시장보고서
상품코드
1491454

세계의 반도체 조립 및 패키징 서비스 시장(2024-2028년)

Global semiconductor assembly and packaging services market 2024-2028

발행일: | 리서치사: TechNavio | 페이지 정보: 영문 184 Pages | 배송안내 : 즉시배송

    
    
    




※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

반도체 조립 및 패키징 서비스 시장은 2023-2028년간 178억 8,820만 달러 확대되고, 예측 기간 중 연평균 복합 성장률(CAGR)은 6.15%를 나타낼 것으로 예측됩니다.

반도체 조립 및 패키징 서비스 시장에 대한 전체적인 분석, 시장 규모와 예측, 동향, 성장 촉진요인, 과제, 약 25개 벤더를 대상으로 한 벤더 분석 등의 정보를 게재했습니다.

현재의 시장 시나리오, 최신 동향과 촉진요인, 시장 환경 전체에 관한 최신 분석을 제공합니다. 반도체 웨이퍼 수요 증가, IoT 등장에 의한 무선 컴퓨팅 디바이스의 폭발적 성장, 3D 칩 패키징, FIWLP, FOWLP 기술의 시장 개척 등이 시장 성장을 촉진하고 있습니다.

시장 범위
기준년 2024년
종료년 2028년
예측 기간 2024-2028년
성장 모멘텀 가속
YOY 2024 5.7%
CAGR 6.15%
증분액 178억 8,820만 달러

본 조사에서는 모바일 기기의 짧은 제품수명주기가 향후 몇 년간 반도체 조립 및 패키징 서비스 시장 성장을 가속하는 주요인 중 하나가 될 것으로 보고 있습니다. 또한 반도체 메모리 디바이스 요구 증가와 웨어러블 디바이스 도입 확대가 시장의 큰 수요로 연결될 것입니다.

목차

제1장 주요 요약

  • 시장 개요

제2장 시장 구도

  • 시장 생태계
  • 시장 특징
  • 밸류체인 분석

제3장 시장 규모 평가

  • 시장의 정의
  • 시장 부문 분석
  • 시장 규모(2023년)
  • 시장 전망2023-2028년)

제4장 시장 규모 실적

  • 세계의 반도체 조립 및 패키징 서비스 시장(2018-2022년)
  • 용도별 부문 분석(2018-2022년)
  • 유형별 부문 분석(2018-2022년)
  • 지역별 부문 분석(2018-2022년)
  • 국가별 부문 분석(2018-2022년)

제5장 Five Forces 분석

  • Five Forces 요약
  • 바이어의 교섭력
  • 공급 기업의 교섭력
  • 신규 진출업체의 위협
  • 대체품의 위협
  • 경쟁 위협
  • 시장 현황

제6장 시장 세분화 : 용도별

  • 시장 세분화
  • 비교 : 용도별
  • 통신 부문 : 시장 규모와 예측(2023-2028년)
  • 산업 및 자동차 부문 : 시장 규모와 예측(2023-2028년)
  • 컴퓨터 및 네트워크 부문 : 시장 규모와 예측(2023-2028년)
  • 가전제품 부문 : 시장 규모와 예측(2023-2028년)
  • 시장 기회 : 용도별

제7장 시장 세분화 : 유형별

  • 시장 세분화
  • 비교 : 유형별
  • WLP : 시장 규모와 예측(2023-2028년)
  • 다이레벨 패키징 : 시장 규모와 예측(2023-2028년)
  • 시장 기회 : 유형별

제8장 고객 상황

  • 고객 상황 개요

제9장 지역별 상황

  • 지역별 세분화
  • 지역별 비교
  • 아시아태평양 : 시장 규모와 예측(2023-2028년)
  • 북미 : 시장 규모와 예측(2023-2028년)
  • 유럽 : 시장 규모와 예측(2023-2028년)
  • 남미 : 시장 규모와 예측(2023-2028년)
  • 중동 및 아프리카 : 시장 규모와 예측(2023-2028년)
  • 한국 : 시장 규모와 예측(2023-2028년)
  • 대만 : 시장 규모와 예측(2023-2028년)
  • 중국 : 시장 규모와 예측(2023-2028년)
  • 미국 : 시장 규모와 예측(2023-2028년)
  • 일본 : 시장 규모와 예측(2023-2028년)
  • 시장 기회 : 지역 상황별

