½ÃÀ庸°í¼­
»óǰÄÚµå
1722442

5G Ĩ¼Â ½ÃÀå º¸°í¼­ : Ĩ¼Â À¯Çü, µ¿ÀÛ Á֯ļö, ÃÖÁ¾»ç¿ëÀÚ, Áö¿ªº°(2025-2033³â)

5G Chipset Market Report by Chipset Type (Application-Specific Integrated Circuits, Radio Frequency Integrated Circuit, Millimeter Wave Technology Chips, Field-Programmable Gate Array ), Operational Frequency, End User, and Region 2025-2033

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: IMARC | ÆäÀÌÁö Á¤º¸: ¿µ¹® 140 Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

¼¼°è 5G Ĩ¼Â ½ÃÀå ±Ô¸ð´Â 2024³â 79¾ï ´Þ·¯¿¡ ´ÞÇß½À´Ï´Ù. ÇâÈÄ IMARC GroupÀº ÀÌ ½ÃÀåÀÌ 2033³â±îÁö 854¾ï ´Þ·¯¿¡ ´ÞÇϰí, 2025³âºÎÅÍ 2033³â±îÁö 30.2%ÀÇ ¿¬Æò±Õ ¼ºÀå·ü(CAGR)À» º¸ÀÏ °ÍÀ¸·Î ¿¹ÃøÇϰí ÀÖ½À´Ï´Ù. ÀÌ ½ÃÀåÀº ´Ù¾çÇÑ ºÐ¾ßÀÇ Ãʰí¼Ó ÀÎÅÍ³Ý ¹× °í±Þ µ¥ÀÌÅÍ ¼­ºñ½º¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡, IoT ±â±âÀÇ º¸±Þ, 5G ³×Æ®¿öÅ© ±¸ÃàÀ» À§ÇÑ ¸·´ëÇÑ ÅõÀÚ¿Í Á¤ºÎ Áö¿ø Á¤Ã¥ µîÀ» ¹è°æÀ¸·Î ²ÙÁØÈ÷ ¼ºÀåÇϰí ÀÖÀ¸¸ç, 5G Ĩ¼Â ½ÃÀåÀº ¾Æ½Ã¾ÆÅÂÆò¾çÀÌ ¼¼°è ÃÖ´ë Á¡À¯À²À» Â÷ÁöÇϰí ÀÖ½À´Ï´Ù. Â÷ÁöÇϰí ÀÖ½À´Ï´Ù.

¼¼°è 5G Ĩ¼Â ½ÃÀå ºÐ¼® :

ÁÖ¿ä ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ : Ãʰí¼Ó ÀÎÅÍ³Ý ¹× °í±Þ µ¥ÀÌÅÍ ¼­ºñ½º¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡´Â ÁÖ·Î ½ÃÀå ¼ºÀåÀÇ ¿øµ¿·ÂÀÌ µÇ°í ÀÖ½À´Ï´Ù. ÀÌ ¿Ü¿¡µµ IoT ±â±âÀÇ º¸±Þ, ½º¸¶Æ®½ÃƼ ±¸»ó, »ê¾÷ ÀÚµ¿È­ÀÇ °¡¼ÓÈ­µµ ½ÃÀå ¼ºÀå¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù.

ÁÖ¿ä ½ÃÀå µ¿Çâ : 5G Ĩ¼ÂÀÇ ÅëÇÕ Ãß¼¼´Â ¼ÒºñÀÚ ÀüÀÚ±â±â, ƯÈ÷ ½º¸¶Æ®Æù°ú IoT ¹× »ê¾÷ ÀÚµ¿È­¸¦ À§ÇÑ »ó¾÷¿ë ºÐ¾ß¿¡¼­ 5G Ĩ¼ÂÀÇ ÅëÇÕ Ãß¼¼°¡ °­È­µÇ¸é¼­ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ¿¡³ÊÁö È¿À²ÀÌ ³ô°í ºñ¿ë È¿À²ÀûÀΠĨ¼Â ¼Ö·ç¼ÇÀÇ µµÀÔÀº 5G Ĩ¼Â ½ÃÀåÀÇ ¹Ì·¡¸¦ ¹à°Ô Àü¸ÁÇϰí ÀÖ½À´Ï´Ù.

Áö¸®Àû µ¿Çâ : ¾Æ½Ã¾ÆÅÂÆò¾ç, ƯÈ÷ Áß±¹, Çѱ¹ µîÀÇ ±¹°¡´Â ºü¸¥ ³×Æ®¿öÅ© ±¸Ãà°ú Á¤ºÎ Áö¿øÀ¸·Î 5G Ĩ¼Â ½ÃÀå¿¡¼­ °¡Àå Å« Á¡À¯À²À» Â÷ÁöÇϰí ÀÖ½À´Ï´Ù. ÀÌ Áö¿ªÀº 5G ±¸ÃàÀÇ ÃÖÀü¼±¿¡ ÀÖÀ¸¸ç, ´ë±Ô¸ð ³×Æ®¿öÅ© ±¸Ãà°ú 5G Áö¿ø ±â±âÀÇ ³ôÀº º¸±Þ·üÀ» ÀÚ¶ûÇÕ´Ï´Ù.

