½ÃÀ庸°í¼­
»óǰÄÚµå
1585295

¼¼°èÀÇ ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå : À¯Çüº°, Â÷Á¾º°, ¿ëµµº° ¿¹Ãø(2025-2030³â)

Automotive Integrated Circuit Market by Type (Analog Integrated Circuit, Digital Integrated Circuit, Hybrid Integrated Circuit), Vehicle (Commercial Vehicle, Passenger Vehicle), Application - Global Forecast 2025-2030

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: 360iResearch | ÆäÀÌÁö Á¤º¸: ¿µ¹® 197 Pages | ¹è¼Û¾È³» : 1-2ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

ÀÚµ¿Â÷¿ë ÁýÀûȸ·Î ½ÃÀåÀÇ 2023³â ½ÃÀå ±Ô¸ð´Â 509¾ï 1,000¸¸ ´Þ·¯, 2024³â¿¡´Â 564¾ï 3,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, CAGR 10.92%·Î ¼ºÀåÇØ 2030³â¿¡´Â 1,052¾ï 1,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î(IC) ½ÃÀåÀº ÀÚµ¿Â÷ÀÇ ´Ù¾çÇÑ ±â´ÉÀ» Á¦¾îÇÏ´Â ¹ÝµµÃ¼ µð¹ÙÀ̽ºÀÇ ¼³°è ¹× ¹èÄ¡¸¦ Æ÷ÇÔÇÏ´Â º¸´Ù ±¤¹üÀ§ÇÑ ÀÚµ¿Â÷ ÀüÀÚ ºÐ¾ß¿¡ ¼ÓÇÕ´Ï´Ù. ÀÌ IC´Â ¿£Áø Á¦¾î À¯´Ö, ÀÎÆ÷Å×ÀÎ¸ÕÆ® ½Ã½ºÅÛ, ÆÄ¿öÆ®·¹ÀÎ, ¾ÈÀü ±â´É, ¹Ùµð ÀÏ·ºÆ®·Î´Ð½º µî ¿©·¯ ÀÚµ¿Â÷ ºÐ¾ß¿¡ ÇʼöÀûÀÌ¸ç ¿¡³ÊÁö È¿À², ¾ÈÀü¼º Çâ»ó, °í±Þ Â÷·® ±â´ÉÀ» ÃËÁøÇÕ´Ï´Ù. Àü±âÀÚµ¿Â÷(EV)¿Í ÀÚÀ²ÁÖÇà±â¼úÀÇ ÃßÁø¿¡ µû¶ó ¼¼·ÃµÈ ÀÚµ¿Â÷¿ë ICÀÇ ¿ä±¸°¡ ±ÞÁõÇÏ¿© ½º¸¶Æ®Çϰí È¿À²ÀûÀÎ ÄÄÆ÷³ÍÆ® °³¹ß¿¡ ¹ÚÂ÷°¡ °É¸®°í ÀÖ½À´Ï´Ù. ÀÚµ¿Â÷¿ë IC ½ÃÀåÀº ¾ö°ÝÇÑ ¹è±â°¡½º ±ÔÁ¦, ADAS(÷´Ü¿îÀüÁö¿ø½Ã½ºÅÛ)ÀÇ Ã¤¿ë È®´ë, ÀÚµ¿Â÷ÀÇ Àüµ¿È­ °æÇâÀÇ ³ô¾ÆÁü¿¡ ÀÇÇØ µÞ¹ÞħµÇ°í ÀÖ½À´Ï´Ù. ƯÈ÷ Àü±âÀÚµ¿Â÷¿Í ÇÏÀ̺긮µå ÀÚµ¿Â÷ÀÇ º¸±ÞÀº IC Á¦Á¶¾÷ü¿¡ À¯¸®ÇÑ ¼ºÀå ±âȸ¸¦ Á¦°øÇÕ´Ï´Ù. ¶ÇÇÑ IoT¿Í AI¸¦ ÀÚµ¿Â÷ ½Ã½ºÅÛ¿¡ ÅëÇÕÇϸé Á¦Ç° Á¦°øÀ» Çõ½ÅÇÏ°í ´Ù¾çÈ­ÇÒ ¼ö ÀÖ´Â Å« ÀáÀç·ÂÀ» º¸¿©ÁÝ´Ï´Ù. ±×·¯³ª °íºñ¿ë, º¹ÀâÇÑ Á¦Á¶ °øÁ¤, °¡È¤ÇÑ ÀÚµ¿Â÷ ȯ°æ¿¡ ´ëÇÑ ÀüÀÚ ºÎǰÀÇ Ãë¾à¼º°ú °°Àº °úÁ¦´Â ½ÃÀå ¼ºÀå¿¡ ¾î·Á¿òÀ» °Þ°í ÀÖ½À´Ï´Ù. ¹ÝµµÃ¼ ºÎÁ·ÀÇ ÁøÇàÀº ½ÃÀå ¿ªÇп¡ ´õ¿í ¿µÇâÀ» ¹ÌÄ¡°í °ß°íÇÑ °ø±Þ¸Á °ü¸®¿Í ¿ø·á ´Ù¾çÈ­ÀÇ Çʿ伺À» °­Á¶Çϰí ÀÖ½À´Ï´Ù. ¿¹ÃøÀûÀÎ Â÷·® À¯Áöº¸¼ö¸¦ À§ÇÑ AI ÅëÇÕ, Â÷·® ¿¬°áÀ» À§ÇÑ »çÀ̹ö º¸¾È °­È­, EV °í¼Ó ÃæÀüÀ» Áö¿øÇÏ´Â IC °³¹ß µîÀÇ ºÐ¾ß¿¡¼­ÀÇ Çõ½ÅÀÌ »õ·Î¿î ¼ºÀåÀÇ ±æÀ» °³Ã´ÇÒ °¡´É¼ºÀÌ ÀÖ½À´Ï´Ù. È¿À²¼ºÀ» À¯ÁöÇϸ鼭 ÀÚµ¿Â÷ ¸¶¸ð ¹× ¼Õ»ó¿¡ °ßµð´Â ³»±¸¼º ÀÖ´Â IC °³¹ß¿¡ ÃÊÁ¡À» ¸ÂÃá Á¶»ç´Â ÇöÀçÀÇ ÇѰ踦 ´õ¿í ÇØ°áÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÚµ¿Â÷¿ë IC ½ÃÀåÀº ±Þ¼ÓÇÑ ±â¼ú Áøº¸¿Í Ä¡¿­ÇÑ °æÀïÀ» Ư¡À¸·Î ÇÏ¸ç ±â¾÷Àº °æÀï ¿ìÀ§¸¦ À¯ÁöÇϱâ À§ÇØ Áö¼ÓÀûÀÎ R&D ÅõÀÚ¸¦ Ã˱¸Çϰí ÀÖ½À´Ï´Ù. Àü¹ÝÀûÀ¸·Î ÀÌ ½ÃÀåÀº º¹ÀâÇÑ »óȲÀ» ±Øº¹ÇÏ°í ¹Ì·¡¿¡ ´ëÀÀÇÏ´Â ÀÚµ¿Â÷ ±â¼ú¿¡ ÅõÀÚÇÒ ÀÇÁö°¡ ÀÖ´Â ±â¾÷¿¡°Ô Å« ±âȸ¸¦ Á¦°øÇÕ´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
±âÁسâ(2023) 509¾ï 1,000¸¸ ´Þ·¯
¿¹Ãø³â(2024) 564¾ï 3,000¸¸ ´Þ·¯
¿¹Ãø³â(2030) 1,052¾ï 1,000¸¸ ´Þ·¯
CAGR(%) 10.92%

