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Integrated Passive Devices Market by Material (Glass-based IPD, Silicon-based IPD), Device Type (Baluns, Couplers, Diplexers), Application - Global Forecast 2025-2030

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Portre's Five Forces: ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀå °ø·«À» À§ÇÑ Àü·«Àû Åø

Portre's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀå °æÀï ±¸µµ¸¦ ÀÌÇØÇÏ´Â Áß¿äÇÑ ÅøÀÔ´Ï´Ù. Portre's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ Ž»öÇÒ ¼ö ÀÖ´Â ¸íÈ®ÇÑ ¹æ¹ýÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÀλçÀÌÆ®À» ÅëÇØ ±â¾÷Àº °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ µµÀüÀ» ÇÇÇϰí, º¸´Ù °­·ÂÇÑ ½ÃÀå Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀåÀÇ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀο¡ ´ëÇÑ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇϸç, PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀûÀÎ À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£µµ, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¼±Á¦ÀûÀÌ°í ´Éµ¿ÀûÀÎ ÀÇ»ç°áÁ¤À» ³»¸± Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀå¿¡¼­ °æÀï ±¸µµ ÆÄ¾Ç

ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ º¥´õÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¸ÅÃâ, °í°´ ±â¹Ý, ¼ºÀå·ü°ú °°Àº ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀïÀû À§Ä¡¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®Àº ½ÃÀåÀÇ ÁýÁßÈ­, ´ÜÆíÈ­, ÅëÇÕÀÇ Ãß¼¼¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖÀ¸¸ç, °ø±Þ¾÷ü´Â Ä¡¿­ÇÑ °æÀï ¼Ó¿¡¼­ ÀÚ½ÅÀÇ ÀÔÁö¸¦ °­È­ÇÒ ¼ö ÀÖ´Â Àü·«Àû ÀÇ»ç°áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ ÀλçÀÌÆ®À» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º ÅëÇÕ ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀå¿¡¼­ º¥´õÀÇ ½ÇÀû Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÏ´Â Áß¿äÇÑ ÅøÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº º¥´õÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±â¹ÝÀ¸·Î Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ºÎÇÕÇÏ´Â Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖÀ¸¸ç, 4°³ÀÇ »çºÐ¸éÀ¸·Î º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ¼¼ºÐÈ­ÇÏ¿© Àü·«Àû¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù. Àü·«Àû¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖ½À´Ï´Ù.

ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀå¿¡¼­ ¼º°øÇϱâ À§ÇÑ Àü·« ºÐ¼® ¹× ±ÇÀå »çÇ×

ÁýÀû ÆÐ½Ãºê µð¹ÙÀ̽º ½ÃÀå Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ ÀÔÁö¸¦ °­È­ÇϰíÀÚ ÇÏ´Â ±â¾÷¿¡°Ô ÇʼöÀûÀÔ´Ï´Ù. ÁÖ¿ä ÀÚ¿ø, ¿ª·® ¹× ¼º°ú ÁöÇ¥¸¦ °ËÅäÇÔÀ¸·Î½á ±â¾÷Àº ¼ºÀå ±âȸ¸¦ ½Äº°ÇÏ°í °³¼±ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀº °æÀï ȯ°æÀÇ °úÁ¦¸¦ ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö Àִ ü°è¸¦ ±¸ÃàÇÒ ¼ö ÀÖµµ·Ï µµ¿ÍÁÝ´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀå¿¡ ´ëÇÑ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù. :

1. ½ÃÀå ħÅõµµ : ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

2. ½ÃÀå °³Ã´µµ: ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù°¢È­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä ¹ßÀü, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ÀÇ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú ¹ßÀü µîÀ» °ËÅäÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÷´Ü ±â¼ú, ¿¬±¸°³¹ß Ȱµ¿ ¹× Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

