게이트 드라이버 IC 시장 보고서 : 트랜지스터 유형, 반도체 재료, Attachment 형태, 절연 기술, 응용 분야, 지역별(2024-2032년)

The global gate driver IC market size reached US$ 1.5 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 2.4 Billion by 2032, exhibiting a growth rate (CAGR) of 5.2% during 2024-2032. The market is experiencing steady growth driven by rapid urbanization and infrastructural development, particularly in emerging economies, the rising focus on sustainable practices across the globe, and continuous technological advancements in manufacturing processes.

Gate Driver IC Market Analysis:

Major Market Drivers: The adoption of electric vehicles (EVs) escalates the demand for gate driver ICs which are indispensable in managing and delivering power efficiently. Moreover, the growing spending on renewable energy systems, especially solar and wind, increases the demand for smart gate driver ICs to enhance energy conversions and output.

Key Market Trends: One of the major gate driver IC market trends includes the rise in the demand for gate driver ICs supporting small size and integration means to enable high performance and compact system size. Silicon Carbide (SiC) and Gallium Nitride (GaN) technologies are also able to provide greater efficiency and thermal performance. These characteristics are ideal for high-performance power applications.

Geographical Trends: The Asia-Pacific region is the largest market due to a large electronics manufacturing base, and the growth in EV sales in countries such as China and Japan, making it a significant gate driver IC market. North American and European markets, as well are major focus areas in renewable and cutting-edge automotive technologies.

Competitive Landscape: According to the gate driver IC market analysis, the market is competitive with Infineon Technologies, Texas Instruments, and ON Semiconductor being the key leading innovators trying to maintain their market positions. To enhance their product portfolio and presence in the market companies use strategies, such as mergers and acquisitions, and strategic partnerships.

Challenges and Opportunities: The significant complexity and price linkage associated with developing silicon carbide (SiC) and gallium nitride (GaN) advanced gate driver ICs represent significant growth factors. However, this also provides opportunities for vendors with cost-effective substitutes to capitalize on the rising adoption of high-efficiency power supplies in various applications.

Gate Driver IC Market Trends:

Increasing adoption of electric vehicles (EVs)

Increasing demand for electric vehicles (EVs) is also a major market driver for the growth of the global gate driver IC market. Diverse EV demonstration enterprises around the world continue to be enforced and clean energy promotion is becoming a global standard, which in turn is increasing the sales of EVs. Additionally, the use of gate driver ICs in electric vehicle (EV) powertrains has a significant impact on power management and efficiency by improving the performance of electric motors and inverters. According to a market research report, the global electric vehicle market size reached 25.6 million units in 2023. IMARC Group expects the market to reach 381.3 million units by 2032, exhibiting a growth rate (CAGR) of 34% during 2024-2032. Therefore, this is significantly supporting the gate driver IC market revenue. Furthermore, technological innovation in the field of semiconductors has allowed high-performance gate driver ICs to become smaller and more efficient which is helping increase their implementation in the EV sector. In addition, the roll towards autonomous and connected vehicles also necessitates advanced power management solutions. Therefore, this is significantly supporting the market.

Growing demand for renewable energy systems

The escalating inclination toward renewable energy sources such as solar power and wind power, at the global level, is propelling the demand for gate driver ICs. These include power inverters and converters used in renewable energy systems. It secures cost-effective and reliable transformation from DC power produced by solar panels and wind turbines into grid-compliant AC power. As governments and global organizations are investing more in renewable energy infrastructures to fight climate change and reduce dependency on fossil fuels, more need for power management solutions arises. Along with this, the gate driver ICs play an important role in enabling applications such as renewable energy system performance and efficiency improvements due to precise power electronic device control, increased energy efficiency, and improved system stability. Thus, this is propelling the gate driver IC demand. Moreover, the accelerating need for more advanced power electronics resulting from the penetration of smart grid technologies and energy storage systems utilizing renewable energy sources is propelling the market.

