½ÃÀ庸°í¼­
»óÇ°ÄÚµå
1541170

¼¼°èÀÇ AR/VR Ĩ ½ÃÀå º¸°í¼­ : Ĩ À¯Çü, µð¹ÙÀ̽º À¯Çü, ÃÖÁ¾»ç¿ëÀÚ, Áö¿ªº°(2024-2032³â)

AR/VR Chip Market Report by Chip Type, Device Type, End User, and Region 2024-2032

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: IMARC | ÆäÀÌÁö Á¤º¸: ¿µ¹® 145 Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡Ø º» »óÇ°Àº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

¼¼°èÀÇ AR/VR Ĩ ½ÃÀå ±Ô¸ð´Â 2023³â 44¾ï ´Þ·¯¿¡ ´ÞÇß½À´Ï´Ù. ÇâÈÄ IMARC ±×·ìÀº 2024³âºÎÅÍ 2032³â±îÁöÀÇ º¹ÇÕ ¿¬°£ ¼ºÀå·ü(CAGR)Àº 18.81%¸¦ ³ªÅ¸³¾ Àü¸ÁÀ̸ç 2032³â¿¡´Â 217¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøÇß½À´Ï´Ù. ¼¼°èÀÇ °ÔÀÓ ¹× ¿£ÅÍÅ×ÀθÕÆ® »ê¾÷ÀÇ Á¦Ç° »ç¿ë Áõ°¡, ½º¸¶Æ®Æù ¹× ±âŸ ±â±âÀÇ °ÔÀÓ ±â´É Áõ°¡, ±³À° »ê¾÷ÀÇ Ä¨ ¼ö¿ä Áõ°¡´Â AR/VR Ĩ ½ÃÀåÀ» ÃßÁøÇÏ´Â ¿äÀÎÀÇ ÀϺÎÀÔ´Ï´Ù.

AR/VR Ĩ ½ÃÀå ºÐ¼® :

ÁÖ¿ä ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ: ÈǸ¢ÇÑ °ÔÀÓ Ã¼Çè¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡, ÇコÄÉ¾î ºÐ¾ß¿¡¼­ÀÇ AR/VR ä¿ë Áõ°¡ µîÀÌ ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎÀ¸·Î ²ÅÈü´Ï´Ù.

ÁÖ¿ä ½ÃÀå µ¿Çâ : AI¿Í ¸Ó½Å·¯´× ¾Ë°í¸®ÁòÀÇ ÅëÇÕ Áõ°¡´Â ÁÖ¿ä ½ÃÀå µ¿Çâ Áß ÇϳªÀÔ´Ï´Ù.

Áö¸®Àû µ¿Çâ : ¾Æ½Ã¾ÆÅÂÆò¾çÀº ¸ð¹ÙÀÏ °ÔÀÓ »ê¾÷ÀÇ È®´ë¿¡ °ßÀÎµÇ¾î ½ÃÀåÀ» µ¶Á¡ÇÏ°í ÀÖ½À´Ï´Ù. ¾Æ½Ã¾ÆÅÂÆò¾ç(APAC) Áö¿ªÀº ¼¼°èÀÇ ¸ð¹ÙÀÏ °ÔÀÓ ½ÃÀåÀ» ¼±µµÇßÀ¸¸ç 2023³â¿¡´Â ÃÑ ¸ÅÃâÀÇ 64%¸¦ âÃâÇß½À´Ï´Ù.

°æÀï ±¸µµ: Advanced Micro Devices Inc., Broadcom Inc., Intel Corporation µîÀÌ ÁÖ¿ä ½ÃÀå ±â¾÷ÀÔ´Ï´Ù.

°úÁ¦¿Í ±âȸ: ³ôÀº Á¦Á¶ ºñ¿ëÀÌ ½ÃÀå¿¡ ¸¹Àº °úÁ¦¸¦ °¡Á®¿À°í ÀÖ½À´Ï´Ù. »ý»ê °øÁ¤ÀÇ ±Þ¼ÓÇÑ Çõ½ÅÀº AR/VR Ĩ ½ÃÀå Á¡À¯À²À» ¼±È£ÇÕ´Ï´Ù.

AR/VR Ĩ ½ÃÀå µ¿Çâ :

´Ù¾çÇÑ »ê¾÷¿¡¼­ Á¦Ç° ¼ö¿ä Áõ°¡

Áõ°­Çö½Ç ¹× °¡»óÇö½Ç ¼Ö·ç¼ÇÀº ¹Î°£ Ç×°ø, ¹æÀ§ ¹× º¸¾È, °Ç°­ °ü¸®, µðÁöÅÐ Á¦Á¶, ±³À°, ¿£ÅÍÅ×ÀθÕÆ® µî ´Ù¾çÇÑ »ê¾÷¿¡¼­ ³ôÀº ÀÌ¿ë·üÀ» º¸¿©ÁÝ´Ï´Ù. ±×·¯³ª Áõ°­Çö½Ç,°¡»óÇö½Ç ½ÃÀå¿¡¼­ »ç¾÷À» Àü°³ÇÏ´Â À¯·Â±â¾÷Àº ±¤¾÷, ¼®À¯ ¹× °¡½º, ¿î¼ö µî ´Ù¾çÇÑ »ê¾÷¿¡¼­ Á¸À縦 È®´ëÇϱâ À§ÇØ »ê¾÷º° ¼Ö·ç¼ÇÀÇ µµÀÔ ÁÖ·ÂÀÌ µÉ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. AR/VR ±â¼úÀÇ Ã¤¿ëÀº »ê¾÷, ±³À°, ÇコÄɾî, ¿£ÅÍÅ×ÀθÕÆ® µî ¿©·¯ ºÐ¾ß¿¡¼­ È®´ëµÇ°í ÀÖ½À´Ï´Ù. ¿©·¯ »ê¾÷¿¡¼­ AR°ú VRÀÇ ÀÀ¿ëÀÌ È®´ëµÇ°í Àֱ⠶§¹®¿¡ Àü¿ë Ĩ ¼ö¿ä¿Í AR/VR Ĩ ½ÃÀåÀÇ ¼ºÀåÀÌ Àü¸ÁµË´Ï´Ù.

