일본의 반도체 디바이스 시장(2024-2028년)

The semiconductor device market in Japan is forecasted to grow by USD 8.48 bn during 2023-2028, accelerating at a CAGR of 8.22% during the forecast period. The report on the semiconductor device market in Japan provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing demand for high-power density devices, strategic collaborations among market participants, and government initiatives supporting the development of semiconductor devices.

Technavio's semiconductor device market in Japan is segmented as below:

By Application

• Consumer electronics
• Communications
• Automotive
• Medical devices
• Others

By Device

• PMIC
• Microchips
• RFID

By Material

• Silicon
• Germanium
• Gallium arsenide
• Others

This study identifies the growing investments in 5G technology in Japan as one of the prime reasons driving the semiconductor device market in Japan growth during the next few years. Also, the increasing use of adas in the automotive industry and the rising adoption of low-cost communication devices will lead to sizable demand in the market.

The report on the semiconductor device market in Japan covers the following areas:

• Semiconductor device market in Japan sizing
• Semiconductor device market in Japan forecast
• Semiconductor device market in Japan industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor device market in Japan vendors that include Advanced Micro Devices Inc., AOI ELECTRONICS CO. LTD., Infineon Technologies AG, Intel Corp., Kyocera Corp., Micron Technology Inc., Mitsubishi Electric Corp., NVIDIA Corp., NXP Semiconductors NV, Qualcomm Inc., Rapidus Corp., Renesas Electronics Corp., ROHM Co. Ltd., Samsung Electronics Co. Ltd., Screen Holdings Co. Ltd., Sharp Corp., Shindengen Electric Manufacturing Co. Ltd., STMicroelectronics International NV, Sumitomo Corp., and Toshiba Corp. Also, the semiconductor device market in Japan analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview

2 Market Landscape

• 2.1 Market ecosystem

3 Market Sizing

• 3.1 Market definition
• 3.2 Market segment analysis
• 3.3 Market size 2023
• 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

• 4.1 Semiconductor device market in Japan 2018 - 2022
• 4.2 Application Segment Analysis 2018 - 2022
• 4.3 Device Segment Analysis 2018 - 2022
• 4.4 Material Segment Analysis 2018 - 2022

5 Five Forces Analysis

• 5.1 Five forces summary
• 5.2 Bargaining power of buyers
• 5.3 Bargaining power of suppliers
• 5.4 Threat of new entrants
• 5.5 Threat of substitutes
• 5.6 Threat of rivalry
• 5.7 Market condition

6 Market Segmentation by Application

• 6.1 Market segments
• 6.2 Comparison by Application
• 6.3 Consumer electronics - Market size and forecast 2023-2028
• 6.4 Communications - Market size and forecast 2023-2028
• 6.5 Automotive - Market size and forecast 2023-2028
• 6.6 Medical devices - Market size and forecast 2023-2028
• 6.7 Others - Market size and forecast 2023-2028
• 6.8 Market opportunity by Application

7 Market Segmentation by Device

• 7.1 Market segments
• 7.2 Comparison by Device
• 7.3 PMIC - Market size and forecast 2023-2028
• 7.4 Microchips - Market size and forecast 2023-2028
• 7.5 RFID - Market size and forecast 2023-2028
• 7.6 Market opportunity by Device

8 Market Segmentation by Material

• 8.1 Market segments
• 8.2 Comparison by Material
• 8.3 Silicon - Market size and forecast 2023-2028
• 8.4 Germanium - Market size and forecast 2023-2028
• 8.5 Gallium arsenide - Market size and forecast 2023-2028
• 8.6 Others - Market size and forecast 2023-2028
• 8.7 Market opportunity by Material

9 Customer Landscape

• 9.1 Customer landscape overview

10 Drivers, Challenges, and Trends

• 10.1 Market drivers
• 10.2 Market challenges
• 10.3 Impact of drivers and challenges
• 10.4 Market trends

11 Vendor Landscape

• 11.1 Overview
• 11.2 Vendor landscape
• 11.3 Landscape disruption
• 11.4 Industry risks

12 Vendor Analysis

• 12.1 Vendors covered
• 12.2 Market positioning of vendors
• 12.3 Advanced Micro Devices Inc.
• 12.4 AOI ELECTRONICS CO. LTD.
• 12.5 Infineon Technologies AG
• 12.6 Intel Corp.
• 12.7 Kyocera Corp.
• 12.8 Micron Technology Inc.
• 12.9 NVIDIA Corp.
• 12.10 NXP Semiconductors NV
• 12.11 Qualcomm Inc.
• 12.12 Samsung Electronics Co. Ltd.
• 12.13 Screen Holdings Co. Ltd.
• 12.14 Shindengen Electric Manufacturing Co. Ltd.
• 12.15 STMicroelectronics International NV
• 12.16 Sumitomo Corp.
• 12.17 Toshiba Corp.

13 Appendix

• 13.1 Scope of the report
• 13.2 Inclusions and exclusions checklist
• 13.3 Currency conversion rates for US$
• 13.4 Research methodology
• 13.5 List of abbreviations