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È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå : À¯Çü, ±â¼ú, ¿ëµµº° - ¼¼°è ¿¹Ãø(2025-2030³â)

Chemical Mechanical Planarization Market by Type (CMP Consumable, CMP Equipment), Technology (Emerging, Leading Edge, More Than Moore¢¥s), Application - Global Forecast 2025-2030

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¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀåÀº 2023³â¿¡ 67¾ï 1,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú½À´Ï´Ù. 2024³â¿¡´Â 72¾ï 2,000¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, CAGR 7.78%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 113¾ï 4,000¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

È­Çбâ°èÀû Æòźȭ(CMP)´Â ¿þÀÌÆÛ Ç¥¸éÀÇ ÆòȰȭ ¹× Æòźȭ¸¦ ¼ö¹ÝÇÏ´Â ¹ÝµµÃ¼ Á¦Á¶ÀÇ Áß¿äÇÑ °øÁ¤ÀÔ´Ï´Ù. È­ÇÐÀû ¿¬¸¶¿Í ±â°èÀû ¿¬¸¶¸¦ °áÇÕÇÑ ÇÏÀ̺긮µå ±â¼ú·Î Á¤ÀǵǴ CMP´Â ÁýÀûȸ·Î(IC) Á¦Á¶¿¡ ÇÊ¿äÇÑ ³ôÀº ¼öÁØÀÇ Ç¥¸é Æòźµµ¸¦ ´Þ¼ºÇϱâ À§ÇØ ÇÊ¿äÇϸç, CMP´Â ¹ÝµµÃ¼ ¼ÒÀÚÀÇ ¹Ì¼¼È­¸¦ °¡´ÉÇÏ°Ô Çϰí ÷´Ü ÀüÀÚÁ¦Ç°¿¡ ÇʼöÀûÀÎ ´ÙÃþ ¾ÆÅ°ÅØÃ³¸¦ ¿ëÀÌÇÏ°Ô ÇÕ´Ï´Ù. CMP´Â ¸Þ¸ð¸® ¹× ·ÎÁ÷ ¼ÒÀÚÀÇ ¿þÀÌÆÛ ¿¬¸¶¸¦ Æ÷ÇÔÇÑ ´Ù¾çÇÑ ¹ÝµµÃ¼ Á¦Á¶ °øÁ¤¿¡ ÁÖ·Î »ç¿ëµÇ¸ç, 3D NAND ¹× FinFET°ú °°Àº »õ·Î¿î ±â¼ú¿¡¼­µµ Á¡Á¡ ´õ ¸¹ÀÌ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ÁÖ¿ä ÃÖÁ¾ »ç¿ë »ê¾÷¿¡´Â ÀüÀÚ, ÀÚµ¿Â÷, Åë½Å ºÐ¾ß°¡ Æ÷ÇԵǸç, µ¥ÀÌÅͼ¾ÅÍ ¹× »ç¹°ÀÎÅͳÝ(IoT) ÀåÄ¡¿¡¼­ »ç¿ë ¹üÀ§°¡ È®´ëµÇ°í ÀÖ½À´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
±âÁØ ¿¬µµ(2023³â) 67¾ï 1,000¸¸ ´Þ·¯
¿¹Ãø ¿¬µµ(2024³â) 72¾ï 2,000¸¸ ´Þ·¯
¿¹Ãø ¿¬µµ(2030³â) 113¾ï 4,000¸¸ ´Þ·¯
CAGR(%) 7.78%

