½ÃÀ庸°í¼­
»óǰÄÚµå
1621523

¼¼°èÀÇ ¹Ú¸· ¼¾¼­ ½ÃÀå : À¯Çü, Àç·á, ÃÖÁ¾ ÀÌ¿ë »ê¾÷º° ¿¹Ãø(2025-2030³â)

Thin Film Sensor Market by Type (Pressure Sensors, RTD/Temperature Sensors), Material (Copper, Nickel & Nickel/Iron Alloy, Platinum), End use Industry - Global Forecast 2025-2030

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: 360iResearch | ÆäÀÌÁö Á¤º¸: ¿µ¹® 197 Pages | ¹è¼Û¾È³» : 1-2ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡á º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼ÛÀÏÁ¤Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

¹Ú¸· ¼¾¼­ ½ÃÀåÀÇ 2023³â ½ÃÀå ±Ô¸ð´Â 50¾ï 4,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú½À´Ï´Ù. 2024³â¿¡´Â 53¾ï 5,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, CAGR 6.46%·Î ¼ºÀåÇØ 2030³â¿¡´Â 78¾ï 1,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¹Ú¸· ¼¾¼­´Â ¹Ì½ÃÀûÀ¸·Î ¾ãÀº Àç·áÃþÀ¸·Î ±¸¼ºµÈ ¹Ú¸· ±â¼úÀ» ÀÌ¿ëÇÏ¿© ¿Âµµ³ª ¾Ð·Â µîÀÇ ¹°¸®·®À» ÃøÁ¤ÇÏ´Â ÀåÄ¡ÀÔ´Ï´Ù. ÀÌ·¯ÇÑ ¹ßÀüÀº ÁÖ·Î ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ, ÀÇ·á, ¼ÒºñÀÚ¿ë ÀüÀÚ±â±â ºÐ¾ß¿¡¼­ ÀÌ¿ëµÇ°í ÀÖ½À´Ï´Ù. Ç×°ø¿ìÁÖ ÀÀ¿ë ºÐ¾ß¿¡¼­´Â ȯ°æ Á¶°Ç ¸ð´ÏÅ͸µ¿¡ Á¤È®¼ºÀÌ µµ¿òÀÌ µË´Ï´Ù. »ý»ê·® Áõ°¡¿Í ¿þ¾î·¯ºí Çコ ±â¼úÀÇ ÀÌ¿ë È®´ë´Â ¼¾¼­ °³¹ßÀÚ³ª Á¦Á¶¾÷ü¿¡°Ô Å« ºñÁî´Ï½º ±âȸ¸¦ °¡Á®¿À°í ÀÖ½À´Ï´Ù. ±×·¯³ª ³ôÀº Ãʱ⠺ñ¿ë, º¹ÀâÇÑ Á¦Á¶ °øÁ¤, ´ëü ¼¾¼­ ±â¼ú°úÀÇ °æÀï°ú °°Àº °ú ÁÖÁ¦°¡ ½ÃÀå È®´ë¿¡ ¹æÇذ¡ µÉ ¼ö ÀÖ½À´Ï´Ù. ÀÌ À庮À» ÇØ°áÇÏ·Á¸é ºñ¿ë È¿À²ÀûÀÎ Á¦Á¶ ±â¼ú¿¡ ÅõÀÚÇÏ¿© ¹Ú¸· ¼¾¼­ÀÇ ³»±¸¼º°ú ¼º´ÉÀ» Çâ»ó½ÃÄѾßÇÕ´Ï´Ù. Çõ½ÅÀº °¨µµ³ª ¼ö¸í µî ¼¾¼­ ±â´É Çâ»óÀ» À§ÇÑ Àç·á°úÇÐÀÇ Áøº¸¿Í ½ÅÀç»ý¿¡³ÊÁö, ½º¸¶Æ®È¨ µî ½ÅÈïºÐ¾ß¿¡¼­ÀÇ ÀÀ¿ë ޱ¸¿¡ ÃÊÁ¡À» ¸ÂÃâ ¼ö ÀÖ½À´Ï´Ù. ½ÃÀå °ü°èÀÚ¿¡°Ô´Â ¹Îø¼º°ú ¼±°ß¼ºÀÌ ¿ä±¸µË´Ï´Ù.