Advancements in industrial automation

Industrial automation has proliferated, and smart manufacturing practices are increasingly being adopted, which are major factors driving the gate driver IC market growth. Gate driver ICs are crucial to controlling power electronics in motor drives, robotics, and automatic machines in modern industrial applications. These ICs enable power management to be streamlined, improve system performance in operation, and increase the reliability of automated systems. Along with this, the rising requirement for precision, efficiency, and flexibility in manufacturing processes is driving the adoption of gate driver ICs. Furthermore, increasing market focus on Industry 4.0 (driving for integration of digital technologies into industrial/production operations) is also supporting the demand for sophisticated power electronics solutions. Gate driver ICs facilitate the operation of interconnected, smart industrial devices for predictive maintenance, real-time monitoring, and energy savings. Further, ongoing advancements in semiconductor technologies are resulting in the introduction of high-performance gate drivers which is creating a positive gate driver IC market outlook.

Gate Driver IC Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global gate driver IC market report, along with forecasts at the global, regional, and country levels from 2024-2032. Our report has categorized the market based on transistor type, semiconductor material, mode of attachment, isolation technique, and application.

Breakup by Transistor Type:

MOSFET

IGBT

MOSFET dominates the market

The report has provided a detailed breakup and analysis of the market based on the transistor type. This includes MOSFET and IGBT. According to the report, MOSFET represented the largest segment.

MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) are the leading type of transistors due to their wide field of application in circuits and the high-performance characteristics of MOSFET. Due to their high efficiency, fast switching properties, and ease of integration into various electronic circuits, these transistors play an indispensable role in the field of consumer electronics and industrial power management applications. According to the gate driver IC market forecast, the increasing need for miniaturization and low-energy solutions is driving the adoption of MOSFETs, particularly in electric vehicles and energy harvesting applications, and remote-control devices which find ideal applications in IoT. Furthermore, improvements in MOSFET technology, such as better thermal handling and lowered on-state resistance are enhancing the durability and effectiveness of MOSFETs, thereby establishing their leadership in the transistor market.

Breakup by Semiconductor Material:

Si

SiC

GaN

Si holds the largest share of the market

A detailed breakup and analysis of the market based on the semiconductor material has also been provided in the report. This includes Si, SiC, and GaN. According to the report, Si accounted for the largest market share.

Silicon (Si) is the largest semiconductor material segment in the market, due to the abundance of silicon, low cost, and well-established manufacturing processes. According to the gate driver IC market report, the qualities that make silicon important are its excellent electrical properties, including its high electron mobility and stability, making it an essential material for a vast number of semiconductor devices, from microprocessors to memory chips, and power electronics. Its versatility and reliability have helped establish its place in the diversification of high-performing materials in the advancement of contemporary technologies across a range of sectors, including consumer electronics to automotive and industrial applications. Furthermore, the vast amount of infrastructure on silicon semiconductor fabrication has been another factor that has sustained silicon's position, despite alternative materials such as silicon carbide (SiC) and gallium nitride (GaN) materializing for specialized applications.

Breakup by Mode of Attachment:

On-Chip

Discrete

Discrete holds the largest share of the market

A detailed breakup and analysis of the market based on the mode of attachment has also been provided in the report. This includes on-chip and discrete. According to the report, discrete accounted for the largest market share.

The gate driver IC market overview states that discrete devices are the dominant segment in the semiconductor market, as they fulfil the key functions and enable the flexibility required in electronic circuit design. Contained within the individually packaged canisters are transistors, diodes, and resistors, which provide the designer with the opportunity to tailor and fine-tune certain parameters in the circuit performance. As discrete attachment is a method that allows fine control over where to place components and how they will perform, it is crucial for high-reliability and high-power applications such as automotive, industrial, and consumer applications. In addition, continued demand for discrete components stems from the straightforward process of replacing and repairing these components, and their compatibility with a variety of circuit board designs. This flexibility and adaptability enable discrete components to continue leading the gate driver IC industry, serving the varied and heterogeneous requirements created by modern electronics.

