화합물 반도체 시장 : 세계 산업 동향, 점유율, 규모, 성장, 기회, 예측(2023-2028년)

The global compound semiconductor market size reached US$ 112.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 150.4 Billion by 2028, exhibiting a growth rate (CAGR) of 4.9% during 2023-2028.

Semiconductors refer to materials that exhibit electrical conductivity between conductors and insulators. At the same time, compound semiconductors are manufactured from two or more different groups of chemical elements in the periodic table. Zinc sulphide (ZnS), gallium arsenide (GaAs), silicon-germanium (SiGe), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC) and zinc selenide (ZnSe) are some of the common elements used in compound semiconductors. The devices made from compound semiconductors exhibit various unique properties, such as high electron mobility and bandgap, enhanced frequency, better current and voltage holding capacity, temperature resistance, breakdown electric fields, faster operation and greater ability to generate microwave signals. As a result, compound semiconductors are widely used in telecommunications, defense, aerospace, automotive, healthcare, electronics and information technology (IT) industries.

Compound Semiconductor Market Trends:

• The increasing product demand in light-emitting diode (LED) applications across the globe is creating a positive outlook for the market growth. Compound semiconductors are widely used to sense and emit different color lights in the form of general lighting and signage displays. Additionally, the significant growth in the electronics industry is also favoring the market growth as it is extensively applied in high-frequency devices, information displays and optical devices. Moreover, the increasing utilization of technologies, such as machine learning (ML), artificial intelligence (AI) and the Internet of Things (IoT) for the manufacturing of compound semiconductors are providing an impetus to the market growth. These technologies assist in monitoring inventory control, enhancing the quality and providing maximum operational efficacy. Furthermore, the rising product demand in the automotive industry in autonomous and electric vehicles is positively impacting the market growth. Other factors, including the increasing product utilization in diagnosis and imaging equipment and surgical instrumentation in the healthcare industry, along with the implementation of various government initiatives to promote the installation of energy-efficient lighting sources, are anticipated to drive the market further toward growth.

Key Market Segmentation:

• IMARC Group provides an analysis of the key trends in each sub-segment of the global compound semiconductor market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type, product, deposition technology and application.

Breakup by Type:

• III-V Compound Semiconductor
• Gallium Nitride
• Gallium Phosphide
• Gallium Arsenide
• Indium Phosphide
• Indium Antimonide
• II-VI Compound Semiconductor
• Cadmium Selenide
• Cadmium Telluride
• Zinc Selenide
• Sapphire
• IV-IV Compound Semiconductor
• Others

Breakup by Product:

• Power Semiconductor
• Transistor
• Integrated Circuits
• Diodes and Rectifiers
• Others

Breakup by Deposition Technology:

• Chemical Vapor Deposition
• Molecular Beam Epitaxy
• Hydride Vapor Phase Epitaxy
• Ammonothermal
• Atomic Layer Deposition
• Others

Breakup by Application:

• IT and Telecom
• Aerospace and Defense
• Automotive
• Consumer Electronics
• Healthcare
• Industrial and Energy and Power

Breakup by Region:

• North America
• United States
• Canada
• Asia-Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa

Competitive Landscape:

• The competitive landscape of the industry has also been examined along with the profiles of the key players being Infineon Technologies AG, Microchip Technology Inc., Mitsubishi Electric Corporation, NXP Semiconductors N.V., onsemi, Qorvo Inc., Renesas Electronics Corporation, STMicroelectronics, Texas Instruments Incorporated, WIN Semiconductors Corp. and Wolfspeed Inc.