ÁÖ¿ä ½ÃÀå Åë°è
±âÁسâ(2023) 50¾ï 4,000¸¸ ´Þ·¯
¿¹Ãø³â(2024) 53¾ï 5,000¸¸ ´Þ·¯
¿¹Ãø³â(2030) 78¾ï 1,000¸¸ ´Þ·¯
CAGR(%) 6.46%

½ÃÀå ¿ªÇÐ: ºü¸£°Ô ÁøÈ­ÇÏ´Â ¹Ú¸· ¼¾¼­ ½ÃÀåÀÇ ÁÖ¿ä ½ÃÀå ÀλçÀÌÆ® °ø°³

¹Ú¸·¼¾¼­ ½ÃÀåÀº ¼ö¿ä ¹× °ø±ÞÀÇ ¿ªµ¿ÀûÀÎ »óÈ£ÀÛ¿ë¿¡ ÀÇÇØ º¯¸ð¸¦ ÀÌ·ç°í ÀÖ½À´Ï´Ù. ±×¸®°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ ¾ò±â À§ÇØ Áغñ µÉ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ µ¿ÇâÀ» Á¾ÇÕÀûÀ¸·Î ÆÄ¾ÇÇÔÀ¸·Î½á ±â¾÷Àº Á¤Ä¡Àû, Áö¸®Àû, ±â¼úÀû, »çȸÀû, °æÁ¦Àû ¿µ¿ª¿¡ °ÉÄ£ ´Ù¾çÇÑ À§ÇèÀ» ÁÙÀÏ ¼ö ÀÖÀ¸¸ç, ¼ÒºñÀÚ Çൿ°ú ÀÌ´Â Á¦Á¶ ºñ¿ë°ú ±¸¸Å µ¿Çâ¿¡ ¹ÌÄ¡´Â ¿µÇâÀ» ´õ¿í ¸íÈ®ÇÏ°Ô ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
    • ¼ÒºñÀÚ¿ë ÀüÀÚ ±â±âÀÇ ¼ÒÀ¯ È®´ë¿Í ÀüÀÚ ºÎǰÀÇ ¼ÒÇüÈ­
    • ¼¼°è¿¡¼­ ³ô¾ÆÁö´Â Àδõ½ºÆ®¸® 4.0¿¡ÀÇ ´ëó¿Í ½º¸¶Æ® ½ÃƼ ÇÁ·ÎÁ§Æ®
    • ÇコÄÉ¾î ¹× ÀÇ·á ¿ëµµ¿¡ À־ÀÇ Á¤¹Ð ÃøÁ¤ÀÇ Çʿ伺
  • ½ÃÀå ¼ºÀå ¾ïÁ¦¿äÀÎ
    • ¹Ú¸· ¼¾¼­ÀÇ Á¦Á¶¡¤»ý»ê»óÀÇ ¹®Á¦
  • ½ÃÀå ±âȸ
    • ¹Ú¸· ¼¾¼­ÀÇ ±â´É¡¤¼º´É Çâ»óÀ» À§ÇÑ Áö¼ÓÀûÀÎ ±â¼ú Áøº¸
    • ±âÈÄ º¯È­ ¿ì·Á¿¡ ´ëóÇϰí Áö¼Ó°¡´É¼ºÀ» ÃßÁøÇϱâ À§ÇÑ È¯°æ ¸ð´ÏÅ͸µ¿¡ À־ÀÇ ¹Ú¸·¼¾¼­ÀÇ Àü°³
  • ½ÃÀåÀÇ °úÁ¦
    • ¹Ú¸· ¼¾¼­ÀÇ ±â¼úÀû ÇѰè¿Í ¼º´É ¹®Á¦

