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EMI Â÷Æó ½ÃÀå : Àç·á, ¹æ¹ý, »ê¾÷º° - ¼¼°è ¿¹Ãø(2025-2030³â)

EMI Shielding Market by Material (Conductive Coatings & Paints, Conductive Polymers, EMI & EMC Filters), Method (Conduction, Radiation), Industry - Global Forecast 2025-2030

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EMI Â÷Æó ½ÃÀåÀÇ 2023³â ±Ô¸ð´Â 79¾ï 2,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú½À´Ï´Ù. 2024³â¿¡´Â 83¾ï 8,000¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, CAGR 6.48%·Î ¼ºÀåÀ» Áö¼ÓÇÏ¿© 2030³â¿¡´Â 123¾ï ´Þ·¯¿¡ ´ÞÇÒ Àü¸ÁÀÔ´Ï´Ù.

ÀüÀڱ⠰£¼·(EMI) Â÷Æó´Â ÀÛµ¿À» ¹æÇØÇϰųª ¼º´ÉÀ» ÀúÇϽÃŰ´Â ¿øÄ¡ ¾Ê´Â ÀüÀÚÆÄ·ÎºÎÅÍ ÀüÀÚ±â±â¸¦ º¸È£ÇÏ´Â µ¥ Áß¿äÇÕ´Ï´Ù. À̸¦ À§Çؼ­´Â ÀüÀڱ⠽ÅÈ£¸¦ Â÷´ÜÇϰųª Èí¼öÇÏ´Â Àç·á¿Í ÄÚÆÃÀ» »ç¿ëÇØ¾ß ÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Çʿ伺Àº °¡Àü, ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ, Åë½Å, ÀÇ·á »ê¾÷ µî ÀåÄ¡ÀÇ ½Å·Ú¼º°ú ¼º´ÉÀÌ ÃÖ¿ì¼± ¼øÀ§ÀÎ ´Ù¾çÇÑ ºÐ¾ß¿¡¼­ ¹ß»ýÇϰí ÀÖÀ¸¸ç, EMI Â÷ÆóÀÇ Àû¿ë ºÐ¾ß¿¡´Â ½º¸¶Æ®Æù, ³ëÆ®ºÏ, ÀÚµ¿Â÷¿ë ÀÏ·ºÆ®·Î´Ð½º, ÀÇ·á±â±â, Åë½Å Àåºñ¿Í °°Àº ¹Î°¨ÇÑ ºÎǰÀÇ º¸È£°¡ Æ÷ÇԵ˴ϴÙ. Æ÷ÇԵ˴ϴÙ. ½ÃÀå ¹üÀ§´Â ÀüÀÚ±â ȣȯ¼º(EMC) ¹× ÀüÀÚÆÄ ¾ÈÀü¼ºÀ» Àǹ«È­ÇÏ´Â ±ÔÁ¦ Ç¥ÁØÀ» ÁؼöÇÏ´Â °Í±îÁö ±¤¹üÀ§ÇÏ°Ô È®ÀåµÇ°í ÀÖ½À´Ï´Ù. ½ÃÀåÀÇ ÁÖ¿ä ¿øµ¿·ÂÀº ¼ÒºñÀÚ ÀüÀÚÁ¦Ç°ÀÇ º¸±Þ°ú ÷´Ü Â÷·®¿ë ÀüÀÚÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡, ±×¸®°í ÇコÄÉ¾î ºÐ¾ß¿¡¼­ÀÇ ÀüÀÚÁ¦Ç° »ç¿ë Áõ°¡¿¡ µû¸¥ °ÍÀÔ´Ï´Ù. ±×·¯³ª ÷´Ü ¼ÒÀç¿Í ±â¼úÀ» µµÀÔÇÏ´Â µ¥ µå´Â ºñ¿ëÀÌ ³ô´Ù´Â Á¦¾àÀÌ ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ±â¼ú Çõ½ÅÀÇ ºü¸¥ ¼Óµµ·Î ÀÎÇØ ÇöÀçÀÇ ¼Ö·ç¼ÇÀÌ ºü¸£°Ô ³ëÈÄÈ­µÉ ¼ö ÀÖ´Ù´Â Á¡µµ ÀáÀçÀûÀÎ µµÀüÀÌ µÇ°í ÀÖ½À´Ï´Ù. »ç¹°ÀÎÅͳÝ(IoT) ¹× 5G ±â¼ú°ú °°Àº »õ·Î¿î Æ®·»µå¿¡ ´ëÀÀÇÒ ¼ö ÀÖ´Â ºñ¿ë È¿À²ÀûÀ̰í, °¡º±°í, À¯¿¬ÇÑ EMI Â÷Æó ¼Ö·ç¼ÇÀ» °³¹ßÇÒ ¼ö ÀÖ´Â ±âȸ°¡ ÀÖ½À´Ï´Ù. ±â¾÷µéÀº ³ª³ë±â¼ú, Àüµµ¼º Æú¸®¸Ó ¹× º¹ÇÕÀç·áÀÇ Çõ½ÅÀ» Ȱ¿ëÇÏ¿© °í¼º´É Â÷Æó ¼Ö·ç¼ÇÀ» µµÀÔÇÒ ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ Áö¼Ó °¡´ÉÇϰí ģȯ°æÀûÀÎ ¼ÒÀç¿¡ ´ëÇÑ ¿¬±¸µµ °æÀï·ÂÀ» ³ôÀÏ ¼ö ÀÖ½À´Ï´Ù. ½ÃÀåÀÌ ÀüÀÚÁ¦Ç°ÀÇ ¼ÒÇüÈ­, °íÁýÀûÈ­¸¦ ÃßÁøÇÔ¿¡ µû¶ó EMI Â÷ÆóÀÇ ¼º´É ÀúÇÏ ¾øÀÌ ¼ÒÇüÈ­, °æ·®È­¸¦ ½ÇÇöÇÏ´Â °ÍÀº ¸Å¿ì Áß¿äÇÑ Çõ½Å ºÐ¾ß°¡ µÉ °ÍÀ̸ç, EMI Â÷Æó ½ÃÀåÀÇ Æ¯¼ºÀº ¿ªµ¿ÀûÀÌ°í °æÀïÀÌ Ä¡¿­ÇÏ¸ç ±â¼ú ¹ßÀüÀÌ ºü¸£°Ô ÁøÇàµÇ°í ÀÖ½À´Ï´Ù. ±â¾÷Àº ½ÃÀå Á¡À¯À²À» È®º¸Çϰí È®´ëÇϱâ À§ÇØ ²÷ÀÓ¾øÀÌ Çõ½ÅÇϰí ÁøÈ­ÇÏ´Â »óȲ¿¡ ÀûÀÀÇÏ¿© Á¦Ç°ÀÌ »õ·Î¿î Ç¥Áذú ¼ÒºñÀÚ ¿ä±¸¸¦ ÃæÁ·½Ãų ¼ö ÀÖµµ·Ï ²÷ÀÓ¾øÀÌ Çõ½ÅÇØ¾ß ÇÕ´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
±âÁØ ¿¬µµ(2023³â) 79¾ï 2,000¸¸ ´Þ·¯
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¿¹Ãø ¿¬µµ(2030³â) 123¾ï ´Þ·¯
CAGR(%) 6.48%