°æÀï ±¸µµ: ¼¼°è 5G Ĩ¼Â ¾÷°èÀÇ ÁÖ¿ä ±â¾÷À¸·Î´Â Broadcom Inc. Corporation,Qorvo,Qualcomm Technologies, Inc.,Samsung Electronics Co. µîÀÌ ÀÖ½À´Ï´Ù.

°úÁ¦¿Í ±âȸ: ÀÌ ½ÃÀåÀº ³ôÀº ÀÎÇÁ¶ó ºñ¿ë°ú Áö¿ª °£ Ç¥ÁØÈ­ÀÇ Çʿ伺À̶ó´Â ¹®Á¦¿¡ Á÷¸éÇØ ÀÖ½À´Ï´Ù. ±×·¯³ª ÀÌ·¯ÇÑ µµÀüÀº ºñ¿ë È¿À²ÀûÀÎ ¼Ö·ç¼ÇÀÇ Çõ½Å°ú ¼¼°è ½ÃÀå È®´ë¸¦ ÃËÁøÇϱâ À§ÇÑ º¸ÆíÀûÀΠǥÁØÀ» °³¹ßÇÒ ¼ö ÀÖ´Â ±âȸ·Î ÀÛ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù. °¢±¹ Á¤ºÎÀÇ ÀÌ´Ï¼ÅÆ¼ºê´Â ÅõÀÚ ¹× Áö¿ø Á¤Ã¥À» ÅëÇØ ½ÃÀå ¼ºÀåÀÇ Å« ±âȸ¸¦ Á¦°øÇÕ´Ï´Ù.

¼¼°è 5G Ĩ¼Â ½ÃÀå µ¿Çâ :

Ãʰí¼Ó ÀÎÅÍ³Ý ¹× µ¥ÀÌÅÍ ¼­ºñ½º¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡

¼¼°è ½ÃÀåÀº Ãʰí¼Ó ÀÎÅͳݰú °í±Þ µ¥ÀÌÅÍ ¼­ºñ½º¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡·Î ÀÎÇØ Å©°Ô °ßÀεǰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, IoT ±â±â, ½º¸¶Æ® ½ÃƼ, »ê¾÷ ÀÚµ¿È­ÀÇ È®»êµµ 5G Ĩ¼ÂÀÇ Çʿ伺À» ³ôÀ̰í ÀÖ½À´Ï´Ù. Àü ¼¼°èÀûÀ¸·Î ¿©·¯ ½º¸¶Æ®½ÃƼ ÇÁ·ÎÁ§Æ®¿Í ÀÌ´Ï¼ÅÆ¼ºê°¡ ÁøÇà ÁßÀ̸ç, 2025³â±îÁö Àü ¼¼°èÀûÀ¸·Î ¾à 30°³ÀÇ ½º¸¶Æ®½ÃƼ°¡ ź»ýÇÒ °ÍÀ¸·Î ¿¹»óµÇ¸ç, ±× Áß Àý¹ÝÀº ºÏ¹Ì¿Í À¯·´¿¡ À§Ä¡ÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ·¯ÇÑ ¿òÁ÷ÀÓÀº Àü ¼¼°èÀûÀÎ ÅõÀÚ¿¡ ÀÇÇØ µÞ¹ÞħµÇ°í ÀÖÀ¸¸ç, OECD¿¡ µû¸£¸é 2010³âºÎÅÍ 2030³â±îÁö µµ½Ã ÀÎÇÁ¶ó ÇÁ·ÎÁ§Æ®¿¡ ´ëÇÑ ÃÑ ÅõÀÚ¾×Àº 1Á¶ 8,000¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµÇ°í ÀÖ½À´Ï´Ù. ÀÌ¿¡ µû¶ó ½º¸¶Æ® ½ÃƼ Ä¿³ØÆ¼µå ¿ëµµ¸¦ À§ÇÑ 5G Ĩ¼Â¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ¸ð¹ÙÀÏ ³×Æ®¿öÅ©ÀÇ ±Þ¼ÓÇÑ È®Àå°ú ½º¸¶Æ®ÆùÀÇ º¸±Þ È®´ëµµ ÀÌ·¯ÇÑ Ãß¼¼¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. Àü ¼¼°è ½º¸¶Æ®Æù »ç¿ëÀÚ ¼ö´Â 2024³âºÎÅÍ 2029³â±îÁö ÃÑ 15¾ï ¸í(30.6% Áõ°¡)ÀÌ Áö¼ÓÀûÀ¸·Î Áõ°¡ÇÒ °ÍÀ¸·Î ¿¹»óµÇ¸ç, 15³â ¿¬¼Ó Áõ°¡ÇÑ ½º¸¶Æ®Æù »ç¿ëÀÚ ¼ö´Â 2029³â 64¾ï ¸í¿¡ ´ÞÇϰí, »õ·Î¿î Á¤Á¡À» ÂïÀ» °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ¶ÇÇÑ, ½ºÆ®¸®¹Ö ¼­ºñ½º, ¿Â¶óÀÎ °ÔÀÓ, ½Ç½Ã°£ µ¥ÀÌÅÍ ¾×¼¼½º¿¡ ´ëÇÑ ¿å±¸°¡ Áõ°¡ÇÔ¿¡ µû¶ó °ß°íÇÏ°í ºü¸¥ ¿¬°á ¼Ö·ç¼ÇÀÌ ÇÊ¿äÇϸç, ¹ÝµµÃ¼ Á¦Á¶¾÷ü°¡ À̸¦ Á¦°øÇÒ ¼ö ÀÖ½À´Ï´Ù.