Breakup by Isolation Technique:

Magnetic Isolation

Capacitive Isolation

Optical Isolation

Optical isolation dominates the market

A detailed breakup and analysis of the market based on the isolation technique has also been provided in the report. This includes magnetic isolation, capacitive isolation, optical isolation. According to the report, optical isolation accounted for the largest market share.

Optical isolation is the market segment holding the largest portion of the market share as it is one of the gate driver IC market recent developments that is capable of providing electrical isolation and signal transmission between different parts of the circuit. Using light to transfer information over an isolation barrier ensures that the high voltage side cannot directly affect the control side of the system, both protecting any sensitive electronics and the user. In addition, traditional applications include optical isolators for use in industrial automation, power supplies, and communication systems, where these devices are valued for their ability to operate at high temperatures and their low noise susceptibility. Moreover, the rising need for sophisticated electronic systems with increasing security features and better signal clarity influences the demand for optical isolation and reaffirms its market dominance. Additionally, improvements in the technology of the optoelectronic components and devices are continuously enhancing the performance and efficiency of the optical isolators, acting as gate driver IC market recent opportunities.

Breakup by Application:

Residential

Industrial

Commercial

A detailed breakup and analysis of the market based on the application have also been provided in the report. This includes residential, industrial, and commercial.

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific exhibits a clear dominance, accounting for the largest gate driver IC market share

The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific represented the largest market.

The Asia-Pacific region leads the market size, mainly due to its operational efficiencies and august supply chains, and the growth prospects in advancements owing to immense investments in technology. The whole system is a production hub for electronics of all kinds including consumer electronics, automotive, industrial, and electronics. In addition, the region's market command is further reinforced by an abundance of semiconductor fabrication plants and foundries as well as strong government backing and beneficial policies. Apart from this, the region is adopting sophisticated technology such as 5G, artificial intelligence, and electric vehicles at a rapid pace, and these types of advanced semiconductor components. Moreover, Asia Pacific, with the largest gate driver IC market share, maintains its position driven by its sustained investment in cumbersome R&D to accommodate the growing semiconductor manufacturing technology ecosystem globally.

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the major market players in the gate driver IC industry include:

Hitachi Power Semiconductor Device Ltd. (Hitachi Ltd.)

Infineon Technologies AG

Microchip Technology Inc.

Mouser Electronics (TTI Inc., Berkshire Hathaway Inc.)

NXP Semiconductors N.V.

Onsemi

Renesas Electronics Corporation

Rohm Semiconductor

Semtech Corporation

STMicroelectronics

Texas Instruments Incorporated

Toshiba Corporation

(Please note that this is only a partial list of the key players, and the complete list is provided in the report.)

Major companies are investing in R&D to expand their capabilities and maintain a competitive edge. Additionally, the interest of gate driver IC companies is for innovations related to semiconductor materials (SiC, GaN) to allow top performance and energy saving in high-power applications. Along with this, the companies continue to explore strategic partnerships and collaborations to increase the market footprint and co-developing technology. Moreover, the accelerating investments into increasing manufacturing capacity, as well as in the development and adoption of advanced methodologies, such as EUV lithography allow the production of smaller and more performative chips. These actions are geared towards addressing escalating demand for chips drawn by newer technologies including 5G, artificial intelligence, and electric cars.

Gate Driver IC Market News:

June 06, 2024: Infineon Technologies AG launched OPTIGA(TM) Authenticate NBT, a high-performance NFC I2C bridge tag that enables one-tap authentication and secure IoT device design According to the company, it is the only asymmetric cryptography tag on the market as it signs and verifies the activities, and type by NFC platform Verified 4 tags.

April 19, 2024: Hitachi Power Semiconductor Device Ltd & Sagar Semiconductors Pvt. signed a memorandum of understanding to collaborate in marketing high-power devices, including IGBTs and SiC as well as new product development and technology transfer related to high voltage diode. This collaboration is an effort to further strengthen the semiconductor ecosystem in India and supports the 'Make-in-India' initiative.