Porter's Five Force : ¹Ú¸· ¼¾¼­ ½ÃÀåÀ» Ž»öÇÏ´Â Àü·« µµ±¸

Porter's Five Force Framework´Â ½ÃÀå »óȲ°æÀï ±¸µµ¸¦ ÀÌÇØÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. Porter's Five Force Framework´Â ±â¾÷ÀÇ °æÀï·ÂÀ» Æò°¡Çϰí Àü·«Àû ±âȸ¸¦ ޱ¸ÇÏ´Â ¸íÈ®ÇÑ ±â¼úÀ» Á¦°øÇÕ´Ï´Ù. ÀÌ ÇÁ·¹ÀÓ¿öÅ©´Â ±â¾÷ÀÌ ½ÃÀå ³» ¼¼·Âµµ¸¦ Æò°¡ÇÏ°í ½Å±Ô »ç¾÷ÀÇ ¼öÀͼºÀ» °áÁ¤ÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ÀÌ·¯ÇÑ ÅëÂûÀ» ÅëÇØ ±â¾÷Àº ÀÚ»çÀÇ °­Á¡À» Ȱ¿ëÇϰí, ¾àÁ¡À» ÇØ°áÇϰí, ÀáÀçÀûÀÎ °úÁ¦¸¦ ÇÇÇÒ ¼ö ÀÖÀ¸¸ç, º¸´Ù °­ÀÎÇÑ ½ÃÀå¿¡¼­ÀÇ Æ÷Áö¼Å´×À» º¸ÀåÇÒ ¼ö ÀÖ½À´Ï´Ù.

PESTLE ºÐ¼® : ¹Ú¸· ¼¾¼­ ½ÃÀå¿¡¼­ ¿ÜºÎ·ÎºÎÅÍÀÇ ¿µÇâ ÆÄ¾Ç

¿ÜºÎ °Å½Ã ȯ°æ ¿äÀÎÀº ¹Ú¸· ¼¾¼­ ½ÃÀåÀÇ ¼º°ú ¿ªÇÐÀ» Çü¼ºÇϴµ¥ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» ÇÕ´Ï´Ù. Á¤Ä¡Àû, °æÁ¦Àû, »çȸÀû, ±â¼úÀû, ¹ýÀû, ȯ°æÀû ¿äÀÎ ºÐ¼®Àº ÀÌ·¯ÇÑ ¿µÇâÀ» Ž»öÇÏ´Â µ¥ ÇÊ¿äÇÑ Á¤º¸¸¦ Á¦°øÇÕ´Ï´Ù. PESTLE ¿äÀÎÀ» Á¶»çÇÔÀ¸·Î½á ±â¾÷Àº ÀáÀçÀûÀÎ À§Çè°ú ±âȸ¸¦ ´õ Àß ÀÌÇØÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ±â¾÷Àº ±ÔÁ¦, ¼ÒºñÀÚ ¼±È£, °æÁ¦ µ¿ÇâÀÇ º¯È­¸¦ ¿¹ÃøÇÏ°í ¾ÕÀ¸·Î ¿¹»óµÇ´Â Àû±ØÀûÀÎ ÀÇ»ç °áÁ¤À» ÇÒ Áغñ¸¦ ÇÒ ¼ö ÀÖ½À´Ï´Ù.

½ÃÀå Á¡À¯À² ºÐ¼® : ¹Ú¸· ¼¾¼­ ½ÃÀå °æÀï ±¸µµ ÆÄ¾Ç

¹Ú¸· ¼¾¼­ ½ÃÀåÀÇ »ó¼¼ÇÑ ½ÃÀå Á¡À¯À² ºÐ¼®À» ÅëÇØ °ø±Þ¾÷üÀÇ ¼º°ú¸¦ Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±â¾÷Àº ¼öÀÍ, °í°´ ±â¹Ý, ¼ºÀå·ü µî ÁÖ¿ä ÁöÇ¥¸¦ ºñ±³ÇÏ¿© °æÀï Æ÷Áö¼Å´×À» ¹àÈú ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºÐ¼®À» ÅëÇØ ½ÃÀå ÁýÁß, ´ÜÆíÈ­, ÅëÇÕ µ¿ÇâÀ» ¹àÇô³»°í º¥´õµéÀº °æÀïÀÌ Ä¡¿­ÇØÁö´Â °¡¿îµ¥ ÀÚ»çÀÇ ÁöÀ§¸¦ ³ôÀÌ´Â Àü·«Àû ÀÇ»ç °áÁ¤À» ³»¸®´Â µ¥ ÇÊ¿äÇÑ Áö½ÄÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù.