Key Questions Answered in This Report:

• How has the global compound semiconductor market performed so far and how will it perform in the coming years?
• What has been the impact of COVID-19 on the global compound semiconductor market?
• What are the key regional markets?
• What is the breakup of the market based on the type?
• What is the breakup of the market based on the product?
• What is the breakup of the market based on the deposition technology?
• What is the breakup of the market based on the application?
• What are the various stages in the value chain of the industry?
• What are the key driving factors and challenges in the industry?
• What is the structure of the global compound semiconductor market and who are the key players?
• What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Compound Semiconductor Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Type

• 6.1 III-V Compound Semiconductor
  • 6.1.1 Market Trends
  • 6.1.2 Key Segments
    • 6.1.2.1 Gallium Nitride
    • 6.1.2.2 Gallium Phosphide
    • 6.1.2.3 Gallium Arsenide
    • 6.1.2.4 Indium Phosphide
    • 6.1.2.5 Indium Antimonide
  • 6.1.3 Market Forecast
• 6.2 II-VI Compound Semiconductor
  • 6.2.1 Market Trends
  • 6.2.2 Key Segments
    • 6.2.2.1 Cadmium Selenide
    • 6.2.2.2 Cadmium Telluride
    • 6.2.2.3 Zinc Selenide
  • 6.2.3 Market Forecast
• 6.3 Sapphire
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 IV-IV Compound Semiconductor
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast
• 6.5 Others
  • 6.5.1 Market Trends
  • 6.5.2 Market Forecast

7 Market Breakup by Product

• 7.1 Power Semiconductor
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Transistor
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Integrated Circuits
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Diodes and Rectifiers
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Deposition Technology

• 8.1 Chemical Vapor Deposition
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Molecular Beam Epitaxy
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast
• 8.3 Hydride Vapor Phase Epitaxy
  • 8.3.1 Market Trends
  • 8.3.2 Market Forecast
• 8.4 Ammonothermal
  • 8.4.1 Market Trends
  • 8.4.2 Market Forecast
• 8.5 Atomic Layer Deposition
  • 8.5.1 Market Trends
  • 8.5.2 Market Forecast
• 8.6 Others
  • 8.6.1 Market Trends
  • 8.6.2 Market Forecast

9 Market Breakup by Application

• 9.1 IT and Telecom
  • 9.1.1 Market Trends
  • 9.1.2 Market Forecast
• 9.2 Aerospace and Defense
  • 9.2.1 Market Trends
  • 9.2.2 Market Forecast
• 9.3 Automotive
  • 9.3.1 Market Trends
  • 9.3.2 Market Forecast
• 9.4 Consumer Electronics
  • 9.4.1 Market Trends
  • 9.4.2 Market Forecast
• 9.5 Healthcare
  • 9.5.1 Market Trends
  • 9.5.2 Market Forecast
• 9.6 Industrial and Energy and Power
  • 9.6.1 Market Trends
  • 9.6.2 Market Forecast

10 Market Breakup by Region

• 10.1 North America
  • 10.1.1 United States
    • 10.1.1.1 Market Trends
    • 10.1.1.2 Market Forecast
  • 10.1.2 Canada
    • 10.1.2.1 Market Trends
    • 10.1.2.2 Market Forecast
• 10.2 Asia-Pacific
  • 10.2.1 China
    • 10.2.1.1 Market Trends
    • 10.2.1.2 Market Forecast
  • 10.2.2 Japan
    • 10.2.2.1 Market Trends
    • 10.2.2.2 Market Forecast
  • 10.2.3 India
    • 10.2.3.1 Market Trends
    • 10.2.3.2 Market Forecast
  • 10.2.4 South Korea
    • 10.2.4.1 Market Trends
    • 10.2.4.2 Market Forecast
  • 10.2.5 Australia
    • 10.2.5.1 Market Trends
    • 10.2.5.2 Market Forecast
  • 10.2.6 Indonesia
    • 10.2.6.1 Market Trends
    • 10.2.6.2 Market Forecast
  • 10.2.7 Others
    • 10.2.7.1 Market Trends
    • 10.2.7.2 Market Forecast
• 10.3 Europe
  • 10.3.1 Germany
    • 10.3.1.1 Market Trends
    • 10.3.1.2 Market Forecast
  • 10.3.2 France
    • 10.3.2.1 Market Trends
    • 10.3.2.2 Market Forecast
  • 10.3.3 United Kingdom
    • 10.3.3.1 Market Trends
    • 10.3.3.2 Market Forecast
  • 10.3.4 Italy
    • 10.3.4.1 Market Trends
    • 10.3.4.2 Market Forecast
  • 10.3.5 Spain
    • 10.3.5.1 Market Trends
    • 10.3.5.2 Market Forecast
  • 10.3.6 Russia
    • 10.3.6.1 Market Trends
    • 10.3.6.2 Market Forecast
  • 10.3.7 Others
    • 10.3.7.1 Market Trends
    • 10.3.7.2 Market Forecast
• 10.4 Latin America
  • 10.4.1 Brazil
    • 10.4.1.1 Market Trends
    • 10.4.1.2 Market Forecast
  • 10.4.2 Mexico
    • 10.4.2.1 Market Trends
    • 10.4.2.2 Market Forecast
  • 10.4.3 Others
    • 10.4.3.1 Market Trends
    • 10.4.3.2 Market Forecast
• 10.5 Middle East and Africa
  • 10.5.1 Market Trends
  • 10.5.2 Market Breakup by Country
  • 10.5.3 Market Forecast

