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시장보고서
상품코드
1557591
와이어 본더 장비 시장(2024-2028년)Global Wire Bonder Equipment Market 2024-2028 |
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※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.
와이어 본더 장비 시장은 2023-2028년간 2억 2,750만 달러 확대되고, 예측 기간 중 연평균 복합 성장률(CAGR)은 3.32%를 나타낼 전망입니다.
와이어 본더 장비 시장에 대한 전체적인 분석, 시장 규모와 예측, 동향, 성장 촉진요인, 과제, 약 25개 벤더를 대상으로 한 벤더 분석 등의 정보를 게재했습니다.
현재의 시장 시나리오, 최신 동향과 촉진요인, 시장 환경 전체에 관한 최신 분석을 제공합니다. 이 시장 성장을 촉진하고 있는 것은 세계적인 일렉트로닉스 생산 대수 증가, 자동차에 탑재되는 전자부품 증가, OSAT(후속 공정) 벤더 증가 등입니다.
| 시장 범위 | |
|---|---|
| 기준년 | 2024년 |
| 종료년 | 2028년 |
| 예측 기간 | 2024-2028년 |
| 성장 모멘텀 | 가속 |
| YOY 2024 | 3.17% |
| CAGR | 3.32% |
| 증분액 | 2억 2,750만 달러 |
본 조사에서는 향후 몇 년간 와이어 본더 장비 시장 성장을 가속하는 주요인 중 하나로서 와이어 본딩 기술의 진보를 들고 있습니다. 또한 인더스트리 4.0에 준거한 와이어 본더 장비 개척, 플립칩 본딩 기술 보급이 시장의 큰 수요로 연결될 것입니다.
목차
제1장 주요 요약
- 시장 개요
제2장 시장 구도
- 시장 생태계
- 시장 특징
- 밸류체인 분석
제3장 시장 규모 평가
- 시장의 정의
- 시장 부문 분석
- 시장 규모(2023년)
- 시장 전망(2023-2028년)
제4장 시장 규모 실적
- 세계의 와이어 본더 장비 시장(2018-2022년)
- 제품별 부문 분석(2018-2022년)
- 최종사용자별 부문 분석(2018-2022년)
- 지역별 부문 분석(2018-2022년)
- 국가별 부문 분석(2018-2022년)
제5장 Five Forces 분석
- Five Forces 요약
- 바이어의 교섭력
- 공급 기업의 교섭력
- 신규 진출업체의 위협
- 대체품의 위협
- 경쟁 위협
- 시장 현황
제6장 시장 세분화 : 제품별
- 시장 세분화
- 비교 : 제품별
- Ball bonders : 시장 규모와 예측(2023-2028년)
- Stud-bump bonders : 시장 규모와 예측(2023-2028년)
- Wedge bonders : 시장 규모와 예측(2023-2028년)
- 시장 기회 : 제품별
제7장 시장 세분화 : 최종사용자별
- 시장 세분화
- 비교 : 최종사용자별
- OSAT : 시장 규모와 예측(2023-2028년)
- IDM : 시장 규모와 예측(2023-2028년)
- 시장 기회 : 최종사용자별
제8장 고객 상황
- 고객 상황 개요
제9장 지역별 상황
- 지역별 세분화
- 지역별 비교
- 아시아태평양 : 시장 규모와 예측(2023-2028년)
- 북미 : 시장 규모와 예측(2023-2028년)
- 유럽 : 시장 규모와 예측(2023-2028년)
- 남미 : 시장 규모와 예측(2023-2028년)
- 중동 및 아프리카 : 시장 규모와 예측(2023-2028년)
- 중국 : 시장 규모와 예측(2023-2028년)
- 미국 : 시장 규모와 예측(2023-2028년)
- 일본 : 시장 규모와 예측(2023-2028년)
- 인도 : 시장 규모와 예측(2023-2028년)
- 독일 : 시장 규모와 예측(2023-2028년)
- 시장 기회 : 지역 상황별
제10장 성장 촉진요인, 과제, 기회 및 성장 억제요인
- 시장 성장 촉진요인
- 시장이 해결해야 할 과제
- 성장 촉진요인과 과제의 영향
- 시장 기회와 시장 성장 억제요인
제11장 경쟁 구도
- 개요
- 경쟁 구도
- 혼란 상황
- 업계 리스크
제12장 경쟁 분석
- 기업 개요
- 기업의 시장 포지셔닝
- ASMPT Ltd.
