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¼¼°èÀÇ SoC(System on Chip) ½ÃÀå : À¯Çüº°, ÁýÀû À¯Çüº°, ¿ëµµº° - ¿¹Ãø(2025-2030³â)

System on Chip Market by Type, Integration Type, Application - Global Forecast 2025-2030

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SoC(System on Chip) ½ÃÀåÀÇ 2023³â ½ÃÀå ±Ô¸ð´Â 1,562¾ï 2,000¸¸ ´Þ·¯·Î Æò°¡µÇ¾ú½À´Ï´Ù. 2024³â¿¡´Â 1,682¾ï ´Þ·¯·Î ¼ºÀåÇÏ¿© CAGRÀº 8.32%, 2030³â¿¡´Â 2,734¾ï 3,000¸¸ ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

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±âÁØ ¿¬µµ : 2023³â 1,562¾ï 2,000¸¸ ´Þ·¯
ÃßÁ¤ ¿¬µµ : 2024³â 1,682¾ï ´Þ·¯
¿¹Ãø ¿¬µµ : 2030³â 2,734¾ï 3,000¸¸ ´Þ·¯
CAGR(%) 8.32%

SoC(System on Chip)) ½ÃÀåÀº Çö´ë ÀüÀÚÁ¦Ç°ÀÇ ÇÙ½ÉÀ¸·Î ÁøÈ­ÇÏ¿© ¼ÒºñÀÚ ±â±â¿¡¼­ ÀÚµ¿Â÷ ¿ëµµ¿¡ À̸£±â±îÁö ´Ù¾çÇÑ »ê¾÷ ºÐ¾ßÀÇ Çõ½ÅÀ» ÁÖµµÇÏ°í¤¤ ÀÖ½À´Ï´Ù. ¿À´Ã³¯ÀÇ SoC ¼Ö·ç¼ÇÀº ´Ù¾çÇÑ ±â´ÉÀ» ´ÜÀÏ Ä¨¿¡ ÅëÇÕÇÏ¿© º¸´Ù ºü¸£°í È¿À²ÀûÀ̸ç ÄÄÆÑÆ®ÇÑ ¼³°è¸¦ °¡´ÉÇÏ°Ô ÇÔÀ¸·Î½á µð¹ÙÀ̽ºÀÇ ¼º´É°ú »óÈ£ ÀÛ¿ëÀ» Çõ½ÅÀûÀ¸·Î º¯È­½Ã۰í ÀÖ½À´Ï´Ù. ¹ÝµµÃ¼ ±â¼úÀÇ Áö¼ÓÀûÀÎ ¹ßÀüÀ¸·Î SoC´Â ÇöÀç ºñ¿ë°ú Àü·Â ¼Òºñ¸¦ ÁÙÀ̸鼭 ¼³°èÀÇ º¹À⼺À» °£¼ÒÈ­ÇÏ´Â º¸´Ù ½º¸¶Æ®ÇÏ°í ¿¬°á¼ºÀÌ ³ôÀº ½Ã½ºÅÛ °³¹ßÀ» Áö¿øÇϰí ÀÖ½À´Ï´Ù.

Áö³­ 10³â°£ SoC ±â¼úÀÇ ¹ßÀüÀº Çϵå¿þ¾î¿Í ¼ÒÇÁÆ®¿þ¾îÀÇ °æ°è¸¦ ÀçÁ¤ÀÇÇϰí È¿À²¼º°ú ÅëÇÕÀÌ ÃÖ¿ì¼±½ÃµÇ´Â ȯ°æÀ» Á¶¼ºÇß½À´Ï´Ù. ¼³°èÀÚ¿Í ¿£Áö´Ï¾îµéÀº ´ÜÀÏ Ç÷§Æû¿¡¼­ ¾Æ³¯·Î±×, µðÁöÅÐ, È¥ÇÕ ½ÅÈ£ ±â´ÉÀ» °áÇÕÇÏ´Â ÀÌÁ¡À» Á¡Á¡ ´õ ¸¹ÀÌ È°¿ëÇϰí ÀÖÀ¸¸ç, ÀÌ´Â ÀΰøÁö´É, ¸Ó½Å·¯´×, °í¼º´É ÄÄÇ»ÆÃ°ú °°Àº ºÐ¾ßÀÇ Çõ½ÅÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Á¾ÇÕÀûÀÎ ¼ºÀåÀº ±â¼úÀû Çõ½ÅÀÇ »ê¹°ÀÏ »Ó¸¸ ¾Æ´Ï¶ó, ´Ù±â´É ¹× È®Àå °¡´ÉÇÑ ¼Ö·ç¼Ç¿¡ ´ëÇÑ ½ÃÀå ¼ö¿ä¿¡ ´ëÇÑ ´ëÀÀÀ̱⵵ ÇÕ´Ï´Ù.