제10장 성장 촉진요인, 과제, 기회, 성장 억제요인

  • 시장 성장 촉진요인
  • 시장이 해결해야 할 과제
  • 성장 촉진요인과 과제의 영향
  • 시장 기회 및 성장 억제요인

제11장 경쟁 구도

  • 개요
  • 경쟁 구도
  • 혼란 상황
  • 업계 리스크

제12장 경쟁 분석

  • 기업 개요
  • 기업의 시장 포지셔닝
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • ASMPT Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • HANA Micron Co. Ltd.
  • Intel Corp.
  • King Yuan Electronics Co. Ltd.
  • KLA Corp.
  • Microchip Technology Inc.
  • Powertech Technology Inc.
  • Renesas Electronics Corp.
  • Samsung Electronics Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • ULVAC Inc.
  • Yole Developpement SA

제13장 부록

LSH 24.06.17

The semiconductor assembly and packaging services market is forecasted to grow by USD 17888.2 mn during 2023-2028, accelerating at a CAGR of 6.15% during the forecast period. The report on the semiconductor assembly and packaging services market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for semiconductor wafers, the explosive growth of wireless computing devices due to the advent of IoT, and the development of 3D chip packaging, FIWLP, and FOWLP technology.

Technavio's semiconductor assembly and packaging services market is segmented as below:

Market Scope
Base Year2024
End Year2028
Series Year2024-2028
Growth MomentumAccelerate
YOY 20245.7%
CAGR6.15%
Incremental Value$17888.2mn

By Service Type

  • Assembly services
  • Testing services

By Application

  • Communication
  • Computing and networking
  • Industrial
  • Consumer electronics
  • Automotive electronics

By Geographical Landscape

  • APAC
  • North America
  • Europe
  • South America
  • Middle East and Africa

This study identifies the short product lifecycle of mobile devices as one of the prime reasons driving the semiconductor assembly and packaging services market growth during the next few years. Also, the growing need for semiconductor memory devices and the rising acceptance of wearable devices will lead to sizable demand in the market.

The report on the semiconductor assembly and packaging services market covers the following areas:

  • Semiconductor assembly and packaging services market sizing
  • Semiconductor assembly and packaging services market forecast
  • Semiconductor assembly and packaging services market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor assembly and packaging services market vendors that include Amkor Technology Inc., ASE Technology Holding Co. Ltd., ASMPT Ltd., ChipMOS TECHNOLOGIES INC., HANA Micron Co. Ltd., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., KLA Corp., Microchip Technology Inc., Powertech Technology Inc., Promex Industries Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., SIGNETICS Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Toshiba Corp., ULVAC Inc., and Yole Developpement SA. Also, the semiconductor assembly and packaging services market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview
    • Executive Summary - Chart on Market Overview
    • Executive Summary - Data Table on Market Overview
    • Executive Summary - Chart on Global Market Characteristics
    • Executive Summary - Chart on Market By Geographical Landscape
    • Executive Summary - Chart on Market Segmentation by Application
    • Executive Summary - Chart on Market Segmentation by Type
    • Executive Summary - Chart on Incremental Growth
    • Executive Summary - Data Table on Incremental Growth
    • Executive Summary - Chart on Company Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
    • Parent Market
    • Data Table on - Parent Market
  • 2.2 Market characteristics
    • Market characteristics analysis
  • 2.3 Value chain analysis
    • Value Chain Analysis

3 Market Sizing

  • 3.1 Market definition
    • Offerings of companies included in the market definition
  • 3.2 Market segment analysis
    • Market segments
  • 3.3 Market size 2023
  • 3.4 Market outlook: Forecast for 2023-2028
    • Chart on Global - Market size and forecast 2023-2028 ($ million)
    • Data Table on Global - Market size and forecast 2023-2028 ($ million)
    • Chart on Global Market: Year-over-year growth 2023-2028 (%)
    • Data Table on Global Market: Year-over-year growth 2023-2028 (%)

4 Historic Market Size

  • 4.1 Global Semiconductor Assembly And Packaging Services Market 2018 - 2022
    • Historic Market Size - Data Table on Global Semiconductor Assembly And Packaging Services Market 2018 - 2022 ($ million)
  • 4.2 Application segment analysis 2018 - 2022
    • Historic Market Size - Application Segment 2018 - 2022 ($ million)
  • 4.3 Type segment analysis 2018 - 2022
    • Historic Market Size - Type Segment 2018 - 2022 ($ million)
  • 4.4 Geography segment analysis 2018 - 2022
    • Historic Market Size - Geography Segment 2018 - 2022 ($ million)
  • 4.5 Country segment analysis 2018 - 2022
    • Historic Market Size - Country Segment 2018 - 2022 ($ million)

