세계의 차세대 메모리 시장 규모, 점유율, 동향, 예측 : 기술, 웨이퍼 사이즈, 스토리지 유형, 용도, 지역별(2025-2033년)

The global next generation memory market size reached USD 7.6 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 47.7 Billion by 2033, exhibiting a growth rate CAGR of 22.51% during 2025-2033. Asia Pacific currently dominates the market, holding a significant share of 39.8% in 2024, driven by strong semiconductor manufacturing, rising demand for advanced memory solutions, and increasing adoption of AI, IoT, and cloud technologies.

Next generation memory refers to a fast, efficient and cost-effective storage solution that can store more data than silicon chips. It consequently finds extensive applications in the telecommunications, information technology (IT), and banking, financial services and insurance (BFSI) industries across the globe. At present, there is a surge in the requirement for high bandwidth, low power consumption, and highly scalable memory devices that rely on artificial intelligence (AI), the Internet of things (IoT), big data and other technologies. This, in turn, is catalyzing the demand for next generation memory.

Next Generation Memory Market Trends:

There is presently a significant rise in the traction of universal memory worldwide. This, in confluence with the burgeoning electronics industry, represents one of the key factors bolstering the growth of the market. Apart from this, with the growing sales of smartphones, tablets, universal serial bus (USB) drives, and solid-state drives (SSD), the demand for NOT-AND (NAND) flash memory, which is a type of non-volatile storage technology that does not need energy to retain data is also increasing. Besides this, high-bandwidth memory (HBM), a next generation memory technology for graphics, is rapidly being used in leading-edge graphics, networking, high-performance computing (HPC), and artificial intelligence (AI) systems. For instance, it is utilized in decoders, fully autonomous vehicles, neural network designs, and other advanced applications that require low power and enormous bandwidth. This, coupled with the rising usage of wearable devices, is facilitating the growth of the market. Other factors, such as the increasing use of connected cars and considerable growth in the IT industry, are projected to create a positive outlook for the market in the upcoming years.

Key Market Segmentation:

Breakup by Technology:

• Non-Volatile
• Magneto-Resistive Random-Access Memory (MRAM)
• Ferroelectric RAM (FRAM)
• Resistive Random-Access Memory (ReRAM)
• 3D Xpoint
• Nano RAM
• Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
• Volatile
• Hybrid Memory Cube (HMC)
• High-Bandwidth Memory (HBM)

Breakup by Wafer Size:

• 200 mm
• 300 mm
• 450 mm

Breakup by Storage Type:

• Mass Storage
• Embedded Storage
• Others

Breakup by Application:

• BFSI
• Consumer Electronics
• Government
• Telecommunications
• Information Technology
• Others

Breakup by Region:

• North America
• United States
• Canada
• Asia-Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Avalanche Technology, Crossbar Inc., Fujitsu Limited, Honeywell International Inc., Infineon Technologies AG, Intel Corporation, Micron Technology Inc., Nantero Inc., Samsung Electronics Co. Ltd., SK hynix Inc., Spin Memory Inc. and Taiwan Semiconductor Manufacturing Co. Ltd.

Key Questions Answered in This Report

• 1.How big is the next generation memory market?
• 2.What is the future outlook of next generation memory market?
• 3.What are the key factors driving the next generation memory market?
• 4.Which region accounts for the largest next generation memory market share?
• 5.Which are the leading companies in the global next generation memory market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Next Generation Memory Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Technology

• 6.1 Non-Volatile
  • 6.1.1 Market Trends
  • 6.1.2 Key Segments
    • 6.1.2.1 Magneto-Resistive Random-Access Memory (MRAM)
    • 6.1.2.2 Ferroelectric RAM (FRAM)
    • 6.1.2.3 Resistive Random-Access Memory (ReRAM)
    • 6.1.2.4 3D Xpoint
    • 6.1.2.5 Nano RAM
    • 6.1.2.6 Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
  • 6.1.3 Market Forecast
• 6.2 Volatile
  • 6.2.1 Market Trends
  • 6.2.2 Key Segments
    • 6.2.2.1 Hybrid Memory Cube (HMC)
    • 6.2.2.2 High-Bandwidth Memory (HBM)
  • 6.2.3 Market Forecast

7 Market Breakup by Wafer Size

• 7.1 200 mm
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 300 mm
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 450 mm
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast

8 Market Breakup by Storage Type

• 8.1 Mass Storage
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Embedded Storage
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast
• 8.3 Others
  • 8.3.1 Market Trends
  • 8.3.2 Market Forecast

9 Market Breakup by Application

• 9.1 BFSI
  • 9.1.1 Market Trends
  • 9.1.2 Market Forecast
• 9.2 Consumer Electronics
  • 9.2.1 Market Trends
  • 9.2.2 Market Forecast
• 9.3 Government
  • 9.3.1 Market Trends
  • 9.3.2 Market Forecast
• 9.4 Telecommunications
  • 9.4.1 Market Trends
  • 9.4.2 Market Forecast
• 9.5 Information Technology
  • 9.5.1 Market Trends
  • 9.5.2 Market Forecast
• 9.6 Others
  • 9.6.1 Market Trends
  • 9.6.2 Market Forecast