ÀÌ ±¤¹üÀ§ÇÑ °³¿ä´Â SoC ½ÃÀåÀÇ ÁÖ¿ä µ¿ÀÎÀ» ޱ¸Çϰí, »ê¾÷À» ÀçÆíÇÏ´Â º¯ÇõÀû µ¿ÇâÀ» ºÐ¼®Çϸç, °¢ ÇÏÀ§ Ä«Å×°í¸®ÀÇ Çõ½ÅÀû ÀáÀç·ÂÀ» °­Á¶ÇÏ´Â ÅëÂû·Â ÀÖ´Â ¼¼ºÐÈ­¸¦ Á¦½ÃÇÕ´Ï´Ù. ½ÃÀåÀÇ ÁøÈ­, Áö¿ªº° »óȲ, °æÀï ȯ°æ, ¹Ì·¡ ºñÁî´Ï½º ±âȸ¸¦ »ìÆìº½À¸·Î½á ±â¾÷°ú »ê¾÷ ¸®´õµéÀÌ µðÁöÅÐ ½Ã´ëÀÇ µµ·¡¸¦ Á¤È®Çϰí Àü·«ÀûÀ¸·Î ÇìÃijª°¥ ¼ö ÀÖ´Â È®½ÇÇÑ Åä´ë¸¦ ¸¶·ÃÇÒ ¼ö ÀÖµµ·Ï µ½½À´Ï´Ù.

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ÃÖ±Ù SoCÀÇ Àü¸ÁÀ» ÀçÁ¤ÀÇÇÏ´Â Çõ½ÅÀûÀÎ º¯È­°¡ ÀϾ°í ÀÖ½À´Ï´Ù. ¹ÝµµÃ¼ ±â¼ú°ú °øÁ¤ ÅëÇÕÀÇ Çõ½ÅÀº SoC ¼³°èÀÇ ¼º´É°ú ¿¡³ÊÁö È¿À²À» Çâ»ó½ÃÄ×À» »Ó¸¸ ¾Æ´Ï¶ó ½Ã½ºÅÛ ¾ÆÅ°ÅØÃ³ÀÇ »õ·Î¿î ÆÐ·¯´ÙÀÓÀ» °¡´ÉÇÏ°Ô Çß½À´Ï´Ù. ¼³°èÀÚµéÀÌ °í¼Ó ¿¬»ê°ú ½Ç½Ã°£ µ¥ÀÌÅÍ Ã³¸®¸¦ Áö¿øÇÏ´Â ¼Ö·ç¼ÇÀ¸·Î ÀüȯÇÔ¿¡ µû¶ó Åë½Å, »ê¾÷ ÀÚµ¿È­, ¼ÒºñÀÚ ÀüÀÚ±â±â µîÀÇ »ê¾÷¿¡¼­ SoCÀÇ ¿ªÇÒÀÌ Á¡Á¡ ´õ Áß¿äÇØÁö°í ÀÖ½À´Ï´Ù.

¸ÖƼÄÚ¾î ÇÁ·Î¼¼½Ì, ÀΰøÁö´É °¡¼Ó, IoT Ä¿³ØÆ¼ºñƼ µîÀÇ ±â¼ú ¹ßÀüÀº ±âÁ¸ SoC ¼³°è ÆÐ·¯´ÙÀÓÀ» º¯È­½Ã۰í ÀÖ½À´Ï´Ù. ÀÌÁ¾ ºÎǰÀ» ´ÜÀÏ Ä¨¿¡ ÅëÇÕÇÔÀ¸·Î½á °ú°Å¿¡´Â ºÒ°¡´ÉÇÏ´Ù°í ¿©°ÜÁ³´ø ¼º´É Çâ»óÀ» ½±°Ô ´Þ¼ºÇÒ ¼ö ÀÖ°Ô µÇ¾ú½À´Ï´Ù. ¶ÇÇÑ, µðÁöÅаú ¾Æ³¯·Î±× ±â´ÉÀÌ ÅëÇÕ Ç÷§ÆûÀ¸·Î ¼ö·ÅµÇ¸é¼­ °³¹ß ÁֱⰡ ´ÜÃàµÇ°í, ´Ù¾çÇÑ ºÐ¾ß¿¡ °ÉÃÄ Çõ½ÅÀûÀÎ ¿ëµµÀÌ Åº»ýÇϰí ÀÖ½À´Ï´Ù.