½ÃÀå ¿ªÇÐ: ±Þ¼ÓÈ÷ ÁøÈ­ÇÏ´Â ÀÚµ¿Â÷¿ë ÁýÀûȸ·Î ½ÃÀåÀÇ ÁÖ¿ä ½ÃÀå ÀλçÀÌÆ® °ø°³

ÀÚµ¿Â÷¿ë ÁýÀûȸ·Î ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ÀÛ¿ë¿¡ ÀÇÇØ º¯¸ð¸¦ ÀÌ·ç°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÃÀå ¿ªÇÐÀÇ ÁøÈ­¸¦ ÀÌÇØÇÔÀ¸·Î½á ±â¾÷Àº ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÅõÀÚ°áÁ¤, Àü·«Àû ÀÇ»ç°áÁ¤, »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ ȹµæÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ µ¿ÇâÀ» Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª¿¡ °ÉÄ£ ´Ù¾çÇÑ ¸®½ºÅ©¸¦ °æ°¨ÇÒ ¼ö ÀÖÀ» »Ó¸¸ ¾Æ´Ï¶ó, ¼ÒºñÀÚ Çൿ°ú ±×°ÍÀÌ Á¦Á¶ ºñ¿ë ¶Ç´Â ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ»º¸´Ù ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
    • ±â¼úÀûÀ¸·Î ¼±ÁøÀûÀÎ ÀÚµ¿Â÷ ä¿ë È®´ë
    • °ø°øÀÇ ¾ÈÀü°ú º¸¾ÈÀ» ÇâÇÑ Á¤ºÎÀÇ ±ÔÁ¦
    • ÀÚµ¿Â÷ÀÇ ±Þ¼ÓÇÑ Àüµ¿È­¿Í IC ±â¼úÀÇ ÀÌ¿ë È®´ë
  • ½ÃÀå ¼ºÀå ¾ïÁ¦¿äÀÎ
    • IC ¼³°èÀÇ º¹À⼺
  • ½ÃÀå ±âȸ
    • ÀÚµ¿Â÷ ÆÄ¿ö À©µµ¿ì ½ºÀ§Ä¡ ¾÷°è¿¡¼­ IoTÀÇ »ó½Â
    • Áö´ÉÇü ±³Åë ½Ã½ºÅÛ ¼ö¿ä ±ÞÁõ
  • ½ÃÀåÀÇ °úÁ¦
    • IC ºÎÁ·ÀÇ ¿ì·Á

Portre's Five Forces: ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀåÀ» Ž»öÇÏ´Â Àü·« µµ±¸

Porter's Five Forces ÇÁ·¹ÀÓ ¿öÅ©´Â ½ÃÀå »óȲ°æÀï ±¸µµ¸¦ ÀÌÇØÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Porter's Five Force Framework´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ ޱ¸ÇÏ´Â ¸íÈ®ÇÑ ±â¼úÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» °áÁ¤ÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÅëÂûÀ» ÅëÇØ ±â¾÷Àº ÀÚ»çÀÇ °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ °úÁ¦¸¦ ÇÇÇÒ ¼ö ÀÖÀ¸¸ç, º¸´Ù °­ÀÎÇÑ ½ÃÀå¿¡¼­ÀÇ Æ÷Áö¼Å´×À» º¸ÀåÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå¿¡¼­ ¿ÜºÎ·ÎºÎÅÍÀÇ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇϴµ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀÎ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇÕ´Ï´Ù. PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀûÀÎ À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¾ÕÀ¸·Î ¿¹»óµÇ´Â Àû±ØÀûÀÎ ÀÇ»ç °áÁ¤À» ÇÒ Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® : ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå¿¡¼­ °æÀï ±¸µµ¸¦ ÆÄ¾Ç

ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ °ø±Þ¾÷üÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü µî ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀï Æ÷Áö¼Å´×À» ¹àÈú ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ½ÃÀå ÁýÁß, ´ÜÆíÈ­, ÅëÇÕ µ¿ÇâÀ» ¹àÇô³»°í º¥´õµéÀº °æÀïÀÌ Ä¡¿­ÇØÁö´Â °¡¿îµ¥ ÀÚ»çÀÇ ÁöÀ§¸¦ ³ôÀÌ´Â Àü·«Àû ÀÇ»ç °áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ Áö½ÄÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º : ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå¿¡¼­ °ø±Þ¾÷üÀÇ ¼º´É Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Á¤º¸¸¦ ±â¹ÝÀ¸·Î ÀÇ»ç °áÁ¤À» ³»¸± ¼ö ÀÖ½À´Ï´Ù. ³× °¡Áö »çºÐ¸éÀ» ÅëÇØ º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ºÎ¹®È­Çϰí Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê ¹× ¼Ö·ç¼ÇÀ» ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× ±ÇÀå : ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå¿¡¼­ ¼º°ø¿¡ ´ëÇÑ ±æÀ» ±×¸³´Ï´Ù.

ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀåÀÇ Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ÀÇ ÇÁ·¹Á𽺠°­È­¸¦ ¸ñÇ¥·Î ÇÏ´Â ±â¾÷¿¡ ÇʼöÀûÀÔ´Ï´Ù. ÀÌ ¹æ¹ýÀ» »ç¿ëÇÏ¸é °æÀï ±¸µµ¿¡¼­ ¾î·Á¿òÀ» ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö ÀÖ½À´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀåÀÇ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõ: ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

2. ½ÃÀå °³Ã´µµ: ½ÅÈï ½ÃÀåÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇÏ°í ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡ÇÏ¸ç ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù¾çÈ­: ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä Áøº¸, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú Áøº¸ µîÀ» °ËÁõÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÃÖ÷´Ü ±â¼ú, R&D Ȱµ¿, Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

¶ÇÇÑ ÀÌÇØ°ü°èÀÚ°¡ ÃæºÐÇÑ Á¤º¸¸¦ ¾ò°í ÀÇ»ç°áÁ¤À» ÇÒ ¼ö ÀÖµµ·Ï Áß¿äÇÑ Áú¹®¿¡ ´ë´äÇϰí ÀÖ½À´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå ¿¹ÃøÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹® ¹× Áö¿ªÀº ¾îµðÀԴϱî?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õÀÇ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

5. º¥´õ ½ÃÀå ÁøÀÔ¡¤Ã¶¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÍ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ½ÃÀå °³¿ä

Á¦5Àå ½ÃÀå ÀλçÀÌÆ®

  • ½ÃÀå ¿ªÇÐ
    • ¼ºÀå ÃËÁø¿äÀÎ
      • ±â¼úÀûÀ¸·Î °í±Þ Â÷·®ÀÇ µµÀÔ Áõ°¡
      • °ø°øÀÇ ¾ÈÀü°ú º¸¾È¿¡ °üÇÑ Á¤ºÎÀÇ ±ÔÁ¦
      • Â÷·®ÀÇ ±Þ¼ÓÇÑ Àüµ¿È­¿Í ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î(IC) ±â¼úÀÇ ÀÌ¿ë Áõ°¡
    • ¾ïÁ¦¿äÀÎ
      • IC ¼³°èÀÇ º¹À⼺
    • ±âȸ
      • ÀÚµ¿Â÷ ¾÷°è¿¡¼­ IoTÀÇ ÃâÇö
      • Áö´ÉÇü ±³Åë ½Ã½ºÅÛ ¼ö¿ä ±ÞÁõ
    • °úÁ¦
      • IC ºÎÁ·¿¡ µû¸¥ ¿ì·Á
  • ½ÃÀå ¼¼ºÐÈ­ ºÐ¼®
  • Porter's Five Forces ºÐ¼®
  • PESTEL ºÐ¼®
    • Á¤Ä¡Àû
    • °æÁ¦
    • »ç±³
    • ±â¼úÀû
    • ¹ý·ü»ó
    • ȯ°æ

Á¦6Àå ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå : À¯Çüº°

  • ¾Æ³¯·Î±× ÁýÀû ȸ·Î
  • µðÁöÅÐ ÁýÀû ȸ·Î
  • ÇÏÀ̺긮µå ÁýÀû ȸ·Î
  • ¸ð³î¸®½Ä ÁýÀû ȸ·Î

Á¦7Àå ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå : Â÷·®º°

  • »ó¿ëÂ÷
  • ½Â¿ëÂ÷

Á¦8Àå ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå : ¿ëµµº°

  • ÷´Ü ¿îÀü Áö¿ø ½Ã½ºÅÛ
  • ¿£Áø °ü¸®
  • ÀÚµ¿Â÷ ³×Æ®¿öÅ©
  • º¯¼Ó±â Á¦¾î ½Ã½ºÅÛ

Á¦9Àå ¾Æ¸Þ¸®Ä«ÀÇ ÀÚµ¿Â÷¿ë ÁýÀûȸ·Î ½ÃÀå

  • ¾Æ¸£ÇîÆ¼³ª
  • ºê¶óÁú
  • ij³ª´Ù
  • ¸ß½ÃÄÚ
  • ¹Ì±¹

Á¦10Àå ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå

  • È£ÁÖ
  • Áß±¹
  • Àεµ
  • Àεµ³×½Ã¾Æ
  • ÀϺ»
  • ¸»·¹À̽þÆ
  • Çʸ®ÇÉ
  • ½Ì°¡Æ÷¸£
  • Çѱ¹
  • ´ë¸¸
  • ű¹
  • º£Æ®³²

