½ÃÀ庸°í¼­
»óǰÄÚµå
1451606

¼¼°èÀÇ Æ÷ÆÃ ÄÄÆÄ¿îµå ½ÃÀå º¸°í¼­ : ÄÄÆÄ¿îµå À¯Çü, °æÈ­ ±â¼ú, ÃÖÁ¾ »ç¿ëÀÚ ¹× Áö¿ªº°(2024-2032³â)

Potting Compound Market Report by Resin Type, Curing Technology, End User, and Region 2024-2032

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: IMARC | ÆäÀÌÁö Á¤º¸: ¿µ¹® 143 Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

¼¼°è Æ÷ÆÃ ÄÄÆÄ¿îµå ½ÃÀå ±Ô¸ð´Â 2023³â 33¾ï ´Þ·¯¿¡ ´ÞÇß½À´Ï´Ù. IMARC ±×·ìÀº 2032³â±îÁö ½ÃÀå ±Ô¸ð°¡ 47¾ï ´Þ·¯¿¡ ´ÞÇϰí 2024-2032³â°£ ¿¬Æò±Õ ¼ºÀå·ü(CAGR)Àº 3.8%¸¦ ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹ÃøÇß½À´Ï´Ù.

Æ÷ÆÃ ÄÄÆÄ¿îµå´Â ȸ·Î ±âÆÇ À§¿¡ È帣´Â ¾×ü ¼öÁö·Î ½À±â, ¿­, Áøµ¿, Ãæ°Ý ¹× ȯ°æ ¿äÀÎÀ¸·ÎºÎÅÍ ÀüÀÚ ºÎǰÀ» º¸È£ÇÕ´Ï´Ù. ¿¡Æø½Ã, Æú¸®¿ì·¹Åº, ½Ç¸®ÄÜÀ¸·Î ±¸¼ºµÇ¾î ÀüÀÚ Á¦Ç°¿¡ ³ôÀº Á¢Âø·ÂÀ» Á¦°øÇÕ´Ï´Ù. ´Ü¶ôÀ» ¹æÁöÇϰí, º¹ÀâÇÑ ¾î¼Àºí¸®ÀÇ È­ÇÐÀû º¸È£¸¦ °­È­Çϸç, °¡È¤ÇÑ È¯°æ Á¶°Ç¿¡¼­ ±â°èÀû Ãæ°Ý°ú Áøµ¿¿¡ ´ëÇÑ ³»¼ºÀ» Á¦°øÇÕ´Ï´Ù. ¶ÇÇÑ, Àڿܼ±(UV)À¸·Î ÀÎÇÑ ÀüÀÚ ÀåÄ¡ÀÇ ±Õ¿­ ¹× Ȳº¯À» ¹æÁöÇÏ°í °í¿Â ³»¼ºÀ» Á¦°øÇÕ´Ï´Ù. ±× °á°ú, Æ÷ÆÃ ÄÄÆÄ¿îµå´Â Àü ¼¼°è ÀÚµ¿Â÷, ÀüÀÚ, Ç×°ø¿ìÁÖ, Àü·Â »ê¾÷¿¡¼­ ³Î¸® »ç¿ëµÇ°í ÀÖ½À´Ï´Ù.

Æ÷ÆÃ ÄÄÆÄ¿îµå ½ÃÀå µ¿Çâ :

