세계의 3세대 반도체 산업 동향과 전략 전망

Amid escalating geopolitical risks, ongoing conflicts, and tightening monetary policies in Europe and the U.S., global economic performance is expected to remain flat compared to 2023. However, the semiconductor market is nearing the end of its inventory adjustments, with demand in the automotive, high-performance computing (HPC), and Artificial Intelligence of Things (AIoT) sectors poised to support a return to growth, potentially leading to double-digit gains. Additionally, wide-bandgap compound semiconductors, or third-generation materials, are gaining attention for their high voltage resistance, temperature tolerance, and energy efficiency—crucial attributes for achieving net-zero emissions. Companies in Europe, the U.S., and Japan currently lead in this market, with emerging competition from China, South Korea, and Taiwan.

This value pack provides an overview of global semiconductor market performance, analyzes the competitive landscape of leading DRAM suppliers—Samsung, SK Hynix, and Micron—and explores future developments in 3D NAND, major wafer foundries, and the third-generation semiconductor industry across key regions. It also examines policies of major countries for third-generation semiconductors, such as Japan, South Korea, and China.

Table of Contents

• Development and Strategic Position of the Global Semiconductor Industry Chain

1. Global Semiconductor Market Performance

• 1.1 Global Semiconductor Market Declines in 2023
• 1.2 Supply Chain Recovery Likely to Drive Double-Digit Growth in the Semiconductor Market in 2024
• 1.3 ICs Dominating the Global Semiconductor Market with Over 80% Share
• 1.4 Global End-Product Shipment Growth Driving Pull-in Demand in 2024

2. Capex of Global Semiconductor Companies

• 2.1 High Concentration of CapEx among Global Semiconductor Firms
• 2.2 Semiconductor Equipment Takes the Largest Share of CapEx

3. Competitive Landscape of three DRAM suppliers

• 3.1 Two Korea Suppliers Dominates the DRAM Market with a 72% Share
• 3.2 Fierce Competition Expected as DRAM Enters the 1γ Process in 2024
• 3.3 HPC Applications Drive HBM Development

4. 3D NAND Advances into the 200-Layer Era

• 4.1 Two Korean Companies Lead the NAND Flash Market with a 52% Share
• 4.2 The Future of 3D NAND Entering the 300-Layer Era

5. Major Wafer Foundries Have Mass-Produced 3nm Process

• 5.1 2022-2023: Major Foundries Kick off 3nm Process Mass Production
• 5.2 2024-2025: Major Foundries Compete in the 2nm Era

6. Global Semiconductor Companies’ Revenue Ranking

• 6.1 TSMC Remains the World’s Largest Semiconductor Company in 2023
• 6.2 Nvidia Stands Out in 2023 with Revenue Growth of 87%

7. MIC Perspective

Appendix

• List of Companies
• Development of the Global Third-Generation Semiconductor Industry and Product Strategies of Leading Companies

1. Development of European and US Third-Gen Semiconductor Industry

• 1.1 Europe
  • 1.1.1 Focusing on Automotive and Industrial Niches
  • 1.1.2 Abundant Research Resources and Robust Epitaxy and Wafer Foundry Capabilities
• 1.2 US
  • 1.2.1 Prioritizing Military Applications , Expanding to Civilian Uses
  • 1.2.2 Leading SiC Substrate Market Share with Equal Focus on Communication and Power Devices

2. Product Strategies of Leading Companies in Europe and the US

• 2.1 STMicroelectronics
• 2.2 Infineon
• 2.3 Onsemi
• 2.4 Wolfspeed
• 2.5 Navitas
• 2.6 Qorvo

3. Development of Third-Gen Semiconductor Industry in East Asia

• 3.1 Japan
  • 3.1.1 Equal Focus on Development of Power and Communication Devices
  • 3.1.2 Leading in Patents, with Strengths in Epitaxy Technology
• 3.2 Korea
  • 3.2.1 Government-led Development with Focus on Power Applications
• 3.3 China
  • 3.3.1 Government-led Development with Rapid Expansion
  • 3.3.2 Foreign Companies Partnering with Local Firms due to Large Domestic Market and Policy Support

4. Product Strategies of Leading Companies in East Asia

• 4.1 ROHM
• 4.2 Sumitomo Group
• 4.3 Mitsubishi
• 4.4 Innoscience
• 4.5 Sanan Optoelectronics

5. MIC Perspective

Appendix

• List of Companies
• Industry Policies of Third-Generation Semiconductors - SiC - in Japan, Korea, and China

1.Analysis of SiC Industry Policies in Japan and Korea

• 1.1 Japan Introduces Energy-Saving Plans to Boost SiC Industry Development
• 1.2 Japan Reinforces Semiconductor Self-sufficiency to Prevent Industry Exodus
• 1.3 With High Hopes for the High-Power Market, Japan Focuses on SiC Industry Development
• 1.4 Korea Focuses on Energy-Saving Applications for Breakthroughs in SiC Industry
• 1.5 Global Chip Shortages Present a Critical Turning Point for Korea’s Semiconductor Industry
• 1.6 Korea Ramps up R&D to Cultivate the Automotive SiC Power Device Market

2. Analysis of SiC Industry Policies in China

• 2.1 China Targets SiC as a Key Priority for National Energy Development
• 2.2 China Aims to Surpass Western Advancements in SiC via the 14th Five-Year Plan
• 2.3 China Bolsters Local Enterprises to Strengthen Competitiveness in the SiC Market

3. SiC Policy Development Trends of Major Countries

• 3.1 SiC Policy Development Trends in the United States
• 3.2 SiC Policy Development Trends in the EU
• 3.3 SiC Policy Development Trends in Japan and Korea
• 3.4 SiC Policy Development Trends in China

4. MIC Perspective

Appendix

• List of Companies
• Development of Taiwan's Third-Generation Semiconductor Industry and Key Players

1.Taiwanese Third-Generation Semiconductor Industry Development

• 1.1 Taiwan's Late Entry into Third-Generation Semiconductors Focuses Mainly on Wafer Foundry
• 1.2 Positive Outlook Drives Capacity Expansion by Quasi-IDMs and Foundries
• 1.3 Policy Prioritizing Technological and Material Independence, But Further Applications Still Need Improvement

2. Trends and Straties of Major Taiwanese Companies

• 2.1 SAS
• 2.2 Foxconn Technology Group
• 2.3 Panjit

3. MIC Perspective

Appendix

• List of Companies