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¿øÀÚÃþ ÁõÂø Àåºñ ½ÃÀå º¸°í¼ : Á¦Ç°, ¿ëµµ, Áö¿ªº°(2024-2032³â)Atomic Layer Deposition Equipment Market Report by Product (Metal ALD, Aluminum Oxide ALD, Plasma Enhanced ALD, Catalytic ALD, and Others), Application (Semiconductors, Solar Devices, Electronics, Medical Equipment, and Others), and Region 2024-2032 |
¿øÀÚÃþ ÁõÂø Àåºñ ¼¼°è ½ÃÀå ±Ô¸ð´Â 2023³â 66¾ï ´Þ·¯¿¡ ´ÞÇß½À´Ï´Ù. ÇâÈÄ IMARC GroupÀº 2032³â±îÁö ½ÃÀå ±Ô¸ð°¡ 2024-2032³â »çÀÌ 14.5%ÀÇ ¿¬Æò±Õ ¼ºÀå·ü(CAGR)À» ±â·ÏÇϸç 2032³â±îÁö 226¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøÇß½À´Ï´Ù.
¿øÀÚÃþ ÁõÂø(ALD)Àº ±âü »ó¹ýÀ¸·Î, Àü±¸Ã¼¿¡ ±³´ë·Î ³ëÃâµÈ ÈÄ ±âÆÇ À§¿¡ Ãʹڸ·À» ÁõÂøÇÏ´Â ¹æ¹ýÀÔ´Ï´Ù. ÀϹÝÀûÀ¸·Î »ç¿ëµÇ´Â Àåºñ¿¡´Â ´ÜÀÏ ¿þÀÌÆÛ, ¹èÄ¡, ÇöóÁ, ´ëÇü ±âÆÇ¿ë ALD ¹ÝÀÀ±â, ¹Ú¸· Àü°è ¹ß±¤(TFEL) µð½ºÇ÷¹ÀÌ ¹× ±âŸ ÀüÀÚºÎǰÀÌ Æ÷ÇԵ˴ϴÙ. ÀÌ·¯ÇÑ Àåºñ´Â µÎ²²¸¦ Á¦¾îÇÏ¿© ±ÕÀϼºÀ» º¸ÀåÇϰí ÀúÇ×, Àüµµ¼º, °µµ µî ±âÆÇÀÇ ´Ù¾çÇÑ Æ¯¼ºÀ» °³¼±Çϰųª º¯°æÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ Æ¯¼ºÀ¸·Î ÀÎÇØ ¹ÝµµÃ¼, ÀüÀÚ±â±â, ±¤ÇÐ ±â±â, ¿¬·áÀüÁö, ¿Àü Àç·á µî¿¡ »ç¿ëµË´Ï´Ù. ÇöÀç ¿øÀÚÃþ ÁõÂø Àåºñ´Â ±Ý¼Ó, ÇöóÁ °ÈÇü, ¾Ë·ç¹Ì´½ »êȹ°, Ã˸ÅÇü µî ´Ù¾çÇÑ À¯ÇüÀ¸·Î ½ÃÆÇµÇ°í ÀÖ½À´Ï´Ù.
½ÃÀå ¼ºÀåÀÇ ÁÖ¿ä ¿øµ¿·ÂÀº ´Ù¾çÇÑ ¿¬±¸ °³¹ß(R&D) ½Ã¼³, ÀÇ·á ¹× Å¾çÀüÁö ºÎ¹®¿¡¼ ALD Àåºñ°¡ ³Î¸® »ç¿ëµÇ°í ÀÖÀ¸¸ç, ±â´É¼ºÀ» Çâ»ó½ÃŰ°í ´õ ³ôÀº Á¤È®µµ¸¦ Á¦°øÇϱâ À§ÇÑ À¯¿¬ÇÑ µµ±¸¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡Çϰí Àֱ⠶§¹®ÀÔ´Ï´Ù. ÀÌ¿Í ÇÔ²² µ¥ÀÌÅÍ ½ºÅ丮Áö, ¼ÒÇü ÀüÀÚºÎǰ, µð½ºÇ÷¹ÀÌ ÀåÄ¡ µî ´Ù¾çÇÑ Á¦Ç°À» ÁõÂøÇϱâ À§ÇÑ ÀüÀÚ Àç·áÀÇ ¼ÒÇüÈ, ¹ÝµµÃ¼, Àü·Â °ü¸® ½Ã½ºÅÛ¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡°¡ ½ÃÀå ¼ºÀå¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ ÁýÀûȸ·Î(IC), Ĩ, ±¤ ½ºÀ§Ä¡, ¼¾¼, ÄÄÇ»ÅÍ µî ¹Ì¼¼ÀüÀÚ±â°è½Ã½ºÅÛ(MEMS) Á¦Ç° Á¦Á¶¿¡ ¿øÀÚÃþ ÁõÂø Àåºñ°¡ Ȱ¿ëµÇ°í ÀÖ´Â Á¡µµ ½ÃÀå ¼ºÀå¿¡ ÈûÀ» º¸Å°í ÀÖ½À´Ï´Ù. ÀÌ¿Í ÇÔ²² ±â¼ú ¹ßÀüÀ¸·Î ¿¬¼º ÀüÀÚÁ¦Ç°À» À§ÇÑ °ø°£ ALD¿Í º¹ÀâÇÑ 3D ³ª³ë ±¸Á¶ÀÇ ±ÕÀϼº°ú ÀûÇÕ¼ºÀ» º¸ÀåÇϱâ À§ÇÑ 3Â÷¿ø(3D) ÇÁ¸°ÆÃ ¸®¾×ÅÍÀÇ µµÀÔµµ ¼ºÀåÀ» ÃËÁøÇÏ´Â ¿äÀÎÀ¸·Î ÀÛ¿ëÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ü³» »ðÀÔÇü, ½º¸¶Æ®¿öÄ¡, ½º¸¶Æ®Æù, ÀÇ·á±â±âÀÇ Áõ°¡·Î ÀÎÇØ °íü ¹Ú¸· ¹èÅ͸®¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡Çϰí ÀÖ´Â °Íµµ ½ÃÀå ¼ºÀå¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. À̿ʹ º°µµ·Î, ÇöóÁ °È ALD¸¦ Ãâ½ÃÇϱâ À§ÇÑ ÁÖ¿ä ±â¾÷µé °£ÀÇ Àü·«Àû Á¦ÈÞ´Â ½ÃÀå¿¡ ¹àÀº Àü¸ÁÀ» Á¦½ÃÇϰí ÀÖ½À´Ï´Ù.
The global atomic layer deposition equipment market size reached US$ 6.6 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 22.6 Billion by 2032, exhibiting a growth rate (CAGR) of 14.5% during 2024-2032.
