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Printed Circuit Board Market by Type (Double-Sided PCBs, Multi-Layer PCBs, Single-Sided PCBs), Substrate (Flexible, Rigid, Rigid-Flex), Component, Materials, End-User - Global Forecast 2025-2030

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CAGR(%) 4.81%

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Portre's Five Forces: Àμâȸ·Î±âÆÇ ½ÃÀå Ž»öÀ» À§ÇÑ Àü·«Àû Åø

Portre's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â Àμâȸ·Î±âÆÇ ½ÃÀå °æÀï ±¸µµ¸¦ ÀÌÇØÇÏ´Â Áß¿äÇÑ ÅøÀÔ´Ï´Ù. PorterÀÇ Five Forces Framework´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ Ž»öÇÏ´Â ¸íÈ®ÇÑ ¹æ¹ýÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÀλçÀÌÆ®À» ÅëÇØ ±â¾÷Àº °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ µµÀüÀ» ÇÇÇϰí, º¸´Ù °­·ÂÇÑ ½ÃÀå Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : Àμâȸ·Î±âÆÇ ½ÃÀå¿¡¼­ÀÇ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº Àμâȸ·Î±âÆÇ ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀο¡ ´ëÇÑ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇϸç, PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀû À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£µµ, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¼±Á¦ÀûÀÌ°í ´Éµ¿ÀûÀÎ ÀÇ»ç°áÁ¤À» ³»¸± Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® Àμâȸ·Î±âÆÇ ½ÃÀå¿¡¼­ °æÀï ±¸µµ ÆÄ¾Ç

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FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º Àμâȸ·Î±âÆÇ ½ÃÀå¿¡¼­ÀÇ º¥´õ ¼º°ú Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â Àμâȸ·Î±âÆÇ ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÏ´Â Áß¿äÇÑ ÅøÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº º¥´õÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±â¹ÝÀ¸·Î Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ºÎÇÕÇÏ´Â Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖÀ¸¸ç, 4°³ÀÇ »çºÐ¸éÀ¸·Î º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ¼¼ºÐÈ­ÇÏ¿© Àü·«Àû¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù. Àü·«Àû¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× Ãßõ Àμâȸ·Î±âÆÇ ½ÃÀå¿¡¼­ÀÇ ¼º°ø °æ·Î¸¦ ±×¸®´Â ¹æ¹ý

Àμâȸ·Î±âÆÇ ½ÃÀå Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ÀÇ ÀÔÁö¸¦ °­È­ÇϰíÀÚ ÇÏ´Â ±â¾÷¿¡°Ô ÇʼöÀûÀÔ´Ï´Ù. ÁÖ¿ä ÀÚ¿ø, ¿ª·® ¹× ¼º°ú ÁöÇ¥¸¦ °ËÅäÇÔÀ¸·Î½á ±â¾÷Àº ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇÏ°í °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀ» ÅëÇØ °æÀï ȯ°æÀÇ °úÁ¦¸¦ ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» ´Þ¼ºÇÒ ¼ö ÀÖµµ·Ï ÁغñÇÒ ¼ö ÀÖ½À´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀå¿¡ ´ëÇÑ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù. :

1. ½ÃÀå ħÅõµµ : ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

2. ½ÃÀå °³Ã´µµ: ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù°¢È­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä ¹ßÀü, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ÀÇ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú ¹ßÀü µîÀ» °ËÅäÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÷´Ü ±â¼ú, ¿¬±¸°³¹ß Ȱµ¿ ¹× Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

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1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå Àü¸ÁÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹®, Áö¿ªÀº?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

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  • Advanced Circuits Inc.
  • AT & S Austria Technologie & Systemtechnik AG
  • Becker & Muller Schaltungsdruck GmbH
  • CMK Corporation
  • Compeq Manufacturing Co. Ltd.
  • DAEDUCK ELECTRONICS Co.,Ltd.
  • Dynamic Electronics Co., Ltd.
  • Epitome Components Limited
  • Flexium Interconnect, Inc.
  • Fujikura Printed Circuits Ltd.
  • Hi-Q Electronics Private Limited
  • Ibiden Co., Ltd.
  • India Circuits Pvt . Ltd
  • Jabil Inc.
  • Kyoden Co., Ltd.
  • LG Innotek
  • Meiko Electronics Co., Ltd.
  • Molex, LLC
  • Multi-Fineline Electronix, Inc.
  • Nan Ya Printed Circuit Board Corporation
  • Samsung Electro-Mechanics
  • Shennan Circuits Co., Ltd.
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • Young Poong Electronics Co., Ltd.
KSA 24.12.05

The Printed Circuit Board Market was valued at USD 85.75 billion in 2023, expected to reach USD 89.76 billion in 2024, and is projected to grow at a CAGR of 4.81%, to USD 119.22 billion by 2030.

