광 상호연결 시장 보고서 : 제품 유형별, 상호연결 레벨별, 파이버 모드별, 용도별, 최종 이용 산업별, 지역별(2025-2033년)

The global optical interconnect market size reached USD 13.4 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 34.3 Billion by 2033, exhibiting a growth rate (CAGR) of 10.42% during 2025-2033.

An optical interconnect is a link that is used to connect multiple computer systems in a circuit through light. It is an interface that assists in receiving digital signals from network equipment and converting them into optical signals that are transmitted through the fiber network. Advanced signal processing is facilitated by optical interconnect to monitor or manage errors and reduce distortion in fiber optics. Optical interconnections can range from short connections on motherboards to kilometer-long links used in large area networks. These interconnects have a low frequency-dependent loss, negligible crosstalk and high bandwidth due to which they find wide applications in the semiconductor industry.

Increasing demand for internet services across the domestic, commercial and industrial sectors is the key factor driving the market growth. Owing to the rapid growth of the information technology (IT) sector along with the introduction of big data analytics and Internet of Things (IoT), the demand for high data transmission and bandwidth communication is on the rise, which has led to an increased demand for optical interconnect globally. Optical interconnect is considered a more suitable alternative to the traditionally used technologies, in order to meet the current performance requirements of data processors. Also, the rising demand for increased bandwidth capacity along with the reduced power consumption within data center networks is acting as a major growth-inducing factor. Furthermore, rising network traffic from both private and government sectors has resulted in an increasing demand for optical interconnect devices for efficient utilization of resources while handling web applications and cloud computing systems. With cloud applications facilitating rapid communication and the rising trend of digitalization, there is a rise in the adoption of optical interconnect systems that favor the growth of various information-centric industries.

Key Market Segmentation:

Breakup by Product Type:

• Cable Assemblies
  • Indoor Cable Assemblies
  • Outdoor Cable Assemblies
  • Active Optical Cables
  • Multi-Source Agreement
• QSFP
• CXP
• CFP
• CDFP
• Connectors
  • LC Connectors
  • SC Connectors
  • ST Connectors
  • MPO/MTP Connectors
• Optical Transceivers
• Free Space Optics, Fiber and Waveguides
• Silicon Photonics
• PIC-Based Interconnects
• Optical Engines

Breakup by Interconnect Level:

• Chip- & Board-Level Interconnect
• Board-To-Board and Rack-Level Optical Interconnect
• Metro & Long Haul Optical Interconnect

Breakup by Fiber Mode:

• Multi-Mode Fiber
  • Step Index Multi-Mode Fiber
  • Graded Index Multi-Mode Fiber
• Single-Mode Fiber

Breakup by Application:

• Data Communication
  • Data Center
  • High-Performance Computing (HPC)
• Telecommunication

Breakup by End Use Industry:

• Military and Aerospace
• Consumer Electronics
• Automotive
• Chemicals
• Others

Breakup by Region:

• North America
• Europe
• Asia Pacific
• Middle East and Africa
• Latin America

Competitive Landscape:

The report has also analysed the competitive landscape of the market with some of the key players being Finisar, Mellanox Technologies, Molex, Oclaro, Sumitomo Electric Industries, Broadcom, TE Connectivity, Amphenol, Juniper Networks, Fujitsu, Infinera Corporation, Lumentum Holdings, OFS Fitel, LLC (FURUKAWA ELECTRIC CO., LTD), 3M Company, Acacia Communication, Dow Corning, Huawei, Intel, Infineon Technologies, etc.

Key Questions Answered in This Report:

• How has the global optical interconnect market performed so far and how will it perform in the coming years?
• What are the key regional markets in the global optical interconnect industry?
• What has been the impact of COVID-19 on the global optical interconnect industry?
• What is the breakup of the market based on the product type?
• What is the breakup of the market based on the interconnect level?
• What is the breakup of the market based on the fiber mode?
• What is the breakup of the market based on the application?
• What is the breakup of the market based on the end use industry?
• What are the various stages in the value chain of the global optical interconnect industry?
• What are the key driving factors and challenges in the global optical interconnect industry?
• What is the structure of the global optical interconnect industry and who are the key players?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Optical Interconnect Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Breakup by Product Type
• 5.5 Market Breakup by Interconnect Level
• 5.6 Market Breakup by Fiber Mode
• 5.7 Market Breakup by Application
• 5.8 Market Breakup by End Use Industry
• 5.9 Market Breakup by Region
• 5.10 Market Forecast