½ÃÀå ¿ªÇÐ: ºü¸£°Ô ÁøÈ­ÇÏ´Â EMI Â÷Æó ½ÃÀåÀÇ ÁÖ¿ä ½ÃÀå ÀλçÀÌÆ® °ø°³

EMI Â÷Æó ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ÀÛ¿ë¿¡ ÀÇÇØ º¯È­Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ½ÃÀå ¿ªÇÐÀÇ ÁøÈ­¸¦ ÀÌÇØÇÔÀ¸·Î½á ±â¾÷Àº Á¤º¸¿¡ ÀÔ°¢ÇÑ ÅõÀÚ °áÁ¤À» ³»¸®°í, Àü·«Àû ÀÇ»ç°áÁ¤À» Á¤±³È­Çϸç, »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Æ÷ÂøÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Æ®·»µå¸¦ Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª Àü¹Ý¿¡ °ÉÄ£ ´Ù¾çÇÑ ¸®½ºÅ©¸¦ ÁÙÀÏ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ±×°ÍÀÌ Á¦Á¶ ºñ¿ë ¹× ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» º¸´Ù ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
    • Àü±â ¹× ÀüÀÚ ÀåºñÀÇ EMI Â÷Æó äÅà Ȯ´ë
    • ÀÚµ¿Â÷ Á¦Á¶¿¡ EMI Â÷Æó Çʸ§ Ȱ¿ë
    • ÀåºñÀÇ °íÀåÀ» ¹æÁöÇÏ°í ¾ÈÀü¼ºÀ» À¯ÁöÇϱâ À§ÇÑ ÀÇ·á±â±â¿ë EMI Â÷Æó
  • ½ÃÀå ¼ºÀå ¾ïÁ¦¿äÀÎ
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    • 5G ±â¼ú¿¡ ´ëÇÑ ÅõÀÚ È®´ë
    • EMI Â÷Æó Çʸ§ÀÇ ±â¼ú ¹ßÀü ¹× ¿¬±¸ °³¹ß
  • ½ÃÀå °úÁ¦
    • EMI Â÷ÆóÀÇ ±â¼úÀû ¹× ¿î¿µ»óÀÇ ÇѰè

Portre's Five Forces: EMI Â÷Æó ½ÃÀå Ž»öÀ» À§ÇÑ Àü·«Àû µµ±¸

Portre's Five Forces ÇÁ·¹ÀÓ¿öÅ©´Â EMI Â÷Æó ½ÃÀå °æÀï ±¸µµ¸¦ ÀÌÇØÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. PorterÀÇ 5°¡Áö Èû ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ Ž»öÇÒ ¼ö ÀÖ´Â ¸íÈ®ÇÑ ¹æ¹ýÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» ÆÇ´ÜÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÅëÂû·ÂÀ» ÅëÇØ ±â¾÷Àº °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ µµÀüÀ» ÇÇÇϰí, º¸´Ù °­·ÂÇÑ ½ÃÀå Æ÷Áö¼Å´×À» È®º¸ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : EMI Â÷Æó ½ÃÀåÀÇ ¿ÜºÎ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº EMI Â÷Æó ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇÏ´Â µ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀο¡ ´ëÇÑ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇϸç, PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀû À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£µµ, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¼±Á¦ÀûÀÌ°í ´Éµ¿ÀûÀÎ ÀÇ»ç°áÁ¤À» ³»¸± Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® EMI Â÷Æó ½ÃÀå¿¡¼­°æÀï ±¸µµ ÆÄ¾Ç