ÇöÀç Àü±â ¹× ÀüÀÚ »ê¾÷¿¡¼­ ½À±â¿Í Ãæ°ÝÀ¸·ÎºÎÅÍ Á¦Ç°À» º¸È£ÇÏ´Â ³»ÀåÇü ¼öÁö¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÀÌ´Â ¼ÒÇü ÈÞ´ë¿ë ¹× ÇÚµåÇïµå ÄÄÇ»ÅÍ ±â±â °³¹ßÀ» À§ÇÑ ÀüÀÚ ºÎǰÀÇ ¼ÒÇüÈ­ Ãß¼¼¿Í ÇÔ²² ½ÃÀåÀ» °ßÀÎÇÏ´Â ÁÖ¿ä ¿äÀÎ Áß ÇϳªÀÔ´Ï´Ù. ¶ÇÇÑ, ¿Â½Ç°¡½º ¹èÃâ·® °¨ÃàÀ» À§ÇÑ ¿î¼Û ºÐ¾ß¿¡¼­ÀÇ Â÷·® Àüµ¿È­ Ãß¼¼µµ ½ÃÀå ¼ºÀå¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ³»ºñ°ÔÀ̼Ç, ÀÎÆ÷Å×ÀÎ¸ÕÆ®, ADAS(÷´Ü ¿îÀüÀÚ º¸Á¶ ½Ã½ºÅÛ) µî ÀÚµ¿Â÷ ÀüÀÚ ½Ã½ºÅÛÀÇ ÅëÇÕÀÌ Áõ°¡Çϰí ÀÖ´Â °Íµµ ¾÷°è ÅõÀÚÀڵ鿡°Ô À¯¸®ÇÑ ¼ºÀå ±âȸ¸¦ Á¦°øÇÕ´Ï´Ù. À̿ʹ º°µµ·Î, ÀüÀÚ ÀåÄ¡ Á¦Á¶¿¡ ÀÓº£µðµå ¼öÁöÀÇ ÀåÁ¡(°íÁ¡µµ, ¹Ý°æÁú, À¯¿¬ÇÑ ±¸¼º µî)¿¡ ´ëÇÑ ´ëÁßÀÇ ÀνÄÀÌ ³ô¾ÆÁö¸é¼­ ½ÃÀå¿¡ ±àÁ¤ÀûÀÎ ¿µÇâÀ» ¹ÌÄ¡°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ ¹ÝµµÃ¼, Ä¿ÆÐ½ÃÅÍ, º¯¾Ð±â, ¼Ö·¹³ëÀÌµå µî ÀüÀÚ±â±â¿¡ ´ëÇÑ ¼ö¿ä°¡ Àü ¼¼°èÀûÀ¸·Î Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÀÌ´Â ±Þ¼ºÀåÇÏ´Â ÀüÀÚ »ê¾÷°ú °áÇÕÇÏ¿© ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Ç×°ø¿ìÁÖ »ê¾÷¿¡¼­ ÀÓº£µðµå ¼öÁö¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇϰí ÀÖ½À´Ï´Ù.

º» º¸°í¼­¿¡¼­ ´Ù·é ÁÖ¿ä Áú¹®

  • 2023³â Æ÷ÆÃ ÄÄÆÄ¿îµå ¼¼°è ½ÃÀå ±Ô¸ð´Â?
  • 2024-2032³â Æ÷ÆÃ ÄÄÆÄ¿îµå ¼¼°è ½ÃÀå ¼ºÀå·ü Àü¸ÁÀº?
  • Æ÷ÆÃ ÄÄÆÄ¿îµå ¼¼°è ½ÃÀåÀ» ÁÖµµÇÏ´Â ÁÖ¿ä ¿äÀÎÀº?
  • Äڷγª19°¡ ¼¼°è Æ÷ÆÃ ÄÄÆÄ¿îµå ½ÃÀå¿¡ ¹ÌÄ¡´Â ¿µÇâÀº?
  • ¼öÁö À¯Çüº° Æ÷ÆÃ ÄÄÆÄ¿îµå ¼¼°è ½ÃÀå ÇöȲÀº?
  • °æÈ­ ±â¼úº° Æ÷ÆÃ ÄÄÆÄ¿îµå ¼¼°è ½ÃÀå ÇöȲÀº?
  • Æ÷ÆÃ ÄÄÆÄ¿îµå ¼¼°è ½ÃÀå ÃÖÁ¾ »ç¿ëÀÚº° ºÐ·ù´Â?
  • Æ÷ÆÃ ÄÄÆÄ¿îµå ¼¼°è ½ÃÀå¿¡¼­ ÁÖ¿ä Áö¿ªÀº?
  • ¼¼°è Æ÷ÆÃ ÄÄÆÄ¿îµå ½ÃÀåÀÇ ÁÖ¿ä ±â¾÷Àº?

