세계의 3D 센서 시장(2024-2028년)

The 3D sensors market is forecasted to grow by USD 5148.49 mn during 2023-2028, accelerating at a CAGR of 18.69% during the forecast period. The report on the 3D sensors market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by the use of 3D sensors in security and surveillance systems, increasing demand for 3D imaging in the healthcare sector, and the growing use of HMI technologies.

Technavio's 3D sensors market is segmented as below:

By Application

• Industrial/commercial
• Automotive
• Consumer electronics
• Others

By Connectivity

• Wireless
• Wired

By Geographical Landscape

• North America
• APAC
• Europe
• South America
• Middle East and Africa

This study identifies the growing number of strategic partnerships among market participants as one of the prime reasons driving the 3D sensors market growth during the next few years. Also, the integration of multiple-lens camera systems in smartphones and growing investments in autonomous vehicles safety precautions will lead to sizable demand in the market.

The report on the 3D sensors market covers the following areas:

• 3D sensors market sizing
• 3D sensors market forecast
• 3D sensors market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading 3D sensors market vendors that include ams OSRAM AG, Broadcom Inc., FUJIFILM Corp., Himax Technologies Inc., ifm electronic gmbh, Infineon Technologies AG, Intel Corp., Lumentum Holdings Inc., Melexis NV, OmniVision Technologies Inc., Ouster Inc., Panasonic Holdings Corp., Qualcomm Inc., Quanergy Systems Inc., SmartRay GmbH, Sony Group Corp., STMicroelectronics International NV, TKH Group NV, Xovis AG, Analog Devices Inc., and OEM AUTOMATIC UAB. Also, the 3D sensors market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview

2 Market Landscape

• 2.1 Market ecosystem

3 Market Sizing

• 3.1 Market definition
• 3.2 Market segment analysis
• 3.3 Market size 2023
• 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

• 4.1 Global 3D sensors market 2018 - 2022
• 4.2 Application Segment Analysis 2018 - 2022
• 4.3 Connectivity Segment Analysis 2018 - 2022
• 4.4 Geography Segment Analysis 2018 - 2022
• 4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

• 5.1 Five forces summary
• 5.2 Bargaining power of buyers
• 5.3 Bargaining power of suppliers
• 5.4 Threat of new entrants
• 5.5 Threat of substitutes
• 5.6 Threat of rivalry
• 5.7 Market condition

6 Market Segmentation by Application

• 6.1 Market segments
• 6.2 Comparison by Application
• 6.3 Industrial/commercial - Market size and forecast 2023-2028
• 6.4 Automotive - Market size and forecast 2023-2028
• 6.5 Consumer electronics - Market size and forecast 2023-2028
• 6.6 Others - Market size and forecast 2023-2028
• 6.7 Market opportunity by Application

7 Market Segmentation by Connectivity

• 7.1 Market segments
• 7.2 Comparison by Connectivity
• 7.3 Wireless - Market size and forecast 2023-2028
• 7.4 Wired - Market size and forecast 2023-2028
• 7.5 Market opportunity by Connectivity

8 Customer Landscape

• 8.1 Customer landscape overview

9 Geographic Landscape

• 9.1 Geographic segmentation
• 9.2 Geographic comparison
• 9.3 North America - Market size and forecast 2023-2028
• 9.4 APAC - Market size and forecast 2023-2028
• 9.5 Europe - Market size and forecast 2023-2028
• 9.6 South America - Market size and forecast 2023-2028
• 9.7 Middle East and Africa - Market size and forecast 2023-2028
• 9.8 US - Market size and forecast 2023-2028
• 9.9 China - Market size and forecast 2023-2028
• 9.10 Japan - Market size and forecast 2023-2028
• 9.11 South Korea - Market size and forecast 2023-2028
• 9.12 Germany - Market size and forecast 2023-2028
• 9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

• 10.1 Market drivers
• 10.2 Market challenges
• 10.3 Impact of drivers and challenges
• 10.4 Market trends

11 Vendor Landscape

• 11.1 Overview
• 11.2 Vendor landscape
• 11.3 Landscape disruption
• 11.4 Industry risks

12 Vendor Analysis

• 12.1 Vendors covered
• 12.2 Market positioning of vendors
• 12.3 ams OSRAM AG
• 12.4 Analog Devices Inc.
• 12.5 Broadcom Inc.
• 12.6 Himax Technologies Inc.
• 12.7 ifm electronic gmbh
• 12.8 Infineon Technologies AG
• 12.9 Intel Corp.
• 12.10 Lumentum Holdings Inc.
• 12.11 OmniVision Technologies Inc.
• 12.12 Ouster Inc.
• 12.13 Panasonic Holdings Corp.
• 12.14 Qualcomm Inc.
• 12.15 Sony Group Corp.
• 12.16 STMicroelectronics International NV
• 12.17 TKH Group NV

13 Appendix

• 13.1 Scope of the report
• 13.2 Inclusions and exclusions checklist
• 13.3 Currency conversion rates for US$
• 13.4 Research methodology
• 13.5 List of abbreviations