EMI Â÷Æó ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ º¥´õÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü°ú °°Àº ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀïÀû À§Ä¡¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®Àº ½ÃÀåÀÇ ÁýÁßÈ­, ´ÜÆíÈ­, ÅëÇÕÀÇ Ãß¼¼¸¦ ÆÄ¾ÇÇÒ ¼ö ÀÖÀ¸¸ç, °ø±Þ¾÷ü´Â Ä¡¿­ÇÑ °æÀï ¼Ó¿¡¼­ ÀÚ½ÅÀÇ ÀÔÁö¸¦ °­È­ÇÒ ¼ö ÀÖ´Â Àü·«Àû ÀÇ»ç°áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ ÅëÂû·ÂÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º EMI Â÷Æó ½ÃÀå¿¡¼­ÀÇ º¥´õ ¼º´É Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â EMI Â÷Æó ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ÀÌ ¸ÅÆ®¸¯½º¸¦ ÅëÇØ ºñÁî´Ï½º Á¶Á÷Àº º¥´õÀÇ ºñÁî´Ï½º Àü·«°ú Á¦Ç° ¸¸Á·µµ¸¦ ±â¹ÝÀ¸·Î Æò°¡ÇÏ¿© ¸ñÇ¥¿¡ ºÎÇÕÇÏ´Â Á¤º¸¿¡ ÀÔ°¢ÇÑ ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖÀ¸¸ç, 4°³ÀÇ »çºÐ¸éÀº º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ±¸ºÐÇÏ¿© »ç¿ëÀÚ°¡ Àü·«Àû ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê¿Í ¼Ö·ç¼ÇÀ» ½Äº°ÇÒ ¼ö ÀÖµµ·Ï µµ¿ÍÁÝ´Ï´Ù. ½Äº°ÇÒ ¼ö ÀÖµµ·Ï µµ¿ÍÁÝ´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â Á¾ÇÕÀûÀÎ ½ÃÀå ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõµµ : ¾÷°è ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅ͸¦ Æ÷ÇÔÇÑ ÇöÀç ½ÃÀå ȯ°æ¿¡ ´ëÇÑ »ó¼¼ÇÑ °ËÅä.

2. ½ÃÀå °³Ã´µµ: ½ÅÈï ½ÃÀå¿¡¼­ÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇϰí, ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡Çϸç, ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù°¢È­ : ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä ¹ßÀü, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ÀÇ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú ¹ßÀü µîÀ» °ËÅäÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÷´Ü ±â¼ú, ¿¬±¸ °³¹ß Ȱµ¿ ¹× Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

ÀÌÇØ°ü°èÀÚµéÀÌ ÃæºÐÇÑ Á¤º¸¸¦ ¹ÙÅÁÀ¸·Î ÀÇ»ç°áÁ¤À» ³»¸± ¼ö ÀÖµµ·Ï ´ÙÀ½°ú °°Àº Áß¿äÇÑ Áú¹®¿¡ ´ëÇÑ ´äº¯µµ Á¦°øÇÕ´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå Àü¸ÁÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹®, Áö¿ªÀº?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õÀÇ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

5.º¥´õ ½ÃÀå ÁøÀÔ ¹× ö¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÍ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

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Á¦5Àå ½ÃÀå ÀλçÀÌÆ®

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  • PESTEL ºÐ¼®
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Á¦6Àå EMI Â÷Æó ½ÃÀå : ¼ÒÀ纰

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  • Àüµµ¼º Æú¸®¸Ó
  • EMI ¹× EMC ÇÊÅÍ
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Á¦7Àå EMI Â÷Æó ½ÃÀå : ¹æ¹ýº°

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Á¦8Àå EMI Â÷Æó ½ÃÀå : ¾÷°èº°

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  • °¡Àü
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Á¦9Àå ¾Æ¸Þ¸®Ä«ÀÇ EMI Â÷Æó ½ÃÀå

  • ¾Æ¸£ÇîÆ¼³ª
  • ºê¶óÁú
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Á¦10Àå ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ EMI Â÷Æó ½ÃÀå

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Á¦11Àå À¯·´, Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ EMI Â÷Æó ½ÃÀå

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Á¦12Àå °æÀï ±¸µµ

  • ½ÃÀå Á¡À¯À² ºÐ¼®, 2023³â
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±â¾÷ ¸®½ºÆ®

