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반도체 고급 공정 기술 : Intel, Samsung, TSMC의 경쟁 분석

Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung and TSMC

리서치사 MIC - Market Intelligence & Consulting Institute
발행일 2015년 11월 상품 코드 344753
페이지 정보 영문 14 Pages
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반도체 고급 공정 기술 : Intel, Samsung, TSMC의 경쟁 분석 Semiconductor Advanced Process Technologies: Competitive Analysis of Intel, Samsung and TSMC
발행일 : 2015년 11월 페이지 정보 : 영문 14 Pages

세계의 반도체 파운드리 시장은 스마트폰, 컴퓨터, 웨어러블 기기, IoT 대응 디바이스에 대한 수요에 의해서 최근 꾸준히 성장하고 있습니다.

Intel, Samsung, TSMC의 경쟁력에 대해 조사 분석했으며, 기술 전개, 생산능력, 고객 관계에 초점을 맞추어 반도체 파운드리 시장 향후 발전 동향 등의 정보를 전해드립니다.

제1장 고급 공정 기술 분석

  • 기술 로드맵
  • 주요 기술 발전
  • 자본 지출

제2장 생산능력 분석

  • 다양한 생산 라인으로 경쟁력을 강화
  • 스마트 생산으로 경제적 이익을 창출

제3장 고객 관계 분석

  • Samsung, Intel은 고객 신뢰가 낮다

결론

  • Intel
  • Samsung
  • TSMC

부록

  • 용어집
  • 기업 리스트
KSM 15.11.19

The worldwide semiconductor foundry market has been growing steadily in recent years, thanks to the demand for smartphones, computers, wearables, and IoT (Internet of Things) application devices. Advanced processes have been the major driving force behind the growth. For this reason, IDMs such as Intel and Samsung have been deploying in 14nm and 10nm process technologies, thereby shaking the leadership of TSMC's market share. This report profiles the competition among Intel, Samsung, and TSMC-from the perspective of technology deployment, manufacturing capabilities, and customer relationship-and analyzes the future development of the semiconductor foundry market.

Table of Contents

1. Analysis of Advanced Process Technologies

  • 1.1 Technology Roadmaps
    • 1.1.1 Intel's Technology Leadership Had Little Impact on Pure-play Foundries
    • 1.1.2 TSMC Dominates 20nm Process; Samsung Has a Head Start in 14nm Process
    • 1.1.3 TSMC, Samsung Head-to-Head Competition for 10nm Process
  • 1.2 Development of Key Technologies
    • 1.2.1 Vendors Pursue 3D FinFET in Sub-2xnm Designs
    • 1.2.2 TSMC Gets the Upper Hand over Samsung on 16/14nm Process
    • 1.2.3 Samsung Faces More Challenges at 10nm Technology
    • 1.2.4 Vendors All Focus on 3D IC Packaging Services
  • 1.3 Capital Expenditures (Capex)
    • 1.3.1 TSMC Concentrates on Advanced Process Investments

2. Analysis of Manufacturing Capabilities

  • 2.1 Diversified Production Lines to Strengthen Competitiveness
    • 2.1.1 TSMC Continues to Expand Market Share of Homogeneous ICs
    • 2.1.2 Samsung, Intel Have a Head Start in Heterogeneous Integration
  • 2.2 Smart Manufacturing to Create Economic Benefits
    • 2.2.1 TSMC can Use Big Data Analytics to Widen its Advantage

3. Analysis of Customer Relationship

  • 3.1 Samsung, Intel May Have Lower Customer Trust

Conclusion

  • Intel Strengthens Advanced Process Capacity by Acquisitions
  • Samsung Could Focus on Heterogeneous Integration
  • TSMC Needs to Reinforce Cooperation with Memory Vendors on 3D ICs
  • Appendix
  • Glossary of Terms
  • List of Companies

List of Topics

Analysis of the three companies' advanced process technologies, including their technology roadmaps, key technologies, pros and cons, and capital expenditures during 2011 and 2014

Overview of their manufacturing capabilities, touching on homogeneous integration, heterogeneous integration, and big data analytics applications on semiconductor fabrication

Profile of each company's customer relationship, comparing IDMs and pure-play foundries in terms of customer trust

List of Figures

  • Figure 1: Major Vendors' Advanced Technology Roadmap
  • Figure 2: Comparison of Major Vendors' Key Technologies
  • Figure 3: Comparison of Major Vendors' Packaging & Testing Technologies
  • Figure 4: Comparison of Major Vendors' Capex, 2011-2014
  • Figure 5: Product Lines of Major Vendors' Contract Manufacturing Services
  • Figure 6: Application of Big Data Analytics on Semiconductor Fabrication
  • Figure 7: Major Vendors' Position in the Semiconductor Industry Chain

Companies covered

Altera, Apple, Archronix, ESMT, Etron, IBM, Intel, MediaTek, NVIDIA, Qualcomm, Samsung, Spreadtrum, Tabula, Tsinghua Unigroup, TSMC, Xilinx

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