세계의 반도체 웨이퍼 연마 및 연삭 장비 시장(2024-2028년)

The semiconductor wafer polishing and grinding equipment market is forecasted to grow by USD 442.01 mn during 2023-2028, accelerating at a CAGR of 4.06% during the forecast period. The report on the semiconductor wafer polishing and grinding equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by emergence of miniaturized semiconductor components, growing investment in new fabrication plants, and incentives and discounts for long-term customers of end-users.

Technavio's semiconductor wafer polishing and grinding equipment market is segmented as below:

By Application

300 mm

200 mm

• Less than 200 mm

By End-user

• Foundries
• IDM
• Memory manufacturers

By Geographical Landscape

• APAC
• North America
• Europe
• South America
• Middle East and Africa

This study identifies the increasing use of NEMS as one of the prime reasons driving the semiconductor wafer polishing and grinding equipment market growth during the next few years. Also, growth of ULSI and transition toward 3D structures will lead to sizable demand in the market.

The report on the semiconductor wafer polishing and grinding equipment market covers the following areas:

• Semiconductor wafer polishing and grinding equipment market sizing
• Semiconductor wafer polishing and grinding equipment market forecast
• Semiconductor wafer polishing and grinding equipment market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor wafer polishing and grinding equipment market vendors that include ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., Applied Materials Inc., ASM International NV, Axus Technology, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp.. Also, the semiconductor wafer polishing and grinding equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview

2 Market Landscape

• 2.1 Market ecosystem

3 Market Sizing

• 3.1 Market definition
• 3.2 Market segment analysis
• 3.3 Market size 2023
• 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

• 4.1 Global semiconductor wafer polishing and grinding equipment market 2018 - 2022
• 4.2 Application Segment Analysis 2018 - 2022
• 4.3 End-User Segment Analysis 2018 - 2022
• 4.4 Geography Segment Analysis 2018 - 2022
• 4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

• 5.1 Five forces summary
• 5.2 Bargaining power of buyers
• 5.3 Bargaining power of suppliers
• 5.4 Threat of new entrants
• 5.5 Threat of substitutes
• 5.6 Threat of rivalry
• 5.7 Market condition

6 Market Segmentation by Application

• 6.1 Market segments
• 6.2 Comparison by Application
• 6.3 300 mm - Market size and forecast 2023-2028
• 6.4 200 mm - Market size and forecast 2023-2028
• 6.5 Less than 200 mm - Market size and forecast 2023-2028
• 6.6 Market opportunity by Application

7 Market Segmentation by End-user

• 7.1 Market segments
• 7.2 Comparison by End-user
• 7.3 Foundries - Market size and forecast 2023-2028
• 7.4 IDM - Market size and forecast 2023-2028
• 7.5 Memory manufacturers - Market size and forecast 2023-2028
• 7.6 Market opportunity by End-user

8 Customer Landscape

• 8.1 Customer landscape overview

9 Geographic Landscape

• 9.1 Geographic segmentation
• 9.2 Geographic comparison
• 9.3 APAC - Market size and forecast 2023-2028
• 9.4 North America - Market size and forecast 2023-2028
• 9.5 Europe - Market size and forecast 2023-2028
• 9.6 South America - Market size and forecast 2023-2028
• 9.7 Middle East and Africa - Market size and forecast 2023-2028
• 9.8 South Korea - Market size and forecast 2023-2028
• 9.9 Taiwan - Market size and forecast 2023-2028
• 9.10 China - Market size and forecast 2023-2028
• 9.11 Japan - Market size and forecast 2023-2028
• 9.12 US - Market size and forecast 2023-2028
• 9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

• 10.1 Market drivers
• 10.2 Market challenges
• 10.3 Impact of drivers and challenges
• 10.4 Market trends

11 Vendor Landscape

• 11.1 Overview
• 11.2 Vendor landscape
• 11.3 Landscape disruption
• 11.4 Industry risks

12 Vendor Analysis

• 12.1 Vendors covered
• 12.2 Market positioning of vendors
• 12.3 Amtech Systems Inc.
• 12.4 Applied Materials Inc.
• 12.5 ASM International NV
• 12.6 Axus Technology
• 12.7 DISCO Corp.
• 12.8 Ebara Corp.
• 12.9 G and N GmbH
• 12.10 KLA Corp.
• 12.11 Lapmaster Wolters
• 12.12 Logitech Ltd.
• 12.13 Okamoto Corp
• 12.14 Revasum Inc.
• 12.15 S3 Alliance.
• 12.16 Tokyo Electron Ltd.
• 12.17 TOKYO SEIMITSU CO. LTD

13 Appendix

• 13.1 Scope of the report
• 13.2 Inclusions and exclusions checklist
• 13.3 Currency conversion rates for US$
• 13.4 Research methodology
• 13.5 List of abbreviations