¹ÝµµÃ¼ ¹× Åë½Å »ê¾÷ÀÇ ±â¼ú ¹ßÀü

¹ÝµµÃ¼ ¹× Åë½Å ºÐ¾ßÀÇ Áö¼ÓÀûÀÎ ±â¼ú ¹ßÀüµµ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇϰí ÀÖ½À´Ï´Ù. Ĩ¼Â ¼³°èÀÇ Áö¼ÓÀûÀÎ ±â¼ú Çõ½ÅÀº ´õ ÀÛ°í È¿À²ÀûÀÌ¸ç ºñ¿ë È¿À²ÀûÀÎ ±¸¼º ¿ä¼ÒÀÇ °³¹ßÀ» Æ÷ÇÔÇÏ¿© Àüü ½ÃÀå¿¡ ¹àÀº Àü¸ÁÀ» °¡Á®¿À°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ´Ù¾çÇÑ Åë½Å »ç¾÷ÀÚµéÀÌ 5G ¿¬°á ¹üÀ§¸¦ È®´ëÇϱâ À§ÇØ Á֯ļö ´ë¿ªÀ» ȹµæÇϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î, 2022³â 8¿ù Àεµ ÃÖÃÊÀÇ 5G Á֯ļö °æ¸Å¿¡¼­ ¿¡¾îÅÚÀº 19,800MHz Á֯ļö ´ë¿ª¿¡ 43,084 ·çÇǸ¦ ÁöºÒÇß½À´Ï´Ù. Áö³­ 20³â µ¿¾È 900MHz, 2100MHz, 1800MHz, 3300MHz, 26GHz Á֯ļö ´ë¿ªÀ» °æ¸Å¸¦ ÅëÇØ ȹµæÇß½À´Ï´Ù. ÀÌ È¸»ç´Â 3.5GHz ´ë¿ª°ú 26GHz ´ë¿ª¿¡¼­ Àεµ Àü¿ª¿¡ °ÉÃÄ ¹ßÀÚ±¹À» È®º¸Çß½À´Ï´Ù. ȸ»ç Ãø¿¡ µû¸£¸é, ÀÌ´Â ÃÖ°íÀÇ 5G °æÇèÀ» Á¦°øÇϱâ À§ÇÑ ÀÌ»óÀûÀÎ Á֯ļö ¹ðÅ©À̸ç, ÃÖÀú ºñ¿ëÀ¸·Î 100¹èÀÇ ¿ë·® È®ÀåÀ» Àü·«ÀûÀ¸·Î ¼öÇàÇÒ ¼ö ÀÖ´Ù°í ¹àÇû½À´Ï´Ù. ¶ÇÇÑ 5G ÀÎÇÁ¶ó¸¦ °³¼±Çϱâ À§ÇØ ´Ù¾çÇÑ ÁÖ¿ä ½ÃÀå ±â¾÷µéµµ ¼­·Î Çù·ÂÇϰí ÀÖ½À´Ï´Ù. ¿¹¸¦ µé¾î, ABB¿Í ¿¡¸¯½¼Àº ű¹ÀÇ Àδõ½ºÆ®¸® 4.0ÀÇ ¾ß¸ÁÀ» ½ÇÇöÇϰí ÀÚµ¿È­ ½Ã½ºÅÛ°ú ¹«¼± Åë½ÅÀ¸·Î ¹Ì·¡ÀÇ À¯¿¬ÇÑ »ý»êÀ» ÃËÁøÇϱâ À§ÇØ Çù·ÂÇß½À´Ï´Ù. ÁßÁ¡ ºÐ¾ß´Â ABBÀÇ ·Îº¿ ¹× °³º° ÀÚµ¿È­, »ê¾÷ ÀÚµ¿È­, ¸ð¼Ç »ç¾÷ ºÐ¾ß¿Í ABB Ability TM Platform Services¸¦ Æ÷ÇÔÇÕ´Ï´Ù. À̹ø Çù·ÂÀº ¿¡¸¯½¼ÀÇ Åë½Å ¼­ºñ½º Á¦°ø¾÷ü ÆÄÆ®³Ê¿Í IoT-Accelerator Ç÷§ÆûÀ» ÅëÇØ Àü ¼¼°è¿¡ NB-IoT·Î ¿¬°áµÈ ¸ðÅÍ¿Í µå¶óÀ̺ê, ±×¸®°í Á¦Á¶ ȯ°æ¿¡¼­ ¿ø°Ý ½Ã¿îÀüÀ» À§ÇÑ 5G Áö¿ø Áõ°­Çö½Ç ·»Á ´ë»óÀ¸·Î ÇÕ´Ï´Ù. ¶ÇÇÑ, ´õ ÀÛÀº ³ª³ë¹ÌÅÍ °øÁ¤ ³ëµå·ÎÀÇ Àüȯ µî ¹ÝµµÃ¼ ±â¼úÀÇ ¹ßÀüÀ¸·Î ¼º´É°ú ¿¡³ÊÁö È¿À²ÀÌ Çâ»óµÇ°í ÀÖÀ¸¸ç, ÀÌ´Â 5G Ĩ¼Â ½ÃÀåÀÇ ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