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SoC ½ÃÀå ¼¼ºÐÈ­¿¡ ´ëÇÑ ±íÀº ÅëÂû·Â Á¦°ø

½ÃÀå ¼¼ºÐÈ­¿¡ ´ëÇÑ ±íÀº ÀÌÇØ¸¦ ÅëÇØ SoC »ê¾÷À» Á¤ÀÇÇÏ´Â ´Ù¾çÇÑ Ãø¸é¿¡ ´ëÇÑ ±ÍÁßÇÑ ÅëÂû·ÂÀ» ¾òÀ» ¼ö ÀÖ½À´Ï´Ù. ½ÃÀåÀ» À¯Çüº°·Î »ìÆìº¸¸é ¾Æ³¯·Î±×, µðÁöÅÐ, È¥ÇÕ ½ÅÈ£ÀÇ ¼¼ °¡Áö ÁÖ¿ä ºÎ¹®À¸·Î ±¸ºÐÇÒ ¼ö ÀÖ½À´Ï´Ù. °¢ ºÐ·ù´Â ¼­·Î ´Ù¸¥ ¿ëµµ ¿ä±¸»çÇ×°ú ¼º´É »ç¾ç¿¡ ´ëÀÀÇÏ°í °íÀ¯ÇÑ ÀåÁ¡À» °¡Áö°í ÀÖ½À´Ï´Ù. ¾Æ³¯·Î±× ½Ã½ºÅÛÀº ÁÖ·Î ½ÅÈ£ 󸮿¡ ÁßÁ¡À» µÎ°í, µðÁöÅÐ ÄÄÆ÷³ÍÆ®´Â ÄÄÇ»ÆÃ ¹× µ¥ÀÌÅÍ °ü¸®¿¡ ÁßÁ¡À» µÓ´Ï´Ù. ÅëÇÕ È¥ÇÕ ½ÅÈ£ ¼Ö·ç¼ÇÀº ÀÌ µÑ »çÀÌÀÇ °£±ØÀ» ¸Þ¿ì°í ´Ù¾çÇÑ »ê¾÷ ¿ä±¸¿¡ ´ëÀÀÇÒ ¼ö ÀÖ´Â ´Ù±â´É¼ºÀ» ¼³¸íÇÕ´Ï´Ù.

ÁýÀûµµ À¯ÇüÀ¸·Î º¸¸é »óȲÀº ´õ¿í ´Ù¾çÇØÁý´Ï´Ù. ½ÃÀå ºÐ¼®Àº ¼Ö·ç¼ÇÀ» Ç® Ä¿½ºÅÒ ÁýÀûÈ­, ¼¼¹Ì Ä¿½ºÅÒ ÁýÀûÈ­, Ç¥ÁØ ¼¿ ¹æ½ÄÀ¸·Î ºÐ·ùÇÕ´Ï´Ù. °¢ ÅëÇÕ À¯ÇüÀº ¼³°èÀÇ º¹À⼺°ú Ä¿½ºÅ͸¶ÀÌ¡ ¼öÁØÀÇ Â÷À̸¦ ¹Ý¿µÇϸç, SoC ±¸ÇöÀÇ Àü¹ÝÀûÀÎ ¼º´É°ú ºñ¿ë È¿À²¼º¿¡ ¿µÇâÀ» ¹ÌĨ´Ï´Ù. Ç® Ä¿½ºÅÒ ÅëÇÕÀº ¼º´É ÃÖÀûÈ­¸¦ ±Ø´ëÈ­ÇÏÁö¸¸, ¼³°è º¹À⼺ÀÌ ³ô¾ÆÁý´Ï´Ù. ¼¼¹Ì Ä¿½ºÅÒ ÅëÇÕÀº À¯¿¬¼º°ú ¾î´À Á¤µµÀÇ Ç¥ÁØÈ­¸¦ °áÇÕÇÑ ±ÕÇü ÀâÈù Á¢±Ù ¹æ½ÄÀ» Á¦°øÇϸç, Ç¥ÁØ ¼¿ Á¶»ç ¹æ¹ýÀº È¿À²¼º°ú ºü¸¥ ¹èÆ÷¿¡ ÁßÁ¡À» µÓ´Ï´Ù.

