세계의 일렉트로닉스용 접착제, 실링제 및 충전제 시장 : 제품, 용도, 최종 용도별 예측(2025-2030년)

The Adhesives, Sealants & Fillers for Electronics Market was valued at USD 4.09 billion in 2023, expected to reach USD 4.34 billion in 2024, and is projected to grow at a CAGR of 6.50%, to USD 6.36 billion by 2030.

The market for adhesives, sealants, and fillers in electronics is a crucial segment within the broader industrial adhesives sector, supporting the assembly, protection, and maintenance of electronic devices. These materials are indispensable for enhancing device reliability, performance, and lifespan by providing thermal management, electrical insulation, and protection against environmental factors. The applications in this sector are diverse, encompassing use in consumer electronics, automotive electronics, telecommunications, and healthcare devices, among others. The demand is primarily driven by rapid advancements in electronic device miniaturization and the proliferation of smart technologies, which necessitate innovative bonding solutions that can withstand the stresses associated with smaller and more complex assemblies.

Key growth factors include technological advancements in electronics manufacturing, increasing demand for efficient and robust packaging solutions, and the ongoing trend toward the Internet of Things (IoT), which boosts the necessity for reliable electronic components. Emerging opportunities arise from the development of eco-friendly and sustainable adhesives, increasing regulatory pressures for safer and non-toxic formulations, and expanding applications into new technologies such as flexible and wearable electronics. To capitalize on these trends, companies should focus on R&D investments that explore advanced formulations, including electrically conductive adhesives and bio-based materials.

However, the market faces challenges such as stringent regulatory compliance requirements that might restrict certain chemicals, high raw material costs that pressure profit margins, and intense competition among key players necessitating continuous innovation. Additionally, the evolving nature of electronics requires constant adaptation in adhesive formulations to meet new specifications and performance criteria.

Innovation should target the development of lightweight, multi-functional adhesives that offer superior properties such as heat dissipation, electrical conductivity, and environmental resistance. Additionally, exploring methods to enhance the recyclability and sustainability of these products aligns with broader industry trends toward environmentally responsible manufacturing processes. Overall, the market is dynamic, with promising growth pathways provided companies strategically navigate the technological and regulatory landscapes.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Adhesives, Sealants & Fillers for Electronics Market

The Adhesives, Sealants & Fillers for Electronics Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Growing need for reliable and durable electronic components increasing the demand for adhesives and sealants
  • Rising electronics manufacturing volumes increasing the demand for specialized adhesive solutions
  • Rising demand for miniaturized and high-performance electronic devices
• Market Restraints
  • Issues associated with achieving consistent quality and performance standards
• Market Opportunities
  • Increasing demand for customizable and flexible electronic components
  • Increasing investments in R&D for the development of eco-friendly and sustainable adhesive formulations
• Market Challenges
  • Concerns related to thermal management and heat dissipation in electronic devices

Porter's Five Forces: A Strategic Tool for Navigating the Adhesives, Sealants & Fillers for Electronics Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Adhesives, Sealants & Fillers for Electronics Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Adhesives, Sealants & Fillers for Electronics Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Adhesives, Sealants & Fillers for Electronics Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Adhesives, Sealants & Fillers for Electronics Market

A detailed market share analysis in the Adhesives, Sealants & Fillers for Electronics Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Adhesives, Sealants & Fillers for Electronics Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Adhesives, Sealants & Fillers for Electronics Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Adhesives, Sealants & Fillers for Electronics Market

A strategic analysis of the Adhesives, Sealants & Fillers for Electronics Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Adhesives, Sealants & Fillers for Electronics Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Ashland Global Holdings Inc., Avery Dennison Corporation, BASF SE, CHT Group, Cytec Industries Inc. by Solvay, Dow Inc., Dymax Corporation, Evonik Industries AG, H.B. Fuller Company, Henkel AG & Co. KGaA, Huntsman Corporation, Illinois Tool Works Inc., MacDermid Alpha Electronic Solutions, Master Bond Inc., MG Chemicals Ltd., Momentive Performance Materials Inc., Panacol-Elosol GmbH, Parker-Hannifin Corporation, Permabond LLC, PPG Industries, Inc., Shin-Etsu Chemical Co., Ltd., Sika AG, Wacker Chemie AG, and WEVO-CHEMIE GmbH.