Atomic layer deposition (ALD) refers to a vapor phase technique that is deployed for depositing ultra-thin films on top of a substrate after getting exposed to alternating precursors. Some of the commonly used equipment includes single wafer, batch, plasma, large substrate ALD reactors, thin-film electroluminescent (TFEL) displays and other electronic components. These tools help in ensuring uniformity by controlling the thickness and improving or modifying various properties of substrates, including resistance, conductivity, and strength. On account of these properties, it is used in semiconductors, electronics, optical devices, fuel cells and thermoelectric materials. At present, atomic layer deposition equipment is commercially available in varying types, such as metal, plasma-enhanced, aluminum oxide, and catalytic.
The widespread adoption of ALD equipment across various research and development (R&D) facilities, healthcare, and solar sector on account of the increasing need for flexible tools to improve functionality and offer higher accuracy is primarily driving the market growth. In line with this, the rising demand for miniaturization, semiconductors, and power management systems in electronic materials for depositing various products, including data storage, small electronic components and display devices are further contributing to the market growth. This is further supported by the utilization of atomic layer deposition equipment for manufacturing integrated circuits (IC), chips, and micro-electromechanical systems (MEMS) products, such as optical switches, sensors, and computers. In line with this, significant technological advancements have led to the introduction of spatial ALD for flexible electronics and three-dimensional (3D) printed reactors to ensure uniformity and conformity of complex 3D nanostructures, which is acting as another growth-inducing factor. Additionally, the escalating requirement for solid-state thin-film batteries due to the increasing uptake of implantable, smartwatches, smartphones and medical equipment is contributing to the market growth. Apart from this, strategic collaborations amongst key players for launching plasma-enhanced ALD are creating a positive outlook for the market.
IMARC Group provides an analysis of the key trends in each sub-segment of the global atomic layer deposition equipment market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on product and application.
Metal ALD
Aluminum Oxide ALD
Plasma Enhanced ALD
Catalytic ALD
Others
Semiconductors
Solar Devices
Electronics
Medical Equipment
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Arradiance LLC, ASM International, Beneq Oy, CVD Equipment Corporation, Forge Nano Inc., Kurt J. Lesker Company, Lam Research Corporation, Oxford Instruments plc, Picosun Oy (Applied Materials Inc.), SENTECH Instruments GmbH, Veeco Instruments Inc., Wonik IPS Co. Ltd. and Tokyo Electron Limited.