Key Questions Answered in This Report:

• How has the global gate driver IC market performed so far, and how will it perform in the coming years?
• What are the drivers, restraints, and opportunities in the global gate driver IC market?
• What is the impact of each driver, restraint, and opportunity on the global gate driver IC market?
• What are the key regional markets?
• Which countries represent the most attractive gate driver IC market?
• What is the breakup of the market based on the transistor type?
• Which is the most attractive transistor type in the gate driver IC market?
• What is the breakup of the market based on the semiconductor material?
• Which is the most attractive semiconductor material in the gate driver IC market?
• What is the breakup of the market based on the mode of attachment?
• Which is the most attractive mode of attachment in the gate driver IC market?
• What is the breakup of the market based on the isolation technique?
• Which is the most attractive isolation technique in the gate driver IC market?
• What is the breakup of the market based on the application?
• Which is the most attractive application in the gate driver IC market?
• What is the competitive structure of the market?
• Who are the key players/companies in the global gate driver IC market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Gate Driver IC Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Transistor Type

• 6.1 MOSFET
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 IGBT
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast

7 Market Breakup by Semiconductor Material

• 7.1 Si
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 SiC
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 GaN
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast

8 Market Breakup by Mode of Attachment

• 8.1 On-Chip
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Discrete
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast

9 Market Breakup by Isolation Technique

• 9.1 Magnetic Isolation
  • 9.1.1 Market Trends
  • 9.1.2 Market Forecast
• 9.2 Capacitive Isolation
  • 9.2.1 Market Trends
  • 9.2.2 Market Forecast
• 9.3 Optical Isolation
  • 9.3.1 Market Trends
  • 9.3.2 Market Forecast

10 Market Breakup by Application

• 10.1 Residential
  • 10.1.1 Market Trends
  • 10.1.2 Market Forecast
• 10.2 Industrial
  • 10.2.1 Market Trends
  • 10.2.2 Market Forecast
• 10.3 Commercial
  • 10.3.1 Market Trends
  • 10.3.2 Market Forecast

11 Market Breakup by Region

• 11.1 North America
  • 11.1.1 United States
    • 11.1.1.1 Market Trends
    • 11.1.1.2 Market Forecast
  • 11.1.2 Canada
    • 11.1.2.1 Market Trends
    • 11.1.2.2 Market Forecast
• 11.2 Asia-Pacific
  • 11.2.1 China
    • 11.2.1.1 Market Trends
    • 11.2.1.2 Market Forecast
  • 11.2.2 Japan
    • 11.2.2.1 Market Trends
    • 11.2.2.2 Market Forecast
  • 11.2.3 India
    • 11.2.3.1 Market Trends
    • 11.2.3.2 Market Forecast
  • 11.2.4 South Korea
    • 11.2.4.1 Market Trends
    • 11.2.4.2 Market Forecast
  • 11.2.5 Australia
    • 11.2.5.1 Market Trends
    • 11.2.5.2 Market Forecast
  • 11.2.6 Indonesia
    • 11.2.6.1 Market Trends
    • 11.2.6.2 Market Forecast
  • 11.2.7 Others
    • 11.2.7.1 Market Trends
    • 11.2.7.2 Market Forecast
• 11.3 Europe
  • 11.3.1 Germany
    • 11.3.1.1 Market Trends
    • 11.3.1.2 Market Forecast
  • 11.3.2 France
    • 11.3.2.1 Market Trends
    • 11.3.2.2 Market Forecast
  • 11.3.3 United Kingdom
    • 11.3.3.1 Market Trends
    • 11.3.3.2 Market Forecast
  • 11.3.4 Italy
    • 11.3.4.1 Market Trends
    • 11.3.4.2 Market Forecast
  • 11.3.5 Spain
    • 11.3.5.1 Market Trends
    • 11.3.5.2 Market Forecast
  • 11.3.6 Russia
    • 11.3.6.1 Market Trends
    • 11.3.6.2 Market Forecast
  • 11.3.7 Others
    • 11.3.7.1 Market Trends
    • 11.3.7.2 Market Forecast
• 11.4 Latin America
  • 11.4.1 Brazil
    • 11.4.1.1 Market Trends
    • 11.4.1.2 Market Forecast
  • 11.4.2 Mexico
    • 11.4.2.1 Market Trends
    • 11.4.2.2 Market Forecast
  • 11.4.3 Others
    • 11.4.3.1 Market Trends
    • 11.4.3.2 Market Forecast
• 11.5 Middle East and Africa
  • 11.5.1 Market Trends
  • 11.5.2 Market Breakup by Country
  • 11.5.3 Market Forecast