Á¤ºÎÀÇ ÀÌ´Ï¼ÅÆ¼ºê¿Í 5G ÀÎÇÁ¶ó ÅõÀÚ

Á¤ºÎÀÇ Á¤Ã¥°ú ÅõÀÚ´Â ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÏ´Â µ¥ ÀÖ¾î ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. ¸¹Àº ±¹°¡µéÀÌ µðÁöÅÐ ÀüȯÀÇ ÀÏȯÀ¸·Î 5G ³×Æ®¿öÅ© ±¸ÃàÀ» Àû±ØÀûÀ¸·Î ÃßÁøÇϰí ÀÖÀ¸¸ç, ÀÌ °úÁ¤À» °¡¼ÓÈ­Çϱâ À§ÇØ ÀçÁ¤Àû, ±ÔÁ¦Àû Áö¿øÀ» Á¦°øÇÕ´Ï´Ù. ¿¹¸¦ µé¾î, IBEF µ¥ÀÌÅÍ¿¡ µû¸£¸é, Àεµ Á¤ºÎ´Â GDP¿¡ ´ëÇÑ Á¦Á¶¾÷ÀÇ »ý»ê·® ±â¿©µµ¸¦ 16%¿¡¼­ 2025³â±îÁö 25%·Î ²ø¾î¿Ã¸®°Ú´Ù´Â ¾ß½ÉÂù ¸ñÇ¥¸¦ ¼¼¿ì°í ÀÖ½À´Ï´Ù. Smart Advanced Manufacturing and Rapid Transformation Hub(SAMARTH) Udyog Bharat 4.0 ÀÌ´Ï¼ÅÆ¼ºê´Â Àεµ Á¦Á¶¾÷¿¡¼­ Àδõ½ºÆ®¸® 4.0¿¡ ´ëÇÑ ÀνÄÀ» ³ôÀ̰í ÀÌÇØ°ü°èÀÚµéÀÌ ½º¸¶Æ® Á¦Á¶ÀÇ °úÁ¦¸¦ ÇØ°áÇÒ ¼ö ÀÖµµ·Ï Áö¿øÇÏ´Â °ÍÀ» ¸ñÇ¥·Î Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, °¢±¹ Á¤ºÎ´Â 5G ³×Æ®¿öÅ©ÀÇ È¿À²ÀûÀÎ ¿î¿µ°ú 5G Ĩ¼ÂÀÇ ¼º´É¿¡ ÇʼöÀûÀÎ 5G Á֯ļö ´ë¿ªÀÇ ÇÒ´çÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù.

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹üÀ§¿Í Á¶»ç ¹æ¹ý

  • Á¶»ç ¸ñÀû
  • ÀÌÇØ°ü°èÀÚ
  • µ¥ÀÌÅÍ ¼Ò½º
    • 1Â÷ Á¤º¸
    • 2Â÷ Á¤º¸
  • ½ÃÀå ÃßÁ¤
    • º¸ÅÒ¾÷ Á¢±Ù
    • Åé´Ù¿î Á¢±Ù
  • Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ¼­·Ð