ÀÌÇØ°ü°èÀÚµéÀÌ ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖµµ·Ï ´ÙÀ½°ú °°Àº Áß¿äÇÑ Áú¹®¿¡ ´ëÇÑ ´äº¯µµ Á¦°øÇÕ´Ï´Ù. :

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå Àü¸ÁÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹®, Áö¿ªÀº?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

5.º¥´õ ½ÃÀå ÁøÀÔ ¹× ö¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÔ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

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  • 3D Glass Solutions
  • Advanced Furnace Systems Corp.
  • Amkor Technology, Inc.,
  • Ansys Canada Ltd.
  • Broadcom Inc.
  • Cadence Design Systems, Inc.
  • CTS Corporation
  • JCET Group Co., Ltd.
  • Johanson Technology
  • Knowles group
  • LLC 3DiS Technologies.
  • MACOM Technology Solutions Inc
  • Murata Manufacturing Co., Ltd
  • NXP B.V
  • ON Semiconductor Corporation
  • Semiconductor Components Industries, LLC
  • SGS-Thomson Microelectronics N.V.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Company Limited
  • Taiyo Yuden Co., Ltd.
  • Texas Instruments Incorporated
  • Vishay Intertechnology, Inc.
KSA 24.12.03

The Integrated Passive Devices Market was valued at USD 1.79 billion in 2023, expected to reach USD 1.95 billion in 2024, and is projected to grow at a CAGR of 9.30%, to USD 3.34 billion by 2030.

Integrated Passive Devices (IPDs) represent a crucial component in modern electronics, incorporating resistors, capacitors, and inductors into a single, efficient microchip. IPDs are essential for miniaturization, improving device performance while reducing space and production costs. Their application spans various sectors, including automotive, telecommunications, healthcare, and consumer electronics, where they enhance functionalities like signal filtering, impedance matching, and RF circuit integration. The demand for IPDs is driven by trends like the rise of 5G technology, IoT expansion, and the growing demand for portable and wearable devices, positioning them as critical components for advanced technological solutions. Market growth is influenced positively by the ongoing push for smaller, energy-efficient devices and the burgeoning demand for semiconductors. However, challenges such as high initial development costs, technological complexities, and competitive pressure from standard discrete components present notable barriers. Furthermore, the specialized manufacturing processes required for IPDs can limit market entry for new players. Opportunities in the market include expanding into emerging markets, where infrastructure development can catalyze demand, and investing in research to improve device efficiency and functionality to meet emerging technological trends. Working on developing new applications in biomedical devices or enhancing the capabilities of IPDs in 5G communications represents viable paths for innovation. Continuous investment in R&D for faster synthesis methods and advanced materials may address existing limitations, helping companies differentiate their products. Additionally, partnerships with semiconductor manufacturers and telecom firms to create tailor-made solutions for specific industrial applications can be strategic. The nature of the IPD market is dynamic, characterized by rapid technological advancement, which necessitates agility and proactive innovation to maintain competitive advantages and seize emerging business opportunities effectively.

KEY MARKET STATISTICS
Base Year [2023] USD 1.79 billion
Estimated Year [2024] USD 1.95 billion
Forecast Year [2030] USD 3.34 billion
CAGR (%) 9.30%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Integrated Passive Devices Market

The Integrated Passive Devices Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increased adoption of smartphone and portable device across the globe
    • Growing utilization of integrated passives in micromodule SIPs
    • Upsurge in demand for integrated passive devices from automotive industry
  • Market Restraints
    • High cost associated with developing and integrating integrated passive devices
  • Market Opportunities
    • Rising trends towards miniaturization of devices with enhanced performance
    • Technological advancements in semiconductor technologies and integrated passive devices
  • Market Challenges
    • Long cycle time for designing products with complex manufacturing procedure

Porter's Five Forces: A Strategic Tool for Navigating the Integrated Passive Devices Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Integrated Passive Devices Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Integrated Passive Devices Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Integrated Passive Devices Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Integrated Passive Devices Market

