세계의 첨단 IC 패키징 시장 : 유형별, 용도별 - 예측(2025-2030년)

The Advanced IC Packaging Market was valued at USD 45.02 billion in 2023, expected to reach USD 48.51 billion in 2024, and is projected to grow at a CAGR of 8.26%, to USD 78.50 billion by 2030.

Advanced IC Packaging refers to the technologies used in the assembly and encapsulation of integrated circuits (ICs) that improve their performance, efficiency, and scalability. The necessity for advanced IC packaging stems from the continual demand for increased performance, reduced power consumption, and miniaturization in electronics across sectors like consumer electronics, automotive, telecommunications, and healthcare. Applications of advanced IC packaging include mobile phones, wearables, AI, IoT devices, and automotive electronics, where the demand for high reliability and robust performance under diverse conditions is critical. The end-use scope is vast, touching verticals such as cloud computing, edge devices, and semiconductor manufacturing. The market is propelled by key growth factors like the rise of 5G technology, increased use of AI, and the growth of smart devices. Furthermore, evolving consumer electronics and expanding automotive electronics markets present new growth avenues. However, challenges such as high initial costs, complex manufacturing processes, and supply chain bottlenecks pose considerable limitations. The market currently offers potential opportunities in areas such as heterogeneous integration and System-in-Package (SiP) technologies. Companies can capitalize on these opportunities by investing in R&D to enhance thermal management and electrical performance. Best areas for innovation include developing packaging solutions that offer superior electrical and thermal performance, lower power consumption, and smaller footprints. Collaborations between semiconductor manufacturers and end-user companies could also drive value creation. Globally, the market is competitive with key players constantly innovating to gain an edge. Despite the challenges, the increasing need for efficient, compact, and powerful electronics ensures ongoing growth. A strategic focus on emerging applications in AI and IoT will be crucial for market players aiming to maximize business growth in the advanced IC packaging domain.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Advanced IC Packaging Market

The Advanced IC Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Increasing demand and adoption of consumer electronic devices
  • Gowing demand for miniaturized electronic products from defense sector
  • Ongoing electrification of transportation sector across economies
• Market Restraints
  • High cost of advanced IC packaging processes
• Market Opportunities
  • Evolution and development of new advanced IC packaging solutions
  • Rising investment in semiconductor manufacturing industry
• Market Challenges
  • Reliablity, power dissipation and power usage challenges associated with advanced IC packaging

Porter's Five Forces: A Strategic Tool for Navigating the Advanced IC Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Advanced IC Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Advanced IC Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Advanced IC Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Advanced IC Packaging Market

A detailed market share analysis in the Advanced IC Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Advanced IC Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Advanced IC Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Advanced IC Packaging Market

A strategic analysis of the Advanced IC Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Advanced IC Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., ASMPT, Broadcom, Inc., Cadence Design Systems, Inc., Carsem (M) Sdn Bhd, Faraday Technology Corporation, FormFactor, Inc., Intel Corporation, Jiangsu Changdian Technology Co., Ltd., KYOCERA Corporation, Microchip Technology Inc., Micross Components, Inc., NHanced Semiconductors, Inc., NXP Semiconductors N.V., Optima Technology Associates, Inc., Pac Tech - Packaging Technologies GmbH, Powertech Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Tektronix, Inc., Texas Instruments Incorporated, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Advanced IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Type, market is studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.
• Based on Application, market is studied across Aerospace & Defense, Automotive & Transportation, Consumer Electronics, and IT & Telecom.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Increasing demand and adoption of consumer electronic devices
    • 5.1.1.2. Gowing demand for miniaturized electronic products from defense sector
    • 5.1.1.3. Ongoing electrification of transportation sector across economies
  • 5.1.2. Restraints
    • 5.1.2.1. High cost of advanced IC packaging processes
  • 5.1.3. Opportunities
    • 5.1.3.1. Evolution and development of new advanced IC packaging solutions
    • 5.1.3.2. Rising investment in semiconductor manufacturing industry
  • 5.1.4. Challenges
    • 5.1.4.1. Reliablity, power dissipation and power usage challenges associated with advanced IC packaging
• 5.2. Market Segmentation Analysis
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Advanced IC Packaging Market, by Type

• 6.1. Introduction
• 6.2. 2.5D Integrated Circuit
• 6.3. 2D Integrated Circuit
• 6.4. 3D Integrated Circuit
• 6.5. Fan Out Silicon In Package
• 6.6. Fan Out Wafer Level Package
• 6.7. Flip Chip
• 6.8. Wafer Level Chip Scale Package

7. Advanced IC Packaging Market, by Application

• 7.1. Introduction
• 7.2. Aerospace & Defense
• 7.3. Automotive & Transportation
• 7.4. Consumer Electronics
• 7.5. IT & Telecom

8. Americas Advanced IC Packaging Market

• 8.1. Introduction
• 8.2. Argentina
• 8.3. Brazil
• 8.4. Canada
• 8.5. Mexico
• 8.6. United States

9. Asia-Pacific Advanced IC Packaging Market

• 9.1. Introduction
• 9.2. Australia
• 9.3. China
• 9.4. India
• 9.5. Indonesia
• 9.6. Japan
• 9.7. Malaysia
• 9.8. Philippines
• 9.9. Singapore
• 9.10. South Korea
• 9.11. Taiwan
• 9.12. Thailand
• 9.13. Vietnam

10. Europe, Middle East & Africa Advanced IC Packaging Market

• 10.1. Introduction
• 10.2. Denmark
• 10.3. Egypt
• 10.4. Finland
• 10.5. France
• 10.6. Germany
• 10.7. Israel
• 10.8. Italy
• 10.9. Netherlands
• 10.10. Nigeria
• 10.11. Norway
• 10.12. Poland
• 10.13. Qatar
• 10.14. Russia
• 10.15. Saudi Arabia
• 10.16. South Africa
• 10.17. Spain
• 10.18. Sweden
• 10.19. Switzerland
• 10.20. Turkey
• 10.21. United Arab Emirates
• 10.22. United Kingdom

11. Competitive Landscape

• 11.1. Market Share Analysis, 2023
• 11.2. FPNV Positioning Matrix, 2023
• 11.3. Competitive Scenario Analysis
• 11.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Amkor Technology, Inc.
• 2. ASE Technology Holding Co, Ltd.
• 3. ASMPT
• 4. Broadcom, Inc.
• 5. Cadence Design Systems, Inc.
• 6. Carsem (M) Sdn Bhd
• 7. Faraday Technology Corporation
• 8. FormFactor, Inc.
• 9. Intel Corporation
• 10. Jiangsu Changdian Technology Co., Ltd.
• 11. KYOCERA Corporation
• 12. Microchip Technology Inc.
• 13. Micross Components, Inc.
• 14. NHanced Semiconductors, Inc.
• 15. NXP Semiconductors N.V.
• 16. Optima Technology Associates, Inc.
• 17. Pac Tech - Packaging Technologies GmbH
• 18. Powertech Technology Inc.
• 19. Renesas Electronics Corporation
• 20. Samsung Electronics Co., Ltd.
• 21. Taiwan Semiconductor Manufacturing Company, Ltd.
• 22. Tektronix, Inc.
• 23. Texas Instruments Incorporated
• 24. United Microelectronics Corporation