11 SWOT Analysis

• 11.1 Overview
• 11.2 Strengths
• 11.3 Weaknesses
• 11.4 Opportunities
• 11.5 Threats

12 Value Chain Analysis

13 Porters Five Forces Analysis

• 13.1 Overview
• 13.2 Bargaining Power of Buyers
• 13.3 Bargaining Power of Suppliers
• 13.4 Degree of Competition
• 13.5 Threat of New Entrants
• 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

• 15.1 Market Structure
• 15.2 Key Players
• 15.3 Profiles of Key Players
  • 15.3.1 Infineon Technologies AG
    • 15.3.1.1 Company Overview
    • 15.3.1.2 Product Portfolio
    • 15.3.1.3 Financials
    • 15.3.1.4 SWOT Analysis
  • 15.3.2 Microchip Technology Inc.
    • 15.3.2.1 Company Overview
    • 15.3.2.2 Product Portfolio
    • 15.3.2.3 Financials
    • 15.3.2.4 SWOT Analysis
  • 15.3.3 Mitsubishi Electric Corporation
    • 15.3.3.1 Company Overview
    • 15.3.3.2 Product Portfolio
    • 15.3.3.3 Financials
    • 15.3.3.4 SWOT Analysis
  • 15.3.4 NXP Semiconductors N.V.
    • 15.3.4.1 Company Overview
    • 15.3.4.2 Product Portfolio
    • 15.3.4.3 Financials
    • 15.3.4.4 SWOT Analysis
  • 15.3.5 onsemi
    • 15.3.5.1 Company Overview
    • 15.3.5.2 Product Portfolio
    • 15.3.5.3 Financials
    • 15.3.5.4 SWOT Analysis
  • 15.3.6 Qorvo Inc.
    • 15.3.6.1 Company Overview
    • 15.3.6.2 Product Portfolio
    • 15.3.6.3 Financials
    • 15.3.6.4 SWOT Analysis
  • 15.3.7 Renesas Electronics Corporation
    • 15.3.7.1 Company Overview
    • 15.3.7.2 Product Portfolio
    • 15.3.7.3 Financials
    • 15.3.7.4 SWOT Analysis
  • 15.3.8 STMicroelectronics
    • 15.3.8.1 Company Overview
    • 15.3.8.2 Product Portfolio
    • 15.3.8.3 Financials
    • 15.3.8.4 SWOT Analysis
  • 15.3.9 Texas Instruments Incorporated
    • 15.3.9.1 Company Overview
    • 15.3.9.2 Product Portfolio
    • 15.3.9.3 Financials
    • 15.3.9.4 SWOT Analysis
  • 15.3.10 WIN Semiconductors Corp.
    • 15.3.10.1 Company Overview
    • 15.3.10.2 Product Portfolio
    • 15.3.10.3 Financials
  • 15.3.11 Wolfspeed Inc.
    • 15.3.11.1 Company Overview
    • 15.3.11.2 Product Portfolio
    • 15.3.11.3 Financials
    • 15.3.11.4 SWOT Analysis