  • °³¿ä
  • ÁÖ¿ä ¾÷°è µ¿Çâ

Á¦5Àå ¼¼°èÀÇ 5G Ĩ¼Â ½ÃÀå

  • ½ÃÀå °³¿ä
  • ½ÃÀå ½ÇÀû
  • COVID-19ÀÇ ¿µÇâ
  • ½ÃÀå ¿¹Ãø

Á¦6Àå ½ÃÀå ºÐ¼® : Ĩ¼Â À¯Çüº°

  • ÁÖ¹®Çü ÁýÀûȸ·Î(ASIC)
  • ¹«¼± Á֯ļö ÁýÀûȸ·Î(RFIC)
  • ¹Ð¸®¹ÌÅÍÆÄ ±â¼ú Ĩ
  • Çʵå ÇÁ·Î±×·¡¸Óºí °ÔÀÌÆ® ¾î·¹ÀÌ(FPGA)

Á¦7Àå ½ÃÀå ºÐ¼® : µ¿ÀÛ Á֯ļöº°

  • 6GHz ¹Ì¸¸
  • 26-39GHz
  • 39GHz ÀÌ»ó

Á¦8Àå ½ÃÀå ºÐ¼® : ÃÖÁ¾»ç¿ëÀÚº°

  • °¡Àü
  • »ê¾÷ ÀÚµ¿È­
  • ÀÚµ¿Â÷ ¹× ¿î¼Û
  • ¿¡³ÊÁö ¹× À¯Æ¿¸®Æ¼
  • ÇコÄɾî
  • ¼Ò¸Å
  • ±âŸ

Á¦9Àå ½ÃÀå ºÐ¼® : Áö¿ªº°

  • ºÏ¹Ì
    • ¹Ì±¹
    • ij³ª´Ù
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • Áß±¹
    • ÀϺ»
    • Àεµ
    • Çѱ¹
    • È£ÁÖ
    • Àεµ³×½Ã¾Æ
    • ±âŸ
  • À¯·´
    • µ¶ÀÏ
    • ÇÁ¶û½º
    • ¿µ±¹
    • ÀÌÅ»¸®¾Æ
    • ½ºÆäÀÎ
    • ·¯½Ã¾Æ
    • ±âŸ
  • ¶óƾ¾Æ¸Þ¸®Ä«
    • ºê¶óÁú
    • ¸ß½ÃÄÚ
    • ±âŸ
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«
    • ½ÃÀå ³»¿ª : ±¹°¡º°

Á¦10Àå SWOT ºÐ¼®

  • °³¿ä
  • °­Á¡
  • ¾àÁ¡
  • ±âȸ
  • À§Çù

Á¦11Àå ¹ë·ùüÀÎ ºÐ¼®

Á¦12Àå PorterÀÇ Five Forces ºÐ¼®

  • °³¿ä
  • ¹ÙÀ̾îÀÇ ±³¼··Â
  • °ø±Þ ±â¾÷ÀÇ ±³¼··Â
  • °æÀï Á¤µµ
  • ½Å±Ô ÁøÃâ¾÷üÀÇ À§Çù
  • ´ëüǰÀÇ À§Çù

Á¦13Àå °¡°Ý ºÐ¼®

Á¦14Àå °æÀï ±¸µµ

  • ½ÃÀå ±¸Á¶
  • ÁÖ¿ä ±â¾÷
  • ÁÖ¿ä ±â¾÷ °³¿ä
    • Broadcom Inc.
    • Huawei Technologies Co. Ltd.
    • Infineon Technologies Ag
    • Intel Corporation
    • Mediatek Inc
    • Nokia Corporation
    • Qorvo
    • Qualcomm Technologies Inc.
    • Samsung Electronics Co. Ltd.
    • Xilinx Inc.
LSH 25.06.02

The global 5G chipset market size reached USD 7.9 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 85.4 Billion by 2033, exhibiting a growth rate (CAGR) of 30.2% during 2025-2033. The market is experiencing steady growth driven by the escalating demand for high-speed internet and advanced data services across various sectors, the widespread adoption of IoT devices, and substantial investments and supportive government policies for 5G network deployment. Asia Pacific accounts for the largest 5G chipset market share in the world.

Global 5G Chipset Market Analysis:

Major Market Drivers: The escalating demand for high-speed internet and advanced data services is primarily driving the growth of the market. In addition to this, the widespread adoption of IoT devices, smart city initiatives, and the acceleration of industrial automation is also contributing to the market growth.

Key Market Trends: The growing trend towards the integration of 5G chipsets in consumer electronics, particularly smartphones, and in commercial sectors for IoT and industrial automation is augmenting the market growth. Moreover, the introduction of energy-efficient and cost-effective chipset solutions is creating a positive outlook for the future of the 5G chipset market.

Geographical Trends: The Asia-Pacific region, particularly countries such as China and South Korea, holds the largest 5G chipset market share due to rapid network deployment and government support. This region has been at the forefront of 5G deployment, with extensive network rollouts and a high adoption rate of 5G-enabled devices.