- BE Semiconductor Industries NV
- Corintech Ltd.
- DIAS Automation HK Ltd.
- F and K DELVOTEC Bondtechnik GmbH
- F and S BONDTEC Semiconductor GmbH
- Hesse GmbH
- HYBOND Inc.
- Kulicke and Soffa Industries Inc.
- Micro Point Pro Ltd.
- Palomar Technologies Inc.
- Toray Industries Inc.
- TPT Wirebonder GmbH and Co. KG
- WestBond Inc.
- Yamaha Motor Co. Ltd.
제13장 부록
LSH 24.10.10The wire bonder equipment market is forecasted to grow by USD 227.5 mn during 2023-2028, accelerating at a CAGR of 3.32% during the forecast period. The report on the wire bonder equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising electronics production across world, rising electronic content in automobiles, and increase in number of osat vendors.
Technavio's wire bonder equipment market is segmented as below:
| Market Scope | |
|---|---|
| Base Year | 2024 |
| End Year | 2028 |
| Series Year | 2024-2028 |
| Growth Momentum | Accelerate |
| YOY 2024 | 3.17% |
| CAGR | 3.32% |
| Incremental Value | $227.5mn |
By Product
- Ball bonders
- Stud-bump bonders
- Wedge bonders
By End-user
- OSAT
- IDM
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
This study identifies the technological advancements in wire bonding as one of the prime reasons driving the wire bonder equipment market growth during the next few years. Also, development of wire bonder equipment compliant with industry 4.0 and increasing popularity of flip-chip bonding technology will lead to sizable demand in the market.
The report on the wire bonder equipment market covers the following areas:
- Wire bonder equipment market sizing
- Wire bonder equipment market forecast
- Wire bonder equipment market industry analysis
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading wire bonder equipment market vendors that include Accelonix Ltd., ASMPT Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F and K DELVOTEC Bondtechnik GmbH, F and S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd.. Also, the wire bonder equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
- 1.1 Market overview
- Executive Summary - Chart on Market Overview
- Executive Summary - Data Table on Market Overview
- Executive Summary - Chart on Global Market Characteristics
- Executive Summary - Chart on Market By Geographical Landscape
- Executive Summary - Chart on Market Segmentation by Product
- Executive Summary - Chart on Market Segmentation by End-user
- Executive Summary - Chart on Incremental Growth
- Executive Summary - Data Table on Incremental Growth
- Executive Summary - Chart on Company Market Positioning
2 Market Landscape
- 2.1 Market ecosystem
- Parent Market
- Data Table on - Parent Market
- 2.2 Market characteristics
- Market characteristics analysis
- 2.3 Value chain analysis
- Value Chain Analysis
3 Market Sizing
- 3.1 Market definition
- Offerings of companies included in the market definition
- 3.2 Market segment analysis
- Market segments
- 3.3 Market size 2023
- 3.4 Market outlook: Forecast for 2023-2028
- Chart on Global - Market size and forecast 2023-2028 ($ million)
- Data Table on Global - Market size and forecast 2023-2028 ($ million)
- Chart on Global Market: Year-over-year growth 2023-2028 (%)
- Data Table on Global Market: Year-over-year growth 2023-2028 (%)
4 Historic Market Size
- 4.1 Global Wire Bonder Equipment Market 2018 - 2022
- Historic Market Size - Data Table on Global Wire Bonder Equipment Market 2018 - 2022 ($ million)
- 4.2 Product segment analysis 2018 - 2022
- Historic Market Size - Product Segment 2018 - 2022 ($ million)
- 4.3 End-user segment analysis 2018 - 2022
- Historic Market Size - End-user Segment 2018 - 2022 ($ million)
- 4.4 Geography segment analysis 2018 - 2022
- Historic Market Size - Geography Segment 2018 - 2022 ($ million)