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º : ¹Ú¸· ¼¾¼­ ½ÃÀå¿¡¼­ °ø±Þ¾÷üÀÇ ¼º´É Æò°¡

FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º´Â ¹Ú¸· ¼¾¼­ ½ÃÀå¿¡¼­ º¥´õ¸¦ Æò°¡ÇÏ´Â Áß¿äÇÑ µµ±¸ÀÔ´Ï´Ù. ±âº» °áÁ¤À» ³»¸± ¼ö ÀÖ½À´Ï´Ù. ³× °¡Áö »çºÐ¸éÀ» ÅëÇØ º¥´õ¸¦ ¸íÈ®Çϰí Á¤È®ÇÏ°Ô ºÐÇÒÇϰí Àü·« ¸ñÇ¥¿¡ °¡Àå ÀûÇÕÇÑ ÆÄÆ®³Ê ¹× ¼Ö·ç¼ÇÀ» ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù.

Àü·« ºÐ¼® ¹× ±ÇÀå : ¹Ú¸· ¼¾¼­ ½ÃÀå¿¡¼­ ¼º°øÀ» À§ÇÑ ±æÀ» ±×¸®±â

¹Ú¸· ¼¾¼­ ½ÃÀåÀÇ Àü·« ºÐ¼®Àº ¼¼°è ½ÃÀå¿¡¼­ÀÇ ÇÁ·¹Á𽺠°­È­¸¦ ¸ñÇ¥·Î ÇÏ´Â ±â¾÷¿¡ ÇʼöÀûÀÔ´Ï´Ù. ÀÌ·¯ÇÑ Á¢±Ù ¹æ½ÄÀ» ÅëÇØ °æÀï ±¸µµ¿¡¼­ °úÁ¦¸¦ ±Øº¹ÇÏ°í »õ·Î¿î ºñÁî´Ï½º ±âȸ¸¦ Ȱ¿ëÇÏ¿© Àå±âÀûÀÎ ¼º°øÀ» °ÅµÑ ¼ö Àִ üÁ¦¸¦ ±¸ÃàÇÒ ¼ö ÀÖ½À´Ï´Ù.

ÀÌ º¸°í¼­´Â ÁÖ¿ä °ü½É ºÐ¾ß¸¦ Æ÷°ýÇÏ´Â ½ÃÀåÀÇ Á¾ÇÕÀûÀÎ ºÐ¼®À» Á¦°øÇÕ´Ï´Ù.

1. ½ÃÀå ħÅõ: ÇöÀç ½ÃÀå ȯ°æÀÇ »ó¼¼ÇÑ °ËÅä, ÁÖ¿ä ±â¾÷ÀÇ ±¤¹üÀ§ÇÑ µ¥ÀÌÅÍ, ½ÃÀå µµ´Þ¹üÀ§ ¹× Àü¹ÝÀûÀÎ ¿µÇâ·Â Æò°¡.

2. ½ÃÀå °³Ã´µµ: ½ÅÈï ½ÃÀåÀÇ ¼ºÀå ±âȸ¸¦ ÆÄ¾ÇÇÏ°í ±âÁ¸ ºÐ¾ßÀÇ È®Àå °¡´É¼ºÀ» Æò°¡ÇÏ¸ç ¹Ì·¡ ¼ºÀåÀ» À§ÇÑ Àü·«Àû ·Îµå¸ÊÀ» Á¦°øÇÕ´Ï´Ù.

3. ½ÃÀå ´Ù¾çÈ­: ÃÖ±Ù Á¦Ç° Ãâ½Ã, ¹Ì°³Ã´ Áö¿ª, ¾÷°èÀÇ ÁÖ¿ä Áøº¸, ½ÃÀåÀ» Çü¼ºÇÏ´Â Àü·«Àû ÅõÀÚ¸¦ ºÐ¼®ÇÕ´Ï´Ù.

4. °æÀï Æò°¡ ¹× Á¤º¸ : °æÀï ±¸µµ¸¦ öÀúÈ÷ ºÐ¼®ÇÏ¿© ½ÃÀå Á¡À¯À², »ç¾÷ Àü·«, Á¦Ç° Æ÷Æ®Æú¸®¿À, ÀÎÁõ, ±ÔÁ¦ ´ç±¹ ½ÂÀÎ, ƯÇã µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ±â¼ú Áøº¸ µîÀ» °ËÁõÇÕ´Ï´Ù.