6 Market Breakup by Product Type

• 6.1 Cable Assemblies
  • 6.1.1 Market Trends
  • 6.1.2 Market Breakup by Type
    • 6.1.2.1 Indoor Cable Assemblies
    • 6.1.2.2 Outdoor Cable Assemblies
    • 6.1.2.3 Active Optical Cables
    • 6.1.2.4 Multi-Source Agreement
      • 6.1.2.4.1 Market Trends
      • 6.1.2.4.2 Major Types
        • 6.1.2.4.2.1 QSFP
        • 6.1.2.4.2.2 CXP
        • 6.1.2.4.2.3 CFP
        • 6.1.2.4.2.4 CDFP
      • 6.1.2.4.3 Market Forecast
  • 6.1.3 Market Forecast
• 6.2 Connectors
  • 6.2.1 Market Trends
  • 6.2.2 Major Types
    • 6.2.2.1 LC Connectors
    • 6.2.2.2 SC Connectors
    • 6.2.2.3 ST Connectors
    • 6.2.2.4 MPO/MTP Connectors
  • 6.2.3 Market Forecast
• 6.3 Optical Transceivers
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 Free Space Optics, Fiber and Waveguides
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast
• 6.5 Silicon Photonics
  • 6.5.1 Market Trends
  • 6.5.2 Market Forecast
• 6.6 PIC-Based Interconnects
  • 6.6.1 Market Trends
  • 6.6.2 Market Forecast
• 6.7 Optical Engines
  • 6.7.1 Market Trends
  • 6.7.2 Market Forecast

7 Market Breakup by Interconnect Level

• 7.1 Chip- & Board-Level Interconnect
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Board-To-Board and Rack-Level Optical Interconnect
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Metro & Long Haul Optical Interconnect
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast

8 Market Breakup by Fiber Mode

• 8.1 Multi-Mode Fiber
  • 8.1.1 Market Trends
  • 8.1.2 Major Types
    • 8.1.2.1 Step Index Multi-Mode Fiber
    • 8.1.2.2 Graded Index Multi-Mode Fiber
  • 8.1.3 Market Forecast
• 8.2 Single-Mode Fiber
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast

9 Market Breakup by Application

• 9.1 Data Communication
  • 9.1.1 Market Trends
  • 9.1.2 Major Types
    • 9.1.2.1 Data Center
    • 9.1.2.2 High-Performance Computing (HPC)
  • 9.1.3 Market Forecast
• 9.2 Telecommunication
  • 9.2.1 Market Trends
  • 9.2.2 Market Forecast

10 Market Breakup by End Use Industry

• 10.1 Military and Aerospace
  • 10.1.1 Market Trends
  • 10.1.2 Market Forecast
• 10.2 Consumer Electronics
  • 10.2.1 Market Trends
  • 10.2.2 Market Forecast
• 10.3 Automotive
  • 10.3.1 Market Trends
  • 10.3.2 Market Forecast
• 10.4 Chemicals
  • 10.4.1 Market Trends
  • 10.4.2 Market Forecast
• 10.5 Others
  • 10.5.1 Market Trends
  • 10.5.2 Market Forecast

11 Market Breakup by Region

• 11.1 North America
  • 11.1.1 Market Trends
  • 11.1.2 Market Forecast
• 11.2 Europe
  • 11.2.1 Market Trends
  • 11.2.2 Market Forecast
• 11.3 Asia Pacific
  • 11.3.1 Market Trends
  • 11.3.2 Market Forecast
• 11.4 Middle East and Africa
  • 11.4.1 Market Trends
  • 11.4.2 Market Forecast
• 11.5 Latin America
  • 11.5.1 Market Trends
  • 11.5.2 Market Forecast

12 SWOT Analysis

• 12.1 Overview
• 12.2 Strengths
• 12.3 Weaknesses
• 12.4 Opportunities
• 12.5 Threats

13 Value Chain Analysis

14 Porter's Five Forces Analysis

• 14.1 Overview
• 14.2 Bargaining Power of Buyers
• 14.3 Bargaining Power of Suppliers
• 14.4 Degree of Competition
• 14.5 Threat of New Entrants
• 14.6 Threat of Substitutes

15 Price Analysis

16 Competitive Landscape

• 16.1 Market Structure
• 16.2 Key Players
• 16.3 Profiles of Key Players
  • 16.3.1 Finisar
  • 16.3.2 Mellanox Technologies
  • 16.3.3 Molex
  • 16.3.4 Oclaro
  • 16.3.5 Sumitomo Electric Industries
  • 16.3.6 Broadcom
  • 16.3.7 TE Connectivity
  • 16.3.8 Amphenol
  • 16.3.9 Juniper Networks
  • 16.3.10 Fujitsu
  • 16.3.11 Infinera Corporation
  • 16.3.12 Lumentum Holdings
  • 16.3.13 OFS Fitel, LLC (FURUKAWA ELECTRIC CO., LTD)
  • 16.3.14 3M Company
  • 16.3.15 Acacia Communication
  • 16.3.16 Dow Corning
  • 16.3.17 Huawei
  • 16.3.18 Intel
  • 16.3.19 Infineon Technologies