화합물 반도체 시장 : 유형별, 제품별, 증착 기술별, 용도별, 지역별(2025-2033년)

The global compound semiconductor market size reached USD 122.8 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 177.0 Billion by 2033, exhibiting a growth rate (CAGR) of 4.1% during 2025-2033. The need for high-speed electronics, 5G communication, and power-efficient devices, automotive advancements, LED lighting adoption, and emerging applications, including IoT and renewable energy technologies, are propelling the market growth.

A compound semiconductor is a type of semiconductor material composed of two or more elements from different groups in the periodic table. Unlike elemental semiconductors such as silicon or germanium, which consist of a single element, compound semiconductors combine distinct elements to form a crystalline structure with unique electronic properties. These materials offer advantages such as superior electron mobility, wider energy bandgaps, and enhanced performance in specific applications, including high-frequency devices, optoelectronics, and power amplifiers. Some of the common compound semiconductors include gallium arsenide (GaAs), indium phosphide (InP), and gallium nitride (GaN), each tailored for specific functions due to their tunable properties.

The escalating demand for high-speed, high-frequency communication systems and the rapid evolution of 5G networks have spurred the need for compound semiconductors, primarily driving the market growth. In line with this, the rising demand for gallium nitride (GaN) and gallium arsenide (GaAs), which offer superior performance in high-power, high-frequency applications is creating a positive outlook for market expansion. Moreover, the growing prominence of energy-efficient solutions has driven the adoption of compound semiconductors in power electronics, bolstering the market growth. In addition to this, the expanding applications of optoelectronics, encompassing light emitting diodes (LEDs), lasers, and photodetectors, are acting as another significant growth-inducing driver. Compound semiconductors, such as indium phosphide (InP), facilitate advancements in data communication, sensing, and imaging technologies, thereby favoring the market growth. Furthermore, the rising acceptance of these materials across various industrial verticals, owing to their unique properties, fostering innovations is contributing to the market's growth.

Compound Semiconductor Market Trends/Drivers:

High-frequency communication and 5G networks

The surge in demand for high-speed, high-capacity communication systems has been a pivotal driver for compound semiconductors. As the world transitions towards the deployment of 5G networks, these semiconductors are essential due to their ability to operate efficiently at high frequencies, presenting lucrative opportunities for market expansion. Additionally, the shifting preference for compound semiconductors, such as gallium nitride (GaN) and gallium arsenide (GaAs), over traditional elemental semiconductors, including silicon that struggle with high-frequency performance due to their intrinsic properties, is aiding in market expansion. Furthermore, the rising employment of GaN in 5G base stations, radar systems, and satellite communication equipment due to its high electron mobility and robust power handling capabilities is strengthening the market growth.

Power electronics and energy efficiency

The surging emphasis on energy efficiency and the drive towards renewable energy sources has spurred the adoption of compound semiconductors in power electronics, fueling the market growth. Silicon-based semiconductors have limitations in high-temperature and high-voltage applications. However, materials such as silicon carbide (SiC) offer superior thermal conductivity and breakdown voltage, enabling more efficient energy conversion and reduced power losses, which is propelling the market forward. Concurrent with this, the increasing use of SiC in electric vehicles (EVs), solar inverters, and industrial motor drives to minimize energy consumption and enhance sustainability is contributing to the bolstering growth of the compound semiconductor.

Optoelectronics and photonics advancements

The evolution of optoelectronics has been a catalyst for compound semiconductors, including indium phosphide (InP). InP-based devices have exceptional optical properties, making them suitable for applications ranging from high-speed data communication to sensors and imaging technologies, which, in turn, is creating a positive outlook for market expansion. Besides this, InP-based lasers and photodetectors are essential components in optical communication systems, data centers, and emerging technologies such as LiDAR (light detection and ranging), boosting their demand. In addition to this, compound semiconductors play a vital role in the development of LEDs and solid-state lighting solutions, driving energy-efficient lighting options across various sectors.

Compound Semiconductor Industry Segmentation:

Breakup by Type:

• III-V Compound Semiconductor
• Gallium Nitride
• Gallium Phosphide
• Gallium Arsenide
• Indium Phosphide
• Indium Antimonide
• II-VI Compound Semiconductor
• Cadmium Selenide
• Cadmium Telluride
• Zinc Selenide
• Sapphire
• IV-IV Compound Semiconductor
• Others

III-V compound semiconductor dominates the market

The demand for III-V compound semiconductors, including gallium nitride (GaN), gallium phosphide, gallium arsenide (GaAs), indium phosphide (InP), and indium antimonide, is propelled by their unique material properties that enable breakthroughs in niche applications. GaN's exceptional power handling capabilities are driving innovations in high-power electronics, RF amplifiers, and 5G infrastructure. GaAs' high electron mobility supports high-speed devices for wireless communication and aerospace applications, thereby impelling the market growth. Moreover, InP's superior optical properties make it vital for high-speed optical \communication systems, while InSb finds use in infrared detectors for thermal imaging. This demand underscores the pivotal role of III-V compound semiconductors in pushing the boundaries of performance in specialized domains.