5. Á¦Ç° °³¹ß ¹× Çõ½Å : ¹Ì·¡ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ °ÍÀ¸·Î ¿¹»óµÇ´Â ÃÖ÷´Ü ±â¼ú, R&D Ȱµ¿, Á¦Ç° Çõ½ÅÀ» °­Á¶ÇÕ´Ï´Ù.

¶ÇÇÑ ÀÌÇØ°ü°èÀÚ°¡ ÃæºÐÇÑ Á¤º¸¸¦ ¾ò°í ÀÇ»ç°áÁ¤À» ÇÒ ¼ö ÀÖµµ·Ï Áß¿äÇÑ Áú¹®¿¡ ´ë´äÇϰí ÀÖ½À´Ï´Ù.

1. ÇöÀç ½ÃÀå ±Ô¸ð¿Í ÇâÈÄ ¼ºÀå ¿¹ÃøÀº?

2. ÃÖ°íÀÇ ÅõÀÚ ±âȸ¸¦ Á¦°øÇÏ´Â Á¦Ç°, ºÎ¹® ¹× Áö¿ªÀº ¾îµðÀԴϱî?

3. ½ÃÀåÀ» Çü¼ºÇÏ´Â ÁÖ¿ä ±â¼ú µ¿Çâ°ú ±ÔÁ¦ÀÇ ¿µÇâÀº?

4. ÁÖ¿ä º¥´õÀÇ ½ÃÀå Á¡À¯À²°ú °æÀï Æ÷Áö¼ÇÀº?

5. º¥´õ ½ÃÀå ÁøÀÔ¡¤Ã¶¼ö Àü·«ÀÇ ¿øµ¿·ÂÀÌ µÇ´Â ¼öÀÍ¿ø°ú Àü·«Àû ±âȸ´Â ¹«¾ùÀΰ¡?

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ½ÃÀå °³¿ä

Á¦5Àå ½ÃÀå ÀλçÀÌÆ®

  • ½ÃÀå ¿ªÇÐ
    • ¼ºÀå ÃËÁø¿äÀÎ
      • °¡ÀüÁ¦Ç° ¼ÒÀ¯À² È®´ë¿Í ÀüÀÚºÎǰ ¼ÒÇüÈ­
      • ¼¼°è Àδõ½ºÆ®¸® 4.0ÀÇ ´ëó¿Í ½º¸¶Æ® ½ÃƼ ÇÁ·ÎÁ§Æ®°¡ Áõ°¡
      • ÀÇ·á ¹× ÀÇ·á ÀÀ¿ë ºÐ¾ß¿¡¼­ Á¤È®ÇÑ ÃøÁ¤ÀÇ Çʿ伺
    • ¾ïÁ¦¿äÀÎ
      • ¹Ú¸· ¼¾¼­ Á¦Á¶ ¹× »ý»ê ¹®Á¦
    • ±âȸ
      • ¹Ú¸· ¼¾¼­ÀÇ ±â´É°ú ¼º´ÉÀ» Çâ»ó½Ã۱â À§ÇÑ Áö¼ÓÀûÀÎ ±â¼ú Áøº¸
      • ±âÈÄ º¯È­ ¿ì·Á¿¡ ´ëóÇϰí Áö¼Ó°¡´É¼ºÀ» ÃßÁøÇϱâ À§ÇÑ È¯°æ ¸ð´ÏÅ͸µ¿¡ À־ÀÇ ¹Ú¸· ¼¾¼­ÀÇ µµÀÔ
    • °úÁ¦
      • ¹Ú¸· ¼¾¼­ÀÇ ±â¼úÀû ÇѰè¿Í ¼º´É»óÀÇ ¹®Á¦
  • ½ÃÀå ¼¼ºÐÈ­ ºÐ¼®
    • À¯Çü : ´Ù¾çÇÑ ¾÷°è¿¡¼­ Á¤È®ÇÑ ¿Âµµ ¸ð´ÏÅ͸µÀÌ ÇʼöÀûÀ̸ç RTD/¿Âµµ ¼¾¼­ÀÇ Çʿ伺ÀÌ ³ô¾ÆÁö°í ÀÖ½À´Ï´Ù.
    • ÃÖÁ¾ ÀÌ¿ë »ê¾÷ : ½º¸¶Æ®Æù ¹× ¿þ¾î·¯ºí ¼ö¿ä Áõ°¡¿¡ µû¸¥ ¼ÒºñÀÚ¿ë ÀüÀÚ ±â±â¿¡¼­ÀÇ ¹Ú¸· ¼¾¼­ÀÇ »ç¿ë Áõ°¡
  • Porter's Five Forces ºÐ¼®
  • PESTEL ºÐ¼®
    • Á¤Ä¡Àû
    • °æÁ¦
    • »ç±³
    • ±â¼úÀû
    • ¹ý·ü»ó
    • ȯ°æ