Competitive Landscape: Some of the leading players in the global 5G chipset industry include Broadcom Inc., Huawei Technologies Co., Ltd., Infineon Technologies Ag, Intel Corporation, Mediatek Inc., Nokia Corporation, Qorvo, Qualcomm Technologies, Inc., Samsung Electronics Co. Ltd., Xilinx Inc, among others.

Challenges and Opportunities: The market faces challenges, such as high infrastructure costs and the need for standardization across regions. However, these challenges present opportunities for innovation in cost-effective solutions and the development of universal standards to foster global market expansion. Government initiatives in various countries offer substantial opportunities for market growth through investments and supportive policies.

Global 5G Chipset Market Trends:

Increasing Demand for High-Speed Internet and Data Services

The global market is significantly driven by the escalating demand for high-speed internet and advanced data services. Furthermore, the proliferation of IoT devices, smart cities, and industrial automation is also augmenting the need for 5G chipsets. Several smart city projects and initiatives are underway around the world, and it is expected that by 2025, there will be around 30 global smart cities, with half of these located in North America and Europe. These steps are supported by global investments, which, according to the OECD, are expected to total US$ 1.8 Trillion in urban infrastructure projects between 2010 and 2030. This, in turn, is driving the demand for 5G chipsets for smart city connectivity applications. Moreover, the rapid expansion of mobile networks and increasing smartphone penetration are contributing to this trend. The global number of smartphone users was forecast to continuously increase between 2024 and 2029 by, in total, 1.5 billion users (+30.6 %). After the fifteenth consecutive increasing year, the smartphone user base is estimated to reach 6.4 billion users and, therefore, a new peak in 2029. Furthermore, the growing appetite for streaming services, online gaming, and real-time data access necessitates robust and fast connectivity solutions, which they can provide.

Technological Advancements in Semiconductor and Telecommunication Industries

Ongoing technological advancements in the semiconductor and telecommunication sectors are also propelling the growth of the market. Continuous innovation in chipset design, including the development of smaller, more efficient, and cost-effective components, is creating a positive outlook for the overall market. Additionally, various telecom operators are acquiring spectrums to increase their 5G connection coverage. For instance, in August 2022, in India's first 5G spectrum auction, Airtel paid INR 43,084 crore for 19,800 MHz spectrum. In the past 20 years, spectrum bands 900 MHz, 2100 MHz, 1800 MHz, 3300 MHz, and 26 GHz have been acquired through auctions. It obtained a pan-India footprint in the 3.5 GHz and 26 GHz bands. According to the company, this is the ideal spectrum bank for the best 5G experience, with 100x capacity enhancement done strategically at the lowest cost. Moreover, various key market players are also collaborating with each other to improve 5G infrastructure. For example, ABB and Ericsson collaborated to realize Thailand's Industry 4.0 ambition and facilitate future flexible production with automation systems and wireless communications. The focus areas include ABB's Robotics & Discrete Automation, Industrial Automation, and Motion business areas and ABB Ability TM Platform Services. The collaboration covers 5G-enabled Augmented Reality Lenses for remote commissioning in manufacturing environments in addition to global NB-IoT connected motors and drives through Ericsson Communication Service Provider partners and its IoT-Accelerator platform. Furthermore, advances in semiconductor technology, such as the transition to smaller nanometre process nodes, are enhancing their performance and energy efficiency, which is anticipated to propel the 5G chipset market growth.

Government Initiatives and Investment in 5G Infrastructure

Government policies and investments are playing a pivotal role in driving the market growth. Numerous countries are actively promoting the deployment of 5G networks as part of their digital transformation agendas, providing financial and regulatory support to accelerate this process. For instance, according to IBEF data, the Government of India has set an ambitious target of increasing manufacturing output contribution to GDP to 25% by 2025, up from 16%. The Smart Advanced Manufacturing and Rapid Transformation Hub (SAMARTH) Udyog Bharat 4.0 initiative aims to raise awareness of Industry 4.0 in the Indian manufacturing industry and assist stakeholders in addressing smart manufacturing challenges. Furthermore, governments are facilitating the allocation of 5G spectrum bands, crucial for the efficient operation of 5G networks and, by extension, the performance of 5G chipsets.

5G Chipset Industry Segmentation:

Breakup by Chipset Type:

  • Application-specific Integrated Circuits (ASIC)
  • Radio Frequency Integrated Circuit (RFIC)
  • Millimeter Wave Technology Chips
  • Field-programmable Gate Array (FPGA)

Application-specific integrated circuits (ASIC) dominate the market

The ASIC segment holds the largest share of the market. These chips are custom-designed for specific applications, making them highly efficient for dedicated tasks. In the context of 5G, ASICs are predominantly used in network infrastructure and high-performance computing applications where efficiency and speed are critical. Their ability to provide tailored solutions for complex processes, such as signal processing and data handling in 5G networks, makes them a preferred choice. Despite their higher upfront development cost, their optimized performance and lower operational costs in the long term contribute significantly to their market dominance.