12 SWOT Analysis

• 12.1 Overview
• 12.2 Strengths
• 12.3 Weaknesses
• 12.4 Opportunities
• 12.5 Threats

13 Value Chain Analysis

14 Porters Five Forces Analysis

• 14.1 Overview
• 14.2 Bargaining Power of Buyers
• 14.3 Bargaining Power of Suppliers
• 14.4 Degree of Competition
• 14.5 Threat of New Entrants
• 14.6 Threat of Substitutes

15 Price Analysis

16 Competitive Landscape

• 16.1 Market Structure
• 16.2 Key Players
• 16.3 Profiles of Key Players
  • 16.3.1 Hitachi Power Semiconductor Device Ltd. (Hitachi Ltd.)
    • 16.3.1.1 Company Overview
    • 16.3.1.2 Product Portfolio
  • 16.3.2 Infineon Technologies AG
    • 16.3.2.1 Company Overview
    • 16.3.2.2 Product Portfolio
    • 16.3.2.3 Financials
    • 16.3.2.4 SWOT Analysis
  • 16.3.3 Microchip Technology Inc.
    • 16.3.3.1 Company Overview
    • 16.3.3.2 Product Portfolio
    • 16.3.3.3 Financials
    • 16.3.3.4 SWOT Analysis
  • 16.3.4 Mouser Electronics (TTI Inc., Berkshire Hathaway Inc.)
    • 16.3.4.1 Company Overview
    • 16.3.4.2 Product Portfolio
  • 16.3.5 NXP Semiconductors N.V.
    • 16.3.5.1 Company Overview
    • 16.3.5.2 Product Portfolio
    • 16.3.5.3 Financials
    • 16.3.5.4 SWOT Analysis
  • 16.3.6 Onsemi
    • 16.3.6.1 Company Overview
    • 16.3.6.2 Product Portfolio
    • 16.3.6.3 Financials
    • 16.3.6.4 SWOT Analysis
  • 16.3.7 Renesas Electronics Corporation
    • 16.3.7.1 Company Overview
    • 16.3.7.2 Product Portfolio
    • 16.3.7.3 Financials
    • 16.3.7.4 SWOT Analysis
  • 16.3.8 Rohm Semiconductor
    • 16.3.8.1 Company Overview
    • 16.3.8.2 Product Portfolio
    • 16.3.8.3 Financials
    • 16.3.8.4 SWOT Analysis
  • 16.3.9 Semtech Corporation
    • 16.3.9.1 Company Overview
    • 16.3.9.2 Product Portfolio
    • 16.3.9.3 Financials
  • 16.3.10 STMicroelectronics
    • 16.3.10.1 Company Overview
    • 16.3.10.2 Product Portfolio
  • 16.3.11 Texas Instruments Incorporated
    • 16.3.11.1 Company Overview
    • 16.3.11.2 Product Portfolio
    • 16.3.11.3 Financials
    • 16.3.11.4 SWOT Analysis
  • 16.3.12 Toshiba Corporation
    • 16.3.12.1 Company Overview
    • 16.3.12.2 Product Portfolio
    • 16.3.12.3 Financials
    • 16.3.12.4 SWOT Analysis