½ÃÀå ¼ºÀåÀÇ ÁÖ¿ä ¿äÀÎÀº °¡ÀüÁ¦Ç° ¼ö¿ä Áõ°¡, ½º¸¶Æ®Æù º¸±Þ È®´ë, ¹ÝµµÃ¼ ±â¼ú ¹ßÀüÀÔ´Ï´Ù. ÁÖ¿ä ¿µÇâ¿äÀÎÀ¸·Î´Â ³ëµå ¹Ì¼¼È­¸¦ ÇâÇÑ ±Þ¼ÓÇÑ ±â¼ú ¹ßÀü°ú CMP°¡ Á¦°øÇÏ´Â °áÇÔ ¾ø´Â °íµµÀÇ ÆòźÇÑ Ç¥¸éÀÇ Çʿ伺À» µé ¼ö ÀÖ½À´Ï´Ù. ƯÈ÷ ÀΰøÁö´É°ú ¸Ó½Å·¯´× ¿ëµµÀÇ È®´ë´Â ÀáÀçÀûÀÎ ºñÁî´Ï½º ±âȸ·Î, AI Ĩ¿¡ ¸Â´Â Ư¼ö CMP °øÁ¤ÀÇ ±æÀ» ¿­¾îÁÖ°í ÀÖ½À´Ï´Ù. ±×·¯³ª ³ôÀº ¿î¿µ ºñ¿ë, ´Ù¾çÇÑ Àç·á¿¡¼­ ±ÕÀÏÇÑ Æòźȭ ´Þ¼ºÀÇ º¹À⼺, ½½·¯¸® Æó±â¹°·Î ÀÎÇÑ ÀáÀçÀû ȯ°æ ¿µÇâ µîÀÌ Å« Á¦¾àÀ¸·Î ÀÛ¿ëÇϰí ÀÖ½À´Ï´Ù.

¼º´É Çâ»ó, ºñ¿ë Àý°¨, »ýÅ ¹ßÀÚ±¹À» ÃÖ¼ÒÈ­Çϱâ À§ÇØ ½½·¯¸® ¹èÇÕ ¹× ÆÐµå ¼³°èÀÇ Çõ½ÅÀÌ ±â´ëµÇ°í ÀÖ½À´Ï´Ù. ȯ°æ ģȭÀûÀÎ ½½·¯¸® °³¹ß°ú ÀÚ¿ø Ȱ¿ëÀÇ ÃÖÀûÈ­´Â ¿¬±¸¿Í Çõ½ÅÀÇ ÇÙ½É ºÐ¾ßÀÔ´Ï´Ù. ¶ÇÇÑ AI¿Í ¸Ó½Å·¯´×À» »ç¿ëÇÏ¿© ¿¹Ãø À¯Áö º¸¼ö ¹× Á¤È®µµ Çâ»óÀ» À§ÇØ °øÁ¤ ¸ð´ÏÅ͸µÀ» °­È­ÇÏ´Â °ÍÀº Å« ÀáÀç·ÂÀ» °¡Áö°í ÀÖÀ¸¸ç, CMP ½ÃÀåÀº ±Þ¼ÓÇÑ ±â¼ú ¹ßÀü°ú ÁýÁßÀûÀÎ ¿¬±¸ °³¹ß ³ë·ÂÀ¸·Î Ư¡ Áö¾îÁö¸ç ¿ªµ¿ÀûÀÌ°í °æÀïÀûÀÎ »óȲÀ» ¾Ï½ÃÇÕ´Ï´Ù. ±â¾÷ÀÌ »õ·Î¿î ±âȸ¸¦ Æ÷ÂøÇϱâ À§Çؼ­´Â R&D¿¡ ´ëÇÑ Àü·«Àû ÅõÀÚ¿Í Àü ¼¼°èÀûÀ¸·Î ÁøÈ­ÇÏ´Â ±ÔÁ¦ ¹× ±â¼ú ÇÁ·¹ÀÓ¿öÅ©¿¡ ºÎÇÕÇÏ´Â Áö¼Ó °¡´ÉÇÑ °üÇàÀÌ ÇÊ¿äÇÕ´Ï´Ù.

