차세대 비휘발성 메모리 시장 : 제품 유형, 웨이퍼 사이즈, 최종사용자별 - 세계 예측(2025-2030년)

The Next Generation Non-Volatile Memory Market was valued at USD 8.37 billion in 2023, expected to reach USD 9.79 billion in 2024, and is projected to grow at a CAGR of 18.18%, to USD 26.95 billion by 2030.

Next Generation Non-Volatile Memory (NGNVM) encompasses advanced memory technologies that retain data without power, crucial for future computing speeds, efficiency, and capacity needs. This category includes technologies like Resistive RAM (ReRAM), Phase Change Memory (PCM), Magnetoresistive RAM (MRAM), and Ferroelectric RAM (FeRAM), addressing limitations of traditional DRAM, NAND, and NOR flash memories. The necessity for NGNVM arises from the growing demand for faster, more efficient, and scalable storage solutions as data-intensive applications like AI, IoT, and big data analytics proliferate. Applications span consumer electronics, automotive, industrial systems, enterprise storage, and networking equipment, with industries seeking higher endurance, increased speed, lower power consumption, and greater densities. Key growth factors include the booming demand for energy-efficient storage technologies, a rise in smart devices and wearables, and increasing investments in IoT solutions. The emergence of Industry 4.0 further accentuates the need for NGNVM. Opportunities lie in penetrating sectors like autonomous vehicles, AI-driven systems, and next-gen communication platforms. However, challenges include high initial costs, technological integration issues, and competition from established memory solutions like SSDs. Market growth might also be limited due to production scalability and materials research unsolved margins. Innovators should focus on enhancing endurance, reducing latency, and cost efficiency to address these challenges. Collaborative research in materials science, architecture scalability, and multi-functionality could yield breakthroughs, offering a competitive edge. Researchers should explore hybrid memory systems that combine the advantages of various NGNVM types for broader application adaptability. The NGNVM market is inherently dynamic, driven by rapid technological advancements and volubility in consumption patterns, necessitating continuous monitoring and adaptation for players seeking to capitalize on emerging trends and consumer demands.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Next Generation Non-Volatile Memory Market

The Next Generation Non-Volatile Memory Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Growing demand for fast and cost-effective storage solutions
  • Increasing demand for effective storage solutions in consumer electronics
• Market Restraints
  • High cost of next-generation non-volatile memory technologies
• Market Opportunities
  • Technological advancements in next-generation non-volatile memory
  • Increasing cloud storage and data centers requirements
• Market Challenges
  • Lack of standardized processes for memory technologies across applications

Porter's Five Forces: A Strategic Tool for Navigating the Next Generation Non-Volatile Memory Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Next Generation Non-Volatile Memory Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Next Generation Non-Volatile Memory Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Next Generation Non-Volatile Memory Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Next Generation Non-Volatile Memory Market

A detailed market share analysis in the Next Generation Non-Volatile Memory Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Next Generation Non-Volatile Memory Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Next Generation Non-Volatile Memory Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Next Generation Non-Volatile Memory Market

A strategic analysis of the Next Generation Non-Volatile Memory Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Next Generation Non-Volatile Memory Market, highlighting leading vendors and their innovative profiles. These include ANAFLASH Inc., Avalanche Technologies Inc., CrossBar, Inc., Everspin Technologies, Inc., Fujitsu Limited, GlobalFoundries Inc., Honeywell International Inc., Huawei Technologies Co., Ltd., Infineon Technologies AG, InnoGrit Corporation, Intel Corporation, International Business Machines Corporation, Kioxia Corporation, Macronix International Co., Ltd., Micron Technology, Inc., Netlist, Inc., Panasonic Holdings Corporation, Rambus Inc., Renesas Electronics Corporation, Rohm Co., Ltd., Samsung Electronics Co., Ltd., SK hynix Inc., Sony Group Corporation, STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, Toshiba Corporation, United Microelectronics Corporation, Viking Technology by Sanmina Corporation, Western Digital Corporation, and Winbond Electronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Next Generation Non-Volatile Memory Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Product Type, market is studied across Ferroelectric Random-Access Memory, Magnetic Random-Access Memory, Phase-Change Memory, and Resistive Random Access Memory.
• Based on Type, market is studied across Embedded Systems and Stand-Alone Storage Modules.
• Based on Wafer Size, market is studied across 200mm Wafers and 300mm Wafers.
• Based on End-User, market is studied across Aerospace & Defence, Automotive, Consumer Electronics, Enterprise Storage, Medical Equipment, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across Arizona, California, Florida, Massachusetts, New York, North Carolina, Ohio, Oregon, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growing demand for fast and cost-effective storage solutions
    • 5.1.1.2. Increasing demand for effective storage solutions in consumer electronics
  • 5.1.2. Restraints
    • 5.1.2.1. High cost of next-generation non-volatile memory technologies
  • 5.1.3. Opportunities
    • 5.1.3.1. Technological advancements in next-generation non-volatile memory
    • 5.1.3.2. Increasing cloud storage and data centers requirements
  • 5.1.4. Challenges
    • 5.1.4.1. Lack of standardized processes for memory technologies across applications
• 5.2. Market Segmentation Analysis
  • 5.2.1. Product Type: Emerging adoption of magnetic random-access memory owing to its durability, high speed, and endurance
  • 5.2.2. Type: Widening usage of embedded systems for incorporation in next generation non-volatile memory
  • 5.2.3. Wafer Size: Preference for 300mm in semiconductor manufacturing processes
  • 5.2.4. End-User: Rising ownership and production of consumer electronics worldwide
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Next Generation Non-Volatile Memory Market, by Product Type