Printed Circuit Boards (PCBs) are fundamental components in electronic devices, serving as the backbone that connects and supports electronic components. They play a critical role in the functioning of various devices by facilitating the electrical connectivity among components. The PCB market is driven by factors such as the growing demand for consumer electronics, automation across industries, and advancements in telecommunications infrastructure like 5G. Applications span across consumer electronics, automotive, healthcare, industrial electronics, and aerospace, each demanding different PCB specifications. The necessity of PCBs arises from their ability to provide reliable electrical connections within compact spaces, which is crucial in the design of modern electronics. End-use industries such as IoT devices, electric vehicles, and renewable energy systems are progressively expanding the scope of PCB applications.

KEY MARKET STATISTICS
Base Year [2023] USD 85.75 billion
Estimated Year [2024] USD 89.76 billion
Forecast Year [2030] USD 119.22 billion
CAGR (%) 4.81%

Key growth influencers include the pressing demand for miniaturization of devices, the rise of next-gen wireless technologies, and the increasing complexity of electronic products. Nonetheless, the market faces challenges, such as fluctuating raw material prices, the environmental impacts of PCB production, and intense competition driving price pressures. Emerging opportunities lie in the development of PCBs for high-frequency applications, flexible and rigid-flex PCBs that cater to advanced electronics, and eco-friendly alternatives to traditional PCB materials. For businesses to capitalize on these opportunities, investing in R&D for novel materials and manufacturing processes that enhance reliability and reduce costs is pivotal. Furthermore, adopting sustainable practices and circular economy principles can offer a competitive edge.

Barriers to growth include regulatory compliance issues and the high capital requirements for advanced manufacturing setup. Innovation in automation and artificial intelligence for PCB design and production, along with improving thermal management and signal integrity, hold promise for future developments. With the integration of IoT, there is a move toward smarter PCBs that support enhanced functionalities, representing a significant area for research. The market's competitive nature emphasizes the need for differentiation through innovation and cost-effective solutions.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Printed Circuit Board Market

The Printed Circuit Board Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Rising demand for consumer electronics among consumers globally
    • Proliferation of IoT devices into various industries
    • Increasing demand for advanced medical devices and diagnostic equipment
  • Market Restraints
    • High manufacturing costs and complexities associated with production of advanced printed circuit board
  • Market Opportunities
    • Ongoing advancements in flexible and rigid-flex printed circuit boards
    • Global shift towards electric vehicles (EVs) and autonomous driving technologies
  • Market Challenges
    • Environmental and regulatory challenges associated in printed circuit board manufacturing

Porter's Five Forces: A Strategic Tool for Navigating the Printed Circuit Board Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Printed Circuit Board Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Printed Circuit Board Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Printed Circuit Board Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Printed Circuit Board Market

A detailed market share analysis in the Printed Circuit Board Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Printed Circuit Board Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Printed Circuit Board Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Printed Circuit Board Market

A strategic analysis of the Printed Circuit Board Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Printed Circuit Board Market, highlighting leading vendors and their innovative profiles. These include Advanced Circuits Inc., AT & S Austria Technologie & Systemtechnik AG, Becker & Muller Schaltungsdruck GmbH, CMK Corporation, Compeq Manufacturing Co. Ltd., DAEDUCK ELECTRONICS Co.,Ltd., Dynamic Electronics Co., Ltd., Epitome Components Limited, Flexium Interconnect, Inc., Fujikura Printed Circuits Ltd., Hi-Q Electronics Private Limited, Ibiden Co., Ltd., India Circuits Pvt . Ltd, Jabil Inc., Kyoden Co., Ltd., LG Innotek, Meiko Electronics Co., Ltd., Molex, LLC, Multi-Fineline Electronix, Inc., Nan Ya Printed Circuit Board Corporation, Samsung Electro-Mechanics, Shennan Circuits Co., Ltd., TTM Technologies, Inc., Unimicron Technology Corporation, and Young Poong Electronics Co., Ltd..

Market Segmentation & Coverage

This research report categorizes the Printed Circuit Board Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Double-Sided PCBs, Multi-Layer PCBs, and Single-Sided PCBs.
  • Based on Substrate, market is studied across Flexible, Rigid, and Rigid-Flex.
  • Based on Component, market is studied across Capacitors, Connectors, Diodes, Integrated Circuits (ICs), Resistors, Sensors, and Transistors.
  • Based on Materials, market is studied across Ceramic, FR-4, Metal, Polyimide, and PTFE (Teflon).
  • Based on End-User, market is studied across Automotive Electronics, Consumer Electronics, Defense & Aerospace, Healthcare, Military, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising demand for consumer electronics among consumers globally
      • 5.1.1.2. Proliferation of IoT devices into various industries
      • 5.1.1.3. Increasing demand for advanced medical devices and diagnostic equipment
    • 5.1.2. Restraints
      • 5.1.2.1. High manufacturing costs and complexities associated with production of advanced printed circuit board
    • 5.1.3. Opportunities
      • 5.1.3.1. Ongoing advancements in flexible and rigid-flex printed circuit boards
      • 5.1.3.2. Global shift towards electric vehicles (EVs) and autonomous driving technologies
    • 5.1.4. Challenges
      • 5.1.4.1. Environmental and regulatory challenges associated in printed circuit board manufacturing
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type : Rising preference for multi-layer printed circuit boards in high-performance electronic devices
    • 5.2.2. End-User : Expanding use of printed circuit boards in healthcare devices
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Printed Circuit Board Market, by Type