Breakup by Operational Frequency:

  • Sub 6 GHz
  • Between 26 and 39 Ghz
  • Above 39 Ghz

Sub 6 GHz holds the largest share in the market

The sub 6 GHz segment is currently the largest in the global market. This frequency range is crucial for providing widespread coverage and better penetration through obstacles, making it ideal for urban and suburban areas. Chipsets operating in this spectrum are fundamental to ensuring broad 5G network accessibility, especially in regions where dense building construction can impede higher frequency signals. These chipsets support a balance between coverage and data rate, making them suitable for a wide array of consumer devices and industrial applications.

Breakup by End User:

  • Consumer Electronics
  • Industrial Automation
  • Automotive and Transportation
  • Energy and Utilities
  • Healthcare
  • Retail
  • Others

Consumer electronics hold the largest share of the market

The consumer electronics segment holds the largest share of the market, driven by the rapid adoption of 5G technology in smartphones, tablets, wearables, and smart home devices. According to the Cisco Annual Internet Report, the average smartphone connection speed in the United States was 81.1 Mbps as of 2023, up from 19.2 Mbps in 2018, a 4.2-fold growth (33% CAGR). Alongside 5G rollouts, operators are also pursuing ambitious network transformation strategies. Moreover, numerous consumer electronic operators are increasingly collaborating with 5G providers, which is creating a positive outlook for the overall market. For instance, 18 global telecom and consumer device makers partnered with US-based Qualcomm for their 5G chipset. Such innovations and advancements will continue to cater to the growth of this segment.

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Asia Pacific leads the market, accounting for the largest 5G chipset market share.

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

Asia Pacific (APAC) is the largest segment in the market, primarily driven by rapid technological advancements and strong government support in countries such as China, South Korea, and Japan. This region has been at the forefront of 5G deployment, with extensive network rollouts and a high adoption rate of 5G-enabled devices. Further, South Korea also boasts one of the highest 5G performances in APAC, exceeded only by Malaysia. The two countries are home to the leading cities in terms of 5G performance, with Seoul having the fastest download speed and Kuala Lumpur the fastest upload speed among major cities in the region. South Korea was the first country worldwide to launch 5G services in April 2019.

Leading Key Players in the 5G Chipset Industry:

The market research report has provided a comprehensive analysis of the competitive landscape. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

  • Broadcom Inc
  • Huawei Technologies Co., Ltd.
  • Infineon Technologies Ag
  • Intel Corporation
  • Mediatek Inc
  • Nokia Corporation
  • Qorvo
  • Qualcomm Technologies, Inc.
  • Samsung Electronics Co. Ltd.
  • Xilinx Inc.

Key Questions Answered in This Report

  • 1.How large is the 5G chipset market?
  • 2.What is the expected growth rate of the global 5G chipset market during 2025-2033?
  • 3.What are the key 5G chipset market drivers, propelling the market growth?
  • 4.What has been the impact of COVID-19 on the global 5G chipset market?
  • 5.What is the breakup of the global 5G chipset market based on the chipset type?
  • 6.What is the breakup of the global 5G chipset market based on the operational frequency?
  • 7.What is the breakup of the global 5G chipset market based on end user?
  • 8.What are the key regions in the global 5G chipset market?
  • 9.Who are the key players/companies in the global 5G chipset market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global 5G Chipset Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Chipset Type

  • 6.1 Application-specific Integrated Circuits (ASIC)
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Radio Frequency Integrated Circuit (RFIC)
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 Millimeter Wave Technology Chips
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 Field-programmable Gate Array (FPGA)
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast

7 Market Breakup by Operational Frequency

  • 7.1 Sub 6 GHz
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Between 26 and 39 Ghz
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Above 39 Ghz
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast

8 Market Breakup by End User

  • 8.1 Consumer Electronics
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Industrial Automation
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Automotive and Transportation
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Energy and Utilities
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 Healthcare
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast
  • 8.6 Retail
    • 8.6.1 Market Trends
    • 8.6.2 Market Forecast
  • 8.7 Others
    • 8.7.1 Market Trends
    • 8.7.2 Market Forecast

