블루투스 집적 회로 시장(2026-2030년)

The global bluetooth integrated circuit (IC) market is forecasted to grow by USD 29304.2 mn during 2025-2030, accelerating at a CAGR of 11.0% during the forecast period. The report on the global bluetooth integrated circuit (IC) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing adoption of iot devices, expanding demand for wireless connectivity in consumer electronics, advancing deployment of connected technologies in automotive and industrial applications.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.

Technavio's global bluetooth integrated circuit (IC) market is segmented as below:

By Class Type

• Class II
• Class I
• Class III

By Application

• Beacons
• Audio devices
• Smart homes
• Automotive
• Others

By Type

• Dual-mode bluetooth ICs
• Bluetooth low energy ICs
• Bluetooth classic ICs

Geography

• APAC
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
• Middle East and Africa
  • UAE
  • South Africa
  • Turkey
• South America
  • Brazil
  • Argentina
  • Chile
• Rest of World (ROW)

This study identifies the advancing integration of ble and edge intelligence capabilities as one of the prime reasons driving the global bluetooth integrated circuit (IC) market growth during the next few years. Also, evolving adoption of higher data throughput and enhanced audio communication standards and increasing convergence of multi-protocol wireless connectivity platforms will lead to sizable demand in the market.

The report on the global bluetooth integrated circuit (IC) market covers the following areas:

• Global bluetooth integrated circuit (IC) market sizing
• Global bluetooth integrated circuit (IC) market forecast
• Global bluetooth integrated circuit (IC) market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading global bluetooth integrated circuit (IC) market vendors that include Broadcom Inc., Espressif Systems Shanghai, Infineon Technologies AG, MediaTek Inc., Microchip Technology Inc., Nordic Semiconductor ASA, NXP Semiconductors NV, ON Semiconductor Corp., Qualcomm Inc., Realtek Semiconductor Corp., Renesas Electronics Corp., ROHM Co. Ltd., Shenzhen Goodix Technology Co., Silicon Laboratories Inc., Sony Group Corp., STMicroelectronics NV, Synaptics Inc., Texas Instruments Inc., Toshiba Corp.. Also, the global bluetooth integrated circuit (IC) market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview
  • Executive Summary - Chart on Market Overview
  • Executive Summary - Data Table on Market Overview
  • Executive Summary - Chart on Global Market Characteristics
  • Executive Summary - Chart on Market by Geography
  • Executive Summary - Chart on Market Segmentation by Class Type
  • Executive Summary - Chart on Market Segmentation by Application
  • Executive Summary - Chart on Market Segmentation by Type
  • Executive Summary - Chart on Incremental Growth
  • Executive Summary - Data Table on Incremental Growth
  • Executive Summary - Chart on Company Market Positioning

2 Technavio Analysis

• 2.1 Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
• 2.2 Criticality of inputs and Factors of differentiation
• 2.3 Factors of disruption
• 2.4 Impact of drivers and challenges

3 Market Landscape

• 3.1 Market ecosystem
• 3.2 Market characteristics
• 3.3 Value chain analysis

4 Market Sizing

• 4.1 Market definition
• 4.2 Market segment analysis
  • Market segments
• 4.3 Market size 2025
• 4.4 Market outlook: Forecast for 2025-2030

5 Historic Market Size

• 5.1 Global Bluetooth Integrated Circuit (IC) Market 2020 - 2024
  • Historic Market Size - Data Table on Global Bluetooth Integrated Circuit (IC) Market 2020 - 2024 ($ million)
• 5.2 Class Type segment analysis 2020 - 2024
  • Historic Market Size - Class Type Segment 2020 - 2024 ($ million)
• 5.3 Application segment analysis 2020 - 2024
  • Historic Market Size - Application Segment 2020 - 2024 ($ million)
• 5.4 Type segment analysis 2020 - 2024
  • Historic Market Size - Type Segment 2020 - 2024 ($ million)
• 5.5 Geography segment analysis 2020 - 2024
  • Historic Market Size - Geography Segment 2020 - 2024 ($ million)
• 5.6 Country segment analysis 2020 - 2024
  • Historic Market Size - Country Segment 2020 - 2024 ($ million)

6 Qualitative Analysis

• 6.1 Impact of AI on global bluetooth integrated circuit (IC) market
• 6.2 Impact of geopolitical conflicts on global bluetooth integrated circuit (IC) market

7 Five Forces Analysis

• 7.1 Five forces summary
  • Five forces analysis - Comparison between 2025 and 2030
• 7.2 Bargaining power of buyers
  • Bargaining power of buyers - Impact of key factors 2025 and 2030
• 7.3 Bargaining power of suppliers
  • Bargaining power of suppliers - Impact of key factors in 2025 and 2030
• 7.4 Threat of new entrants
  • Threat of new entrants - Impact of key factors in 2025 and 2030
• 7.5 Threat of substitutes
  • Threat of substitutes - Impact of key factors in 2025 and 2030
• 7.6 Threat of rivalry
  • Threat of rivalry - Impact of key factors in 2025 and 2030
• 7.7 Market condition