Á¦6Àå ¹Ú¸· ¼¾¼­ ½ÃÀå : À¯Çüº°

  • ¾Ð·Â ¼¾¼­
  • RTD/¿Âµµ ¼¾¼­

Á¦7Àå ¹Ú¸· ¼¾¼­ ½ÃÀå : ¼ÒÀ纰

  • ±¸¸®
  • ´ÏÄÌ ¹× ´ÏÄÌ/ö ÇÕ±Ý
  • ¹é±Ý

Á¦8Àå ¹Ú¸· ¼¾¼­ ½ÃÀå : ÃÖÁ¾ ÀÌ¿ë »ê¾÷º°

  • Ç×°ø¿ìÁÖ ¹× ¹æ¾î
  • ÀÚµ¿Â÷
  • °¡Àü
  • ÇコÄɾî
  • »ê¾÷ ÀÚµ¿È­

Á¦9Àå ¾Æ¸Þ¸®Ä« ¹Ú¸· ¼¾¼­ ½ÃÀå

  • ¾Æ¸£ÇîÆ¼³ª
  • ºê¶óÁú
  • ij³ª´Ù
  • ¸ß½ÃÄÚ
  • ¹Ì±¹

Á¦10Àå ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ ¹Ú¸· ¼¾¼­ ½ÃÀå

  • È£ÁÖ
  • Áß±¹
  • Àεµ
  • Àεµ³×½Ã¾Æ
  • ÀϺ»
  • ¸»·¹À̽þÆ
  • Çʸ®ÇÉ
  • ½Ì°¡Æ÷¸£
  • Çѱ¹
  • ´ë¸¸
  • ű¹
  • º£Æ®³²

Á¦11Àå À¯·´¡¤Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ ¹Ú¸· ¼¾¼­ ½ÃÀå

  • µ§¸¶Å©
  • ÀÌÁýÆ®
  • Çɶõµå
  • ÇÁ¶û½º
  • µ¶ÀÏ
  • À̽º¶ó¿¤
  • ÀÌÅ»¸®¾Æ
  • ³×´ú¶õµå
  • ³ªÀÌÁö¸®¾Æ
  • ³ë¸£¿þÀÌ
  • Æú¶õµå
  • īŸ¸£
  • ·¯½Ã¾Æ
  • »ç¿ìµð¾Æ¶óºñ¾Æ
  • ³²¾ÆÇÁ¸®Ä«
  • ½ºÆäÀÎ
  • ½º¿þµ§
  • ½ºÀ§½º
  • ÅÍŰ
  • ¾Æ¶ø¿¡¹Ì¸®Æ®(UAE)
  • ¿µ±¹

Á¦12Àå °æÀï ±¸µµ

  • ½ÃÀå Á¡À¯À² ºÐ¼® 2023
  • FPNV Æ÷Áö¼Å´× ¸ÅÆ®¸¯½º, 2023
  • °æÀï ½Ã³ª¸®¿À ºÐ¼®
    • Çõ½ÅÀûÀÎ ¹ÙÀÌ¿ÀÀνºÆÄÀÌ¾î ½Ã°¢ ¼¾¼­°¡ Àΰø ½Ã°¢ ½Ã½ºÅÛÀÇ »õ·Î¿î ½Ã´ë¸¦ ¿­¾î
    • Çõ½ÅÀûÀÎ ¼¾¼­ ±â¼ú ±â¾÷ IST AG¿¡ ÀÇÇÑ °í±Þ ¼¾¼­ ±â¼ú, Mouser Electronics°¡ ¼¼°èÀûÀ¸·Î ÆÇ¸Å
    • Àü·«Àû Àμö¿¡ ÀÇÇØ Platypus TechnologiesÀÇ ¼¾¼­ ±â¼úÀÇ ´É·ÂÀÌ °­È­µÈ´Ù
  • Àü·« ºÐ¼®°ú Á¦¾È