°ÔÀÓ ºÐ¾ß¿¡¼­ AR/VR Ĩ ¼ö¿ä Áõ°¡

¿¹Ãø±â°£À» ÅëÇØ Áõ°­Çö½Ç ¹× °¡»óÇö½Ç ±â¹Ý °ÔÀÓ ¼ö¿ä°¡ Áõ°¡ÇÏ¿© AR/VR Ĩ ½ÃÀåÀÇ °¡Ä¡¿¡ ±â¿©ÇÕ´Ï´Ù. °ÔÀÓ Àα¸´Â Áö³­ ¸î ³âµ¿¾È Å©°Ô Áõ°¡ÇÏ°í ÀÖ½À´Ï´Ù. Áõ°­Çö½Ç°ú °¡»óÇö½Ç ±â¼úÀÇ °¡Àå ÀϹÝÀûÀÎ ¿ëµµ Áß Çϳª´Â ºñµð¿À °ÔÀÓÀÔ´Ï´Ù. ½Ç¿ëÀûÀÎ Áõ°­Çö½Ç°ú °¡»óÇö½Ç ±â¹Ý ¼Ö·ç¼ÇÀ» »ç¿ëÇÏ¿© ½º¸¶Æ®Æù Á¦Á¶ ¾÷ü´Â Àü¹ÝÀûÀÎ »ç¿ëÀÚ ÀÎÅÍÆäÀ̽º °æÇèÀ» Çâ»ó½ÃÅ°°í ½ÃÀå¿¡¼­ °æÀï ¾÷ü¸¦ ¼±µµÇϱâ À§ÇØ ÈÞ´ëÆù¿¡ Ãß°¡ °ÔÀÓ ±â´ÉÀ» ³»Àå. ¶ÇÇÑ Áõ°­Çö½Ç°ú °¡»óÇö½ÇÀº Çö½Ç ¼¼°èÀÇ ¼³Á¤À» ¸ð¹æÇϱâ À§ÇØ ±â¼ú Áö¿ø Ç÷§ÆûÀ» »ç¿ëÇÏ¿© ±³À° ¹× ±â¼ú °³¹ß¿¡ µµ¿òÀ̵Ǵ ºñ¿ë È¿À²ÀûÀÎ ´ë¾ÈÀ» Á¦°øÇÕ´Ï´Ù.

AR/VR ±â¼ú Çõ½Å

AR/VR ½ÃÀå º¸°í¼­¿¡ µû¸£¸é Áõ°­Çö½Ç°ú °¡»óÇö½Ç ±â¼úÀº °øµ¿ ¼¼¹Ì³ª, ȸÀÇ, °ø°³ °­ÁÂ, ±º»ç ÈÆ·Ã, Ç×°ø ÈÆ·Ã, °£È£,ÀÇ·á Àü¹®°¡ ÈÆ·Ã, ÀÚ±â ÇнÀ ÀýÂ÷ µî¿¡ »ç¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù. °Ô´Ù°¡ ¼±µµ ±â¾÷µéÀº Á¦Ç° °³¹ß¿¡ Áö¼ÓÀûÀ¸·Î ÁöÃâÇÏ¿© ´õ ³ªÀº Á¦Ç°°ú ¼­ºñ½º¸¦ Á¦°øÇÔÀ¸·Î½á Á¦Ç° Çõ½ÅÀ» ¿ì¼±½ÃÇÏ°í ÀÖÀ½À» ¾Ë ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ µðÁöÅÐ Á¦Á¶, ÇコÄɾî, ±³À°, ¿£ÅÍÅ×ÀθÕÆ®, ±º»ç,º¸¾È, ¹Î°£Ç×°ø µî Æø³ÐÀº ¾÷°è°¡ AR/VR ±â¼ú¿¡ Å©°Ô ÀÇÁ¸ÇÏ°í ÀÖ½À´Ï´Ù. ¾÷°è¸¦ ¼±µµÇÏ´Â ¶óÀ̹ú ±â¾÷Àº ¾÷°è¿¡ ƯȭµÈ ¼Ö·ç¼ÇÀÇ ½ÃÀÛ°ú ÃÖ÷´Ü ±â¼ú °³¹ß¿¡ ÁÖ·ÂÇÏ°í ÀÖÀ¸¸ç, AR/VR Ĩ ¼ö¿ä¸¦ ÃËÁøÇÏ°í ÀÖ½À´Ï´Ù.

AR/VR Ĩ ½ÃÀå ¼¼ºÐÈ­:

IMARC GroupÀº 2024³âºÎÅÍ 2032³â±îÁö ¼¼°èÀÇ, Áö¿ª ¹× ±¹°¡ Â÷¿øÀÇ ¿¹Ãø°ú ÇÔ²² ½ÃÀåÀÇ °¢ ºÎ¹®¿¡¼­ ÁÖ¿ä µ¿Ç⠺м®À» Á¦°øÇÕ´Ï´Ù. ¶ÇÇÑ Ä¨ À¯Çü, µð¹ÙÀ̽º À¯Çü, ÃÖÁ¾ »ç¿ëÀÚº°·Î ½ÃÀåÀ» ºÐ·ùÇÏ°í ÀÖ½À´Ï´Ù.

