![]() |
½ÃÀ庸°í¼
»óǰÄÚµå
1541749
UV Å×ÀÌÇÁ ½ÃÀå º¸°í¼ : Á¦Ç°º°, ¿ëµµº°, Áö¿ªº°(2024-2032³â)UV Tapes Market Report by Product (Polyolefin, Polyvinyl Chloride, Polyethylene Terephthalate, and Others), Application (Wafer Dicing, Back Grinding, and Others), and Region 2024-2032 |
¼¼°èÀÇ UV Å×ÀÌÇÁ ½ÃÀå ±Ô¸ð´Â 2023³â 4¾ï 9,820¸¸ ´Þ·¯¿¡ ´ÞÇß½À´Ï´Ù. IMARC GroupÀº ÇâÈÄ ½ÃÀåÀÌ 2032³â±îÁö 9¾ï 8,640¸¸ ´Þ·¯¿¡ À̸¦ Àü¸ÁÀ̸ç, 2024³âºÎÅÍ 2032³â±îÁö 7.6%ÀÇ ¼ºÀå·ü(CAGR)À» ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹ÃøÇß½À´Ï´Ù.
UV Å×ÀÌÇÁ´Â º£À̽º Æú¸®¸Ó, ¿Ã¸®°í¸Ó, ±¤ÁßÇÕ °³½ÃÁ¦¸¦ »ç¿ëÇÑ Àú¾Ð °¨ÀÀ Å×ÀÌÇÁÀÔ´Ï´Ù. ÀÌ Å×ÀÌÇÁ´Â Á÷»ç ±¤¼± ¹× ±âŸ ȯ°æ ¿äÀο¡ ´ëÇÑ ´ëÀÀÀ» Áö¿øÇÕ´Ï´Ù. ¿©·¯¸é¿¡ °·ÂÇÏ°Ô Á¢ÂøÇϱâ À§ÇØ ±âÁ¸ ´öÆ® Å×ÀÌÇÁÀÇ ´ëüǰÀ¸·Î ÀÌ»óÀûÀÔ´Ï´Ù. ¹é ±×¶óÀÎµå °øÁ¤¿¡¼ ¹ÝµµÃ¼ ¿þÀÌÆÛÀÇ Ç¥¸éÀ» º¸È£Çϰųª ´ÙÀÌ ½Ì °øÁ¤¿¡¼ ¿þÀÌÆÛ¸¦ ¸µ ÇÁ·¹ÀÓÀ» µû¸£´Â µ¥ »ç¿ëµË´Ï´Ù. ¶ÇÇÑ Àڿܼ±¿¡ Àå½Ã°£ ³ëÃâµÇ´Â ¼¼¶ó¹Í, À¯¸®, »çÆÄÀÌ¾î ¹× ÇÃ¶ó½ºÆ½ ÀÛ¾÷¿¡µµ »ç¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù.
±Þ¼ÓÇÑ µµ½ÃÈ, °¡Ã³ºÐ ¼Òµæ Áõ°¡, ½º¸¶Æ® ȨÀÇ ÃâÇöÀ¸·Î ½º¸¶Æ®ÇÏ°í ¼ÒÇüÈµÈ ¼ÒºñÀÚ ÀÏ·ºÆ®·Î´Ð½ºÀÇ Ã¤¿ëÀÌ Áõ°¡Çϰí ÀÖ¾î ¼¼°è ¹ÝµµÃ¼ ¼ö¿ä°¡ ±ÞÁõÇϰí ÀÖ½À´Ï´Ù. À̰ÍÀº ½ÃÀå ¼ºÀå¿¡ ±àÁ¤ÀûÀÎ ¿µÇâÀ» ¹ÌÄ¡´Â Áß¿äÇÑ ¿ä¼Ò Áß ÇϳªÀÔ´Ï´Ù. ÀÌ¿¡ µû¶ó µðÁöÅÐÈÀÇ ÁøÀü°ú ÀÚµ¿ÈÀÇ µ¿Çâ Áõ°¡°¡ ÃÖ½ÅÀÇ ÀÇ·á±â±â¿¡ ¹ÝµµÃ¼ ¸Þ¸ð¸®ÀÇ Ã¤¿ëÀ» ÃËÁøÇϰí, ³ª¾Æ°¡ ½ÃÀå ¼ºÀå¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ±Þ¼ºÀåÇÏ´Â °Ç¼³ »ê¾÷Àº ÆÄÀÌÇÁ, â¹®, ¿ÀÇ Á¶ÀÎÆ® ¿Ü°ü ¹× µµ¾î ÁÖÀ§ÀÇ ¹ÐºÀ¿¡ UV Å×ÀÌÇÁÀÇ »ç¿ëÀ» ÀÚ±ØÇÕ´Ï´Ù. À̿ʹ º°µµ·Î Á¦Ç°ÀÇ ³¶ºñ¸¦ ÃÖ¼ÒÈÇÏ°í ´Ù¾çÇÑ ½ÄÀ½·á(F&B) Á¦Ç°ÀÇ À¯Åë±âÇÑÀ» ¿¬ÀåÇÏ´Â ¿¬Æ÷Àå¿¡ ÀÖ¾î¼ÀÇ Ç÷º¼Ò ÀμâÀÇ ÀÌ¿ë È®´ëµµ ½ÃÀå ¼ºÀåÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ ÁÖ¿ä ½ÃÀå ±â¾÷Àº »ö º¯È ±â´ÉÀ» °®Ãá UV Ȱ¼ºÈ Á¢Âø Å×ÀÌÇÁ¿Í °°Àº Çõ½ÅÀûÀÎ Á¦Ç°À» °³¹ßÇÏ¿© ÀÚµ¿Â÷ »ê¾÷ ¼ö¿ä¸¦ Áõ°¡½Ã۰í ÀÖ½À´Ï´Ù. ÀÌ ¿Ü¿¡µµ UV Å×ÀÌÇÁ°¡ Á¦°øÇÏ´Â ÀÌÁ¡¿¡ ´ëÇÑ ÀÎÁöµµÀÇ Çâ»ó°ú À¯Åë ä³ÎÀÇ È®´ë°¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ°í ÀÖ½À´Ï´Ù.
The global UV tapes market size reached US$ 498.2 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 986.4 Million by 2032, exhibiting a growth rate (CAGR) of 7.6% during 2024-2032.