  • STMicroelectronics International N.V.
  • Solvay S.A.
  • Avery Dennison Corporation
  • Toyo Ink SC Holdings Co., Ltd.
  • Panasonic Industry Co., Ltd.
  • Stockwell Elastomerics, Inc.
  • Tech Etch, Inc.
  • Jinan EMI Shielding Technology Co. Ltd.
  • Shenzhen HFC Co.,Ltd.
  • MG Chemicals
  • Bal Seal Engineering, LLC by Kaman Corp.
  • DuPont de Nemours, Inc.
  • TEXAS INSTRUMENTS INCORPORATED
  • EMP Shield Inc.
  • Lamart Corporation
  • Boyd Corporation
  • Meta Materials Inc.
  • BASF SE
  • Modus Advanced, Inc.
  • Deep Coat Industries
  • Saint-Gobain S.A.
  • Daniels Manufacturing Corporation
  • Murata Manufacturing Co., Ltd.
  • Abrisa Technologies
  • NV Bekaert SA
  • Celanese Corporation
  • Graphenest, S.A.
  • Tatsuta Electric Wire & Cable Co., Ltd.
  • Omega Shielding Products, Inc.
  • Henkel AG & Co. KGaA
  • NANOTECH ENERGY INC.
  • TE Connectivity Corporation
  • PPG Industries, Inc.
  • Parker Hannifin Corporation
  • Polycase
  • 3M Company
  • Denver Rubber Company
  • GEOMATEC Co., Ltd.
  • ETS-Lindgren Inc.
  • Guangzhou Fang Bang Electronics Co., Ltd.
  • Saudi Basic Industries Corporation
  • Huntsman Corporation
  • OIKE & Co., Ltd.
  • Holland Shielding Systems BV
  • Mitsubishi Chemical Corporation
  • RTP Company
  • MADPCB
LSH

The EMI Shielding Market was valued at USD 7.92 billion in 2023, expected to reach USD 8.38 billion in 2024, and is projected to grow at a CAGR of 6.48%, to USD 12.30 billion by 2030.

Electromagnetic interference (EMI) shielding is critical to safeguarding electronic devices from unwanted electromagnetic waves that can disrupt operations or degrade performance. It involves using materials or coatings that block or absorb electromagnetic signals. This necessity arises in various sectors, such as consumer electronics, automotive, aerospace, telecommunications, and medical industries, where device reliability and performance are paramount. The application of EMI shielding includes protecting sensitive components in smartphones, laptops, automotive electronics, medical equipment, and telecommunication devices. The market scope is broad, extending to electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards that mandate electromagnetic safety. The market is primarily driven by the increasing proliferation of consumer electronics and the growing demand for advanced automotive electronics, coupled with the rising use of electronic devices in healthcare. However, one limitation is the high cost of implementing advanced EMI shielding materials and techniques. Additionally, the rapid pace of technological change can make current solutions obsolete quickly, posing a potential challenge. Opportunities lie in the development of cost-effective, lightweight, and flexible EMI shielding solutions that cater to emerging trends like the Internet of Things (IoT) and 5G technology. Companies can capitalize on innovations in nanotechnology, conductive polymers, and composite materials to introduce high-performance shielding solutions. Research into sustainable and eco-friendly EMI shielding materials could also provide a competitive edge. As markets push towards smaller, more integrated electronic devices, miniaturization and weight reduction without sacrificing EMI shielding performance become crucial innovation areas. The nature of the EMI shielding market is dynamic, with strong competition and rapid technological advancements. Businesses must continuously innovate and adapt to the evolving landscape to capture and expand market share, ensuring their products meet emerging standards and consumer needs.