Ĩ À¯Çüº° ³»¿ª

ÇÁ·Î¼¼¼­ IC

»ç¿ëÀÚ ÀÎÅÍÆäÀ̽º IC

ÆÄ¿ö ¸Å´ÏÁö¸ÕÆ® IC

ÇÁ·Î¼¼¼­ IC°¡ ½ÃÀåÀ» ¼®±Ç

º» º¸°í¼­¿¡¼­´Â Ĩ À¯Çüº°·Î ½ÃÀåÀ» »ó¼¼ÇÏ°Ô ±¸ºÐ,ºÐ¼®Çß½À´Ï´Ù. ¿©±â¿¡´Â ÇÁ·Î¼¼¼­ IC, »ç¿ëÀÚ ÀÎÅÍÆäÀ̽º IC, ÆÄ¿ö ¸Å´ÏÁö¸ÕÆ® IC°¡ Æ÷ÇԵ˴ϴÙ. ÀÌ¿¡ µû¸£¸é ÇÁ·Î¼¼¼­ IC´Â °¡Àå Å« ºÎ¹®À» Â÷ÁöÇÕ´Ï´Ù.

ÇÁ·Î¼¼¼­ IC´Â AR/VR Ĩ ½ÃÀåÀÇ ¼öÀÍÀ» µ¶Á¡ÇÏ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Ä¨ÀÌ Á¦°øÇÏ´Â ±â´ÉÀº ´Ù¸¥ ÀÓº£µðµå ½Ã½ºÅÛ¿¡ ºñÇØ ¸Å¿ì È¿À²ÀûÀ̸ç, ÀÌ ºÎ¹®ÀÇ È®Àå¿¡ ¹ÚÂ÷¸¦ °¡ÇÏ°í ÀÖ½À´Ï´Ù. Àü¿ø °ü¸®¿ë ÁýÀû ȸ·Î(IC)´Â ÀÓº£µðµå ½Ã½ºÅÛ, ü³»¿¡ ³»ÀåÇÏ´Â ÀÇ·á±â±â, ½º¸¶Æ® °¡Àü, ¸®¸ðÄÁ, ÀÚµ¿Â÷ÀÇ ¿£Áø Á¦¾î ½Ã½ºÅÛ µî ÀÚµ¿ µ¿ÀÛÇÏ´Â »óÇ°À̳ª °¡Á¬¿¡ žÀçµÇ¾î ÀÖ½À´Ï´Ù. ¼ÒÇü ¸¶ÀÌÅ©·ÎÄÁÆ®·Ñ·¯´Â ¸Þ¸ð¸®, Áß¾Ó ¿¬»êó¸®ÀåÄ¡(CPU), ÀÔÃâ·Â ÁÖº¯±â±â µî Áß¿äÇÑ ±¸¼º¿ä¼Ò¸¦ ¸ðµÎ 1ĨÀ¸·Î ±¸¼ºÇϹǷΠµ¿ÀÏÇÑ °ÍÀ¸·Î ±¸¼ºµÇ¾î ½Ã½ºÅÛ ºñ¿ë Àý°¨À¸·Î À̾îÁý´Ï´Ù. ±× °á°ú Á¦Á¶ ºñ¿ëÀÌ Àý°¨µÇ°í È¿À²ÀÌ Çâ»óµÇ¾úÀ¸¸ç AR/VR Ĩ ½ÃÀå °³¿ä¿¡ À¯ÀÍÇÑ °ÍÀ¸·Î ÀÔÁõµÇ¾ú½À´Ï´Ù.

±â±â À¯Çüº° ³»¿ª:

Çìµå ¸¶¿îÆ® µð½ºÇ÷¹ÀÌ

Á¦½ºÃ³ ÃßÀû ÀåÄ¡

ÇÁ·ÎÁ§ÅÍ ¹× µð½ºÇ÷¹ÀÌ º®

Çìµå¾÷ µð½ºÇ÷¹ÀÌ

ÇÚµåÇïµå µð¹ÙÀ̽º

Çìµå ¸¶¿îÆ® µð½ºÇ÷¹ÀÌ°¡ ÃÖ´ë °øÀ¯

ÀÌ º¸°í¼­´Â ÀåÄ¡ À¯ÇüÀ» ±â¹ÝÀ¸·Î ½ÃÀåÀÇ »ó¼¼ÇÑ ºÐ·ù¿Í ºÐ¼®À» ¼öÇàÇÕ´Ï´Ù. ¿©±â¿¡´Â Çìµå ¸¶¿îÆ® µð½ºÇ÷¹ÀÌ, Á¦½ºÃ³ ÃßÀû ÀåÄ¡, ÇÁ·ÎÁ§ÅÍ ¹× µð½ºÇ÷¹ÀÌ º®, Çìµå¾÷ µð½ºÇ÷¹ÀÌ, ÇÚµåÇïµå ÀåÄ¡°¡ Æ÷ÇԵ˴ϴÙ. ÀÌ º¸°í¼­¿¡ µû¸£¸é Çìµå ¸¶¿îÆ® µð½ºÇ÷¹ÀÌ´Â °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÕ´Ï´Ù.