UV tapes are under-pressure sensitive tapes made using base polymer, oligomer, and a photoinitiator. These tapes assist in coping with direct sunlight and other environmental factors. They provide a strong adhesive bond to multiple surfaces, thereby making them an ideal alternative to conventional duct tapes. They are used to protect the surface of semiconductor wafers during the back grinding process and keep them along the ring frame during the dicing process. They are also applicable on ceramics, glass, sapphires, and plastics workpieces, which experience prolonged exposure to UV light.
The rising adoption of smart and miniaturized consumer electronics on account of rapid urbanization, inflating disposable incomes, and the emergence of smart homes is escalating the demand for semiconductors across the globe. This represents one of the key factors influencing the market growth positively. In line with this, increasing digitization and the rising trend of automation are promoting the adoption of semiconductor memory in modern medical devices, which, in turn, are contributing to the market growth. Moreover, the burgeoning construction industry is stimulating the use of UV tapes for pipes, windows, open joint facades, and sealing around doors. Apart from this, the growing utilization of flexographic printing in flexible packaging that minimizes product wastage and extends the shelf-life of various food and beverage (F&B) products is also propelling the market growth. Furthermore, leading market players are developing innovative products, such as UV-activatable adhesive tape with color change features, which is augmenting their demand in the automotive industry. Besides this, rising awareness about the benefits offered by UV tapes, in confluence with the expanding distribution channel, is projected to foster the market growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global UV tapes market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on product and application.
Polyolefin
Polyvinyl Chloride
Polyethylene Terephthalate
Others
Wafer Dicing
Back Grinding
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being AI Technology Inc., Chase Corporation, Denka Company Limited, Furukawa Electric Co. Ltd., LINTEC Corporation, Loadpoint Ltd, Minitron Elektronik GmbH, Mitsui Chemicals, Nitto Denko Corporation, Sumitomo Bakelite Co. Ltd. and Ultron Systems Inc.