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹üÀ§¿Í Á¶»ç ¹æ¹ý

  • Á¶»ç ¸ñÀû
  • ÀÌÇØ°ü°èÀÚ
  • µ¥ÀÌÅÍ ¼Ò½º
    • 1Â÷ Á¤º¸
    • 2Â÷ Á¤º¸
  • ½ÃÀå ÃßÁ¤
    • º¸ÅÒ¾÷ Á¢±Ù
    • Åé´Ù¿î Á¢±Ù
  • Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ¼­·Ð

  • °³¿ä
  • ÁÖ¿ä »ê¾÷ µ¿Çâ

Á¦5Àå ¼¼°èÀÇ Æ÷ÆÃ ÄÄÆÄ¿îµå ½ÃÀå

  • ½ÃÀå °³¿ä
  • ½ÃÀå ½ÇÀû
  • COVID-19ÀÇ ¿µÇâ
  • ½ÃÀå ¿¹Ãø

Á¦6Àå ½ÃÀå ºÐ¼® : ¼öÁö À¯Çüº°

  • ¿¡Æø½Ã ¼öÁö
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Æú¸®¿ì·¹Åº
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ½Ç¸®ÄÜ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Æú¸®¿¡½ºÅ׸£
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Æú¸®¾Æ¹Ìµå
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Æú¸®¿Ã·¹ÇÉ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ¾ÆÅ©¸±
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø

Á¦7Àå ½ÃÀå ºÐ¼® : °æÈ­ ±â¼úº°

  • UV °æÈ­
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ¿­ °æÈ­
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • »ó¿Â °æÈ­
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø

Á¦8Àå ½ÃÀå ºÐ¼® : ÃÖÁ¾»ç¿ëÀÚº°

  • ÀÏ·ºÆ®·Î´Ð½º
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Ç×°ø¿ìÁÖ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ÀÚµ¿Â÷
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • »ê¾÷
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ±âŸ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø

Á¦9Àå ½ÃÀå ºÐ¼® : Áö¿ªº°

  • ºÏ¹Ì
    • ¹Ì±¹
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ij³ª´Ù
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • Áß±¹
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ÀϺ»
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • Àεµ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • Çѱ¹
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • È£ÁÖ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • Àεµ³×½Ã¾Æ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ±âŸ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
  • À¯·´
    • µ¶ÀÏ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ÇÁ¶û½º
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ¿µ±¹
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ÀÌÅ»¸®¾Æ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ½ºÆäÀÎ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ·¯½Ã¾Æ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ±âŸ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
  • ¶óƾ¾Æ¸Þ¸®Ä«
    • ºê¶óÁú
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ¸ß½ÃÄÚ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
    • ±âŸ
      • ½ÃÀå µ¿Çâ
      • ½ÃÀå ¿¹Ãø
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ºÐ¼® : ±¹°¡º°
    • ½ÃÀå ¿¹Ãø

Á¦10Àå SWOT ºÐ¼®

  • °³¿ä
  • °­Á¡
  • ¾àÁ¡
  • ±âȸ
  • À§Çù

Á¦11Àå ¹ë·ùüÀÎ ºÐ¼®

Á¦12Àå PorterÀÇ Five Forces ºÐ¼®

  • °³¿ä
  • ¹ÙÀ̾îÀÇ ±³¼··Â
  • °ø±Þ ±â¾÷ÀÇ ±³¼··Â
  • °æÀï Á¤µµ
  • ½Å±Ô ÁøÃâ¾÷üÀÇ À§Çù
  • ´ëüǰÀÇ À§Çù

Á¦13Àå °¡°Ý ºÐ¼®

Á¦14Àå °æÀï ±¸µµ

  • ½ÃÀå ±¸Á¶
  • ÁÖ¿ä ±â¾÷
  • ÁÖ¿ä ±â¾÷ °³¿ä
    • 3M Company
    • Aremco Products Inc.
    • DuPont de Nemours Inc.
    • Dymax Corporation
    • EFI Polymers
    • Electrolube(Element Solutions Inc)
    • Henkel AG & Co. KGaA
    • Huntsman International LLC(Huntsman Corporation)
    • LORD Corporation(Parker Hannifin Corporation)
    • Master Bond Inc.
    • MG Chemicals
    • RBC Industries Inc
    • WEVO-CHEMIE GmbH
LSH 24.04.16

The global potting compound market size reached US$ 3.3 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 4.7 Billion by 2032, exhibiting a growth rate (CAGR) of 3.8% during 2024-2032.

Potting compounds are liquid resins that flow over a circuit board to protect the electronic components against moisture, heat, vibration, impact, and environmental factors. They comprise epoxy, polyurethane, and silicone to provide high adhesion to electronic products. They help prevent short circuits, offer increased chemical protection in complex assemblies, and provide mechanical shock and vibration resistance in harsh environmental conditions. In addition, they offer high-temperature resistance while preventing the cracking or yellowing of electronic devices due to ultraviolet (UV) radiation. As a result, potting compounds are widely used in automotive, electronics, aerospace, and power industries across the globe.