AR/VR Ĩ ½ÃÀå Á¶»ç¿¡ µû¸£¸é Çìµå ¸¶¿îÆ® µð½ºÇ÷¹ÀÌ°¡ ½ÃÀåÀ» ¼®±ÇÇÏ°í ÀÖ½À´Ï´Ù. ÀÏ¹Ý º¸±â °¢µµ¸¦ º¯°æÇÏÁö ¾Ê°í »ç¿ëÀÚ¿¡°Ô Á¤º¸¿Í µ¥ÀÌÅ͸¦ Ç¥½ÃÇÏ´Â Åõ¸íÇÑ µð½ºÇ÷¹À̸¦ Çìµå ¸¶¿îÆ® µð½ºÇ÷¹ÀÌ ¶Ç´Â Çìµå¾÷ µð½ºÇ÷¹ÀÌ, HUD¶ó°í ÇÕ´Ï´Ù. ±º°ú °æÂûÀº Çìµå ¸¶¿îÆ® µð½ºÇ÷¹À̸¦ ³Î¸® »ç¿ëÇÏ°í ÀÖÀ¸¸ç, ÀÌ´Â ½ÃÀå È®´ë¸¦ µÞ¹ÞħÇÏ°í ÀÖ½À´Ï´Ù. ÇÑÆí, ¿¹Ãø ±â°£ µ¿¾È º¹ÇÕ ¿¬°£ ¼ºÀå·ü(CAGR)ÀÌ °¡Àå ºü¸£°Ô ¼ºÀåÇÏ´Â °ÍÀº Çìµå¾÷ µð½ºÇ÷¹ÀÌ ºÐ¾ßÀÔ´Ï´Ù. ÀÌ´Â ¼ÒºñÀÚ°¡ Áß´Ü ¾øÀÌ µ¥ÀÌÅ͸¦ º¼ ¼ö Àִ Ư¼º¿¡ ÀÇÇØ ¼³¸íµË´Ï´Ù.

ÃÖÁ¾ »ç¿ëÀÚº° ºÐ·ù:

°ÔÀÓ

¿£ÅÍÅ×ÀθÕÆ® ¹× ¹Ìµð¾î

Ç×°ø¿ìÁÖ ¹× ¹æÀ§

°Ç°­ °ü¸®

±âŸ

°ÔÀÓ ½ÃÀåÀÌ ÃÖ´ë Á¡À¯À²

ÀÌ º¸°í¼­´Â ÃÖÁ¾ »ç¿ëÀÚº° ½ÃÀå ºÐ¼® ¹× ºÐ¼®µµ ÀÚ¼¼È÷ ¼³¸íÇÕ´Ï´Ù. ¿©±â¿¡´Â °ÔÀÓ, ¿£ÅÍÅ×ÀθÕÆ® ¹Ìµð¾î, ¿ìÁÖ Ç×°ø ¹× ¹æ¾î, °Ç°­ °ü¸® µîÀÌ Æ÷ÇԵ˴ϴÙ. ÀÌ º¸°í¼­¿¡ µû¸£¸é °ÔÀÓÀº °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÕ´Ï´Ù.

Á¶»ç º¸°í¼­ ¡¸AR/VRĨ ½ÃÀ塹¿¡ ÀÇÇϸé, ½ÃÀåÀº °ÔÀÓ ºÐ¾ß°¡ Áö¹èÇÏ°í ÀÖ½À´Ï´Ù. ¹Ð·¹´Ï¾ó ¼¼´ë »çÀÌ¿¡´Â °¡»óÇö½ÇÀ̳ª Áõ°­Çö½Ç ±â¼ú°ú ¿¬µ¿ÇÏ´Â ÀüÀÚ °ÔÀÓÀÌ ÀαâÀÔ´Ï´Ù. µðÁöÅÐ Ç÷§ÆûÀ» ÅëÇØ ¼ÒºñÀÚ´Â AR/VR ±â¼ú ´öºÐ¿¡ °ÔÀÓÀÇ ¼¼°èÀǸ¦ ¸®¾óÇÏ°Ô Ã¼ÇèÇÒ ¼ö ÀÖ½À´Ï´Ù. ±× °á°ú, »ý»êÀÚ´Â »óÇ°ÀÇ AR/VR ´ëÀÀ¿¡ ³ôÀº ¿ì¼±¼øÀ§¸¦ µÎ°í ÀÖ½À´Ï´Ù. AR/VR Ĩ¿¡ ´ëÇÑ °ÔÀÓ ¾÷°èÀÇ ¿ä±¸ Áõ°¡, Áõ°­Çö½Ç ¹× °¡»óÇö½Ç ±â¹Ý ¼Ö·ç¼ÇÀÇ Àú·ÅÇÑ °¡°Ý, ´Ù¾çÇÑ ¿ëµµ¿¡¼­ÀÇ ±â¼úÀÇ ½Å¼ÓÇÑ Ã¤¿ëÀÌ AR/VR Ĩ ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎÀÌ µÇ°í ÀÖ½À´Ï´Ù.

Áö¿ªº° ºÐ¼®

ºÏ¹Ì

¹Ì±¹

ij³ª´Ù.

¾Æ½Ã¾ÆÅÂÆò¾ç

Áß±¹

ÀϺ»