10 Market Breakup by Region

• 10.1 North America
  • 10.1.1 United States
    • 10.1.1.1 Market Trends
    • 10.1.1.2 Market Forecast
  • 10.1.2 Canada
    • 10.1.2.1 Market Trends
    • 10.1.2.2 Market Forecast
• 10.2 Asia-Pacific
  • 10.2.1 China
    • 10.2.1.1 Market Trends
    • 10.2.1.2 Market Forecast
  • 10.2.2 Japan
    • 10.2.2.1 Market Trends
    • 10.2.2.2 Market Forecast
  • 10.2.3 India
    • 10.2.3.1 Market Trends
    • 10.2.3.2 Market Forecast
  • 10.2.4 South Korea
    • 10.2.4.1 Market Trends
    • 10.2.4.2 Market Forecast
  • 10.2.5 Australia
    • 10.2.5.1 Market Trends
    • 10.2.5.2 Market Forecast
  • 10.2.6 Indonesia
    • 10.2.6.1 Market Trends
    • 10.2.6.2 Market Forecast
  • 10.2.7 Others
    • 10.2.7.1 Market Trends
    • 10.2.7.2 Market Forecast
• 10.3 Europe
  • 10.3.1 Germany
    • 10.3.1.1 Market Trends
    • 10.3.1.2 Market Forecast
  • 10.3.2 France
    • 10.3.2.1 Market Trends
    • 10.3.2.2 Market Forecast
  • 10.3.3 United Kingdom
    • 10.3.3.1 Market Trends
    • 10.3.3.2 Market Forecast
  • 10.3.4 Italy
    • 10.3.4.1 Market Trends
    • 10.3.4.2 Market Forecast
  • 10.3.5 Spain
    • 10.3.5.1 Market Trends
    • 10.3.5.2 Market Forecast
  • 10.3.6 Russia
    • 10.3.6.1 Market Trends
    • 10.3.6.2 Market Forecast
  • 10.3.7 Others
    • 10.3.7.1 Market Trends
    • 10.3.7.2 Market Forecast
• 10.4 Latin America
  • 10.4.1 Brazil
    • 10.4.1.1 Market Trends
    • 10.4.1.2 Market Forecast
  • 10.4.2 Mexico
    • 10.4.2.1 Market Trends
    • 10.4.2.2 Market Forecast
  • 10.4.3 Others
    • 10.4.3.1 Market Trends
    • 10.4.3.2 Market Forecast
• 10.5 Middle East and Africa
  • 10.5.1 Market Trends
  • 10.5.2 Market Breakup by Country
  • 10.5.3 Market Forecast

11 SWOT Analysis

• 11.1 Overview
• 11.2 Strengths
• 11.3 Weaknesses
• 11.4 Opportunities
• 11.5 Threats

12 Value Chain Analysis

13 Porters Five Forces Analysis

• 13.1 Overview
• 13.2 Bargaining Power of Buyers
• 13.3 Bargaining Power of Suppliers
• 13.4 Degree of Competition
• 13.5 Threat of New Entrants
• 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

• 15.1 Market Structure
• 15.2 Key Players
• 15.3 Profiles of Key Players
  • 15.3.1 Avalanche Technology
    • 15.3.1.1 Company Overview
    • 15.3.1.2 Product Portfolio
  • 15.3.2 Crossbar Inc.
    • 15.3.2.1 Company Overview
    • 15.3.2.2 Product Portfolio
  • 15.3.3 Fujitsu Limited
    • 15.3.3.1 Company Overview
    • 15.3.3.2 Product Portfolio
    • 15.3.3.3 Financials
    • 15.3.3.4 SWOT Analysis
  • 15.3.4 Honeywell International Inc.
    • 15.3.4.1 Company Overview
    • 15.3.4.2 Product Portfolio
    • 15.3.4.3 Financials
    • 15.3.4.4 SWOT Analysis
  • 15.3.5 Infineon Technologies AG
    • 15.3.5.1 Company Overview
    • 15.3.5.2 Product Portfolio
    • 15.3.5.3 Financials
    • 15.3.5.4 SWOT Analysis
  • 15.3.6 Intel Corporation
    • 15.3.6.1 Company Overview
    • 15.3.6.2 Product Portfolio
    • 15.3.6.3 Financials
    • 15.3.6.4 SWOT Analysis
  • 15.3.7 Micron Technology Inc.
    • 15.3.7.1 Company Overview
    • 15.3.7.2 Product Portfolio
    • 15.3.7.3 Financials
    • 15.3.7.4 SWOT Analysis
  • 15.3.8 Nantero Inc.
    • 15.3.8.1 Company Overview
    • 15.3.8.2 Product Portfolio
  • 15.3.9 Samsung Electronics Co. Ltd.
    • 15.3.9.1 Company Overview
    • 15.3.9.2 Product Portfolio
    • 15.3.9.3 Financials
  • 15.3.10 SK hynix Inc.
    • 15.3.10.1 Company Overview
    • 15.3.10.2 Product Portfolio
    • 15.3.10.3 Financials
    • 15.3.10.4 SWOT Analysis
  • 15.3.11 Spin Memory Inc.
    • 15.3.11.1 Company Overview
    • 15.3.11.2 Product Portfolio
  • 15.3.12 Taiwan Semiconductor Manufacturing Co. Ltd.
    • 15.3.12.1 Company Overview
    • 15.3.12.2 Product Portfolio
    • 15.3.12.3 Financials
    • 15.3.12.4 SWOT Analysis