세계의 스마트폰용 전원 관리 IC 시장(2024-2028년)

The smartphone power management IC market is forecasted to grow by USD 5.37 bn during 2023-2028, accelerating at a CAGR of 7.14% during the forecast period. The report on the smartphone power management IC market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing internet penetration and data traffic, integration of advanced technologies in smartphones, and growing adoption of premium-range smartphones.

Technavio's smartphone power management IC market is segmented as below:

By Price

• Premium range
• Medium range
• Low range

By Type

• Integrated ASSP power management ICs
• Battery management ICs
• Others

By Geographical Landscape

• APAC
• North America
• Europe
• Middle East and Africa
• South America

This study identifies the miniaturization of semiconductor devices as one of the prime reasons driving the smartphone power management IC market growth during the next few years. Also, the adoption of gallium nitride (GAN) technology in ICs offering higher efficiency and transition to large-diameter wafers demanding more chips will lead to sizable demand in the market.

The report on the smartphone power management ic market covers the following areas:

• Smartphone power management IC market sizing
• Smartphone power management IC market forecast
• Smartphone power management IC market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading smartphone power management IC market vendors that include Analog Devices Inc., Infineon Technologies AG, MagnaChip Semiconductor Corp., MediaTek Inc., Microchip Technology Inc., Nisshinbo Holdings Inc., NXP Semiconductors NV, ON Semiconductor Corp., Qorvo Inc., Qualcomm Inc., Renesas Electronics Corp., Richtek Technology Corp., ROHM Co. Ltd., Samsung Electronics Co. Ltd., Semtech Corp., STMicroelectronics International NV, Texas Instruments Inc., Toshiba Corp., and Diodes Inc.. Also, the smartphone power management IC market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview

2 Market Landscape

• 2.1 Market ecosystem

3 Market Sizing

• 3.1 Market definition
• 3.2 Market segment analysis
• 3.3 Market size 2023
• 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

• 4.1 Global smartphone power management IC market 2018 - 2022
• 4.2 Price Segment Analysis 2018 - 2022
• 4.3 Type Segment Analysis 2018 - 2022
• 4.4 Geography Segment Analysis 2018 - 2022
• 4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

• 5.1 Five forces summary
• 5.2 Bargaining power of buyers
• 5.3 Bargaining power of suppliers
• 5.4 Threat of new entrants
• 5.5 Threat of substitutes
• 5.6 Threat of rivalry
• 5.7 Market condition

6 Market Segmentation by Price

• 6.1 Market segments
• 6.2 Comparison by Price
• 6.3 Premium range - Market size and forecast 2023-2028
• 6.4 Medium range - Market size and forecast 2023-2028
• 6.5 Low range - Market size and forecast 2023-2028
• 6.6 Market opportunity by Price

7 Market Segmentation by Type

• 7.1 Market segments
• 7.2 Comparison by Type
• 7.3 Integrated ASSP power management ICs - Market size and forecast 2023-2028
• 7.4 Battery management ICs - Market size and forecast 2023-2028
• 7.5 Others - Market size and forecast 2023-2028
• 7.6 Market opportunity by Type

8 Customer Landscape

• 8.1 Customer landscape overview

9 Geographic Landscape

• 9.1 Geographic segmentation
• 9.2 Geographic comparison
• 9.3 APAC - Market size and forecast 2023-2028
• 9.4 North America - Market size and forecast 2023-2028
• 9.5 Europe - Market size and forecast 2023-2028
• 9.6 Middle East and Africa - Market size and forecast 2023-2028
• 9.7 South America - Market size and forecast 2023-2028
• 9.8 China - Market size and forecast 2023-2028
• 9.9 South Korea - Market size and forecast 2023-2028
• 9.10 US - Market size and forecast 2023-2028
• 9.11 Japan - Market size and forecast 2023-2028
• 9.12 Canada - Market size and forecast 2023-2028
• 9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

• 10.1 Market drivers
• 10.2 Market challenges
• 10.3 Impact of drivers and challenges
• 10.4 Market trends

11 Vendor Landscape

• 11.1 Overview
• 11.2 Vendor landscape
• 11.3 Landscape disruption
• 11.4 Industry risks

12 Vendor Analysis

• 12.1 Vendors covered
• 12.2 Market positioning of vendors
• 12.3 Analog Devices Inc.
• 12.4 Diodes Inc.
• 12.5 Infineon Technologies AG
• 12.6 MagnaChip Semiconductor Corp.
• 12.7 MediaTek Inc.
• 12.8 Microchip Technology Inc.
• 12.9 Nisshinbo Holdings Inc.
• 12.10 NXP Semiconductors NV
• 12.11 ON Semiconductor Corp.
• 12.12 Qorvo Inc.
• 12.13 Qualcomm Inc.
• 12.14 Renesas Electronics Corp.
• 12.15 Samsung Electronics Co. Ltd.
• 12.16 STMicroelectronics International NV
• 12.17 Texas Instruments Inc.

13 Appendix

• 13.1 Scope of the report
• 13.2 Inclusions and exclusions checklist
• 13.3 Currency conversion rates for US$
• 13.4 Research methodology
• 13.5 List of abbreviations