Àεµ

Çѱ¹

È£ÁÖ

Àεµ³×½Ã¾Æ

±âŸ

À¯·´

µ¶ÀÏ

ÇÁ¶û½º

¿µ±¹

ÀÌÅ»¸®¾Æ

½ºÆäÀÎ

·¯½Ã¾Æ

±âŸ

¶óƾ¾Æ¸Þ¸®Ä«

ºê¶óÁú

¸ß½ÃÄÚ

±âŸ

Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

¾Æ½Ã¾ÆÅÂÆò¾çÀÌ ½ÃÀåÀ» ¼±µµÇÏ°í ÃÖ´ë AR/VR Ĩ ½ÃÀå Á¡À¯À²À» Â÷Áö

ÀÌ Á¶»ç º¸°í¼­´Â ºÏ¹Ì(¹Ì±¹, ij³ª´Ù), ¾Æ½Ã¾ÆÅÂÆò¾ç(Áß±¹, ÀϺ», Àεµ, Çѱ¹, È£ÁÖ, Àεµ³×½Ã¾Æ µî), À¯·´(µ¶ÀÏ, ÇÁ¶û½º, ¿µ±¹, ÀÌÅ»¸®¾Æ, ½ºÆäÀÎ, ·¯½Ã¾Æ, ±âŸ), ¶óƾ¾Æ¸Þ¸®Ä«( ºê¶óÁú, ¸ß½ÃÄÚ µî)°ú Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«¸¦ Æ÷ÇÔÇÑ ¸ðµç ÁÖ¿ä Áö¿ª ½ÃÀåÀÇ Á¾ÇÕÀûÀÎ ºÐ¼®µµ Á¦°øÇÕ´Ï´Ù. º¸°í¼­¿¡ µû¸£¸é ¾Æ½Ã¾ÆÅÂÆò¾çÀº °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÕ´Ï´Ù.

½ÃÀåÀº ¾Æ½Ã¾ÆÅÂÆò¾çÀÌ Áö¹èÇÏ°í ÀÖ½À´Ï´Ù. ÀÌ Áö¿ªÀÇ ÀÌÁ¡Àº ¼ÒºñÀÚÀÇ ¿Â¶óÀÎ ÇнÀ, ÀÇ·á ¹× ±³À°À» À§ÇÑ °¡»óÇö½Ç ±â¼úÀÇ È°¿ëÀ» °­Á¶ÇÏ°í Àֱ⠶§¹®ÀÔ´Ï´Ù. °Ô´Ù°¡ Àεµ¿Í °°Àº ±¹°¡µéÀÌ ´Ù¾çÇÑ »ê¾÷¿¡ ½Å±â¼úÀ» µµÀÔÇÏ·Á°í ÇÏ´Â °Íµµ Áß¿äÇϸç, ¾Æ½Ã¾ÆÅÂÆò¾çÀÌ ¿¹Ãø ±â°£À» ÅëÇØ AR/VR Ĩ ½ÃÀå¿¡¼­ ´õ ºü¸¥ ¼ºÀå·üÀ» ¸ñ°ÝÇÒ °ÍÀÓ ¸¦ Á¦¾ÈÇÕ´Ï´Ù. ÀÌ Áö¿ªÀº Á¤ºÎ, ¹°·ù, ÁÖÅÃ, »ó¾÷, ¿î¼Û µî ¸¹Àº ºÐ¾ß¿¡¼­ ÃֽŠ±â¼úÀ» äÅÃÇÑ °á°ú ¼ºÀåÇØ ¿Ô½À´Ï´Ù. ±¤¼¶À¯ ÄÉÀ̺í°ú µðÁöÅÐ ¼­ºñ½ºÀÇ Ã¤¿ëÀÌ Áõ°¡ÇÔ¿¡ µû¶ó AR/VR Ĩ ½ÃÀå Àü¸ÁÀº ´õ¿í È®´ëµÇ¾ú½À´Ï´Ù.

ÀÌ º¸°í¼­¿¡¼­ ´Ù·ç´Â ÁÖ¿ä Áú¹®

  • 2023³â ¼¼°èÀÇ AR/VRĨ ½ÃÀå ±Ô¸ð´Â?
  • 2024-2032³â¿¡ À־ÀÇ AR/VRĨ ½ÃÀå ¼ºÀå·üÀº?
  • ¼¼°èÀÇ AR/VR Ĩ ½ÃÀåÀ» °ßÀÎÇÏ´Â ÁÖ¿äÀÎÀº ¹«¾ùÀΰ¡?
  • ¼¼°èÀÇ AR/VR Ĩ ½ÃÀå¿¡ ´ëÇÑ COVID-19ÀÇ ¿µÇâÀº?
  • ¼¼°èÀÇ AR/VRĨ ½ÃÀåÀÇ Ä¨ À¯Çüº° ³»¿ªÀº?
  • ¼¼°èÀÇ AR/VRĨ ½ÃÀåÀÇ µð¹ÙÀ̽º À¯Çüº° ±¸¼ººñ´Â?
  • ¼¼°èÀÇ AR/VRĨ ½ÃÀåÀÇ ÃÖÁ¾ »ç¿ëÀÚº° ³»¿ªÀº?
  • AR/VR Ĩ ½ÃÀåÀÇ ÁÖ¿ä Áö¿ªÀº?
  • ¼¼°èÀÇ AR/VR Ĩ ½ÃÀåÀÇ ÁÖ¿ä ±â¾÷Àº?

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹üÀ§¿Í Á¶»ç ¹æ¹ý

  • Á¶»çÀÇ ¸ñÀû
  • ÀÌÇØ°ü°èÀÚ
  • µ¥ÀÌÅÍ ¼Ò½º
    • 1Â÷ Á¤º¸
    • 2Â÷ Á¤º¸
  • ½ÃÀå ÃßÁ¤
    • »óÇâ½Ä Á¢±Ù
    • ÇÏÇâ½Ä Á¢±Ù
  • Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ¼Ò°³

  • °³¿ä
  • ÁÖ¿ä ¾÷°è µ¿Çâ

Á¦5Àå ¼¼°èÀÇ AR/VR Ĩ ½ÃÀå

  • ½ÃÀå °³¿ä
  • ½ÃÀå ½ÇÀû
  • COVID-19ÀÇ ¿µÇâ
  • ½ÃÀå ¿¹Ãø

Á¦6Àå ½ÃÀå ºÐ¼® : Ĩ À¯Çüº°

  • ÇÁ·Î¼¼¼­ IC
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • »ç¿ëÀÚ ÀÎÅÍÆäÀ̽º IC
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Àü¿ø °ü¸® IC
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø

Á¦7Àå ½ÃÀå ºÐ¼® : µð¹ÙÀ̽º À¯Çüº°

  • Çìµå ¸¶¿îÆ® µð½ºÇ÷¹ÀÌ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Á¦½ºÃ³ ÃßÀû ÀåÄ¡
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ÇÁ·ÎÁ§ÅÍ¿Í µð½ºÇ÷¹ÀÌ º®
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Çìµå¾÷ µð½ºÇ÷¹ÀÌ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ÇÚµåÇïµå µð¹ÙÀ̽º
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø

Á¦8Àå ½ÃÀå ºÐ¼® : ÃÖÁ¾»ç¿ëÀÚº°

  • °ÔÀÓ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ¿£ÅÍÅ×ÀθÕÆ® ¹× ¹Ìµð¾î
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • Ç×°ø¿ìÁÖ ¹× ¹æ¾î
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ÇコÄɾî
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø
  • ±âŸ
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ¿¹Ãø

Á¦9Àå ½ÃÀå ºÐ¼® : Áö¿ªº°

  • ºÏ¹Ì
    • ¹Ì±¹
    • ij³ª´Ù
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • Áß±¹
    • ÀϺ»
    • Àεµ
    • Çѱ¹
    • È£ÁÖ
    • Àεµ³×½Ã¾Æ
    • ±âŸ
  • À¯·´
    • µ¶ÀÏ
    • ÇÁ¶û½º
    • ¿µ±¹
    • ÀÌÅ»¸®¾Æ
    • ½ºÆäÀÎ
    • ·¯½Ã¾Æ
    • ±âŸ
  • ¶óƾ¾Æ¸Þ¸®Ä«
    • ºê¶óÁú
    • ¸ß½ÃÄÚ
    • ±âŸ
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«
    • ½ÃÀå µ¿Çâ
    • ½ÃÀå ºÐ¼® : ±¹°¡º°
    • ½ÃÀå ¿¹Ãø

Á¦10Àå SWOT ºÐ¼®

  • °³¿ä
  • °­Á¡
  • ¾àÁ¡
  • ±âȸ
  • À§Çù

Á¦11Àå ¹ë·ùüÀÎ ºÐ¼®

Á¦12Àå Porter's Five Forces ºÐ¼®

  • °³¿ä
  • ±¸¸ÅÀÚÀÇ Çù»ó·Â
  • °ø±Þ±â¾÷ÀÇ Çù»ó·Â
  • °æÀïµµ
  • ½Å±Ô ÁøÀÔ¾÷ÀÚÀÇ À§Çù
  • ´ëüǰÀÇ À§Çù

Á¦13Àå °¡°Ý ºÐ¼®

Á¦14Àå °æÀï ±¸µµ

  • ½ÃÀå ±¸Á¶
  • ÁÖ¿ä ±â¾÷
  • ÁÖ¿ä ±â¾÷ ÇÁ·ÎÆÄÀÏ
    • Advanced Micro Devices Inc.
    • Broadcom Inc.
    • Intel Corporation
    • MediaTek Inc.
    • Nvidia Corporation
    • Qualcomm Incorporated
    • Spectra7 Microsystems
BJH 24.09.12

The global AR/VR chip market size reached US$ 4.4 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 21.7 Billion by 2032 exhibiting a growth rate (CAGR) of 18.81% during 2024-2032. The rising product use in the gaming and entertainment industries across the globe, the rising number of gaming features in smartphones and other devices, and the growing chip demand in the education industry are some of the factors propelling the AR/VR chip market.

AR/VR Chip Market Analysis:

Major Market Drivers: The increasing demand for amazing gaming experiences and the rising adoption of AR/VR in healthcare sector are some of the major market drivers.

Key Market Trends: The increasing integration of AI and machine learning algorithms is one of the key market trends.

Geographical Trends: Asia Pacific is dominating the market, driven by the expanding mobile gaming industry. The Asia-Pacific (APAC) region led the global mobile gaming market and generated 64% of total revenue in 2023.

Competitive Landscape: Advanced Micro Devices Inc., Broadcom Inc., and Intel Corporation are some of the key market players.

Challenges and Opportunities: High manufacturing costs are posing many challenges for the market. Rapid innovation in production processes is an opportunity for the AR/VR chip market share.

AR/VR Chip Market Trends:

Increasing product demand in various industries

Augmented and virtual reality solutions find high usage in various industries such as civil aviation, defense & security, healthcare, digital manufacturing, education, and entertainment. However, prominent players operating in the augmented and virtual reality market are projected to concentrate on the introduction of industry-specific solutions to expand their presence across various industries such as mining, oil & gas, and transportation. The adoption of AR/VR technology is growing in several sectors, such as industry, education, healthcare, and entertainment. With the growing application of AR and VR across multiple industries, specialized chips are expected to see a rise in demand and AR/VR chip market growth.

Rising demand for AR/VR chips in the gaming sector

Throughout the projected period, there will be a rise in demand for augmented and virtual reality-based games, which will contribute to the AR/VR chip market value. The population of gamers has grown significantly in the last several years. One of the most popular uses of augmented and virtual reality technologies is in video games. Using workable augmented and virtual reality-based solutions, smartphone manufacturing companies are also incorporating extra gaming capabilities into their handsets to improve the overall user interface experience and stay ahead of their competitors in the market. Furthermore, as augmented and virtual reality use technology-enabled platforms to imitate real-world settings, they offer a helpful, cost-effective substitute for training and skill development.