8 Market Segmentation by Class Type

• 8.1 Market segments
• 8.2 Comparison by Class Type
• 8.3 Class II - Market size and forecast 2025-2030
• 8.4 Class I - Market size and forecast 2025-2030
• 8.5 Class III - Market size and forecast 2025-2030
• 8.6 Market opportunity by Class Type
  • Market opportunity by Class Type ($ million)

9 Market Segmentation by Application

• 9.1 Market segments
• 9.2 Comparison by Application
• 9.3 Beacons - Market size and forecast 2025-2030
• 9.4 Audio devices - Market size and forecast 2025-2030
• 9.5 Smart homes - Market size and forecast 2025-2030
• 9.6 Automotive - Market size and forecast 2025-2030
• 9.7 Others - Market size and forecast 2025-2030
• 9.8 Market opportunity by Application
  • Market opportunity by Application ($ million)

10 Market Segmentation by Type

• 10.1 Market segments
• 10.2 Comparison by Type
• 10.3 Dual-mode bluetooth ICs - Market size and forecast 2025-2030
• 10.4 Bluetooth low energy ICs - Market size and forecast 2025-2030
• 10.5 Bluetooth classic ICs - Market size and forecast 2025-2030
• 10.6 Market opportunity by Type
  • Market opportunity by Type ($ million)

11 Customer Landscape

• 11.1 Customer landscape overview
  • Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

12 Geographic Landscape

• 12.1 Geographic segmentation
• 12.2 Geographic comparison
• 12.3 APAC - Market size and forecast 2025-2030
  • 12.3.1 China - Market size and forecast 2025-2030
  • 12.3.2 Japan - Market size and forecast 2025-2030
  • 12.3.3 India - Market size and forecast 2025-2030
  • 12.3.4 South Korea - Market size and forecast 2025-2030
  • 12.3.5 Australia - Market size and forecast 2025-2030
  • 12.3.6 Indonesia - Market size and forecast 2025-2030
• 12.4 North America - Market size and forecast 2025-2030
  • 12.4.1 US - Market size and forecast 2025-2030
  • 12.4.2 Canada - Market size and forecast 2025-2030
  • 12.4.3 Mexico - Market size and forecast 2025-2030
• 12.5 Europe - Market size and forecast 2025-2030
  • 12.5.1 Germany - Market size and forecast 2025-2030
  • 12.5.2 UK - Market size and forecast 2025-2030
  • 12.5.3 France - Market size and forecast 2025-2030
  • 12.5.4 Italy - Market size and forecast 2025-2030
  • 12.5.5 Spain - Market size and forecast 2025-2030
  • 12.5.6 The Netherlands - Market size and forecast 2025-2030
• 12.6 Middle East and Africa - Market size and forecast 2025-2030
  • 12.6.1 Saudi Arabia - Market size and forecast 2025-2030
  • 12.6.2 UAE - Market size and forecast 2025-2030
  • 12.6.3 South Africa - Market size and forecast 2025-2030
  • 12.6.4 Israel - Market size and forecast 2025-2030
  • 12.6.5 Turkey - Market size and forecast 2025-2030
• 12.7 South America - Market size and forecast 2025-2030
  • 12.7.1 Brazil - Market size and forecast 2025-2030
  • 12.7.2 Argentina - Market size and forecast 2025-2030
  • 12.7.3 Chile - Market size and forecast 2025-2030
• 12.8 Market opportunity by geography
  • Market opportunity by geography ($ million)
  • Data Tables on Market opportunity by geography ($ million)

13 Drivers, Challenges, and Opportunity

• 13.1 Market drivers
  • Growing adoption of IoT devices
  • Expanding demand for wireless connectivity in consumer electronics
  • Advancing deployment of connected technologies in automotive and industrial applications
• 13.2 Market challenges
  • Complex semiconductor supply chain dependencies
  • Rising integration complexity across connected ecosystems
  • Stringent regulatory and certification requirements
• 13.3 Impact of drivers and challenges
  • Impact of drivers and challenges in 2025 and 2030
• 13.4 Market opportunities
  • Advancing integration of BLE and edge intelligence capabilities
  • Evolving adoption of higher data throughput and enhanced audio communication standards
  • Increasing convergence of multi-protocol wireless connectivity platforms

14 Competitive Landscape

• 14.1 Overview
• 14.2 Competitive Landscape
  • Overview on criticality of inputs and factors of differentiation
• 14.3 Landscape disruption
  • Overview on factors of disruption
• 14.4 Industry risks
  • Impact of key risks on business