KEY MARKET STATISTICS
Base Year [2023] USD 7.92 billion
Estimated Year [2024] USD 8.38 billion
Forecast Year [2030] USD 12.30 billion
CAGR (%) 6.48%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving EMI Shielding Market

The EMI Shielding Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing adoption of EMI shielding in electrical and electronic devices
    • Utilization of EMI shielding films in automotive manufacturing
    • EMI shielding for medical devices to prevent equipment failure and maintain safety
  • Market Restraints
    • Fluctuating prices of raw materials and high cost of installation
  • Market Opportunities
    • Increasing investments in 5G technologies
    • Technological advancements and R&D in EMI shielding films
  • Market Challenges
    • Technical and operational limitations of EMI shielding

Porter's Five Forces: A Strategic Tool for Navigating the EMI Shielding Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the EMI Shielding Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the EMI Shielding Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the EMI Shielding Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the EMI Shielding Market

A detailed market share analysis in the EMI Shielding Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the EMI Shielding Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the EMI Shielding Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Key Company Profiles

The report delves into recent significant developments in the EMI Shielding Market, highlighting leading vendors and their innovative profiles. These include STMicroelectronics International N.V., Solvay S.A., Avery Dennison Corporation, Toyo Ink SC Holdings Co., Ltd., Panasonic Industry Co., Ltd., Stockwell Elastomerics, Inc., Tech Etch, Inc., Jinan EMI Shielding Technology Co. Ltd., Shenzhen HFC Co.,Ltd., MG Chemicals, Bal Seal Engineering, LLC by Kaman Corp., DuPont de Nemours, Inc., TEXAS INSTRUMENTS INCORPORATED, EMP Shield Inc., Lamart Corporation, Boyd Corporation, Meta Materials Inc., BASF SE, Modus Advanced, Inc., Deep Coat Industries, Saint-Gobain S.A., Daniels Manufacturing Corporation, Murata Manufacturing Co., Ltd., Abrisa Technologies, NV Bekaert SA, Celanese Corporation, Graphenest, S.A., Tatsuta Electric Wire & Cable Co., Ltd., Omega Shielding Products, Inc., Henkel AG & Co. KGaA, NANOTECH ENERGY INC., TE Connectivity Corporation, PPG Industries, Inc., Parker Hannifin Corporation, Polycase, 3M Company, Denver Rubber Company, GEOMATEC Co., Ltd., ETS-Lindgren Inc., Guangzhou Fang Bang Electronics Co., Ltd., Saudi Basic Industries Corporation, Huntsman Corporation, OIKE & Co., Ltd., Holland Shielding Systems BV, Mitsubishi Chemical Corporation, RTP Company, and MADPCB.

Market Segmentation & Coverage

This research report categorizes the EMI Shielding Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Material, market is studied across Conductive Coatings & Paints, Conductive Polymers, EMI & EMC Filters, and EMI Shielding Tapes & Laminates.
  • Based on Method, market is studied across Conduction and Radiation.
  • Based on Industry, market is studied across Aerospace, Automotive, Consumer Electronics, Healthcare, and Telecom & IT.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing adoption of EMI shielding in electrical and electronic devices
      • 5.1.1.2. Utilization of EMI shielding films in automotive manufacturing
      • 5.1.1.3. EMI shielding for medical devices to prevent equipment failure and maintain safety
    • 5.1.2. Restraints
      • 5.1.2.1. Fluctuating prices of raw materials and high cost of installation
    • 5.1.3. Opportunities
      • 5.1.3.1. Increasing investments in 5G technologies
      • 5.1.3.2. Technological advancements and R&D in EMI shielding films
    • 5.1.4. Challenges
      • 5.1.4.1. Technical and operational limitations of EMI shielding
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Material: EMI & EMC filters ensuring the proper functioning of electronic equipment
    • 5.2.2. Method: High utilization of conduction methods to prevent unwanted electromagnetic radiation
    • 5.2.3. Industry: Significant adoption of EMI shielding in the automotive industry
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. EMI Shielding Market, by Material

  • 6.1. Introduction
  • 6.2. Conductive Coatings & Paints
  • 6.3. Conductive Polymers
  • 6.4. EMI & EMC Filters
  • 6.5. EMI Shielding Tapes & Laminates