9 Market Breakup by Region

  • 9.1 North America
    • 9.1.1 United States
      • 9.1.1.1 Market Trends
      • 9.1.1.2 Market Forecast
    • 9.1.2 Canada
      • 9.1.2.1 Market Trends
      • 9.1.2.2 Market Forecast
  • 9.2 Asia-Pacific
    • 9.2.1 China
      • 9.2.1.1 Market Trends
      • 9.2.1.2 Market Forecast
    • 9.2.2 Japan
      • 9.2.2.1 Market Trends
      • 9.2.2.2 Market Forecast
    • 9.2.3 India
      • 9.2.3.1 Market Trends
      • 9.2.3.2 Market Forecast
    • 9.2.4 South Korea
      • 9.2.4.1 Market Trends
      • 9.2.4.2 Market Forecast
    • 9.2.5 Australia
      • 9.2.5.1 Market Trends
      • 9.2.5.2 Market Forecast
    • 9.2.6 Indonesia
      • 9.2.6.1 Market Trends
      • 9.2.6.2 Market Forecast
    • 9.2.7 Others
      • 9.2.7.1 Market Trends
      • 9.2.7.2 Market Forecast
  • 9.3 Europe
    • 9.3.1 Germany
      • 9.3.1.1 Market Trends
      • 9.3.1.2 Market Forecast
    • 9.3.2 France
      • 9.3.2.1 Market Trends
      • 9.3.2.2 Market Forecast
    • 9.3.3 United Kingdom
      • 9.3.3.1 Market Trends
      • 9.3.3.2 Market Forecast
    • 9.3.4 Italy
      • 9.3.4.1 Market Trends
      • 9.3.4.2 Market Forecast
    • 9.3.5 Spain
      • 9.3.5.1 Market Trends
      • 9.3.5.2 Market Forecast
    • 9.3.6 Russia
      • 9.3.6.1 Market Trends
      • 9.3.6.2 Market Forecast
    • 9.3.7 Others
      • 9.3.7.1 Market Trends
      • 9.3.7.2 Market Forecast
  • 9.4 Latin America
    • 9.4.1 Brazil
      • 9.4.1.1 Market Trends
      • 9.4.1.2 Market Forecast
    • 9.4.2 Mexico
      • 9.4.2.1 Market Trends
      • 9.4.2.2 Market Forecast
    • 9.4.3 Others
      • 9.4.3.1 Market Trends
      • 9.4.3.2 Market Forecast
  • 9.5 Middle East and Africa
    • 9.5.1 Market Trends
    • 9.5.2 Market Breakup by Country
    • 9.5.3 Market Forecast

10 SWOT Analysis

  • 10.1 Overview
  • 10.2 Strengths
  • 10.3 Weaknesses
  • 10.4 Opportunities
  • 10.5 Threats

11 Value Chain Analysis

12 Porters Five Forces Analysis

  • 12.1 Overview
  • 12.2 Bargaining Power of Buyers
  • 12.3 Bargaining Power of Suppliers
  • 12.4 Degree of Competition
  • 12.5 Threat of New Entrants
  • 12.6 Threat of Substitutes

13 Price Analysis

14 Competitive Landscape

  • 14.1 Market Structure
  • 14.2 Key Players
  • 14.3 Profiles of Key Players
    • 14.3.1 Broadcom Inc.
      • 14.3.1.1 Company Overview
      • 14.3.1.2 Product Portfolio
      • 14.3.1.3 Financials
      • 14.3.1.4 SWOT Analysis
    • 14.3.2 Huawei Technologies Co. Ltd.
      • 14.3.2.1 Company Overview
      • 14.3.2.2 Product Portfolio
    • 14.3.3 Infineon Technologies Ag
      • 14.3.3.1 Company Overview
      • 14.3.3.2 Product Portfolio
      • 14.3.3.3 Financials
      • 14.3.3.4 SWOT Analysis
    • 14.3.4 Intel Corporation
      • 14.3.4.1 Company Overview
      • 14.3.4.2 Product Portfolio
      • 14.3.4.3 Financials
      • 14.3.4.4 SWOT Analysis
    • 14.3.5 Mediatek Inc
      • 14.3.5.1 Company Overview
      • 14.3.5.2 Product Portfolio
      • 14.3.5.3 Financials
      • 14.3.5.4 SWOT Analysis
    • 14.3.6 Nokia Corporation
      • 14.3.6.1 Company Overview
      • 14.3.6.2 Product Portfolio
    • 14.3.7 Qorvo
      • 14.3.7.1 Company Overview
      • 14.3.7.2 Product Portfolio
      • 14.3.7.3 Financials
      • 14.3.7.4 SWOT Analysis
    • 14.3.8 Qualcomm Technologies Inc.
      • 14.3.8.1 Company Overview
      • 14.3.8.2 Product Portfolio
    • 14.3.9 Samsung Electronics Co. Ltd.
      • 14.3.9.1 Company Overview
      • 14.3.9.2 Product Portfolio
      • 14.3.9.3 Financials
      • 14.3.9.4 SWOT Analysis
    • 14.3.10 Xilinx Inc.
      • 14.3.10.1 Company Overview
      • 14.3.10.2 Product Portfolio
      • 14.3.10.3 Financials
      • 14.3.10.4 SWOT Analysis
»ùÇà ¿äû ¸ñ·Ï
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
¸ñ·Ï º¸±â
Àüü»èÁ¦