5 Five Forces Analysis

  • 5.1 Five forces summary
    • Five forces analysis - Comparison between 2023 and 2028
  • 5.2 Bargaining power of buyers
    • Bargaining power of buyers - Impact of key factors 2023 and 2028
  • 5.3 Bargaining power of suppliers
    • Bargaining power of suppliers - Impact of key factors in 2023 and 2028
  • 5.4 Threat of new entrants
    • Threat of new entrants - Impact of key factors in 2023 and 2028
  • 5.5 Threat of substitutes
    • Threat of substitutes - Impact of key factors in 2023 and 2028
  • 5.6 Threat of rivalry
    • Threat of rivalry - Impact of key factors in 2023 and 2028
  • 5.7 Market condition
    • Chart on Market condition - Five forces 2023 and 2028

6 Market Segmentation by Application

  • 6.1 Market segments
    • Chart on Application - Market share 2023-2028 (%)
    • Data Table on Application - Market share 2023-2028 (%)
  • 6.2 Comparison by Application
    • Chart on Comparison by Application
    • Data Table on Comparison by Application
  • 6.3 Communication sector - Market size and forecast 2023-2028
    • Chart on Communication sector - Market size and forecast 2023-2028 ($ million)
    • Data Table on Communication sector - Market size and forecast 2023-2028 ($ million)
    • Chart on Communication sector - Year-over-year growth 2023-2028 (%)
    • Data Table on Communication sector - Year-over-year growth 2023-2028 (%)
  • 6.4 Industrial and automotive sector - Market size and forecast 2023-2028
    • Chart on Industrial and automotive sector - Market size and forecast 2023-2028 ($ million)
    • Data Table on Industrial and automotive sector - Market size and forecast 2023-2028 ($ million)
    • Chart on Industrial and automotive sector - Year-over-year growth 2023-2028 (%)
    • Data Table on Industrial and automotive sector - Year-over-year growth 2023-2028 (%)
  • 6.5 Computing and networking sector - Market size and forecast 2023-2028
    • Chart on Computing and networking sector - Market size and forecast 2023-2028 ($ million)
    • Data Table on Computing and networking sector - Market size and forecast 2023-2028 ($ million)
    • Chart on Computing and networking sector - Year-over-year growth 2023-2028 (%)
    • Data Table on Computing and networking sector - Year-over-year growth 2023-2028 (%)
  • 6.6 Consumer electronics sector - Market size and forecast 2023-2028
    • Chart on Consumer electronics sector - Market size and forecast 2023-2028 ($ million)
    • Data Table on Consumer electronics sector - Market size and forecast 2023-2028 ($ million)
    • Chart on Consumer electronics sector - Year-over-year growth 2023-2028 (%)
    • Data Table on Consumer electronics sector - Year-over-year growth 2023-2028 (%)
  • 6.7 Market opportunity by Application
    • Market opportunity by Application ($ million)
    • Data Table on Market opportunity by Application ($ million)

7 Market Segmentation by Type

  • 7.1 Market segments
    • Chart on Type - Market share 2023-2028 (%)
    • Data Table on Type - Market share 2023-2028 (%)
  • 7.2 Comparison by Type
    • Chart on Comparison by Type
    • Data Table on Comparison by Type
  • 7.3 WLP - Market size and forecast 2023-2028
    • Chart on WLP - Market size and forecast 2023-2028 ($ million)
    • Data Table on WLP - Market size and forecast 2023-2028 ($ million)
    • Chart on WLP - Year-over-year growth 2023-2028 (%)
    • Data Table on WLP - Year-over-year growth 2023-2028 (%)
  • 7.4 Die level packaging - Market size and forecast 2023-2028
    • Chart on Die level packaging - Market size and forecast 2023-2028 ($ million)
    • Data Table on Die level packaging - Market size and forecast 2023-2028 ($ million)
    • Chart on Die level packaging - Year-over-year growth 2023-2028 (%)
    • Data Table on Die level packaging - Year-over-year growth 2023-2028 (%)
  • 7.5 Market opportunity by Type
    • Market opportunity by Type ($ million)
    • Data Table on Market opportunity by Type ($ million)

8 Customer Landscape

  • 8.1 Customer landscape overview
    • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