½ÃÀå ¿ªÇÐ: ºü¸£°Ô ÁøÈ­ÇÏ´Â È­Çбâ°è Æòźȭ ½ÃÀåÀÇ ÁÖ¿ä ½ÃÀå ÀλçÀÌÆ® °ø°³

È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ÀÛ¿ë¿¡ ÀÇÇØ º¯È­Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÃÀå ¿ªÇÐÀÇ ÁøÈ­¸¦ ÀÌÇØÇÔÀ¸·Î½á ±â¾÷Àº Á¤º¸¿¡ ÀÔ°¢ÇÑ ÅõÀÚ °áÁ¤À» ³»¸®°í, Àü·«Àû ÀÇ»ç°áÁ¤À» Á¤±³È­Çϸç, »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Æ÷ÂøÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Æ®·»µå¸¦ Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª Àü¹Ý¿¡ °ÉÄ£ ´Ù¾çÇÑ ¸®½ºÅ©¸¦ ÁÙÀÏ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ±×°ÍÀÌ Á¦Á¶ ºñ¿ë ¹× ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» º¸´Ù ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
    • ¹ÝµµÃ¼ ¾÷°è ¼ö¿ä Áõ°¡
    • ¸¶ÀÌÅ©·ÎÀÏ·ºÆ®·Î´Ð½º¿ëµµ¿¡¼­ CMP »ç¿ë Áõ°¡
  • ½ÃÀå ¼ºÀå ¾ïÁ¦¿äÀÎ
    • CMP¿¡ µû¸¥ µð½Ì ¹× ºÎ½Ä ¹®Á¦
  • ½ÃÀå ±âȸ
    • ¹ÝµµÃ¼ ±â¼úÀÇ ¹Ì¼¼È­ ¹ßÀü
    • È­Çбâ°è Æòźȭ °³¹ßÀÇ ÁøÀü
  • ½ÃÀå °úÁ¦
    • CMP °øÁ¤Àº 7nm µð¹ÙÀ̽ºÀÇ »õ·Î¿î ±¸Á¶¿Í ½Å¼ÒÀçÀÇ ¿ä±¸ »çÇ×À» ÃæÁ·½ÃŰ±â ¾î·Æ½À´Ï´Ù.

Porter's Five Forces : È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀåÀ» Ž»öÇÏ´Â Àü·«Àû µµ±¸

Portre's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ½ÃÀå »óȲ°æÀï ±¸µµ¸¦ ÆÄ¾ÇÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Porter's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ Ž»öÇÒ ¼ö ÀÖ´Â ¸íÈ®ÇÑ ¹æ¹ýÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÅëÂû·ÂÀ» ÅëÇØ ±â¾÷Àº °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ µµÀüÀ» ÇÇÇϰí, º¸´Ù °­·ÂÇÑ ½ÃÀå Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : È­Çбâ°è Æòźȭ ½ÃÀåÀÇ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀο¡ ´ëÇÑ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇϸç, PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀûÀÎ À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£µµ, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¼±Á¦ÀûÀÌ°í ´Éµ¿ÀûÀÎ ÀÇ»ç°áÁ¤À» ³»¸± Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå¿¡¼­°æÀï ±¸µµ ÆÄ¾Ç

È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ °ø±Þ¾÷üÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü°ú °°Àº ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀïÀû À§Ä¡¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®Àº ½ÃÀåÀÇ ÁýÁßÈ­, ´ÜÆíÈ­ ¹× ÅëÇÕ Ãß¼¼¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖÀ¸¸ç, °ø±Þ¾÷ü´Â Ä¡¿­ÇÑ °æÀï ¼Ó¿¡¼­ ÀÚ½ÅÀÇ ÀÔÁö¸¦ °­È­ÇÒ ¼ö ÀÖ´Â Àü·«Àû ÀÇ»ç°áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ ÅëÂû·ÂÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå¿¡¼­ÀÇ º¥´õ ¼º´É Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº º¥´õÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±â¹ÝÀ¸·Î º¥´õ¸¦ Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ºÎÇÕÇÏ´Â Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖÀ¸¸ç, 4°³ÀÇ »çºÐ¸éÀ¸·Î º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ¼¼ºÐÈ­ÇÏ¿© Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù. Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× Ãßõ È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå¿¡¼­ ¼º°øÀÇ ±æÀ» ±×¸®´Â Àü·« ºÐ¼® ¹× Ãßõ

È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ ÀÔÁö¸¦ °­È­ÇϰíÀÚ ÇÏ´Â ±â¾÷¿¡°Ô ÇʼöÀûÀÔ´Ï´Ù. ÁÖ¿ä ÀÚ¿ø, ¿ª·® ¹× ¼º°ú ÁöÇ¥¸¦ °ËÅäÇÔÀ¸·Î½á ±â¾÷Àº ¼ºÀå ±âȸ¸¦ ½Äº°ÇÏ°í °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀ» ÅëÇØ ±â¾÷Àº °æÀï ȯ°æÀÇ µµÀüÀ» ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö ÀÖµµ·Ï ÁغñÇÒ ¼ö ÀÖ½À´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀå¿¡ ´ëÇÑ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõµµ : ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