A detailed market share analysis in the Integrated Passive Devices Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Integrated Passive Devices Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Integrated Passive Devices Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Integrated Passive Devices Market

A strategic analysis of the Integrated Passive Devices Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Integrated Passive Devices Market, highlighting leading vendors and their innovative profiles. These include 3D Glass Solutions, Advanced Furnace Systems Corp., Amkor Technology, Inc.,, Ansys Canada Ltd., Broadcom Inc., Cadence Design Systems, Inc., CTS Corporation, JCET Group Co., Ltd., Johanson Technology, Knowles group, LLC 3DiS Technologies., MACOM Technology Solutions Inc, Murata Manufacturing Co., Ltd, NXP B.V, ON Semiconductor Corporation, Semiconductor Components Industries, LLC, SGS-Thomson Microelectronics N.V., STMicroelectronics NV, Taiwan Semiconductor Manufacturing Company Limited, Taiyo Yuden Co., Ltd., Texas Instruments Incorporated, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Integrated Passive Devices Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Material, market is studied across Glass-based IPD and Silicon-based IPD.
  • Based on Device Type, market is studied across Baluns, Couplers, Diplexers, Filters, and Resonators.
  • Based on Application, market is studied across Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increased adoption of smartphone and portable device across the globe
      • 5.1.1.2. Growing utilization of integrated passives in micromodule SIPs
      • 5.1.1.3. Upsurge in demand for integrated passive devices from automotive industry
    • 5.1.2. Restraints
      • 5.1.2.1. High cost associated with developing and integrating integrated passive devices
    • 5.1.3. Opportunities
      • 5.1.3.1. Rising trends towards miniaturization of devices with enhanced performance
      • 5.1.3.2. Technological advancements in semiconductor technologies and integrated passive devices
    • 5.1.4. Challenges
      • 5.1.4.1. Long cycle time for designing products with complex manufacturing procedure
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Material: Growing adoption of silicon-based IPD in applications demanding miniaturization
    • 5.2.2. Application: Upsurge in demand for smaller and more efficient consumer electronics demand integrated passive devices
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Integrated Passive Devices Market, by Material

  • 6.1. Introduction
  • 6.2. Glass-based IPD
  • 6.3. Silicon-based IPD

7. Integrated Passive Devices Market, by Device Type

  • 7.1. Introduction
  • 7.2. Baluns
  • 7.3. Couplers
  • 7.4. Diplexers
  • 7.5. Filters
  • 7.6. Resonators

8. Integrated Passive Devices Market, by Application

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Consumer Electronics
  • 8.4. Healthcare
  • 8.5. Industrial
  • 8.6. Telecommunications

9. Americas Integrated Passive Devices Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Integrated Passive Devices Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Integrated Passive Devices Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. X-FAB Silicon Foundries Enhances IPD Fabrication for Next-Gen Communication Needs, Emphasizing Cost and Space Efficiency
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. 3D Glass Solutions
  • 2. Advanced Furnace Systems Corp.
  • 3. Amkor Technology, Inc.,
  • 4. Ansys Canada Ltd.
  • 5. Broadcom Inc.
  • 6. Cadence Design Systems, Inc.
  • 7. CTS Corporation
  • 8. JCET Group Co., Ltd.
  • 9. Johanson Technology
  • 10. Knowles group
  • 11. LLC 3DiS Technologies.
  • 12. MACOM Technology Solutions Inc
  • 13. Murata Manufacturing Co., Ltd
  • 14. NXP B.V
  • 15. ON Semiconductor Corporation
  • 16. Semiconductor Components Industries, LLC
  • 17. SGS-Thomson Microelectronics N.V.
  • 18. STMicroelectronics NV
  • 19. Taiwan Semiconductor Manufacturing Company Limited
  • 20. Taiyo Yuden Co., Ltd.
  • 21. Texas Instruments Incorporated
  • 22. Vishay Intertechnology, Inc.
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