HDI PCB 시장 보고서 : HDI 레이어별, 최종 이용 산업별, 지역별(2025-2033년)

The global high-density interconnect (HDI) PCB market size reached USD 9.1 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 13.9 Billion by 2033, exhibiting a growth rate (CAGR) of 4.59% during 2025-2033. The market is experiencing significant growth due to the rising demand for compact, high-performance electronics. Features like reduced size, enhanced electrical performance, and multi-layered structures make HDI PCBs crucial for smartphones, automotive, and medical devices. The innovations in miniaturization and high-speed data processing, is also contributing positively to the market growth.

Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.

High-Density Interconnect (HDI) PCB Market Trends:

The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.

Key Market Segmentation:

Breakup by Number of HDI Layer:

• 4-6 Layers HDI PCBs
• 8-10 Layer HDI PCBs
• 10+ Layer HDI PCBs

Breakup by End Use Industry:

• Smartphones and Tablets
• Computers
• Telecom/Datacom
• Consumer Electronics
• Automotive
• Others

Breakup by Region:

• North America
• United States
• Canada
• Asia-Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Wurth Elektronik GmbH & Co. KG.

Key Questions Answered in This Report

• 1.What was the size of the global High-Density Interconnect (HDI) PCB market in 2024?
• 2.What is the expected growth rate of the global High-Density Interconnect (HDI) PCB market during 2025-2033?
• 3.What are the key factors driving the global High-Density Interconnect (HDI) PCB market?
• 4.What has been the impact of COVID-19 on the global High-Density Interconnect (HDI) PCB market?
• 5.What is the breakup of the global High-Density Interconnect (HDI) PCB market based on the number of HDI layer?
• 6.What is the breakup of the global High-Density Interconnect (HDI) PCB market based on the end use industry?
• 7.What are the key regions in the global High-Density Interconnect (HDI) PCB market?
• 8.Who are the key players/companies in the global High-Density Interconnect (HDI) PCB market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global High-Density Interconnect (HDI) PCB Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Number of HDI Layer

• 6.1 4-6 Layers HDI PCBs
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 8-10 Layer HDI PCBs
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 10+ Layer HDI PCBs
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by End Use Industry

• 7.1 Smartphones and Tablets
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Computers
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Telecom/Datacom
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Consumer Electronics
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Automotive
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast
• 7.6 Others
  • 7.6.1 Market Trends
  • 7.6.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
  • 13.3.2 Bittele Electronics Inc.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
  • 13.3.3 Fineline Ltd.
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
  • 13.3.4 Meiko Electronics Co. Ltd.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
  • 13.3.5 Millennium Circuits Limited
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
  • 13.3.6 Mistral Solutions Pvt. Ltd.
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
  • 13.3.7 Shenzhen Kinwong Electronic Co. Ltd.
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
  • 13.3.8 Sierra Circuits
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio
  • 13.3.9 TTM Technologies Inc.
    • 13.3.9.1 Company Overview
    • 13.3.9.2 Product Portfolio
    • 13.3.9.3 Financials
    • 13.3.9.4 SWOT Analysis
  • 13.3.10 Unimicron Technology Corporation (United Microelectronics Corporation)
    • 13.3.10.1 Company Overview
    • 13.3.10.2 Product Portfolio
    • 13.3.10.3 Financials
  • 13.3.11 Unitech Printed Circuit Board Corp.
    • 13.3.11.1 Company Overview
    • 13.3.11.2 Product Portfolio
    • 13.3.11.3 Financials
  • 13.3.12 Wurth Elektronik GmbH & Co. KG
    • 13.3.12.1 Company Overview
    • 13.3.12.2 Product Portfolio