- 4.5 Country segment analysis 2018 - 2022
- Historic Market Size - Country Segment 2018 - 2022 ($ million)
5 Five Forces Analysis
- 5.1 Five forces summary
- Five forces analysis - Comparison between 2023 and 2028
- 5.2 Bargaining power of buyers
- Bargaining power of buyers - Impact of key factors 2023 and 2028
- 5.3 Bargaining power of suppliers
- Bargaining power of suppliers - Impact of key factors in 2023 and 2028
- 5.4 Threat of new entrants
- Threat of new entrants - Impact of key factors in 2023 and 2028
- 5.5 Threat of substitutes
- Threat of substitutes - Impact of key factors in 2023 and 2028
- 5.6 Threat of rivalry
- Threat of rivalry - Impact of key factors in 2023 and 2028
- 5.7 Market condition
- Chart on Market condition - Five forces 2023 and 2028
6 Market Segmentation by Product
- 6.1 Market segments
- Chart on Product - Market share 2023-2028 (%)
- Data Table on Product - Market share 2023-2028 (%)
- 6.2 Comparison by Product
- Chart on Comparison by Product
- Data Table on Comparison by Product
- 6.3 Ball bonders - Market size and forecast 2023-2028
- Chart on Ball bonders - Market size and forecast 2023-2028 ($ million)
- Data Table on Ball bonders - Market size and forecast 2023-2028 ($ million)
- Chart on Ball bonders - Year-over-year growth 2023-2028 (%)
- Data Table on Ball bonders - Year-over-year growth 2023-2028 (%)
- 6.4 Stud-bump bonders - Market size and forecast 2023-2028
- Chart on Stud-bump bonders - Market size and forecast 2023-2028 ($ million)
- Data Table on Stud-bump bonders - Market size and forecast 2023-2028 ($ million)
- Chart on Stud-bump bonders - Year-over-year growth 2023-2028 (%)
- Data Table on Stud-bump bonders - Year-over-year growth 2023-2028 (%)
- 6.5 Wedge bonders - Market size and forecast 2023-2028
- Chart on Wedge bonders - Market size and forecast 2023-2028 ($ million)
- Data Table on Wedge bonders - Market size and forecast 2023-2028 ($ million)
- Chart on Wedge bonders - Year-over-year growth 2023-2028 (%)
- Data Table on Wedge bonders - Year-over-year growth 2023-2028 (%)
- 6.6 Market opportunity by Product
- Market opportunity by Product ($ million)
- Data Table on Market opportunity by Product ($ million)
7 Market Segmentation by End-user
- 7.1 Market segments
- Chart on End-user - Market share 2023-2028 (%)
- Data Table on End-user - Market share 2023-2028 (%)
- 7.2 Comparison by End-user
- Chart on Comparison by End-user
- Data Table on Comparison by End-user
- 7.3 OSAT - Market size and forecast 2023-2028
- Chart on OSAT - Market size and forecast 2023-2028 ($ million)
- Data Table on OSAT - Market size and forecast 2023-2028 ($ million)
- Chart on OSAT - Year-over-year growth 2023-2028 (%)
- Data Table on OSAT - Year-over-year growth 2023-2028 (%)
- 7.4 IDM - Market size and forecast 2023-2028
- Chart on IDM - Market size and forecast 2023-2028 ($ million)
- Data Table on IDM - Market size and forecast 2023-2028 ($ million)
- Chart on IDM - Year-over-year growth 2023-2028 (%)
- Data Table on IDM - Year-over-year growth 2023-2028 (%)
- 7.5 Market opportunity by End-user
- Market opportunity by End-user ($ million)
- Data Table on Market opportunity by End-user ($ million)
8 Customer Landscape
- 8.1 Customer landscape overview
- Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
9 Geographic Landscape
- 9.1 Geographic segmentation
- Chart on Market share By Geographical Landscape 2023-2028 (%)
- Data Table on Market share By Geographical Landscape 2023-2028 (%)
- 9.2 Geographic comparison
- Chart on Geographic comparison
- Data Table on Geographic comparison
- 9.3 APAC - Market size and forecast 2023-2028
- Chart on APAC - Market size and forecast 2023-2028 ($ million)
- Data Table on APAC - Market size and forecast 2023-2028 ($ million)
- Chart on APAC - Year-over-year growth 2023-2028 (%)
