시장보고서

상품코드

1635889

3D IC 시장 : 유형별, 구성요소별, 용도별, 최종사용자별, 지역별(2025-2033년)

3D IC Market by Type, Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), Application, End User, and Region 2025-2033

발행일: 2025년 01월 | 리서치사:

IMARC | 페이지 정보: 영문 137 Pages | 배송안내 : 2-3일 (영업일 기준)

샘플 요청 목록에 추가

※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

3D IC 시장 세계 시장 규모는 2024년 202억 달러에 달했습니다. 향후 IMARC Group은 2033년에는 964억 달러에 달할 것으로 예상하며, 2025-2033년 연평균 성장률(CAGR)은 18.01%에 달할 것으로 전망하고 있습니다. 노트북, 스마트폰, 태블릿 등 우수한 기능을 갖춘 다양한 소형 첨단 가전제품의 구매가 증가하고 있는 것이 시장을 이끄는 주요 요인으로 작용하고 있습니다.

3차원(3D) 집적회로(IC)는 서로 다른 실리콘 다이, 칩, 웨이퍼를 수직으로 적층 또는 집적하는 제조 기술의 총칭입니다. 이러한 재료들은 하나의 패키지로 통합되고, 디바이스는 실리콘 비아(TSV)와 하이브리드 본딩(Hybrid Bonding) 절차로 연결됩니다. 적층 공정에 사용되는 표준 기술로는 3D 웨이퍼 레벨 칩 스케일 패키징(WLCSP), 빔 재결정, 고상 결정화, 웨이퍼 본딩 등이 있습니다. 더 높은 기능 밀도를 제공하지만, 동일한 면적에서 더 적은 전력으로 더 높은 기능 밀도를 제공합니다. 또한, 더 높은 대역폭, 유연성, 이종 집적도를 제공하고, 더 빠른 신호 전환을 보장하며, 더 나은 전기적 성능을 가능하게 합니다. 그 결과, 3D IC는 마이크로일렉트로닉스, 포토닉스, 로직 이미징, 옵토일렉트로닉스, 센서 등의 주요 부품으로 폭넓게 적용되고 있습니다.

3D IC 시장 동향:

3D IC는 항공우주, 자동차, 통신 및 통신 등의 산업에서 널리 사용되고 있으며, 시장 성장을 견인하는 중요한 요소 중 하나입니다. 이에 따라 노트북, 스마트폰, 태블릿 등 우수한 기능을 갖춘 다양한 소형 첨단 소비자 전자제품의 구매가 증가하면서 전자산업이 크게 확대되고 있는 것이 시장 성장의 원동력이 되고 있습니다. 또한, 전력 소비를 최소화하는 첨단 전자 아키텍처 및 집적 회로에 대한 수요 증가도 시장 성장에 기여하고 있습니다. 또한, 게임기, 센서 등 소형화된 전자기기에 IC를 내장하고 웨이퍼 레벨 패키징을 사용하는 새로운 트렌드도 시장 성장에 기여하고 있습니다. 또한, 보안 잠금장치, 온도 조절기, 팬 컨트롤러, 스마트 연기 감지기, 창문 센서, 에너지 모니터 등 스마트홈 기기에 3D IC가 광범위하게 내장되고 있는 것도 시장 성장을 촉진하고 있습니다. 또한, 소형 보청기, 시각 보조기구, 심장 모니터 등 다양한 헬스케어 기기에도 탑재되고 있습니다. 더 나은 속도, 메모리, 내구성, 효율성, 성능, 타이밍 지연 감소 등 여러 제품의 장점에 대한 소비자의 인식이 높아지면서 시장 성장을 촉진하고 있습니다. 또한, 사물인터넷(IoT) 및 인공지능(AI) 솔루션과 무선 기술의 통합, 제품 생산을 개선하기 위한 제조업체의 첨단 IC 패키징 시스템의 등장은 시장 성장을 촉진하고 있습니다. 그 외, 고대역폭 메모리(HBM)에 대한 수요 증가와 지속적인 제품 다양화 등이 시장 성장을 적극적으로 촉진하고 있습니다.

본 보고서에서 다루는 주요 질문

3D IC 시장 세계 시장은 지금까지 어떻게 전개되어 왔을까?
3D IC 시장 세계 시장에서의 촉진요인, 저해요인, 기회요인은 무엇인가?
주요 지역 시장이란?
가장 매력적인 3D IC 시장은 어느 국가인가?
유형별 시장 분석은?
구성요소별 시장 분석은 어떻게 되는가?
용도별 시장 분석은?
최종사용자별 시장 분석은 어떻게 되는가?
세계 3D IC 시장의 경쟁 구도는?
3D IC 시장 세계 시장에서 주요 플레이어/기업은?