9 Geographic Landscape

  • 9.1 Geographic segmentation
    • Chart on Market share By Geographical Landscape 2023-2028 (%)
    • Data Table on Market share By Geographical Landscape 2023-2028 (%)
  • 9.2 Geographic comparison
    • Chart on Geographic comparison
    • Data Table on Geographic comparison
  • 9.3 APAC - Market size and forecast 2023-2028
    • Chart on APAC - Market size and forecast 2023-2028 ($ million)
    • Data Table on APAC - Market size and forecast 2023-2028 ($ million)
    • Chart on APAC - Year-over-year growth 2023-2028 (%)
    • Data Table on APAC - Year-over-year growth 2023-2028 (%)
  • 9.4 North America - Market size and forecast 2023-2028
    • Chart on North America - Market size and forecast 2023-2028 ($ million)
    • Data Table on North America - Market size and forecast 2023-2028 ($ million)
    • Chart on North America - Year-over-year growth 2023-2028 (%)
    • Data Table on North America - Year-over-year growth 2023-2028 (%)
  • 9.5 Europe - Market size and forecast 2023-2028
    • Chart on Europe - Market size and forecast 2023-2028 ($ million)
    • Data Table on Europe - Market size and forecast 2023-2028 ($ million)
    • Chart on Europe - Year-over-year growth 2023-2028 (%)
    • Data Table on Europe - Year-over-year growth 2023-2028 (%)
  • 9.6 South America - Market size and forecast 2023-2028
    • Chart on South America - Market size and forecast 2023-2028 ($ million)
    • Data Table on South America - Market size and forecast 2023-2028 ($ million)
    • Chart on South America - Year-over-year growth 2023-2028 (%)
    • Data Table on South America - Year-over-year growth 2023-2028 (%)
  • 9.7 Middle East and Africa - Market size and forecast 2023-2028
    • Chart on Middle East and Africa - Market size and forecast 2023-2028 ($ million)
    • Data Table on Middle East and Africa - Market size and forecast 2023-2028 ($ million)
    • Chart on Middle East and Africa - Year-over-year growth 2023-2028 (%)
    • Data Table on Middle East and Africa - Year-over-year growth 2023-2028 (%)
  • 9.8 South Korea - Market size and forecast 2023-2028
    • Chart on South Korea - Market size and forecast 2023-2028 ($ million)
    • Data Table on South Korea - Market size and forecast 2023-2028 ($ million)
    • Chart on South Korea - Year-over-year growth 2023-2028 (%)
    • Data Table on South Korea - Year-over-year growth 2023-2028 (%)
  • 9.9 Taiwan - Market size and forecast 2023-2028
    • Chart on Taiwan - Market size and forecast 2023-2028 ($ million)
    • Data Table on Taiwan - Market size and forecast 2023-2028 ($ million)
    • Chart on Taiwan - Year-over-year growth 2023-2028 (%)
    • Data Table on Taiwan - Year-over-year growth 2023-2028 (%)
  • 9.10 China - Market size and forecast 2023-2028
    • Chart on China - Market size and forecast 2023-2028 ($ million)
    • Data Table on China - Market size and forecast 2023-2028 ($ million)
    • Chart on China - Year-over-year growth 2023-2028 (%)
    • Data Table on China - Year-over-year growth 2023-2028 (%)
  • 9.11 US - Market size and forecast 2023-2028
    • Chart on US - Market size and forecast 2023-2028 ($ million)
    • Data Table on US - Market size and forecast 2023-2028 ($ million)
    • Chart on US - Year-over-year growth 2023-2028 (%)
    • Data Table on US - Year-over-year growth 2023-2028 (%)
  • 9.12 Japan - Market size and forecast 2023-2028
    • Chart on Japan - Market size and forecast 2023-2028 ($ million)
    • Data Table on Japan - Market size and forecast 2023-2028 ($ million)
    • Chart on Japan - Year-over-year growth 2023-2028 (%)
    • Data Table on Japan - Year-over-year growth 2023-2028 (%)
  • 9.13 Market opportunity By Geographical Landscape
    • Market opportunity By Geographical Landscape ($ million)
    • Data Tables on Market opportunity By Geographical Landscape ($ million)

10 Drivers, Challenges, and Opportunity/Restraints

  • 10.1 Market drivers
  • 10.2 Market challenges
  • 10.3 Impact of drivers and challenges
    • Impact of drivers and challenges in 2023 and 2028
  • 10.4 Market opportunities/restraints

11 Competitive Landscape

  • 11.1 Overview
  • 11.2 Competitive Landscape
    • Overview on criticality of inputs and factors of differentiation
  • 11.3 Landscape disruption
    • Overview on factors of disruption
  • 11.4 Industry risks
    • Impact of key risks on business