- Data Table on APAC - Year-over-year growth 2023-2028 (%)
- 9.4 North America - Market size and forecast 2023-2028
- Chart on North America - Market size and forecast 2023-2028 ($ million)
- Data Table on North America - Market size and forecast 2023-2028 ($ million)
- Chart on North America - Year-over-year growth 2023-2028 (%)
- Data Table on North America - Year-over-year growth 2023-2028 (%)
- 9.5 Europe - Market size and forecast 2023-2028
- Chart on Europe - Market size and forecast 2023-2028 ($ million)
- Data Table on Europe - Market size and forecast 2023-2028 ($ million)
- Chart on Europe - Year-over-year growth 2023-2028 (%)
- Data Table on Europe - Year-over-year growth 2023-2028 (%)
- 9.6 South America - Market size and forecast 2023-2028
- Chart on South America - Market size and forecast 2023-2028 ($ million)
- Data Table on South America - Market size and forecast 2023-2028 ($ million)
- Chart on South America - Year-over-year growth 2023-2028 (%)
- Data Table on South America - Year-over-year growth 2023-2028 (%)
- 9.7 Middle East and Africa - Market size and forecast 2023-2028
- Chart on Middle East and Africa - Market size and forecast 2023-2028 ($ million)
- Data Table on Middle East and Africa - Market size and forecast 2023-2028 ($ million)
- Chart on Middle East and Africa - Year-over-year growth 2023-2028 (%)
- Data Table on Middle East and Africa - Year-over-year growth 2023-2028 (%)
- 9.8 China - Market size and forecast 2023-2028
- Chart on China - Market size and forecast 2023-2028 ($ million)
- Data Table on China - Market size and forecast 2023-2028 ($ million)
- Chart on China - Year-over-year growth 2023-2028 (%)
- Data Table on China - Year-over-year growth 2023-2028 (%)
- 9.9 US - Market size and forecast 2023-2028
- Chart on US - Market size and forecast 2023-2028 ($ million)
- Data Table on US - Market size and forecast 2023-2028 ($ million)
- Chart on US - Year-over-year growth 2023-2028 (%)
- Data Table on US - Year-over-year growth 2023-2028 (%)
- 9.10 Japan - Market size and forecast 2023-2028
- Chart on Japan - Market size and forecast 2023-2028 ($ million)
- Data Table on Japan - Market size and forecast 2023-2028 ($ million)
- Chart on Japan - Year-over-year growth 2023-2028 (%)
- Data Table on Japan - Year-over-year growth 2023-2028 (%)
- 9.11 India - Market size and forecast 2023-2028
- Chart on India - Market size and forecast 2023-2028 ($ million)
- Data Table on India - Market size and forecast 2023-2028 ($ million)
- Chart on India - Year-over-year growth 2023-2028 (%)
- Data Table on India - Year-over-year growth 2023-2028 (%)
- 9.12 Germany - Market size and forecast 2023-2028
- Chart on Germany - Market size and forecast 2023-2028 ($ million)
- Data Table on Germany - Market size and forecast 2023-2028 ($ million)
- Chart on Germany - Year-over-year growth 2023-2028 (%)
- Data Table on Germany - Year-over-year growth 2023-2028 (%)
- 9.13 Market opportunity By Geographical Landscape
- Market opportunity By Geographical Landscape ($ million)
- Data Tables on Market opportunity By Geographical Landscape ($ million)
10 Drivers, Challenges, and Opportunity/Restraints
- 10.1 Market drivers
- 10.2 Market challenges
- 10.3 Impact of drivers and challenges
- Impact of drivers and challenges in 2023 and 2028
- 10.4 Market opportunities/restraints
11 Competitive Landscape
- 11.1 Overview
- 11.2 Competitive Landscape
- Overview on criticality of inputs and factors of differentiation
- 11.3 Landscape disruption
- Overview on factors of disruption
- 11.4 Industry risks
- Impact of key risks on business
12 Competitive Analysis
- 12.1 Companies profiled
- Companies covered
- 12.2 Market positioning of companies
- Matrix on companies position and classification
- 12.3 ASMPT Ltd.