±â¾÷ ¸ñ·Ï

  • Accurion GmbH
  • AMS Technologies AG
  • Analog Devices, Inc.
  • Baumer NV
  • Colnatec LLC
  • Gems Sensors, Inc. by Danaher Corp.
  • GEOMATEC Co., Ltd.
  • Heraeus Holding
  • Honeywell International Inc.
  • Infineon Technologies AG
  • Innovative Sensor Technology IST AG
  • Murata Manufacturing Co., Ltd.
  • NXP Semiconductors NV
  • Robert Bosch GmbH
  • Sensing Devices LLC
  • Sensirion AG
  • Senstech AG
  • Siemens AG
  • STMicroelectronics
  • TE Connectivity
  • Tekscan, Inc.
  • Temperature Specialists, Inc.
  • Texas Instruments Incorporated
  • United Electric Controls
  • Vishay Intertechnology, Inc.
JHS 25.01.02

The Thin Film Sensor Market was valued at USD 5.04 billion in 2023, expected to reach USD 5.35 billion in 2024, and is projected to grow at a CAGR of 6.46%, to USD 7.81 billion by 2030.

Thin film sensors are devices that measure physical quantities, such as temperature and pressure, using thin film technology composed of microscopically thin layers of materials. They are integral in various industries due to their high accuracy, adaptability, and reduced size, making them necessary for advancements in modern electronics and industrial applications. These sensors are primarily utilized in automotive, aerospace, medical, and consumer electronics sectors. In the automotive industry, they are essential for monitoring engine systems and emissions. Aerospace applications benefit from their precision in monitoring environmental conditions. In healthcare, thin film sensors are vital in wearable devices for patient monitoring, while in electronics, they serve consumer gadgets by improving functionality without adding bulk. The thin film sensor market is poised for growth driven by the burgeoning demand for miniaturized and efficient electronic devices, increasing automation, and advancements in IoT technology. The rise in smart vehicle production and the expanding use of wearable health technology present significant opportunities for sensor developers and manufacturers. However, challenges such as high initial costs, complex manufacturing processes, and competition from alternative sensor technologies could hinder market expansion. Addressing these barriers involves investing in cost-effective production techniques and enhancing the durability and performance of thin film sensors. Research and innovation could focus on material science advancements to improve sensor capabilities, including sensitivity and lifespan, and exploring applications in emerging sectors like renewable energy and smart homes. The market's nature is dynamic, driven by rapid technological progress and changing consumer demands, necessitating agility and foresight among market players. By actively pursuing collaborative projects and keeping abreast of technological trends, businesses can establish a strong foothold in this evolving market landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 5.04 billion
Estimated Year [2024] USD 5.35 billion
Forecast Year [2030] USD 7.81 billion
CAGR (%) 6.46%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Thin Film Sensor Market

The Thin Film Sensor Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Expanding ownership of consumer electronics and miniaturization of electronic components
    • Rising Industry 4.0 initiatives and smart city projects across the world
    • Need for precise measurement in healthcare and medical applications
  • Market Restraints
    • Fabrication and production issues of thin film sensors
  • Market Opportunities
    • Ongoing technological advancements to improve the functionality and performance of thin film sensors
    • Deployment of thin film sensors in environmental monitoring to tackle climate change concerns and drive sustainability
  • Market Challenges
    • Technical limitations and performance issues of thin film sensors

Porter's Five Forces: A Strategic Tool for Navigating the Thin Film Sensor Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Thin Film Sensor Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Thin Film Sensor Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Thin Film Sensor Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Thin Film Sensor Market

A detailed market share analysis in the Thin Film Sensor Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Thin Film Sensor Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Thin Film Sensor Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Thin Film Sensor Market