Á¦11Àå À¯·´¡¤Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ ÀÚµ¿Â÷¿ë ÁýÀû ȸ·Î ½ÃÀå

  • µ§¸¶Å©
  • ÀÌÁýÆ®
  • Çɶõµå
  • ÇÁ¶û½º
  • µ¶ÀÏ
  • À̽º¶ó¿¤
  • ÀÌÅ»¸®¾Æ
  • ³×´ú¶õµå
  • ³ªÀÌÁö¸®¾Æ
  • ³ë¸£¿þÀÌ
  • Æú¶õµå
  • īŸ¸£
  • ·¯½Ã¾Æ
  • »ç¿ìµð¾Æ¶óºñ¾Æ
  • ³²¾ÆÇÁ¸®Ä«
  • ½ºÆäÀÎ
  • ½º¿þµ§
  • ½ºÀ§½º
  • ÅÍŰ
  • ¾Æ¶ø¿¡¹Ì¸®Æ®(UAE)
  • ¿µ±¹

Á¦12Àå °æÀï ±¸µµ

  • ½ÃÀå Á¡À¯À² ºÐ¼® 2023
  • FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º, 2023
  • °æÀï ½Ã³ª¸®¿À ºÐ¼®
  • Àü·« ºÐ¼®°ú Á¦¾È

±â¾÷ ¸ñ·Ï

  • Infineon Technologies AG
  • Intel Corporation
  • KEC corporation
  • Microchip Technology Inc.
  • NXP Semiconductors NV
  • OmniVision Technologies Inc.
  • Renesas Electronics Corporation
  • Robert Bosch GmbH
  • Rohm Semiconductor
  • Samsung Group
  • Semiconductor Components Industries, LLC
  • STMicroelectronics NV
  • Texas Instruments Incorporated
  • Toshiba Electronic Devices & Storage Corporation
JHS 24.11.14

The Automotive Integrated Circuit Market was valued at USD 50.91 billion in 2023, expected to reach USD 56.43 billion in 2024, and is projected to grow at a CAGR of 10.92%, to USD 105.21 billion by 2030.

The automotive integrated circuit (IC) market falls within the broader domain of automotive electronics, encompassing the design and deployment of semiconductor devices that control various functionalities within vehicles. These ICs are vital for multiple automotive sectors such as engine control units, infotainment systems, powertrain, safety features, and body electronics, facilitating energy efficiency, enhanced safety, and advanced vehicular functionalities. With the propulsion towards electric vehicles (EVs) and autonomous driving technologies, the need for sophisticated automotive ICs has surged, fueling the development of smart, efficient components. The automotive IC market is propelled by stringent emission norms, increased adoption of ADAS (Advanced Driver Assistance Systems), and the growing trend of vehicle electrification. In particular, the proliferation of electric and hybrid vehicles offers lucrative growth opportunities for IC manufacturers. Furthermore, the integration of IoT and AI into automotive systems presents vast potential to innovate and diversify product offerings. However, challenges such as high cost, complex manufacturing processes, and the vulnerability of electronic components to harsh automotive environments pose hurdles to market growth. The ongoing semiconductor shortage has further affected market dynamics, underscoring the necessity for robust supply chain management and diversification of raw materials. Innovating in areas such as integrating AI for predictive vehicle maintenance, enhancing cybersecurity for vehicle connectivity, and developing ICs that support faster charging of EVs may unleash new growth avenues. Research focused on creating durable ICs that withstand automotive wear and tear while maintaining efficiency could further address current limitations. The automotive IC marketplace is characterized by rapid technological advancements and cut-throat competition, prompting companies to continually invest in R&D for sustaining competitive advantage. Overall, the market offers substantial opportunities for players willing to navigate its complexities and invest in future-ready automotive technologies.