The global 3D IC market size reached USD 20.2 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 96.4 Billion by 2033, exhibiting a growth rate (CAGR) of 18.01% during 2025-2033. The increasing purchase of various compact and advanced consumer electronic products with superior functionality, such as laptops, smartphones, and tablets, represents the prime factor driving the market.

Three-dimensional (3D) integrated circuit (IC) refers to an umbrella term representing a manufacturing technology that involves stacking or integrating different silicon die, chips and wafers together vertically. These materials are further combined into a single package wherein the device is connected via silicon vias (TSVs) and hybrid bonding procedures. It also encompasses 3D wafer-level chip-scale packaging (WLCSP), beam re-crystallization, solid phase crystallization, and wafer bonding as standard technologies used in the stacking process. As compared to two-dimensional (2D) IC, 3D IC offers higher speed, minimized footprint, and better functional density at the same reduced power in a similar smaller area. Apart from this, it provides higher bandwidth, flexibility, and heterogeneous integration, ensures faster signal transitions, and enables better electrical performances. As a result, 3D IC finds extensive applications as a key component in microelectronics, photonics, logic imaging, optoelectronics, and sensors.

3D IC Market Trends:

The widespread utilization of 3D IC across industries, such as aerospace, automotive and communications and telecom, represents one of the key factors driving the market growth. In line with this, the considerable expansion in the electronics industry on account of the increasing purchase of various compact and advanced consumer electronics products with superior functionality, such as laptops, smartphones, and tablets, is driving the market growth. Moreover, the rising need for advanced electronics architecture and integrated circuits with minimal power consumption properties, is contributing to the market growth. This is further supported by the emerging trend of incorporating ICs and using wafer-level packaging in miniaturized electronic devices, such as gaming consoles and sensors. Additionally, the extensive incorporation of 3D IC in smart home devices, including security locks, thermostats, fan controllers, smart smoke detectors, window sensors, and energy monitors, is favoring the market growth. They are further embedded in diverse healthcare devices, such as small hearing and visual aids and heart monitors. The escalating consumer awareness regarding the multiple product benefits, including better speed, memory, durability, efficiency, performance, and reduced timing delays, is propelling the market growth. Furthermore, the integration of the Internet of Things (IoT) and artificial intelligence (AI) solutions with wireless technologies and the advent of advanced IC packaging systems by manufacturers to improve product production is impelling the market growth. Other factors, such as the fueling need for high-bandwidth memory (HBM) and ongoing product diversification, are positively stimulating the market growth.

Key Market Segmentation:

Type Insights:

Stacked 3D
Monolithic 3D
The report has also provided a detailed breakup and analysis of the 3D IC market based on the type. This includes stacked and monolithic 3D. According to the report, stacked 3D represented the largest segment.

Component Insights:

Through-Silicon Via (TSV)
Through Glass Via (TGV)
Silicon Interposer

Application Insights:

Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Others
The report has also provided a detailed breakup and analysis of the 3D IC market based on the application. This includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, and others. According to the report, MEMS/sensors represented the largest segment.

End User Insights:

Consumer Electronics
Telecommunication
Automotive
Military and Aerospace
Medical Devices
Industrial
Others

Regional Insights:

North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others), Latin America (Brazil, Mexico, and others), and the Middle East and Africa. According to the report, Asia Pacific was the largest market for 3D IC. Some of the factors driving the Asia Pacific 3D IC market included its rapid expansion in the electronics sector and the increasing purchase of compact consumer electronic products with superior functionality.

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global 3D IC market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro Devices Inc., MonolithIC 3D Inc., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

How has the global 3D IC market performed so far and how will it perform in the coming years?
What are the drivers, restraints, and opportunities in the global 3D IC market?
What are the key regional markets?
Which countries represent the most attractive 3D IC markets?
What is the breakup of the market based on the type?
What is the breakup of the market based on the component?
What is the breakup of the market based on the application?
What is the breakup of the market based on the end user?
What is the competitive structure of the global 3D IC market?
Who are the key players/companies in the global 3D IC market?

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

4.1 Overview
4.2 Key Industry Trends

5 Global 3D IC Market

5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast

6 Market Breakup by Type

6.1 Stacked 3D
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
6.2 Monolithic 3D
- 6.2.1 Market Trends
- 6.2.2 Market Forecast

7 Market Breakup by Component

7.1 Through-Silicon Via (TSV)
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
7.2 Through Glass Via (TGV)
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
7.3 Silicon Interposer
- 7.3.1 Market Trends
- 7.3.2 Market Forecast

8 Market Breakup by Application

8.1 Logic
- 8.1.1 Market Trends
- 8.1.2 Market Forecast
8.2 Imaging and Optoelectronics
- 8.2.1 Market Trends
- 8.2.2 Market Forecast
8.3 Memory
- 8.3.1 Market Trends
- 8.3.2 Market Forecast
8.4 MEMS/Sensors
- 8.4.1 Market Trends
- 8.4.2 Market Forecast
8.5 LED
- 8.5.1 Market Trends
- 8.5.2 Market Forecast
8.6 Others
- 8.6.1 Market Trends
- 8.6.2 Market Forecast