2. ½ÃÀå °³Ã´µµ: ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù°¢È­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä ¹ßÀü, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ÀÇ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú ¹ßÀü µîÀ» °ËÅäÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÷´Ü ±â¼ú, ¿¬±¸ °³¹ß Ȱµ¿ ¹× Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

¶ÇÇÑ ÀÌÇØ°ü°èÀÚµéÀÌ Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸®´Â µ¥ µµ¿òÀÌ µÇ´Â Áß¿äÇÑ Áú¹®¿¡ ´ëÇÑ ´äº¯µµ Á¦°øÇÕ´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå Àü¸ÁÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹®, Áö¿ªÀº?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õÀÇ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

5.º¥´õ ½ÃÀå ÁøÀÔ ¹× ö¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÍ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

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  • Emerging
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  • More Than Moore's

Á¦8Àå È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå : ¿ëµµº°

  • ÁýÀûȸ·Î
  • MEMS ¹× NEMS
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Á¦9Àå ¾Æ¸Þ¸®Ä«ÀÇ È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå

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Á¦10Àå ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ È­ÇÐ ±â°è Æòźȭ(CMP) ½ÃÀå

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  • Air Products and Chemicals, Inc.
  • Applied Materials, Inc.
  • BASF SE
  • Cabot Corporation
  • DuPont de Nemours, Inc.
  • Ebara Technologies, Inc.
  • Entegris Inc.
  • FUJIMI CORPORATION
  • HORIBA, Ltd.
  • Kemet International Ltd.
  • Lam Research Corporation
  • Lapmaster Wolters GmbH
  • Logitech Ltd. by Logitech International SA
  • Merck KGaA
  • MKS Instruments, Inc.
  • Okamoto Machine Tool Works, Ltd.
  • Saint-Gobain S.A.
  • Showa Denko Materials Co., Ltd. by Hitachi, Ltd.
  • Tokyo Seimitsu Co., Ltd.
LSH.

The Chemical Mechanical Planarization Market was valued at USD 6.71 billion in 2023, expected to reach USD 7.22 billion in 2024, and is projected to grow at a CAGR of 7.78%, to USD 11.34 billion by 2030.

Chemical Mechanical Planarization (CMP) is a crucial process in semiconductor manufacturing that involves the smoothing and flattening of wafer surfaces. Defined as a hybrid technique combining chemical and mechanical polishing, CMP is necessary for achieving the high level of surface planarity required in the production of integrated circuits (ICs). It enables the miniaturization of semiconductor devices, facilitating multilayered architectures crucial for advanced electronics. CMP finds its application mainly in various semiconductor manufacturing processes, including wafer polishing for memory and logic devices, and is increasingly used in emerging technologies like 3D NAND and FinFET. Key end-use industries include electronics, automotive, and telecommunication sectors, with a growing scope in data centers and internet of things (IoT) devices.

KEY MARKET STATISTICS
Base Year [2023] USD 6.71 billion
Estimated Year [2024] USD 7.22 billion
Forecast Year [2030] USD 11.34 billion
CAGR (%) 7.78%

Market growth is primarily driven by the rising demand for consumer electronics, growing adoption of smartphones, and advancements in semiconductor technology. Key influencing factors include the rapid technological evolution towards smaller nodes and the necessity for defect-free, highly planar surfaces which CMP provides. Notably, the expansion of artificial intelligence and machine learning applications poses potential opportunities, presenting an avenue for specialized CMP processes tailored to AI chips. However, challenges such as high operational costs, complexity in achieving uniform planarization across various materials, and potential environmental impact through slurry waste pose significant limitations.