KEY MARKET STATISTICS
Base Year [2023] USD 50.91 billion
Estimated Year [2024] USD 56.43 billion
Forecast Year [2030] USD 105.21 billion
CAGR (%) 10.92%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Automotive Integrated Circuit Market

The Automotive Integrated Circuit Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing adoption of technologically advanced vehicles
    • Government regulations towards public safety and security
    • Rapid electrification of vehicles and increasing usage of automotive integrated circuit (IC) technology
  • Market Restraints
    • Complexity in the designing of ICs
  • Market Opportunities
    • Emergence of IoT in automotiAutomotive Power Window Switchve industry
    • Surge in demand of intelligent transportation system
  • Market Challenges
    • Concerns associated with shortage of ICs

Porter's Five Forces: A Strategic Tool for Navigating the Automotive Integrated Circuit Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Automotive Integrated Circuit Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Automotive Integrated Circuit Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Automotive Integrated Circuit Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Automotive Integrated Circuit Market

A detailed market share analysis in the Automotive Integrated Circuit Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Automotive Integrated Circuit Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Automotive Integrated Circuit Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Automotive Integrated Circuit Market

A strategic analysis of the Automotive Integrated Circuit Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Automotive Integrated Circuit Market, highlighting leading vendors and their innovative profiles. These include Infineon Technologies AG, Intel Corporation, KEC corporation, Microchip Technology Inc., NXP Semiconductors N.V., OmniVision Technologies Inc., Renesas Electronics Corporation, Robert Bosch GmbH, Rohm Semiconductor, Samsung Group, Semiconductor Components Industries, LLC, STMicroelectronics N.V., Texas Instruments Incorporated, and Toshiba Electronic Devices & Storage Corporation.

Market Segmentation & Coverage

This research report categorizes the Automotive Integrated Circuit Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Analog Integrated Circuit, Digital Integrated Circuit, Hybrid Integrated Circuit, and Monolithic Integrated Circuit.
  • Based on Vehicle, market is studied across Commercial Vehicle and Passenger Vehicle.
  • Based on Application, market is studied across Advance Driver Assistance System, Engine Management, In-Vehicle Networking, and Transmission Control System.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing adoption of technologically advanced vehicles
      • 5.1.1.2. Government regulations towards public safety and security
      • 5.1.1.3. Rapid electrification of vehicles and increasing usage of automotive integrated circuit (IC) technology
    • 5.1.2. Restraints
      • 5.1.2.1. Complexity in the designing of ICs
    • 5.1.3. Opportunities
      • 5.1.3.1. Emergence of IoT in automotiAutomotive Power Window Switchve industry
      • 5.1.3.2. Surge in demand of intelligent transportation system
    • 5.1.4. Challenges
      • 5.1.4.1. Concerns associated with shortage of ICs
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Automotive Integrated Circuit Market, by Type

  • 6.1. Introduction
  • 6.2. Analog Integrated Circuit
  • 6.3. Digital Integrated Circuit
  • 6.4. Hybrid Integrated Circuit
  • 6.5. Monolithic Integrated Circuit

7. Automotive Integrated Circuit Market, by Vehicle

  • 7.1. Introduction
  • 7.2. Commercial Vehicle
  • 7.3. Passenger Vehicle

8. Automotive Integrated Circuit Market, by Application

  • 8.1. Introduction
  • 8.2. Advance Driver Assistance System
  • 8.3. Engine Management
  • 8.4. In-Vehicle Networking
  • 8.5. Transmission Control System

9. Americas Automotive Integrated Circuit Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Automotive Integrated Circuit Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Automotive Integrated Circuit Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Infineon Technologies AG
  • 2. Intel Corporation
  • 3. KEC corporation
  • 4. Microchip Technology Inc.
  • 5. NXP Semiconductors N.V.
  • 6. OmniVision Technologies Inc.
  • 7. Renesas Electronics Corporation
  • 8. Robert Bosch GmbH
  • 9. Rohm Semiconductor
  • 10. Samsung Group
  • 11. Semiconductor Components Industries, LLC
  • 12. STMicroelectronics N.V.
  • 13. Texas Instruments Incorporated
  • 14. Toshiba Electronic Devices & Storage Corporation
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