Market Segmentation & Coverage

This research report categorizes the Adhesives, Sealants & Fillers for Electronics Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Product, market is studied across Adhesives, Fillers, and Sealants. The Adhesives is further studied across Acrylic Adhesives, Cyanoacrylate Adhesives, Epoxy Adhesives, Polyurethane Adhesives, and Silicone Adhesives. The Fillers is further studied across Conductive Fillers, Gap Fillers, Non-Conductive Fillers, and Thermal Interface Fillers. The Sealants is further studied across Acrylic Sealants, Epoxy Sealants, Polyurethane Sealants, and Silicone Sealants.
• Based on Application, market is studied across Electrical Conductivity, Electronics Assembly, Protection & Encapsulation, Structural Bonding, and Thermal Management.
• Based on End-Use, market is studied across Aerospace & Defense, Automotive Electronics, Consumer Electronics, Industrial Electronics, Medical Devices, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growing need for reliable and durable electronic components increasing the demand for adhesives and sealants
    • 5.1.1.2. Rising electronics manufacturing volumes increasing the demand for specialized adhesive solutions
    • 5.1.1.3. Rising demand for miniaturized and high-performance electronic devices
  • 5.1.2. Restraints
    • 5.1.2.1. Issues associated with achieving consistent quality and performance standards
  • 5.1.3. Opportunities
    • 5.1.3.1. Increasing demand for customizable and flexible electronic components
    • 5.1.3.2. Increasing investments in R&D for the development of eco-friendly and sustainable adhesive formulations
  • 5.1.4. Challenges
    • 5.1.4.1. Concerns related to thermal management and heat dissipation in electronic devices
• 5.2. Market Segmentation Analysis
  • 5.2.1. Product: Growing use of fillers for enhanced electrical properties
  • 5.2.2. Application: Expanding applications of adhesives, sealants and fillers in structural bonding to enhance robustness
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Adhesives, Sealants & Fillers for Electronics Market, by Product

• 6.1. Introduction
• 6.2. Adhesives
  • 6.2.1. Acrylic Adhesives
  • 6.2.2. Cyanoacrylate Adhesives
  • 6.2.3. Epoxy Adhesives
  • 6.2.4. Polyurethane Adhesives
  • 6.2.5. Silicone Adhesives
• 6.3. Fillers
  • 6.3.1. Conductive Fillers
  • 6.3.2. Gap Fillers
  • 6.3.3. Non-Conductive Fillers
  • 6.3.4. Thermal Interface Fillers
• 6.4. Sealants
  • 6.4.1. Acrylic Sealants
  • 6.4.2. Epoxy Sealants
  • 6.4.3. Polyurethane Sealants
  • 6.4.4. Silicone Sealants

7. Adhesives, Sealants & Fillers for Electronics Market, by Application

• 7.1. Introduction
• 7.2. Electrical Conductivity
• 7.3. Electronics Assembly
• 7.4. Protection & Encapsulation
• 7.5. Structural Bonding
• 7.6. Thermal Management

8. Adhesives, Sealants & Fillers for Electronics Market, by End-Use

• 8.1. Introduction
• 8.2. Aerospace & Defense
• 8.3. Automotive Electronics
• 8.4. Consumer Electronics
• 8.5. Industrial Electronics
• 8.6. Medical Devices
• 8.7. Telecommunications

9. Americas Adhesives, Sealants & Fillers for Electronics Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Adhesives, Sealants & Fillers for Electronics Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Adhesives, Sealants & Fillers for Electronics Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
  • 12.3.1. H.B. Fuller expands electronics adhesives portfolio with ND Industries acquisition
  • 12.3.2. Henkel unveils advanced potting solutions to enhance electronic components' reliability and sustainability in automotive applications
  • 12.3.3. H.B. Fuller acquires Sanglier Limited to expand in the electronics adhesives sector
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. 3M Company
• 2. Ashland Global Holdings Inc.
• 3. Avery Dennison Corporation
• 4. BASF SE
• 5. CHT Group
• 6. Cytec Industries Inc. by Solvay
• 7. Dow Inc.
• 8. Dymax Corporation
• 9. Evonik Industries AG
• 10. H.B. Fuller Company
• 11. Henkel AG & Co. KGaA
• 12. Huntsman Corporation
• 13. Illinois Tool Works Inc.
• 14. MacDermid Alpha Electronic Solutions
• 15. Master Bond Inc.
• 16. MG Chemicals Ltd.
• 17. Momentive Performance Materials Inc.
• 18. Panacol-Elosol GmbH
• 19. Parker-Hannifin Corporation
• 20. Permabond LLC
• 21. PPG Industries, Inc.
• 22. Shin-Etsu Chemical Co., Ltd.
• 23. Sika AG
• 24. Wacker Chemie AG
• 25. WEVO-CHEMIE GmbH