성형 회로 부품 시장 : 제품 유형, 공정, 산업별 - 세계 예측(2025-2030년)

The Molded Interconnect Device Market was valued at USD 2.44 billion in 2023, expected to reach USD 2.78 billion in 2024, and is projected to grow at a CAGR of 14.33%, to USD 6.24 billion by 2030.

Molded Interconnect Devices (MIDs) represent an innovative technology that integrates electrical and mechanical functions in a single package, using 3D injection-molded circuit carriers. The necessity for MIDs arises from the growing demand for miniaturization, increased functionality, and enhanced performance in various applications such as consumer electronics, automotive, medical devices, and telecommunications. By combining circuitry and housing into a single component, MIDs reduce space, weight, and assembly costs. The end-use scope of MIDs spans multiple industries, where they serve in applications ranging from LED packages to antennas and sensor assemblies. Key market growth factors include the rising trend toward miniaturization, increasing demand for efficient electronic devices, and advancements in 3D circuit printing technologies. Opportunities in the MID market are significantly influenced by the increasing adoption in automotive electronics, where the integration of MIDs can aid in seamless connectivity and enhanced vehicle functionalities. As automotive technologies evolve towards electric and autonomous vehicles, MIDs stand to gain as essential components. However, the market faces limitations such as high initial manufacturing costs, lack of standardized manufacturing processes, and technical challenges in integrating complex electrical components. To overcome these hurdles, businesses should focus on areas like developing cost-effective 3D circuit printing methods and improving material performance for better thermal management. Moreover, collaborations and partnerships with R&D institutions for innovation in polymer materials could propel new MID capabilities. Insight into the MID market nature reveals a moderately competitive landscape, with key players focusing on strategic expansions, mergers, and technology innovations to maintain a competitive edge. To capitalize on growth avenues, firms should amplify their focus on emerging markets and invest in advanced manufacturing technologies, enabling the production of more complex MID structures that cater to diverse, evolving customer demands.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Molded Interconnect Device Market

The Molded Interconnect Device Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Rising need in healthcare and consumer electronics industry
  • Wide applications in automotive industry
  • High use of laser direct structuring
• Market Restraints
  • Concerns pertaining to raw materials cost
• Market Opportunities
  • Technological advancements in molded interconnect devices
  • Investments in expanding IIoT ecosystem
• Market Challenges
  • Incompatibility issues of molded interconnect devices

Porter's Five Forces: A Strategic Tool for Navigating the Molded Interconnect Device Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Molded Interconnect Device Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Molded Interconnect Device Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Molded Interconnect Device Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Molded Interconnect Device Market

A detailed market share analysis in the Molded Interconnect Device Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Molded Interconnect Device Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Molded Interconnect Device Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Molded Interconnect Device Market

A strategic analysis of the Molded Interconnect Device Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Molded Interconnect Device Market, highlighting leading vendors and their innovative profiles. These include Amphenol Corporation, Arlington Plating Company, GALTRONICS Corporation Limited, Harting Group, KYOCERA AVX Components Corporation, LPKF Laser & Electronics SE, MID Solutions GmbH, Molex LLC, RTP Company, SUZHOU CICOR TECHNOLOGY CO. LTD, Taoglas, TE Connectivity, Teprosa GmbH, Tongda Group, and Yomura Technologies Inc..

Market Segmentation & Coverage

This research report categorizes the Molded Interconnect Device Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Product Type, market is studied across Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems, and Sensors.
• Based on Process, market is studied across Film Techniques, Laser Direct Structuring, and Two-Shot Molding.
• Based on Vertical, market is studied across Automotive, Consumer Electronics, Industrial, Medical, Military & Aerospace, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Rising need in healthcare and consumer electronics industry
    • 5.1.1.2. Wide applications in automotive industry
    • 5.1.1.3. High use of laser direct structuring
  • 5.1.2. Restraints
    • 5.1.2.1. Concerns pertaining to raw materials cost
  • 5.1.3. Opportunities
    • 5.1.3.1. Technological advancements in molded interconnect devices
    • 5.1.3.2. Investments in expanding IIoT ecosystem
  • 5.1.4. Challenges
    • 5.1.4.1. Incompatibility issues of molded interconnect devices
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Molded Interconnect Device Market, by Product Type

• 6.1. Introduction
• 6.2. Antennae & Connectivity Modules
• 6.3. Connectors & Switches
• 6.4. Lighting Systems
• 6.5. Sensors

7. Molded Interconnect Device Market, by Process

• 7.1. Introduction
• 7.2. Film Techniques
• 7.3. Laser Direct Structuring
• 7.4. Two-Shot Molding

8. Molded Interconnect Device Market, by Vertical

• 8.1. Introduction
• 8.2. Automotive
• 8.3. Consumer Electronics
• 8.4. Industrial
• 8.5. Medical
• 8.6. Military & Aerospace
• 8.7. Telecommunications

9. Americas Molded Interconnect Device Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Molded Interconnect Device Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Molded Interconnect Device Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Amphenol Corporation
• 2. Arlington Plating Company
• 3. GALTRONICS Corporation Limited
• 4. Harting Group
• 5. KYOCERA AVX Components Corporation
• 6. LPKF Laser & Electronics SE
• 7. MID Solutions GmbH
• 8. Molex LLC
• 9. RTP Company
• 10. SUZHOU CICOR TECHNOLOGY CO. LTD
• 11. Taoglas
• 12. TE Connectivity
• 13. Teprosa GmbH
• 14. Tongda Group
• 15. Yomura Technologies Inc.