Technological Innovations in AR/VR

According to the AR/VR market report, augmented and virtual reality technology can be used for collaborative seminars, meetings, public lectures, military training, aviation training, nursing and medical professional training, and self-learning procedures. Additionally, it is seen that major companies are prioritizing product innovation by continuing to spend on product development to provide better products or services. Additionally, a wide range of industries, including digital manufacturing, healthcare, education, entertainment, military and security, and civil aviation, rely significantly on AR/VR technologies. Leading industry rivals are concentrating on launching industry-specific solutions and developing cutting-edge technologies, thus driving AR/VR chip demand.

AR/VR Chip Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the global, regional, and country levels for 2024-2032. Our report has categorized the market based on chip type, device type, and end user.

Breakup by Chip Type:

Processor ICs

User Interface ICs

Power Management IC

Processor ICs dominate the market

The report has provided a detailed breakup and analysis of the market based on the chip type. This includes processor ICs, user interface ICs, and power management IC. According to the report, processor ICs represented the largest segment.

Processor ICs are dominating the AR/VR chip market revenue. The features offered by these chips have made them extremely efficient in comparison to other embedded systems, which has fueled the segment's expansion. Integrated circuits for power management (ICs) are found in automatic-operating goods and gadgets, including embedded systems, medical devices implanted in the body, smart appliances, remote controls, and automotive engine control systems. Smaller microcontrollers consist of the same and result in lower system costs as a single chip consists of all the vital components, including memory, a central processing unit (CPU), and input/output peripherals. This results in reduced manufacturing costs and improved efficiency which proves beneficial for the AR/VR chip market overview.

Breakup by Device Type:

Head Mounted Display

Gesture Tracking Device

Projector and Display Wall

Head Up Display

Handheld Device

Head mounted display holds the largest share in the market

A detailed breakup and analysis of the market based on the device type have also been provided in the report. This includes head mounted display, gesture tracking device, projector and display wall, head up display, and handheld device. According to the report, head mounted display accounted for the largest market share.

According to AR/VR chip market research, head mounted display is dominating the market. A transparent display that shows information or data to the user without requiring them to change their normal viewing angles is called a head mounted display, or heads-up display, or HUD. The military and police use head-mounted displays extensively, which fuels the market's expansion. On the other side, throughout the course of the forecast period, the head-up display segment would see the fastest CAGR growth. This is explained by its characteristics, which let consumers view data without being interrupted.

Breakup by End User:

Gaming

Entertainment and Media

Aerospace and Defense

Healthcare

Others

Gaming holds the maximum share in the market

A detailed breakup and analysis of the market based on the end user have also been provided in the report. This includes gaming, entertainment and media, aerospace and defense, healthcare, and others. According to the report, gaming accounted for the largest market share.

The AR/VR chip market research report shows that the market is dominated by the gaming sector. Among millennials, electronic games that work with virtual and augmented reality technologies are popular. Through a digital platform, consumers can experience the gaming world in real life thanks to AR/VR technology. Consequently, producers have placed a high priority on the AR/VR compatibility of their goods. The gaming industry's increasing need for AR/VR chips, the affordability of augmented and virtual reality-based solutions, and the technology's quick adoption across a range of applications are driving factors in the AR/VR chip market.

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific leads the market, accounting for the largest AR/VR chip market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

The market is being dominated by Asia Pacific. The dominance of this region stems from its emphasis on using virtual reality technology for consumer online learning, medical care, and training. Moreover, it is significant that nations like India are about to introduce new technologies into a range of industries, suggesting that the Asia Pacific area would probably witness a quicker rate of growth in the AR/VR chip market throughout the forecast period. The region has grown as a result of modern technology being adopted by many sectors, including government, logistics, residential and commercial, and transportation. The increased adoption of fiber optic cables and digital services has expanded the AR/VR chip market outlook further.

Competitive Landscape:

The market research report has provided a comprehensive analysis of the competitive landscape. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

Advanced Micro Devices Inc.

Broadcom Inc.

Intel Corporation

MediaTek Inc.

Nvidia Corporation

Qualcomm Incorporated

Spectra7 Microsystems

(Please note that this is only a partial list of the key players, and the complete list is provided in the report.)

The reports discuss both organic and inorganic growth methods along with significant advances in the AR and VR chip market. Many businesses are concentrating on organic growth tactics including product releases, approvals, and other methods like patents and events. The market saw partnerships and collaborations as well as acquisitions as inorganic growth tactics. For instance, Infosys and NVIDIA partnered to develop generative AI solutions to increase productivity across a range of industries. As part of the partnership, 50,000 Infosys staff members will receive AI training from NVIDIA at a new facility. The market participants' consumer base and business have grown as a result of these actions. Due to the growing demand for AR and VR chips in the global industry, market participants in the AR and VR chip sectors are expected to have profitable growth prospects in the future.

AR/VR Chip Market News:

April 16, 2024: Advanced Micro Devices Inc. expanded the commercial AI PC portfolio to deliver leadership performance across professional mobile and desktop systems.

April 9, 2024: Broadcom and Google Cloud announced an expanded partnership to help accelerate innovation for enterprises.

April 23, 2024: Intel announced its plans for an initial investment of more than $20 billion in the construction of two new leading-edge chip factories in Licking County, Ohio.