9 Market Breakup by End User

9.1 Consumer Electronics
- 9.1.1 Market Trends
- 9.1.2 Market Forecast
9.2 Telecommunication
- 9.2.1 Market Trends
- 9.2.2 Market Forecast
9.3 Automotive
- 9.3.1 Market Trends
- 9.3.2 Market Forecast
9.4 Military and Aerospace
- 9.4.1 Market Trends
- 9.4.2 Market Forecast
9.5 Medical Devices
- 9.5.1 Market Trends
- 9.5.2 Market Forecast
9.6 Industrial
- 9.6.1 Market Trends
- 9.6.2 Market Forecast
9.7 Others
- 9.7.1 Market Trends
- 9.7.2 Market Forecast

10 Market Breakup by Region

10.1 North America
- 10.1.1 United States
  - 10.1.1.1 Market Trends
  - 10.1.1.2 Market Forecast
- 10.1.2 Canada
  - 10.1.2.1 Market Trends
  - 10.1.2.2 Market Forecast
10.2 Asia-Pacific
- 10.2.1 China
  - 10.2.1.1 Market Trends
  - 10.2.1.2 Market Forecast
- 10.2.2 Japan
  - 10.2.2.1 Market Trends
  - 10.2.2.2 Market Forecast
- 10.2.3 India
  - 10.2.3.1 Market Trends
  - 10.2.3.2 Market Forecast
- 10.2.4 South Korea
  - 10.2.4.1 Market Trends
  - 10.2.4.2 Market Forecast
- 10.2.5 Australia
  - 10.2.5.1 Market Trends
  - 10.2.5.2 Market Forecast
- 10.2.6 Indonesia
  - 10.2.6.1 Market Trends
  - 10.2.6.2 Market Forecast
- 10.2.7 Others
  - 10.2.7.1 Market Trends
  - 10.2.7.2 Market Forecast
10.3 Europe
- 10.3.1 Germany
  - 10.3.1.1 Market Trends
  - 10.3.1.2 Market Forecast
- 10.3.2 France
  - 10.3.2.1 Market Trends
  - 10.3.2.2 Market Forecast
- 10.3.3 United Kingdom
  - 10.3.3.1 Market Trends
  - 10.3.3.2 Market Forecast
- 10.3.4 Italy
  - 10.3.4.1 Market Trends
  - 10.3.4.2 Market Forecast
- 10.3.5 Spain
  - 10.3.5.1 Market Trends
  - 10.3.5.2 Market Forecast
- 10.3.6 Russia
  - 10.3.6.1 Market Trends
  - 10.3.6.2 Market Forecast
- 10.3.7 Others
  - 10.3.7.1 Market Trends
  - 10.3.7.2 Market Forecast
10.4 Latin America
- 10.4.1 Brazil
  - 10.4.1.1 Market Trends
  - 10.4.1.2 Market Forecast
- 10.4.2 Mexico
  - 10.4.2.1 Market Trends
  - 10.4.2.2 Market Forecast
- 10.4.3 Others
  - 10.4.3.1 Market Trends
  - 10.4.3.2 Market Forecast
10.5 Middle East and Africa
- 10.5.1 Market Trends
- 10.5.2 Market Breakup by Country
- 10.5.3 Market Forecast

11 Drivers, Restraints, and Opportunities

11.1 Overview
11.2 Drivers
11.3 Restraints
11.4 Opportunities

12 Value Chain Analysis

13 Porters Five Forces Analysis

13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
- 15.3.1 Advanced Micro Devices Inc.
  - 15.3.1.1 Company Overview
  - 15.3.1.2 Product Portfolio
  - 15.3.1.3 SWOT Analysis
- 15.3.2 MonolithIC 3D Inc.
  - 15.3.2.1 Company Overview
  - 15.3.2.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

3D IC 시장 : 유형별, 구성요소별, 용도별, 최종사용자별, 지역별(2025-2033년)

3D IC Market by Type, Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), Application, End User, and Region 2025-2033

3D IC 시장 동향:

본 보고서에서 다루는 주요 질문

목차

제1장 서문

제2장 조사 범위와 조사 방법

제3장 주요 요약

제4장 소개

제5장 세계의 3D IC 시장

제6장 시장 내역 : 유형별

제7장 시장 내역 : 구성요소별

제8장 시장 내역 : 용도별

제9장 시장 내역 : 최종사용자별

제10장 시장 내역 : 지역별

제11장 촉진요인, 억제요인, 기회

제12장 밸류체인 분석

제13장 Porter's Five Forces 분석

제14장 가격 분석

제15장 경쟁 구도