후막소자 시장 : 유형별, 최종사용자별, 지역별(2025-2033년)

The global thick film devices market size reached USD 150.4 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 394.3 Billion by 2033, exhibiting a growth rate (CAGR) of 10.74% during 2025-2033. The augmenting need for film devices facilitating high compatibility with multiple substrates, the accelerating demand for consumer electronics, and the shifting trend towards miniaturization of electronic components represent some of the key factors driving the market.

Thick film devices refer to electronic components that are fabricated through a deposition of a thick layer of resistive, conductive, or dielectric material onto a ceramic or glass substrate. The thick film deposition technique assists in the creation of complex electronic circuits and components. Thick film devices have a relatively thick layer of material with high reliability, with materials that exhibit good adhesion and resistance to environmental factors. They are characterized by good electrical conductivity, dielectric constant, thermal conductivity, TCR (Temperature Coefficient of Resistance) and stability over a wide temperature range. These properties enable the integration of multiple circuit elements and higher power handling capabilities. Additionally, they are highly customizable to meet specific electrical and mechanical requirements and are compatible with a wide range of substrate materials. As a result, they are extensively used in electronic circuits, hybrid microelectronics, and integrated circuit manufacturing applications.

Thick Film Devices Market Trends:

The global market is primarily driven by the augmenting need for film devices facilitating high compatibility with multiple substrates in the electrical and electronics industry. This can be attributed to the accelerating demand for consumer electronics as well as industrial electronics. In line with this, the shifting trend towards miniaturization of electronic components resulting in the need for integration of multiple functions on a single substrate is fueling the market. Moreover, the rising adoption of hybrid circuits requiring a combination of analog and digital circuitry in numerous industrial applications is propelling the product demand on the global level. The market is further driven by the rapid expansion of automotive production, coupled with the rising integration of electronics in vehicles. Apart from this, rapid product utilization in the manufacturing of various medical devices such as biosensors, wearable devices, pacemakers, and implantable devices are creating lucrative opportunities in the market. Furthermore, continual technological advancements in the manufacturing processes, material science and design techniques leading to the advent of high-performance, robust, corrosion-resistant product variants are providing an impetus to the market. In addition to this, the growing adoption of industrial automation systems is resulting in the increasing usage of thin film devices in control, sensing, and monitoring applications, which, in turn, is providing a boost to the market. Some of the other factors contributing to the market include the increasing usage of IoT applications and devices, considerable growth in the telecommunications industry, and favorable government initiatives encouraging domestic manufacturing.

Key Market Segmentation:

Type Insights:

• Capacitors
• Resistors
• Photovoltaic cells
• Heaters
• Others

End-user Insights:

• Automotive
• Healthcare
• Consumer Electronics
• Infrastructure
• Others

Regional Insights:

• North America
• United States
• Canada
• Asia Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa
• The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for thick film devices. Some of the factors driving the Asia Pacific thick film devices market included considerable growth in the electrical and electronics industry, widespread adoption of smart devices, rising trend of device miniaturization, inflating disposable income levels, etc.

Competitive Landscape:

• The report has also provided a comprehensive analysis of the competitive landscape in the global thick film devices market. The detailed profiles of all major companies have been provided. Some of the companies covered include Bourns Inc., Ferro Techniek BV, KOA Speer Electronics Inc. (KOA Corporation), Panasonic Corporation, Rohm Semiconductor GmbH, Samsung Electronics Co. Ltd., TE Connectivity Ltd, Thermo Heating Elements LLC, Vishay Intertechnology Inc., Watlow Electric Manufacturing Co., Wurth Elektronik GmbH & Co. KG., YAGEO Corp., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

• How has the global thick film devices market performed so far, and how will it perform in the coming years?
• What are the drivers, restraints, and opportunities in the global thick film devices market?
• What is the impact of each driver, restraint, and opportunity on the global thick film devices market?
• What are the key regional markets?
• Which countries represent the most attractive thick film devices market?
• What is the breakup of the market based on the type?
• Which is the most attractive type in the thick film devices market?
• What is the breakup of the market based on the end-user?
• Which is the most attractive end-user in the thick film devices market?
• What is the competitive structure of the global thick film devices market?
• Who are the key players/companies in the global thick film devices market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Thick Film Devices Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Type

• 6.1 Capacitors
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Resistors
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Photovoltaic cells
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 Heaters
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast
• 6.5 Others
  • 6.5.1 Market Trends
  • 6.5.2 Market Forecast

7 Market Breakup by End-User

• 7.1 Automotive
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Healthcare
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Consumer Electronics
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Infrastructure
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 Drivers, Restraints, and Opportunities

• 9.1 Overview
• 9.2 Drivers
• 9.3 Restraints
• 9.4 Opportunities

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Bourns Inc.
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
  • 13.3.2 Ferro Techniek BV
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
  • 13.3.3 KOA Speer Electronics Inc. (KOA Corporation)
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
  • 13.3.4 Panasonic Corporation
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Rohm Semiconductor GmbH
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
    • 13.3.5.4 SWOT Analysis
  • 13.3.6 Samsung Electronics Co. Ltd.
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 Financials
    • 13.3.6.4 SWOT Analysis
  • 13.3.7 TE Connectivity Ltd
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
    • 13.3.7.4 SWOT Analysis
  • 13.3.8 Thermo Heating Elements LLC
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio
  • 13.3.9 Vishay Intertechnology Inc.
    • 13.3.9.1 Company Overview
    • 13.3.9.2 Product Portfolio
    • 13.3.9.3 Financials
    • 13.3.9.4 SWOT Analysis
  • 13.3.10 Watlow Electric Manufacturing Co.
    • 13.3.10.1 Company Overview
    • 13.3.10.2 Product Portfolio
  • 13.3.11 Wurth Elektronik GmbH & Co. KG.
    • 13.3.11.1 Company Overview
    • 13.3.11.2 Product Portfolio
  • 13.3.12 YAGEO Corp.
    • 13.3.12.1 Company Overview
    • 13.3.12.2 Product Portfolio
    • 13.3.12.3 Financials

Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.