A strategic analysis of the Thin Film Sensor Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Thin Film Sensor Market, highlighting leading vendors and their innovative profiles. These include Accurion GmbH, AMS Technologies AG, Analog Devices, Inc., Baumer NV, Colnatec LLC, Gems Sensors, Inc. by Danaher Corp., GEOMATEC Co., Ltd., Heraeus Holding, Honeywell International Inc., Infineon Technologies AG, Innovative Sensor Technology IST AG, Murata Manufacturing Co., Ltd., NXP Semiconductors N.V., Robert Bosch GmbH, Sensing Devices LLC, Sensirion AG, Senstech AG, Siemens AG, STMicroelectronics, TE Connectivity, Tekscan, Inc., Temperature Specialists, Inc., Texas Instruments Incorporated, United Electric Controls, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Thin Film Sensor Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Pressure Sensors and RTD/Temperature Sensors.
  • Based on Material, market is studied across Copper, Nickel & Nickel/Iron Alloy, and Platinum.
  • Based on End use Industry, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, and Industrial Automation.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Expanding ownership of consumer electronics and miniaturization of electronic components
      • 5.1.1.2. Rising Industry 4.0 initiatives and smart city projects across the world
      • 5.1.1.3. Need for precise measurement in healthcare and medical applications
    • 5.1.2. Restraints
      • 5.1.2.1. Fabrication and production issues of thin film sensors
    • 5.1.3. Opportunities
      • 5.1.3.1. Ongoing technological advancements to improve the functionality and performance of thin film sensors
      • 5.1.3.2. Deployment of thin film sensors in environmental monitoring to tackle climate change concerns and drive sustainability
    • 5.1.4. Challenges
      • 5.1.4.1. Technical limitations and performance issues of thin film sensors
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Critical need for precise temperature monitoring in diverse industries driving the need for RTD/temperature sensors
    • 5.2.2. End use Industry: Growing ownership of growing demand for smartphones and wearables leading to usage of thin film sensors in consumer electronics
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Thin Film Sensor Market, by Type

  • 6.1. Introduction
  • 6.2. Pressure Sensors
  • 6.3. RTD/Temperature Sensors

7. Thin Film Sensor Market, by Material

  • 7.1. Introduction
  • 7.2. Copper
  • 7.3. Nickel & Nickel/Iron Alloy
  • 7.4. Platinum

8. Thin Film Sensor Market, by End use Industry

  • 8.1. Introduction
  • 8.2. Aerospace & Defense
  • 8.3. Automotive
  • 8.4. Consumer Electronics
  • 8.5. Healthcare
  • 8.6. Industrial Automation

9. Americas Thin Film Sensor Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Thin Film Sensor Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Thin Film Sensor Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Innovative Bioinspired Vision Sensor Ushers in New Era for Artificial Visual Systems
    • 12.3.2. Advanced Sensor Technologies by Innovative Sensor Technology IST AG, Globally Distributed by Mouser Electronics
    • 12.3.3. Strategic Acquisition Enhances Platypus Technologies' Capabilities in Sensor Technology
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Accurion GmbH
  • 2. AMS Technologies AG
  • 3. Analog Devices, Inc.
  • 4. Baumer NV
  • 5. Colnatec LLC
  • 6. Gems Sensors, Inc. by Danaher Corp.
  • 7. GEOMATEC Co., Ltd.
  • 8. Heraeus Holding
  • 9. Honeywell International Inc.
  • 10. Infineon Technologies AG
  • 11. Innovative Sensor Technology IST AG
  • 12. Murata Manufacturing Co., Ltd.
  • 13. NXP Semiconductors N.V.
  • 14. Robert Bosch GmbH
  • 15. Sensing Devices LLC
  • 16. Sensirion AG
  • 17. Senstech AG
  • 18. Siemens AG
  • 19. STMicroelectronics
  • 20. TE Connectivity
  • 21. Tekscan, Inc.
  • 22. Temperature Specialists, Inc.
  • 23. Texas Instruments Incorporated
  • 24. United Electric Controls
  • 25. Vishay Intertechnology, Inc.
»ùÇà ¿äû ¸ñ·Ï
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
¸ñ·Ï º¸±â
Àüü»èÁ¦