12 Competitive Analysis

  • 12.1 Companies profiled
    • Companies covered
  • 12.2 Market positioning of companies
    • Matrix on companies position and classification
  • 12.3 Amkor Technology Inc.
    • Amkor Technology Inc. - Overview
    • Amkor Technology Inc. - Business segments
    • Amkor Technology Inc. - Key news
    • Amkor Technology Inc. - Key offerings
    • Amkor Technology Inc. - Segment focus
  • 12.4 ASE Technology Holding Co. Ltd.
    • ASE Technology Holding Co. Ltd. - Overview
    • ASE Technology Holding Co. Ltd. - Business segments
    • ASE Technology Holding Co. Ltd. - Key offerings
    • ASE Technology Holding Co. Ltd. - Segment focus
  • 12.5 ASMPT Ltd.
    • ASMPT Ltd. - Overview
    • ASMPT Ltd. - Business segments
    • ASMPT Ltd. - Key offerings
    • ASMPT Ltd. - Segment focus
  • 12.6 ChipMOS TECHNOLOGIES INC.
    • ChipMOS TECHNOLOGIES INC. - Overview
    • ChipMOS TECHNOLOGIES INC. - Business segments
    • ChipMOS TECHNOLOGIES INC. - Key offerings
    • ChipMOS TECHNOLOGIES INC. - Segment focus
  • 12.7 HANA Micron Co. Ltd.
    • HANA Micron Co. Ltd. - Overview
    • HANA Micron Co. Ltd. - Product / Service
    • HANA Micron Co. Ltd. - Key offerings
  • 12.8 Intel Corp.
    • Intel Corp. - Overview
    • Intel Corp. - Business segments
    • Intel Corp. - Key news
    • Intel Corp. - Key offerings
    • Intel Corp. - Segment focus
  • 12.9 King Yuan Electronics Co. Ltd.
    • King Yuan Electronics Co. Ltd. - Overview
    • King Yuan Electronics Co. Ltd. - Product / Service
    • King Yuan Electronics Co. Ltd. - Key offerings
  • 12.10 KLA Corp.
    • KLA Corp. - Overview
    • KLA Corp. - Business segments
    • KLA Corp. - Key offerings
    • KLA Corp. - Segment focus
  • 12.11 Microchip Technology Inc.
    • Microchip Technology Inc. - Overview
    • Microchip Technology Inc. - Business segments
    • Microchip Technology Inc. - Key news
    • Microchip Technology Inc. - Key offerings
    • Microchip Technology Inc. - Segment focus
  • 12.12 Powertech Technology Inc.
    • Powertech Technology Inc. - Overview
    • Powertech Technology Inc. - Business segments
    • Powertech Technology Inc. - Key offerings
    • Powertech Technology Inc. - Segment focus
  • 12.13 Renesas Electronics Corp.
    • Renesas Electronics Corp. - Overview
    • Renesas Electronics Corp. - Business segments
    • Renesas Electronics Corp. - Key news
    • Renesas Electronics Corp. - Key offerings
    • Renesas Electronics Corp. - Segment focus
  • 12.14 Samsung Electronics Co. Ltd.
    • Samsung Electronics Co. Ltd. - Overview
    • Samsung Electronics Co. Ltd. - Business segments
    • Samsung Electronics Co. Ltd. - Key news
    • Samsung Electronics Co. Ltd. - Key offerings
    • Samsung Electronics Co. Ltd. - Segment focus
  • 12.15 Taiwan Semiconductor Manufacturing Co. Ltd.
    • Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
    • Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
    • Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
  • 12.16 ULVAC Inc.
    • ULVAC Inc. - Overview
    • ULVAC Inc. - Business segments
    • ULVAC Inc. - Key offerings
    • ULVAC Inc. - Segment focus
  • 12.17 Yole Developpement SA
    • Yole Developpement SA - Overview
    • Yole Developpement SA - Product / Service
    • Yole Developpement SA - Key offerings

13 Appendix

  • 13.1 Scope of the report
  • 13.2 Inclusions and exclusions checklist
    • Inclusions checklist
    • Exclusions checklist
  • 13.3 Currency conversion rates for US$
    • Currency conversion rates for US$
  • 13.4 Research methodology
    • Research methodology
  • 13.5 Data procurement
    • Information sources
  • 13.6 Data validation
    • Data validation
  • 13.7 Validation techniques employed for market sizing
    • Validation techniques employed for market sizing
  • 13.8 Data synthesis
    • Data synthesis
    • 360 degree market analysis
    • 360 degree market analysis
  • 13.10 List of abbreviations
    • List of abbreviations
샘플 요청 목록
0 건의 상품을 선택 중
목록 보기
전체삭제