Breakup by Product:

• Power Semiconductor
• Transistor
• Integrated Circuits
• Diodes and Rectifiers
• Others

Power semiconductor holds the largest share in the market

The surging demand for power compound semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), due to their transformative impact on energy efficiency and power electronics is one of the main drivers of the market. Additionally, SiC's high thermal conductivity and breakdown voltage enhance energy conversion in electric vehicles, renewable energy systems, and industrial equipment. GaN's high electron mobility enables compact and efficient power supplies, contributing to smaller form factors in consumer electronics and electric vehicle charging systems. As industries seek enhanced performance, reduced energy losses, and greater power density, power compound semiconductors have emerged as crucial enablers, propelling their adoption across a spectrum of applications, aiding in market expansion.

Breakup by Deposition Technology:

• Chemical Vapor Deposition
• Molecular Beam Epitaxy
• Hydride Vapor Phase Epitaxy
• Ammonothermal
• Atomic Layer Deposition
• Others

Chemical vapor deposition dominates the market

Chemical vapor deposition (CVD) represents the biggest deposition technology in the compound semiconductor market due to several key factors. CVD offers exceptional uniformity and precision in depositing thin film materials, essential for high-quality compound semiconductors, which, in turn, is driving the market growth. Moreover, it supports a wide range of materials and is compatible with various substrates, making it a highly versatile method. Besides this, CVD's scalability and efficiency in mass production make it an attractive option for manufacturers, fulfilling the demand for compound semiconductors in various applications such as electronics, optoelectronics, and photovoltaics.

Breakup by Application:

• IT and Telecom
• Aerospace and Defense
• Automotive
• Consumer Electronics
• Healthcare
• Industrial and Energy and Power

IT and telecom holds the largest share in the market

The utilization of compound semiconductors in the IT and telecom sector is propelled by their capacity to meet the escalating demand for high-speed data transmission, networking, and wireless communication. These materials, such as gallium nitride (GaN) and indium phosphide (InP), enable the creation of high-frequency, high-efficiency devices critical for 5G infrastructure, satellite communication, and broadband expansion, fueling their adoption across various applications across the IT and telecom industry. GaN's superior power handling characteristics enhance the performance of RF amplifiers and base stations, while InP's exceptional optical properties drive advancements in optical communication systems. As the sector continues to seek faster and more reliable connectivity, compound semiconductors play an integral role in enabling the next era of information exchange and digital transformation.

Breakup by Region:

• North America
• United States
• Canada
• Asia-Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa

Asia Pacific exhibits a clear dominance, accounting for the largest compound semiconductor market share.

The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

The Asia Pacific compound semiconductor market is experiencing significant propulsion due to the region's robust manufacturing capabilities, rapid technological advancements, and burgeoning demand for cutting-edge electronics. Countries such as South Korea, Taiwan, China, and Japan have emerged as semiconductor powerhouses, fostering a competitive landscape for compound semiconductor production. In addition to this, the region's focus on consumer electronics, 5G network expansion, and automotive innovations is driving the adoption of compound semiconductors in applications ranging from high-frequency communication devices to power electronics. Additionally, strategic government initiatives and investments in research and development are bolstering the Asia Pacific's position as a key driver in shaping the global compound semiconductor market.

Competitive Landscape:

The competitive landscape of the global compound semiconductor market is marked by a dynamic interplay of established players and emerging contenders, fueled by technological advancements and market demands. Key industry leaders hold substantial market shares, leveraging their expertise in research, development, and manufacturing to offer a diverse range of compound semiconductor solutions. Moreover, collaborations and strategic acquisitions amplify their capabilities, expanding their product portfolios. At the same time, emerging companies are making strides in providing advanced deposition and manufacturing equipment critical for compound semiconductor production. The market's growth is also driven by the convergence of industries such as telecommunications, automotive, and energy, prompting traditional semiconductor giants to enter the domain, intensifying competition.