Key Questions Answered in This Report

  • 1. What was the size of the global AR/VR chip market in 2023?
  • 2. What is the expected growth rate of the global AR/VR chip market during 2024-2032?
  • 3. What are the key factors driving the global AR/VR chip market?
  • 4. What has been the impact of COVID-19 on the global AR/VR chip market?
  • 5. What is the breakup of the global AR/VR chip market based on the chip type?
  • 6. What is the breakup of the global AR/VR chip market based on the device type?
  • 7. What is the breakup of the global AR/VR chip market based on the end user?
  • 8. What are the key regions in the global AR/VR chip market?
  • 9. Who are the key players/companies in the global AR/VR chip market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global AR/VR Chip Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Chip Type

  • 6.1 Processor ICs
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 User Interface ICs
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 Power Management IC
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast

7 Market Breakup by Device Type

  • 7.1 Head Mounted Display
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Gesture Tracking Device
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Projector and Display Wall
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Head Up Display
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Handheld Device
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast

8 Market Breakup by End User

  • 8.1 Gaming
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Entertainment and Media
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Aerospace and Defense
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Healthcare
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 Others
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast

9 Market Breakup by Region

  • 9.1 North America
    • 9.1.1 United States
      • 9.1.1.1 Market Trends
      • 9.1.1.2 Market Forecast
    • 9.1.2 Canada
      • 9.1.2.1 Market Trends
      • 9.1.2.2 Market Forecast
  • 9.2 Asia-Pacific
    • 9.2.1 China
      • 9.2.1.1 Market Trends
      • 9.2.1.2 Market Forecast
    • 9.2.2 Japan
      • 9.2.2.1 Market Trends
      • 9.2.2.2 Market Forecast
    • 9.2.3 India
      • 9.2.3.1 Market Trends
      • 9.2.3.2 Market Forecast
    • 9.2.4 South Korea
      • 9.2.4.1 Market Trends
      • 9.2.4.2 Market Forecast
    • 9.2.5 Australia
      • 9.2.5.1 Market Trends
      • 9.2.5.2 Market Forecast
    • 9.2.6 Indonesia
      • 9.2.6.1 Market Trends
      • 9.2.6.2 Market Forecast
    • 9.2.7 Others
      • 9.2.7.1 Market Trends
      • 9.2.7.2 Market Forecast
  • 9.3 Europe
    • 9.3.1 Germany
      • 9.3.1.1 Market Trends
      • 9.3.1.2 Market Forecast
    • 9.3.2 France
      • 9.3.2.1 Market Trends
      • 9.3.2.2 Market Forecast
    • 9.3.3 United Kingdom
      • 9.3.3.1 Market Trends
      • 9.3.3.2 Market Forecast
    • 9.3.4 Italy
      • 9.3.4.1 Market Trends
      • 9.3.4.2 Market Forecast
    • 9.3.5 Spain
      • 9.3.5.1 Market Trends
      • 9.3.5.2 Market Forecast
    • 9.3.6 Russia
      • 9.3.6.1 Market Trends
      • 9.3.6.2 Market Forecast
    • 9.3.7 Others
      • 9.3.7.1 Market Trends
      • 9.3.7.2 Market Forecast
  • 9.4 Latin America
    • 9.4.1 Brazil
      • 9.4.1.1 Market Trends
      • 9.4.1.2 Market Forecast
    • 9.4.2 Mexico
      • 9.4.2.1 Market Trends
      • 9.4.2.2 Market Forecast
    • 9.4.3 Others
      • 9.4.3.1 Market Trends
      • 9.4.3.2 Market Forecast
  • 9.5 Middle East and Africa
    • 9.5.1 Market Trends
    • 9.5.2 Market Breakup by Country
    • 9.5.3 Market Forecast

10 SWOT Analysis

  • 10.1 Overview
  • 10.2 Strengths
  • 10.3 Weaknesses
  • 10.4 Opportunities
  • 10.5 Threats

11 Value Chain Analysis

12 Porters Five Forces Analysis

  • 12.1 Overview
  • 12.2 Bargaining Power of Buyers
  • 12.3 Bargaining Power of Suppliers
  • 12.4 Degree of Competition
  • 12.5 Threat of New Entrants
  • 12.6 Threat of Substitutes

13 Price Analysis

14 Competitive Landscape

  • 14.1 Market Structure
  • 14.2 Key Players
  • 14.3 Profiles of Key Players
    • 14.3.1 Advanced Micro Devices Inc.
      • 14.3.1.1 Company Overview
      • 14.3.1.2 Product Portfolio
      • 14.3.1.3 Financials
      • 14.3.1.4 SWOT Analysis
    • 14.3.2 Broadcom Inc.
      • 14.3.2.1 Company Overview
      • 14.3.2.2 Product Portfolio
      • 14.3.2.3 Financials
      • 14.3.2.4 SWOT Analysis
    • 14.3.3 Intel Corporation
      • 14.3.3.1 Company Overview
      • 14.3.3.2 Product Portfolio
      • 14.3.3.3 Financials
      • 14.3.3.4 SWOT Analysis
    • 14.3.4 MediaTek Inc.
      • 14.3.4.1 Company Overview
      • 14.3.4.2 Product Portfolio
      • 14.3.4.3 Financials
      • 14.3.4.4 SWOT Analysis
    • 14.3.5 Nvidia Corporation
      • 14.3.5.1 Company Overview
      • 14.3.5.2 Product Portfolio
      • 14.3.5.3 Financials
      • 14.3.5.4 SWOT Analysis
    • 14.3.6 Qualcomm Incorporated
      • 14.3.6.1 Company Overview
      • 14.3.6.2 Product Portfolio
      • 14.3.6.3 Financials
      • 14.3.6.4 SWOT Analysis
    • 14.3.7 Spectra7 Microsystems
      • 14.3.7.1 Company Overview
      • 14.3.7.2 Product Portfolio
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óÇ°À» ¼±Åà Áß
»óÇ° ºñ±³Çϱâ
Àüü»èÁ¦