMic
• Apple
• Arm
• ASE Group
• AT&T
• AWSC
• Aymont
• BItmain
• Bosch
• Broadcom
• Bruckewell Technology
• Cadence
• Canaan
• Cengol
• CEVA
• Codasip
• Cortus
• Cree
• DB HiTek
• Denso
• DuPont
• EPC
• Episil
• Ericsson
• Espressif Systems
• Fraunhofer
• GaN Systems
• GCS
• GeneSiC Semiconductor
• Genesys
• GigaDevice
• Global Power Technology
• GlobalFoundries
• GlobalWafers
• Google
• GW
• Hestia Power
• Horizon Robotics
• Hua Hong
• Huawei
• Hymix
• Infineon
• Intel
• IVWorks
• Kneron
• Macronix
• Maxim
• MediaTek
• Mercedes-Benz
• Microchip
• Microsemi
• Microsoft
• Moderna
• Navitas
• Nokia
• Nordic
• Norstel
• Novatek
• Nvidia
• NXP
• OMMIC
• On Semiconductor
• Pam-Xiamen
• Pan Jit
• Panasonic
• Pixart
• Powerchip
• Princeton
• Qromis
• Qualcomm
• Rambus
• Realtek
• Renesas
• Richtek
• ROHM
• Samsung
• Sanechips
• Semidynamics
• Showa Denko
• SICC
• SiCrystal
• SiFive
• Sirius
• SK Hynix
• SK siltron
• SMIC
• SPIL
• STMicroelectronics
• Sunplus
• Syntronix
• Taiwan Semiconductor
• Texas Instruments
• TI
• Toshiba
• Tower
• Toyota
• TSMC
• UMC
• Unikorn
• V-Air
• Vanguard
• Verizon
• VIS
• Wave Computing
• Weltrend
• Win Semiconductor
• Winbond
• Wolfspeed
• Xilinx

As global demand for chips continues to rise, the global semiconductor revenues are estimated to witness a spike in 2021 and thus the industry’s revenue growth will likely continue into 2022. Meanwhile, as global fabs are expanding their production capacity worldwide, it is anticipated the chip supply crunch will alleviate in the second half of 2022 and/or 2023. This report provides an overview of the development of the global semiconductor market and three Taiwanese three semiconductor sub-industry sectors, including IC design, IC manufacturing and IC packaging and testing; looks into root causes behind the supply and demand imbalance; examines how emerging applications are driving demand for chips, touching on AI chips, automotive electronics, and wide bandgap semiconductors.

Table of Contents

1.Semiconductor Industry Trends and Supply-Demand Dynamics

• 1.1 Global and Taiwan Semiconductor Industry Trends
• 1.2 Supply-Demand Imbalance and Regional Supply Chain Restructuring

2. Emerging Applications Driving Semiconductor Demand

• 2.1 Integration of AI in IoT Chips for Diversified Applications
• 2.2 Automotive Electronics Fueling Robust Demand for Automotive Chips
• 2.3 Wide Bandgap Semiconductors for Emerging Applications
• Conclusion