The report has provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

• Infineon Technologies AG
• Microchip Technology Inc.
• Mitsubishi Electric Corporation
• NXP Semiconductors N.V.
• Onsemi
• Qorvo Inc.
• Renesas Electronics Corporation
• STMicroelectronics
• Texas Instruments Incorporated
• WIN Semiconductors Corp.
• Wolfspeed Inc.

Key Questions Answered in This Report

• 1.What was the size of the global compound semiconductor market in 2024?
• 2.What is the expected growth rate of the global compound semiconductor market during 2025-2033?
• 3.What are the key factors driving the global compound semiconductor market?
• 4.What has been the impact of COVID-19 on the global compound semiconductor market?
• 5.What is the breakup of the global compound semiconductor market based on the type?
• 6.What is the breakup of the global compound semiconductor market based on product?
• 7.What is the breakup of the global compound semiconductor market based on the deposition technology?
• 8.What is the breakup of the global compound semiconductor market based on the application?
• 9.What are the key regions in the global compound semiconductor market?
• 10.Who are the key players/companies in the global compound semiconductor market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Compound Semiconductor Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Type

• 6.1 III-V Compound Semiconductor
  • 6.1.1 Market Trends
  • 6.1.2 Key Segments
    • 6.1.2.1 Gallium Nitride
    • 6.1.2.2 Gallium Phosphide
    • 6.1.2.3 Gallium Arsenide
    • 6.1.2.4 Indium Phosphide
    • 6.1.2.5 Indium Antimonide
  • 6.1.3 Market Forecast
• 6.2 II-VI Compound Semiconductor
  • 6.2.1 Market Trends
  • 6.2.2 Key Segments
    • 6.2.2.1 Cadmium Selenide
    • 6.2.2.2 Cadmium Telluride
    • 6.2.2.3 Zinc Selenide
  • 6.2.3 Market Forecast
• 6.3 Sapphire
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 IV-IV Compound Semiconductor
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast
• 6.5 Others
  • 6.5.1 Market Trends
  • 6.5.2 Market Forecast

7 Market Breakup by Product

• 7.1 Power Semiconductor
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Transistor
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Integrated Circuits
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Diodes and Rectifiers
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Deposition Technology

• 8.1 Chemical Vapor Deposition
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Molecular Beam Epitaxy
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast
• 8.3 Hydride Vapor Phase Epitaxy
  • 8.3.1 Market Trends
  • 8.3.2 Market Forecast
• 8.4 Ammonothermal
  • 8.4.1 Market Trends
  • 8.4.2 Market Forecast
• 8.5 Atomic Layer Deposition
  • 8.5.1 Market Trends
  • 8.5.2 Market Forecast
• 8.6 Others
  • 8.6.1 Market Trends
  • 8.6.2 Market Forecast

9 Market Breakup by Application

• 9.1 IT and Telecom
  • 9.1.1 Market Trends
  • 9.1.2 Market Forecast
• 9.2 Aerospace and Defense
  • 9.2.1 Market Trends
  • 9.2.2 Market Forecast
• 9.3 Automotive
  • 9.3.1 Market Trends
  • 9.3.2 Market Forecast
• 9.4 Consumer Electronics
  • 9.4.1 Market Trends
  • 9.4.2 Market Forecast
• 9.5 Healthcare
  • 9.5.1 Market Trends
  • 9.5.2 Market Forecast
• 9.6 Industrial and Energy and Power
  • 9.6.1 Market Trends
  • 9.6.2 Market Forecast