- ASMPT Ltd. - Overview
- ASMPT Ltd. - Business segments
- ASMPT Ltd. - Key offerings
- ASMPT Ltd. - Segment focus
- 12.4 BE Semiconductor Industries NV
- BE Semiconductor Industries NV - Overview
- BE Semiconductor Industries NV - Business segments
- BE Semiconductor Industries NV - Key offerings
- BE Semiconductor Industries NV - Segment focus
- 12.5 Corintech Ltd.
- Corintech Ltd. - Overview
- Corintech Ltd. - Product / Service
- Corintech Ltd. - Key offerings
- 12.6 DIAS Automation HK Ltd.
- DIAS Automation HK Ltd. - Overview
- DIAS Automation HK Ltd. - Product / Service
- DIAS Automation HK Ltd. - Key offerings
- 12.7 F and K DELVOTEC Bondtechnik GmbH
- F and K DELVOTEC Bondtechnik GmbH - Overview
- F and K DELVOTEC Bondtechnik GmbH - Product / Service
- F and K DELVOTEC Bondtechnik GmbH - Key offerings
- 12.8 F and S BONDTEC Semiconductor GmbH
- F and S BONDTEC Semiconductor GmbH - Overview
- F and S BONDTEC Semiconductor GmbH - Product / Service
- F and S BONDTEC Semiconductor GmbH - Key offerings
- 12.9 Hesse GmbH
- Hesse GmbH - Overview
- Hesse GmbH - Product / Service
- Hesse GmbH - Key offerings
- 12.10 HYBOND Inc.
- HYBOND Inc. - Overview
- HYBOND Inc. - Product / Service
- HYBOND Inc. - Key offerings
- 12.11 Kulicke and Soffa Industries Inc.
- Kulicke and Soffa Industries Inc. - Overview
- Kulicke and Soffa Industries Inc. - Business segments
- Kulicke and Soffa Industries Inc. - Key offerings
- Kulicke and Soffa Industries Inc. - Segment focus
- 12.12 Micro Point Pro Ltd.
- Micro Point Pro Ltd. - Overview
- Micro Point Pro Ltd. - Product / Service
- Micro Point Pro Ltd. - Key offerings
- 12.13 Palomar Technologies Inc.
- Palomar Technologies Inc. - Overview
- Palomar Technologies Inc. - Product / Service
- Palomar Technologies Inc. - Key offerings
- 12.14 Toray Industries Inc.
- Toray Industries Inc. - Overview
- Toray Industries Inc. - Business segments
- Toray Industries Inc. - Key news
- Toray Industries Inc. - Key offerings
- Toray Industries Inc. - Segment focus
- 12.15 TPT Wirebonder GmbH and Co. KG
- TPT Wirebonder GmbH and Co. KG - Overview
- TPT Wirebonder GmbH and Co. KG - Product / Service
- TPT Wirebonder GmbH and Co. KG - Key offerings
- 12.16 WestBond Inc.
- WestBond Inc. - Overview
- WestBond Inc. - Product / Service
- WestBond Inc. - Key offerings
- 12.17 Yamaha Motor Co. Ltd.
- Yamaha Motor Co. Ltd. - Overview
- Yamaha Motor Co. Ltd. - Business segments
- Yamaha Motor Co. Ltd. - Key news
- Yamaha Motor Co. Ltd. - Key offerings
- Yamaha Motor Co. Ltd. - Segment focus
13 Appendix
- 13.1 Scope of the report
- 13.2 Inclusions and exclusions checklist
- Inclusions checklist
- Exclusions checklist
- 13.3 Currency conversion rates for US$
- Currency conversion rates for US$
- 13.4 Research methodology
- Research methodology
- 13.5 Data procurement
- Information sources
- 13.6 Data validation
- Data validation
- 13.7 Validation techniques employed for market sizing
- Validation techniques employed for market sizing
- 13.8 Data synthesis
- Data synthesis
- 13.9 360 degree market analysis
- 360 degree market analysis
- 13.10 List of abbreviations
- List of abbreviations
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