세계의 다이싱 장비 시장 : 기술별, 가공 재료별, 최종 사용자 산업별 - 예측(2025-2030년)

The Dicing Equipment Market was valued at USD 1.59 billion in 2023, expected to reach USD 1.68 billion in 2024, and is projected to grow at a CAGR of 5.88%, to USD 2.37 billion by 2030.

Dicing equipment refers to machinery used in semiconductor manufacturing for cutting silicon wafers into individual dies or chips, which are integral to electronic devices. The demand for efficient dicing equipment is escalating due to the proliferation of consumer electronics, telecommunications, and automotive applications. Dicing equipment is critical for ensuring the precision and efficiency required in semiconductor fabrication, significantly influencing production timelines and throughput. The end-use scope of this market spans industries such as electronics, automotive, and industrial manufacturing, each driving the adoption of advanced dicing solutions to cater to the growing complexity and miniaturization of electronic components. Key factors influencing market growth include the continuous advancement in semiconductor technologies, an increase in capital spending for semiconductor fabrication facilities, and the shift towards 5G technology, all fostering demand for high-precision dicing equipment. Opportunities abound in developing equipment with enhanced precision, speed, and efficiency, with innovations focusing on laser dicing and plasma dicing technologies that promise to reduce wastage and enhance throughput. Challenges, however, include high initial investment costs, the complexity of integrating new technologies, and the shortage of skilled labor for operation and maintenance. Nevertheless, consistent research and development efforts, coupled with strategic partnerships in technology innovation, will mitigate these barriers. To seize emerging opportunities, companies should focus on enhancing equipment automation and IoT integration for predictive maintenance and real-time analytics, keeping in sync with Industry 4.0 paradigms. Exploring eco-friendly dicing processes and materials will also uphold sustainability trends. The market is characterized by rapid technological advancements, demanding continuous innovation and a keen focus on aligning with industry trends and regulatory standards. Prioritizing customer-centric R&D and adaptive business models will be key to navigating the dynamic landscape of the dicing equipment market.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Dicing Equipment Market

The Dicing Equipment Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Increasing demand for semiconductor devices in consumer electronics is boosting the dicing equipment market
  • Rapid advancements in dicing technologies and materials are driving the industry forward
  • Growing adoption of automation and robotics in semiconductor manufacturing processes
  • Rising investments in 5G technology and IoT infrastructure are expanding the need for advanced dicing equipment
• Market Restraints
  • Escalating raw material prices impacting the cost-effectiveness of manufacturing dicing equipment
  • Environmental regulations and waste management issues affecting the operation of dicing equipment industries
• Market Opportunities
  • Advancements in automotive electronics necessitating precision dicing equipment for vehicle component manufacturing
  • Evolution in consumer electronics creating surge in demand for precise dicing technologies
  • Medical device miniaturization trends driving need for specialized dicing equipment solutions
• Market Challenges
  • Stringent regulatory and compliance requirements impacting the pace of innovation in dicing equipment technologies and materials
  • Supply chain disruptions and raw material shortages affecting the consistency of dicing equipment production

Porter's Five Forces: A Strategic Tool for Navigating the Dicing Equipment Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Dicing Equipment Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Dicing Equipment Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Dicing Equipment Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Dicing Equipment Market

A detailed market share analysis in the Dicing Equipment Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Dicing Equipment Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Dicing Equipment Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Dicing Equipment Market

A strategic analysis of the Dicing Equipment Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Dicing Equipment Market, highlighting leading vendors and their innovative profiles. These include Accretech, Advanced Dicing Technologies, Amkor Technology, Inc., ASM International N.V., ASM Pacific Technology Ltd., Axus Technology, Canon Machinery Inc., Disco Corporation, Four Dimensions Inc., JST Manufacturing Inc., KLA Corporation, Kulicke & Soffa Industries, Inc., Micross Components, Mitsuboshi Diamond Industrial.,LTD., ON Semiconductor Corporation, Onto Innovation Inc., Panasonic Corporation, Plasma-Therm LLC, PVA TePla AG, Siliconware Precision Industries Co., Ltd., Sumitomo Precision Products Co., Ltd., Tokyo Electron Limited, TOWA Corporation, and ULTILE Precision Co., Ltd..