15 Competitive Analysis

• 15.1 Companies profiled
  • Companies covered
• 15.2 Company ranking index
  • Company ranking index
• 15.3 Market positioning of companies
  • Matrix on companies position and classification
• 15.4 Broadcom Inc.
  • Broadcom Inc. - Overview
  • Broadcom Inc. - Business segments
  • Broadcom Inc. - Key news
  • Broadcom Inc. - Key offerings
  • Broadcom Inc. - Segment focus
  • SWOT
• 15.5 Infineon Technologies AG
  • Infineon Technologies AG - Overview
  • Infineon Technologies AG - Business segments
  • Infineon Technologies AG - Key news
  • Infineon Technologies AG - Key offerings
  • Infineon Technologies AG - Segment focus
  • SWOT
• 15.6 MediaTek Inc.
  • MediaTek Inc. - Overview
  • MediaTek Inc. - Business segments
  • MediaTek Inc. - Key news
  • MediaTek Inc. - Key offerings
  • MediaTek Inc. - Segment focus
  • SWOT
• 15.7 Microchip Technology Inc.
  • Microchip Technology Inc. - Overview
  • Microchip Technology Inc. - Business segments
  • Microchip Technology Inc. - Key offerings
  • Microchip Technology Inc. - Segment focus
  • SWOT
• 15.8 NXP Semiconductors NV
  • NXP Semiconductors NV - Overview
  • NXP Semiconductors NV - Business segments
  • NXP Semiconductors NV - Key news
  • NXP Semiconductors NV - Key offerings
  • NXP Semiconductors NV - Segment focus
  • SWOT
• 15.9 ON Semiconductor Corp.
  • ON Semiconductor Corp. - Overview
  • ON Semiconductor Corp. - Business segments
  • ON Semiconductor Corp. - Key news
  • ON Semiconductor Corp. - Key offerings
  • ON Semiconductor Corp. - Segment focus
  • SWOT
• 15.10 Qualcomm Inc.
  • Qualcomm Inc. - Overview
  • Qualcomm Inc. - Business segments
  • Qualcomm Inc. - Key news
  • Qualcomm Inc. - Key offerings
  • Qualcomm Inc. - Segment focus
  • SWOT
• 15.11 Realtek Semiconductor Corp.
  • Realtek Semiconductor Corp. - Overview
  • Realtek Semiconductor Corp. - Product / Service
  • Realtek Semiconductor Corp. - Key offerings
  • SWOT
• 15.12 Renesas Electronics Corp.
  • Renesas Electronics Corp. - Overview
  • Renesas Electronics Corp. - Business segments
  • Renesas Electronics Corp. - Key news
  • Renesas Electronics Corp. - Key offerings
  • Renesas Electronics Corp. - Segment focus
  • SWOT
• 15.13 ROHM Co. Ltd.
  • ROHM Co. Ltd. - Overview
  • ROHM Co. Ltd. - Business segments
  • ROHM Co. Ltd. - Key news
  • ROHM Co. Ltd. - Key offerings
  • ROHM Co. Ltd. - Segment focus
  • SWOT
• 15.14 Shenzhen Goodix Technology Co.
  • Shenzhen Goodix Technology Co. - Overview
  • Shenzhen Goodix Technology Co. - Product / Service
  • Shenzhen Goodix Technology Co. - Key offerings
  • SWOT
• 15.15 Sony Group Corp.
  • Sony Group Corp. - Overview
  • Sony Group Corp. - Business segments
  • Sony Group Corp. - Key news
  • Sony Group Corp. - Key offerings
  • Sony Group Corp. - Segment focus
  • SWOT
• 15.16 STMicroelectronics NV
  • STMicroelectronics NV - Overview
  • STMicroelectronics NV - Business segments
  • STMicroelectronics NV - Key news
  • STMicroelectronics NV - Key offerings
  • STMicroelectronics NV - Segment focus
  • SWOT
• 15.17 Texas Instruments Inc.
  • Texas Instruments Inc. - Overview
  • Texas Instruments Inc. - Business segments
  • Texas Instruments Inc. - Key news
  • Texas Instruments Inc. - Key offerings
  • Texas Instruments Inc. - Segment focus
  • SWOT
• 15.18 Toshiba Corp.
  • Toshiba Corp. - Overview
  • Toshiba Corp. - Product / Service
  • Toshiba Corp. - Key offerings
  • SWOT

16 Appendix

• 16.1 Scope of the report
  • Market definition
  • Objectives
  • Notes and caveats
• 16.2 Inclusions and exclusions checklist
  • Inclusions checklist
  • Exclusions checklist
• 16.3 Currency conversion rates for US$
  • Currency conversion rates for US$
• 16.4 Research methodology
  • Research methodology
• 16.5 Data procurement
  • Information sources
• 16.6 Data validation
  • Data validation
• 16.7 Validation techniques employed for market sizing
  • Validation techniques employed for market sizing
• 16.8 Data synthesis
  • Data synthesis
• 16.9 360 degree market analysis
  • 360 degree market analysis
• 16.10 List of abbreviations
  • List of abbreviations