Innovations are anticipated in slurry formulations and pad designs to improve performance, reduce costs, and minimize ecological footprints. Developing eco-friendly slurry and optimizing the use of resources are significant areas for research and innovation. Additionally, enhancing process monitoring using AI and machine learning for predictive maintenance and precision improvement offers great potential. The CMP market is characterized by rapid technological advancements and intensive research and development efforts, suggesting a dynamic and competitive landscape. For businesses, capturing the emerging opportunities will require strategic investments in R&D and sustainable practices that can align with the evolving regulatory and technological frameworks globally.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Chemical Mechanical Planarization Market

The Chemical Mechanical Planarization Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Rising demand from the semiconductor industry
    • Increased use of CMP in microelectronics applications
  • Market Restraints
    • Dishing and corrosion issues associated with CMP
  • Market Opportunities
    • Advancement in miniaturization semiconductor technology
    • Growing advancements in the development of chemical mechanical planarization
  • Market Challenges
    • CMP processes difficulties in meeting requirements of new structures and materials in 7nm devices

Porter's Five Forces: A Strategic Tool for Navigating the Chemical Mechanical Planarization Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Chemical Mechanical Planarization Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Chemical Mechanical Planarization Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Chemical Mechanical Planarization Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Chemical Mechanical Planarization Market

A detailed market share analysis in the Chemical Mechanical Planarization Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Chemical Mechanical Planarization Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Chemical Mechanical Planarization Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Chemical Mechanical Planarization Market

A strategic analysis of the Chemical Mechanical Planarization Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Chemical Mechanical Planarization Market, highlighting leading vendors and their innovative profiles. These include Air Products and Chemicals, Inc., Applied Materials, Inc., BASF SE, Cabot Corporation, DuPont de Nemours, Inc., Ebara Technologies, Inc., Entegris Inc., FUJIMI CORPORATION, HORIBA, Ltd., Kemet International Ltd., Lam Research Corporation, Lapmaster Wolters GmbH, Logitech Ltd. by Logitech International SA, Merck KGaA, MKS Instruments, Inc., Okamoto Machine Tool Works, Ltd., Saint-Gobain S.A., Showa Denko Materials Co., Ltd. by Hitachi, Ltd., and Tokyo Seimitsu Co., Ltd..

Market Segmentation & Coverage

This research report categorizes the Chemical Mechanical Planarization Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across CMP Consumable and CMP Equipment. The CMP Consumable is further studied across PAD, PAD Conditioner, and Slurry.
  • Based on Technology, market is studied across Emerging, Leading Edge, and More Than Moore's.
  • Based on Application, market is studied across Integrated Circuits, MEMS & NEMS, and Optics.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising demand from the semiconductor industry
      • 5.1.1.2. Increased use of CMP in microelectronics applications
    • 5.1.2. Restraints
      • 5.1.2.1. Dishing and corrosion issues associated with CMP
    • 5.1.3. Opportunities
      • 5.1.3.1. Advancement in miniaturization semiconductor technology
      • 5.1.3.2. Growing advancements in the development of chemical mechanical planarization
    • 5.1.4. Challenges
      • 5.1.4.1. CMP processes difficulties in meeting requirements of new structures and materials in 7nm devices
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Chemical Mechanical Planarization Market, by Type

  • 6.1. Introduction
  • 6.2. CMP Consumable
    • 6.2.1. PAD
    • 6.2.2. PAD Conditioner
    • 6.2.3. Slurry
  • 6.3. CMP Equipment

7. Chemical Mechanical Planarization Market, by Technology

  • 7.1. Introduction
  • 7.2. Emerging
  • 7.3. Leading Edge
  • 7.4. More Than Moore's

8. Chemical Mechanical Planarization Market, by Application

  • 8.1. Introduction
  • 8.2. Integrated Circuits
  • 8.3. MEMS & NEMS
  • 8.4. Optics

9. Americas Chemical Mechanical Planarization Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Chemical Mechanical Planarization Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Chemical Mechanical Planarization Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Air Products and Chemicals, Inc.
  • 2. Applied Materials, Inc.
  • 3. BASF SE
  • 4. Cabot Corporation
  • 5. DuPont de Nemours, Inc.
  • 6. Ebara Technologies, Inc.
  • 7. Entegris Inc.
  • 8. FUJIMI CORPORATION
  • 9. HORIBA, Ltd.
  • 10. Kemet International Ltd.
  • 11. Lam Research Corporation
  • 12. Lapmaster Wolters GmbH
  • 13. Logitech Ltd. by Logitech International SA
  • 14. Merck KGaA
  • 15. MKS Instruments, Inc.
  • 16. Okamoto Machine Tool Works, Ltd.
  • 17. Saint-Gobain S.A.
  • 18. Showa Denko Materials Co., Ltd. by Hitachi, Ltd.
  • 19. Tokyo Seimitsu Co., Ltd.
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