Market Segmentation & Coverage

This research report categorizes the Dicing Equipment Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Technology, market is studied across Blade Dicing, Laser Dicing, and Plasma Dicing.
• Based on Materials Processed, market is studied across Gallium Arsenide Wafers, Glass Wafers, Silicon Carbide Wafers, and Silicon Wafers.
• Based on End-User Industry, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Increasing demand for semiconductor devices in consumer electronics is boosting the dicing equipment market
    • 5.1.1.2. Rapid advancements in dicing technologies and materials are driving the industry forward
    • 5.1.1.3. Growing adoption of automation and robotics in semiconductor manufacturing processes
    • 5.1.1.4. Rising investments in 5G technology and IoT infrastructure are expanding the need for advanced dicing equipment
  • 5.1.2. Restraints
    • 5.1.2.1. Escalating raw material prices impacting the cost-effectiveness of manufacturing dicing equipment
    • 5.1.2.2. Environmental regulations and waste management issues affecting the operation of dicing equipment industries
  • 5.1.3. Opportunities
    • 5.1.3.1. Advancements in automotive electronics necessitating precision dicing equipment for vehicle component manufacturing
    • 5.1.3.2. Evolution in consumer electronics creating surge in demand for precise dicing technologies
    • 5.1.3.3. Medical device miniaturization trends driving need for specialized dicing equipment solutions
  • 5.1.4. Challenges
    • 5.1.4.1. Stringent regulatory and compliance requirements impacting the pace of innovation in dicing equipment technologies and materials
    • 5.1.4.2. Supply chain disruptions and raw material shortages affecting the consistency of dicing equipment production
• 5.2. Market Segmentation Analysis
  • 5.2.1. Technology: Usage of laser dicing technology in dicing market for superior precision and cleanliness
  • 5.2.2. End-user industry: Increasing demand of dicing equipment in automotive industry to produce electronic components integral to modern vehicles
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Dicing Equipment Market, by Technology

• 6.1. Introduction
• 6.2. Blade Dicing
• 6.3. Laser Dicing
• 6.4. Plasma Dicing

7. Dicing Equipment Market, by Materials Processed

• 7.1. Introduction
• 7.2. Gallium Arsenide Wafers
• 7.3. Glass Wafers
• 7.4. Silicon Carbide Wafers
• 7.5. Silicon Wafers

8. Dicing Equipment Market, by End-User Industry

• 8.1. Introduction
• 8.2. Aerospace & Defense
• 8.3. Automotive
• 8.4. Consumer Electronics
• 8.5. Healthcare
• 8.6. Telecommunications

9. Americas Dicing Equipment Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Dicing Equipment Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Dicing Equipment Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
  • 12.3.1. Innovative blackStar wafer dicing machine by Fonon enhances semiconductor manufacturing efficiency with cutting-edge FWLD technology and strategic industry positioning
  • 12.3.2. UK government invests Euro 16.6M to advance semiconductor sector, focuses GBP 14M on power semiconductors for electric vehicles and manufacturing
  • 12.3.3. Plasma-Therm bolsters european presence and semiconductor portfolio with strategic acquisition of thin film equipment SrL
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Accretech
• 2. Advanced Dicing Technologies
• 3. Amkor Technology, Inc.
• 4. ASM International N.V.
• 5. ASM Pacific Technology Ltd.
• 6. Axus Technology
• 7. Canon Machinery Inc.
• 8. Disco Corporation
• 9. Four Dimensions Inc.
• 10. JST Manufacturing Inc.
• 11. KLA Corporation
• 12. Kulicke & Soffa Industries, Inc.
• 13. Micross Components
• 14. Mitsuboshi Diamond Industrial.,LTD.
• 15. ON Semiconductor Corporation
• 16. Onto Innovation Inc.
• 17. Panasonic Corporation
• 18. Plasma-Therm LLC
• 19. PVA TePla AG
• 20. Siliconware Precision Industries Co., Ltd.
• 21. Sumitomo Precision Products Co., Ltd.
• 22. Tokyo Electron Limited
• 23. TOWA Corporation
• 24. ULTILE Precision Co., Ltd.