• 6.1. Introduction
• 6.2. Ferroelectric Random-Access Memory
• 6.3. Magnetic Random-Access Memory
• 6.4. Phase-Change Memory
• 6.5. Resistive Random Access Memory

7. Next Generation Non-Volatile Memory Market, by Type

• 7.1. Introduction
• 7.2. Embedded Systems
• 7.3. Stand-Alone Storage Modules

8. Next Generation Non-Volatile Memory Market, by Wafer Size

• 8.1. Introduction
• 8.2. 200mm Wafers
• 8.3. 300mm Wafers

9. Next Generation Non-Volatile Memory Market, by End-User

• 9.1. Introduction
• 9.2. Aerospace & Defence
• 9.3. Automotive
• 9.4. Consumer Electronics
• 9.5. Enterprise Storage
• 9.6. Medical Equipment
• 9.7. Telecommunications

10. Americas Next Generation Non-Volatile Memory Market

• 10.1. Introduction
• 10.2. Argentina
• 10.3. Brazil
• 10.4. Canada
• 10.5. Mexico
• 10.6. United States

11. Asia-Pacific Next Generation Non-Volatile Memory Market

• 11.1. Introduction
• 11.2. Australia
• 11.3. China
• 11.4. India
• 11.5. Indonesia
• 11.6. Japan
• 11.7. Malaysia
• 11.8. Philippines
• 11.9. Singapore
• 11.10. South Korea
• 11.11. Taiwan
• 11.12. Thailand
• 11.13. Vietnam

12. Europe, Middle East & Africa Next Generation Non-Volatile Memory Market

• 12.1. Introduction
• 12.2. Denmark
• 12.3. Egypt
• 12.4. Finland
• 12.5. France
• 12.6. Germany
• 12.7. Israel
• 12.8. Italy
• 12.9. Netherlands
• 12.10. Nigeria
• 12.11. Norway
• 12.12. Poland
• 12.13. Qatar
• 12.14. Russia
• 12.15. Saudi Arabia
• 12.16. South Africa
• 12.17. Spain
• 12.18. Sweden
• 12.19. Switzerland
• 12.20. Turkey
• 12.21. United Arab Emirates
• 12.22. United Kingdom

13. Competitive Landscape

• 13.1. Market Share Analysis, 2023
• 13.2. FPNV Positioning Matrix, 2023
• 13.3. Competitive Scenario Analysis
  • 13.3.1. Samsung Electronics to Innovative 9th Generation V-NAND Flash Technology
  • 13.3.2. IBM Integrates Everspin's 1 Gigabit STT-MRAM in New FlashCore Modules
  • 13.3.3. Innovations in Non-Volatile Memory Showcased by Macronix at Embedded World 2024
  • 13.3.4. Revolutionary Laser-Induced Magnetic Control Promises Enhancements in Non-Volatile Memory Technology
  • 13.3.5. Huawei Innovates with New All-Flash Storage Solutions for Enhanced Data Center Efficiency
  • 13.3.6. Everspin Advances Industrial Applications with Expanded STT-MRAM Offerings
  • 13.3.7. Kioxia and Western Digital Announce Strategic Merger in Next Generation Non-Volatile Memory Market
  • 13.3.8. Strategic Partnership Enhances NVMe Storage Solutions through Next-Generation Technology
  • 13.3.9. SK Hynix Unveils Advanced Memory Solutions for Data Centers at HPE Discover 2023
  • 13.3.10. Winbond Launches Advanced 8Mb Serial Flash Memory Optimized for Compact IoT Devices
• 13.4. Strategy Analysis & Recommendation
  • 13.4.1. Kioxia Corporation
  • 13.4.2. SK hynix Inc.
  • 13.4.3. Winbond Electronics Corporation
  • 13.4.4. Renesas Electronics Corporation
  • 13.4.5. Infineon Technologies AG

Companies Mentioned

• 1. ANAFLASH Inc.
• 2. Avalanche Technologies Inc.
• 3. CrossBar, Inc.
• 4. Everspin Technologies, Inc.
• 5. Fujitsu Limited
• 6. GlobalFoundries Inc.
• 7. Honeywell International Inc.
• 8. Huawei Technologies Co., Ltd.
• 9. Infineon Technologies AG
• 10. InnoGrit Corporation
• 11. Intel Corporation
• 12. International Business Machines Corporation
• 13. Kioxia Corporation
• 14. Macronix International Co., Ltd.
• 15. Micron Technology, Inc.
• 16. Netlist, Inc.
• 17. Panasonic Holdings Corporation
• 18. Rambus Inc.
• 19. Renesas Electronics Corporation
• 20. Rohm Co., Ltd.
• 21. Samsung Electronics Co., Ltd.
• 22. SK hynix Inc.
• 23. Sony Group Corporation
• 24. STMicroelectronics N.V.
• 25. Taiwan Semiconductor Manufacturing Company Limited
• 26. Texas Instruments Incorporated
• 27. Toshiba Corporation
• 28. United Microelectronics Corporation
• 29. Viking Technology by Sanmina Corporation
• 30. Western Digital Corporation
• 31. Winbond Electronics Corporation