Potting Compound Market Trends:

At present, there is a rise in the demand for potting compounds in the electrical and electronics industry to protect products from moisture and shock. This, along with the growing miniaturization of electronic components to develop small portable and handheld computer devices, represents one of the key factors driving the market. Besides this, the rising trend of vehicle electrification in the transportation sector to reduce greenhouse gas emissions is contributing to the growth of the market. Additionally, the increasing integration of electronic systems in vehicles, such as navigation, infotainment, and advanced driver-assistance systems (ADAS), is offering lucrative growth opportunities to industry investors. Apart from this, the growing awareness among the masses about the benefits of using potting compounds to produce electronic devices, such as high viscosity and semi-rigid and flexible compositions, is positively influencing the market. Moreover, there is an increase in the demand for electronic devices, such as semiconductors, capacitors, transformers, and solenoids, around the world. This, coupled with the burgeoning electronic industry, is propelling the growth of the market. Furthermore, the rising demand for potting compounds in the aerospace industry is bolstering the growth of the market.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global potting compound market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on resin type, curing technology and end user.

Breakup by Resin Type:

Epoxy

Polyurethane

Silicone

Polyester

Polyamide

Polyolefin

Acrylics

Breakup by Curing Technology:

UV Curing

Thermal Curing

Room Temperature Curing

Breakup by End User:

Electronics

Aerospace

Automotive

Industrial

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being 3M Company, Aremco Products Inc., DuPont de Nemours Inc., Dymax Corporation, EFI Polymers, Electrolube (Element Solutions Inc), Henkel AG & Co. KGaA, Huntsman International LLC (Huntsman Corporation), LORD Corporation (Parker Hannifin Corporation), Master Bond Inc., MG Chemicals, RBC Industries Inc and WEVO-CHEMIE GmbH.

Key Questions Answered in This Report

  • 1. What was the size of the global potting compound market in 2023?
  • 2. What is the expected growth rate of the global potting compound market during 2024-2032?
  • 3. What are the key factors driving the global potting compound market?
  • 4. What has been the impact of COVID-19 on the global potting compound market?
  • 5. What is the breakup of the global potting compound market based on the resin type?
  • 6. What is the breakup of the global potting compound market based on the curing technology?
  • 7. What is the breakup of the global potting compound market based on the end user?
  • 8. What are the key regions in the global potting compound market?
  • 9. Who are the key players/companies in the global potting compound market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Potting Compound Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Resin Type

  • 6.1 Epoxy
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Polyurethane
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 Silicone
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 Polyester
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast
  • 6.5 Polyamide
    • 6.5.1 Market Trends
    • 6.5.2 Market Forecast
  • 6.6 Polyolefin
    • 6.6.1 Market Trends
    • 6.6.2 Market Forecast
  • 6.7 Acrylics
    • 6.7.1 Market Trends
    • 6.7.2 Market Forecast

7 Market Breakup by Curing Technology

  • 7.1 UV Curing
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Thermal Curing
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Room Temperature Curing
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast

8 Market Breakup by End User

  • 8.1 Electronics
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Aerospace
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Automotive
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Industrial
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 Others
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast

9 Market Breakup by Region

  • 9.1 North America
    • 9.1.1 United States
      • 9.1.1.1 Market Trends
      • 9.1.1.2 Market Forecast
    • 9.1.2 Canada
      • 9.1.2.1 Market Trends
      • 9.1.2.2 Market Forecast
  • 9.2 Asia-Pacific
    • 9.2.1 China
      • 9.2.1.1 Market Trends
      • 9.2.1.2 Market Forecast
    • 9.2.2 Japan
      • 9.2.2.1 Market Trends
      • 9.2.2.2 Market Forecast
    • 9.2.3 India
      • 9.2.3.1 Market Trends
      • 9.2.3.2 Market Forecast
    • 9.2.4 South Korea
      • 9.2.4.1 Market Trends
      • 9.2.4.2 Market Forecast
    • 9.2.5 Australia
      • 9.2.5.1 Market Trends
      • 9.2.5.2 Market Forecast
    • 9.2.6 Indonesia
      • 9.2.6.1 Market Trends
      • 9.2.6.2 Market Forecast
    • 9.2.7 Others
      • 9.2.7.1 Market Trends
      • 9.2.7.2 Market Forecast
  • 9.3 Europe
    • 9.3.1 Germany
      • 9.3.1.1 Market Trends
      • 9.3.1.2 Market Forecast
    • 9.3.2 France
      • 9.3.2.1 Market Trends
      • 9.3.2.2 Market Forecast
    • 9.3.3 United Kingdom
      • 9.3.3.1 Market Trends
      • 9.3.3.2 Market Forecast
    • 9.3.4 Italy
      • 9.3.4.1 Market Trends
      • 9.3.4.2 Market Forecast
    • 9.3.5 Spain
      • 9.3.5.1 Market Trends
      • 9.3.5.2 Market Forecast
    • 9.3.6 Russia
      • 9.3.6.1 Market Trends
      • 9.3.6.2 Market Forecast
    • 9.3.7 Others
      • 9.3.7.1 Market Trends
      • 9.3.7.2 Market Forecast
  • 9.4 Latin America
    • 9.4.1 Brazil
      • 9.4.1.1 Market Trends
      • 9.4.1.2 Market Forecast
    • 9.4.2 Mexico
      • 9.4.2.1 Market Trends
      • 9.4.2.2 Market Forecast
    • 9.4.3 Others
      • 9.4.3.1 Market Trends
      • 9.4.3.2 Market Forecast
  • 9.5 Middle East and Africa
    • 9.5.1 Market Trends
    • 9.5.2 Market Breakup by Country
    • 9.5.3 Market Forecast

10 SWOT Analysis

  • 10.1 Overview
  • 10.2 Strengths
  • 10.3 Weaknesses
  • 10.4 Opportunities
  • 10.5 Threats

11 Value Chain Analysis

12 Porters Five Forces Analysis

  • 12.1 Overview
  • 12.2 Bargaining Power of Buyers
  • 12.3 Bargaining Power of Suppliers
  • 12.4 Degree of Competition
  • 12.5 Threat of New Entrants
  • 12.6 Threat of Substitutes

13 Price Analysis

14 Competitive Landscape

  • 14.1 Market Structure
  • 14.2 Key Players
  • 14.3 Profiles of Key Players
    • 14.3.1 3M Company
      • 14.3.1.1 Company Overview
      • 14.3.1.2 Product Portfolio
      • 14.3.1.3 Financials
      • 14.3.1.4 SWOT Analysis
    • 14.3.2 Aremco Products Inc.
      • 14.3.2.1 Company Overview
      • 14.3.2.2 Product Portfolio
    • 14.3.3 DuPont de Nemours Inc.
      • 14.3.3.1 Company Overview
      • 14.3.3.2 Product Portfolio
      • 14.3.3.3 Financials
      • 14.3.3.4 SWOT Analysis
    • 14.3.4 Dymax Corporation
      • 14.3.4.1 Company Overview
      • 14.3.4.2 Product Portfolio
    • 14.3.5 EFI Polymers
      • 14.3.5.1 Company Overview
      • 14.3.5.2 Product Portfolio
    • 14.3.6 Electrolube (Element Solutions Inc)
      • 14.3.6.1 Company Overview
      • 14.3.6.2 Product Portfolio
    • 14.3.7 Henkel AG & Co. KGaA
      • 14.3.7.1 Company Overview
      • 14.3.7.2 Product Portfolio
      • 14.3.7.3 Financials
      • 14.3.7.4 SWOT Analysis
    • 14.3.8 Huntsman International LLC (Huntsman Corporation)
      • 14.3.8.1 Company Overview
      • 14.3.8.2 Product Portfolio
    • 14.3.9 LORD Corporation (Parker Hannifin Corporation)
      • 14.3.9.1 Company Overview
      • 14.3.9.2 Product Portfolio
    • 14.3.10 Master Bond Inc.
      • 14.3.10.1 Company Overview
      • 14.3.10.2 Product Portfolio
    • 14.3.11 MG Chemicals
      • 14.3.11.1 Company Overview
      • 14.3.11.2 Product Portfolio
    • 14.3.12 RBC Industries Inc
      • 14.3.12.1 Company Overview
      • 14.3.12.2 Product Portfolio
    • 14.3.13 WEVO-CHEMIE GmbH
      • 14.3.13.1 Company Overview
      • 14.3.13.2 Product Portfolio
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