  • 6.1. Introduction
  • 6.2. Double-Sided PCBs
  • 6.3. Multi-Layer PCBs
  • 6.4. Single-Sided PCBs

7. Printed Circuit Board Market, by Substrate

  • 7.1. Introduction
  • 7.2. Flexible
  • 7.3. Rigid
  • 7.4. Rigid-Flex

8. Printed Circuit Board Market, by Component

  • 8.1. Introduction
  • 8.2. Capacitors
  • 8.3. Connectors
  • 8.4. Diodes
  • 8.5. Integrated Circuits (ICs)
  • 8.6. Resistors
  • 8.7. Sensors
  • 8.8. Transistors

9. Printed Circuit Board Market, by Materials

  • 9.1. Introduction
  • 9.2. Ceramic
  • 9.3. FR-4
  • 9.4. Metal
  • 9.5. Polyimide
  • 9.6. PTFE (Teflon)

10. Printed Circuit Board Market, by End-User

  • 10.1. Introduction
  • 10.2. Automotive Electronics
  • 10.3. Consumer Electronics
  • 10.4. Defense & Aerospace
  • 10.5. Healthcare
  • 10.6. Military
  • 10.7. Telecommunications

11. Americas Printed Circuit Board Market

  • 11.1. Introduction
  • 11.2. Argentina
  • 11.3. Brazil
  • 11.4. Canada
  • 11.5. Mexico
  • 11.6. United States

12. Asia-Pacific Printed Circuit Board Market

  • 12.1. Introduction
  • 12.2. Australia
  • 12.3. China
  • 12.4. India
  • 12.5. Indonesia
  • 12.6. Japan
  • 12.7. Malaysia
  • 12.8. Philippines
  • 12.9. Singapore
  • 12.10. South Korea
  • 12.11. Taiwan
  • 12.12. Thailand
  • 12.13. Vietnam

13. Europe, Middle East & Africa Printed Circuit Board Market

  • 13.1. Introduction
  • 13.2. Denmark
  • 13.3. Egypt
  • 13.4. Finland
  • 13.5. France
  • 13.6. Germany
  • 13.7. Israel
  • 13.8. Italy
  • 13.9. Netherlands
  • 13.10. Nigeria
  • 13.11. Norway
  • 13.12. Poland
  • 13.13. Qatar
  • 13.14. Russia
  • 13.15. Saudi Arabia
  • 13.16. South Africa
  • 13.17. Spain
  • 13.18. Sweden
  • 13.19. Switzerland
  • 13.20. Turkey
  • 13.21. United Arab Emirates
  • 13.22. United Kingdom

14. Competitive Landscape

  • 14.1. Market Share Analysis, 2023
  • 14.2. FPNV Positioning Matrix, 2023
  • 14.3. Competitive Scenario Analysis
    • 14.3.1. APCT launches as AdvancedPCB, integrating industry leaders under one brand
    • 14.3.2. LQDX and Kansai Denshi Industries forge sales and license agreement
    • 14.3.3. Fineline Global Group acquires IBR Leiterplatten GmbH & Co. KG to expand PCB market presence
  • 14.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Advanced Circuits Inc.
  • 2. AT & S Austria Technologie & Systemtechnik AG
  • 3. Becker & Muller Schaltungsdruck GmbH
  • 4. CMK Corporation
  • 5. Compeq Manufacturing Co. Ltd.
  • 6. DAEDUCK ELECTRONICS Co.,Ltd.
  • 7. Dynamic Electronics Co., Ltd.
  • 8. Epitome Components Limited
  • 9. Flexium Interconnect, Inc.
  • 10. Fujikura Printed Circuits Ltd.
  • 11. Hi-Q Electronics Private Limited
  • 12. Ibiden Co., Ltd.
  • 13. India Circuits Pvt . Ltd
  • 14. Jabil Inc.
  • 15. Kyoden Co., Ltd.
  • 16. LG Innotek
  • 17. Meiko Electronics Co., Ltd.
  • 18. Molex, LLC
  • 19. Multi-Fineline Electronix, Inc.
  • 20. Nan Ya Printed Circuit Board Corporation
  • 21. Samsung Electro-Mechanics
  • 22. Shennan Circuits Co., Ltd.
  • 23. TTM Technologies, Inc.
  • 24. Unimicron Technology Corporation
  • 25. Young Poong Electronics Co., Ltd.
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