7. EMI Shielding Market, by Method

  • 7.1. Introduction
  • 7.2. Conduction
  • 7.3. Radiation

8. EMI Shielding Market, by Industry

  • 8.1. Introduction
  • 8.2. Aerospace
  • 8.3. Automotive
  • 8.4. Consumer Electronics
  • 8.5. Healthcare
  • 8.6. Telecom & IT

9. Americas EMI Shielding Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific EMI Shielding Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa EMI Shielding Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. JF Technology in Tie-Up for High-End Artificial Intelligence Materials
    • 12.3.2. Schurter Extends FMAB NEO Block Filter Series with New High-Performance Model
    • 12.3.3. Astrodyne TDI Proudly Announces the Grand Opening of their Cutting-Edge Manufacturing Facility in Malaysia
    • 12.3.4. Meta Materials and Panasonic Industry Collaborate on Next Generation Transparent Conductive Materials
    • 12.3.5. HydroGraph and EMP Shield to Create Next-Gen EMI Shielding
    • 12.3.6. TE Connectivity Has Pre-Announced a Public Tender Offer For Schaffner Shares
    • 12.3.7. TOYOCHEM Introduced EMI Shielding Films
    • 12.3.8. Graphenest Raises EUR 1.8 Million in Funding to Commercialize its Sustainable EMI Shielding Solutions and Scale its Proprietary CleanTech
    • 12.3.9. Partnership Targets EMI-Shielding Graphene Polymers
    • 12.3.10. Celanese Launches Nine New Conductive Inks for Consumer Applications
    • 12.3.11. Encres DUBUIT Acquires POLY-INK, Adds Conductive Inks to Portfolio
    • 12.3.12. TE Connectivity Completes Acquisition of Shielding and Sealing Specialist, Kemtron
    • 12.3.13. Tech Etch Announces Expanded Distribution Partnership in Europe

Companies Mentioned

  • 1. STMicroelectronics International N.V.
  • 2. Solvay S.A.
  • 3. Avery Dennison Corporation
  • 4. Toyo Ink SC Holdings Co., Ltd.
  • 5. Panasonic Industry Co., Ltd.
  • 6. Stockwell Elastomerics, Inc.
  • 7. Tech Etch, Inc.
  • 8. Jinan EMI Shielding Technology Co. Ltd.
  • 9. Shenzhen HFC Co.,Ltd.
  • 10. MG Chemicals
  • 11. Bal Seal Engineering, LLC by Kaman Corp.
  • 12. DuPont de Nemours, Inc.
  • 13. TEXAS INSTRUMENTS INCORPORATED
  • 14. EMP Shield Inc.
  • 15. Lamart Corporation
  • 16. Boyd Corporation
  • 17. Meta Materials Inc.
  • 18. BASF SE
  • 19. Modus Advanced, Inc.
  • 20. Deep Coat Industries
  • 21. Saint-Gobain S.A.
  • 22. Daniels Manufacturing Corporation
  • 23. Murata Manufacturing Co., Ltd.
  • 24. Abrisa Technologies
  • 25. NV Bekaert SA
  • 26. Celanese Corporation
  • 27. Graphenest, S.A.
  • 28. Tatsuta Electric Wire & Cable Co., Ltd.
  • 29. Omega Shielding Products, Inc.
  • 30. Henkel AG & Co. KGaA
  • 31. NANOTECH ENERGY INC.
  • 32. TE Connectivity Corporation
  • 33. PPG Industries, Inc.
  • 34. Parker Hannifin Corporation
  • 35. Polycase
  • 36. 3M Company
  • 37. Denver Rubber Company
  • 38. GEOMATEC Co., Ltd.
  • 39. ETS-Lindgren Inc.
  • 40. Guangzhou Fang Bang Electronics Co., Ltd.
  • 41. Saudi Basic Industries Corporation
  • 42. Huntsman Corporation
  • 43. OIKE & Co., Ltd.
  • 44. Holland Shielding Systems BV
  • 45. Mitsubishi Chemical Corporation
  • 46. RTP Company
  • 47. MADPCB
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