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Global Silicon Photonics Market 2024-2028

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  • ams OSRAM AG
  • Cisco Systems Inc.
  • Corning Inc.
  • Hamamatsu Photonics KK
  • II VI Inc.
  • Infinera Corp.
  • Innolume GmbH
  • Intel Corp.
  • International Business Machines Corp.
  • IPG Photonics Corp.
  • Nokia Corp.
  • NVIDIA Corp.
  • OpenLight Photonics Inc.
  • Sicoya GmbH
  • TRUMPF SE Co. KG

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LSH 24.04.19

The silicon photonics market is forecasted to grow by USD 5238.89 mn during 2023-2028, accelerating at a CAGR of 24.88% during the forecast period. The report on the silicon photonics market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by the increasing need for higher bandwidth, reduction in transportation costs and scalability beyond 400g, and growing use of hybrid silicon photonics.

Technavio's silicon photonics market is segmented as below:

Market Scope
Base Year2024
End Year2028
Series Year2024-2028
Growth MomentumAccelerate
YOY 202423.6%
CAGR24.88%
Incremental Value$5238.89mn

By Application

  • Communications
  • Consumer electronics
  • Others

By Component

  • Lasers
  • Modulators
  • Photo detectors

By Geographical Landscape

  • North America
  • APAC
  • Europe
  • South America
  • Middle East and Africa

This study identifies the emergence of optical data centers as one of the prime reasons driving the silicon photonics market growth during the next few years. Also, the development of silicon-integrated mini-roadm and jedec initiative to develop standards for silicon photonics will lead to sizable demand in the market.

The report on the silicon photonics market covers the following areas:

  • Silicon photonics market sizing
  • Silicon photonics market forecast
  • Silicon photonics market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading silicon photonics market vendors that include AIO Core Co. Ltd., ams OSRAM AG, Broadcom Inc., Corning Inc., Hamamatsu Photonics KK, II VI Inc., Infinera Corp., Innolume GmbH, Intel Corp., International Business Machines Corp., IPG Photonics Corp., MACOM Technology Solutions Inc., NKT Photonics AS, Nokia Corp., NVIDIA Corp., OpenLight Photonics Inc., OSCPS Motion Sensing Inc, RANVOUS Inc., Sicoya GmbH, TRUMPF SE Co. KG, and Cisco Systems Inc.. Also, the silicon photonics market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview

2 Market Landscape

  • 2.1 Market ecosystem

3 Market Sizing

  • 3.1 Market definition
  • 3.2 Market segment analysis
  • 3.3 Market size 2023
  • 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

  • 4.1 Global silicon photonics market 2018 - 2022
  • 4.2 Application Segment Analysis 2018 - 2022
  • 4.3 Component Segment Analysis 2018 - 2022
  • 4.4 Geography Segment Analysis 2018 - 2022
  • 4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

  • 5.1 Five forces summary
  • 5.2 Bargaining power of buyers
  • 5.3 Bargaining power of suppliers
  • 5.4 Threat of new entrants
  • 5.5 Threat of substitutes
  • 5.6 Threat of rivalry
  • 5.7 Market condition

6 Market Segmentation by Application

  • 6.1 Market segments
  • 6.2 Comparison by Application
  • 6.3 Communications - Market size and forecast 2023-2028
  • 6.4 Consumer electronics - Market size and forecast 2023-2028
  • 6.5 Others - Market size and forecast 2023-2028
  • 6.6 Market opportunity by Application

7 Market Segmentation by Component

  • 7.1 Market segments
  • 7.2 Comparison by Component
  • 7.3 Lasers - Market size and forecast 2023-2028
  • 7.4 Modulators - Market size and forecast 2023-2028
  • 7.5 Photo detectors - Market size and forecast 2023-2028
  • 7.6 Market opportunity by Component

8 Customer Landscape

  • 8.1 Customer landscape overview

9 Geographic Landscape

  • 9.1 Geographic segmentation
  • 9.2 Geographic comparison
  • 9.3 North America - Market size and forecast 2023-2028
  • 9.4 APAC - Market size and forecast 2023-2028
  • 9.5 Europe - Market size and forecast 2023-2028
  • 9.6 South America - Market size and forecast 2023-2028
  • 9.7 Middle East and Africa - Market size and forecast 2023-2028
  • 9.8 US - Market size and forecast 2023-2028
  • 9.9 China - Market size and forecast 2023-2028
  • 9.10 Germany - Market size and forecast 2023-2028
  • 9.11 Japan - Market size and forecast 2023-2028
  • 9.12 UK - Market size and forecast 2023-2028
  • 9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

  • 10.1 Market drivers
  • 10.2 Market challenges
  • 10.3 Impact of drivers and challenges
  • 10.4 Market trends

11 Vendor Landscape

  • 11.1 Overview
  • 11.2 Vendor landscape
  • 11.3 Landscape disruption
  • 11.4 Industry risks

12 Vendor Analysis

  • 12.1 Vendors covered
  • 12.2 Market positioning of vendors
  • 12.3 ams OSRAM AG
  • 12.4 Cisco Systems Inc.
  • 12.5 Corning Inc.
  • 12.6 Hamamatsu Photonics KK
  • 12.7 II VI Inc.
  • 12.8 Infinera Corp.
  • 12.9 Innolume GmbH
  • 12.10 Intel Corp.
  • 12.11 International Business Machines Corp.
  • 12.12 IPG Photonics Corp.
  • 12.13 Nokia Corp.
  • 12.14 NVIDIA Corp.
  • 12.15 OpenLight Photonics Inc.
  • 12.16 Sicoya GmbH
  • 12.17 TRUMPF SE Co. KG

13 Appendix

  • 13.1 Scope of the report
  • 13.2 Inclusions and exclusions checklist
  • 13.3 Currency conversion rates for US$
  • 13.4 Research methodology
  • 13.5 List of abbreviations
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