10 Market Breakup by Region

• 10.1 North America
  • 10.1.1 United States
    • 10.1.1.1 Market Trends
    • 10.1.1.2 Market Forecast
  • 10.1.2 Canada
    • 10.1.2.1 Market Trends
    • 10.1.2.2 Market Forecast
• 10.2 Asia-Pacific
  • 10.2.1 China
    • 10.2.1.1 Market Trends
    • 10.2.1.2 Market Forecast
  • 10.2.2 Japan
    • 10.2.2.1 Market Trends
    • 10.2.2.2 Market Forecast
  • 10.2.3 India
    • 10.2.3.1 Market Trends
    • 10.2.3.2 Market Forecast
  • 10.2.4 South Korea
    • 10.2.4.1 Market Trends
    • 10.2.4.2 Market Forecast
  • 10.2.5 Australia
    • 10.2.5.1 Market Trends
    • 10.2.5.2 Market Forecast
  • 10.2.6 Indonesia
    • 10.2.6.1 Market Trends
    • 10.2.6.2 Market Forecast
  • 10.2.7 Others
    • 10.2.7.1 Market Trends
    • 10.2.7.2 Market Forecast
• 10.3 Europe
  • 10.3.1 Germany
    • 10.3.1.1 Market Trends
    • 10.3.1.2 Market Forecast
  • 10.3.2 France
    • 10.3.2.1 Market Trends
    • 10.3.2.2 Market Forecast
  • 10.3.3 United Kingdom
    • 10.3.3.1 Market Trends
    • 10.3.3.2 Market Forecast
  • 10.3.4 Italy
    • 10.3.4.1 Market Trends
    • 10.3.4.2 Market Forecast
  • 10.3.5 Spain
    • 10.3.5.1 Market Trends
    • 10.3.5.2 Market Forecast
  • 10.3.6 Russia
    • 10.3.6.1 Market Trends
    • 10.3.6.2 Market Forecast
  • 10.3.7 Others
    • 10.3.7.1 Market Trends
    • 10.3.7.2 Market Forecast
• 10.4 Latin America
  • 10.4.1 Brazil
    • 10.4.1.1 Market Trends
    • 10.4.1.2 Market Forecast
  • 10.4.2 Mexico
    • 10.4.2.1 Market Trends
    • 10.4.2.2 Market Forecast
  • 10.4.3 Others
    • 10.4.3.1 Market Trends
    • 10.4.3.2 Market Forecast
• 10.5 Middle East and Africa
  • 10.5.1 Market Trends
  • 10.5.2 Market Breakup by Country
  • 10.5.3 Market Forecast

11 SWOT Analysis

• 11.1 Overview
• 11.2 Strengths
• 11.3 Weaknesses
• 11.4 Opportunities
• 11.5 Threats

12 Value Chain Analysis

13 Porters Five Forces Analysis

• 13.1 Overview
• 13.2 Bargaining Power of Buyers
• 13.3 Bargaining Power of Suppliers
• 13.4 Degree of Competition
• 13.5 Threat of New Entrants
• 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

• 15.1 Market Structure
• 15.2 Key Players
• 15.3 Profiles of Key Players
  • 15.3.1 Infineon Technologies AG
    • 15.3.1.1 Company Overview
    • 15.3.1.2 Product Portfolio
    • 15.3.1.3 Financials
    • 15.3.1.4 SWOT Analysis
  • 15.3.2 Microchip Technology Inc.
    • 15.3.2.1 Company Overview
    • 15.3.2.2 Product Portfolio
    • 15.3.2.3 Financials
    • 15.3.2.4 SWOT Analysis
  • 15.3.3 Mitsubishi Electric Corporation
    • 15.3.3.1 Company Overview
    • 15.3.3.2 Product Portfolio
    • 15.3.3.3 Financials
    • 15.3.3.4 SWOT Analysis
  • 15.3.4 NXP Semiconductors N.V.
    • 15.3.4.1 Company Overview
    • 15.3.4.2 Product Portfolio
    • 15.3.4.3 Financials
    • 15.3.4.4 SWOT Analysis
  • 15.3.5 onsemi
    • 15.3.5.1 Company Overview
    • 15.3.5.2 Product Portfolio
    • 15.3.5.3 Financials
    • 15.3.5.4 SWOT Analysis
  • 15.3.6 Qorvo Inc.
    • 15.3.6.1 Company Overview
    • 15.3.6.2 Product Portfolio
    • 15.3.6.3 Financials
    • 15.3.6.4 SWOT Analysis
  • 15.3.7 Renesas Electronics Corporation
    • 15.3.7.1 Company Overview
    • 15.3.7.2 Product Portfolio
    • 15.3.7.3 Financials
    • 15.3.7.4 SWOT Analysis
  • 15.3.8 STMicroelectronics
    • 15.3.8.1 Company Overview
    • 15.3.8.2 Product Portfolio
    • 15.3.8.3 Financials
    • 15.3.8.4 SWOT Analysis
  • 15.3.9 Texas Instruments Incorporated
    • 15.3.9.1 Company Overview
    • 15.3.9.2 Product Portfolio
    • 15.3.9.3 Financials
    • 15.3.9.4 SWOT Analysis
  • 15.3.10 WIN Semiconductors Corp.
    • 15.3.10.1 Company Overview
    • 15.3.10.2 Product Portfolio
    • 15.3.10.3 Financials
  • 15.3.11 Wolfspeed Inc.
    • 15.3.11.1 Company Overview
    • 15.3.11.2 Product Portfolio
    • 15.3.11.3 Financials
    • 15.3.11.4 SWOT Analysis