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  • Advanced Micro Devices, Inc.
  • AMBARELLA, INC.
  • Analog Devices, Inc.
  • Apple Inc.
  • Arm Holdings PLC
  • Broadcom Inc.
  • Efinix, Inc.
  • Esperanto Technologies
  • Espressif Systems
  • Fujitsu Limited
  • Huawei Investment & Holding Co., Ltd.
  • InCore
  • Infineon Technologies AG
  • Intel Corporation
  • Kneron, Inc.
  • Marvell Technology, Inc.
  • Microchip Technology Incoporated
  • Novatek Microelectronics Corp.
  • NVIDIA Corporation
  • NXP Semiconductors N.V.
  • Qualcomm Technologies, Inc.
  • QUICKLOGIC CORPORATION
  • Realtek Semiconductor Corp
  • Renesas Electronics Corporation
  • Samsung Electronics Co. Ltd.
  • STMicroelectronics N.V.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated
  • UNISOC(Shanghai) Technology Co., Ltd.
LSH 25.05.23

The System on Chip Market was valued at USD 156.22 billion in 2023 and is projected to grow to USD 168.20 billion in 2024, with a CAGR of 8.32%, reaching USD 273.43 billion by 2030.

KEY MARKET STATISTICS
Base Year [2023] USD 156.22 billion
Estimated Year [2024] USD 168.20 billion
Forecast Year [2030] USD 273.43 billion
CAGR (%) 8.32%

The System on Chip (SoC) market has evolved into a cornerstone of modern electronics, driving innovation across multiple industries from consumer devices to automotive applications. Today's SoC solutions integrate various functionalities into a single chip, enabling faster, more efficient, and compact designs that transform how devices perform and interact. With continual progress in semiconductor technology, SoCs now underpin the development of smarter, more connected systems that streamline design complexity while reducing cost and power consumption.

Over the past decade, the evolution of SoC technology has redefined the boundaries between hardware and software, fostering an environment where efficiency and integration become paramount. Designers and engineers are increasingly leveraging the benefits of combining analog, digital, and mixed signal functionalities on a single platform, thereby promoting innovation in areas such as artificial intelligence, machine learning, and high-performance computing. This comprehensive growth is not only a product of technological breakthroughs but also a response to market demand for multifunctional, scalable solutions.

In this expansive overview, we delve into the key drivers of the SoC market, analyze transformative trends reshaping the industry, and present insightful segmentation that highlights the innovative potential of each sub-category. By examining the market's evolution, geographical strengths, competitive landscape, and future opportunities, the narrative sets a solid foundation for organizations and industry leaders to navigate the emerging digital era with precision and strategic foresight.

Transformative Shifts in the SoC Landscape

Recent years have witnessed transformative shifts that have redefined the SoC landscape. Innovations in semiconductor technology and process integration have not only enhanced the performance and energy efficiency of SoC designs but have also enabled new paradigms in system architecture. As designers pivot towards solutions that support high-speed computations and real-time data processing, the role of SoCs in industries such as telecommunications, industrial automation, and consumer electronics has become increasingly critical.

Technological advancements in areas like multi-core processing, artificial intelligence acceleration, and IoT connectivity are transforming traditional SoC design paradigms. The integration of heterogeneous components onto a single chip facilitates performance improvements that were once thought unattainable. Moreover, the convergence of digital and analog functionalities within a unified platform is streamlining development cycles and fostering innovative applications across various domains.

These shifts are also driven by market demands for lower power consumption and greater operational efficiency. As demand for smart devices surges worldwide, industry stakeholders are compelled to reimagine the boundaries of integration and miniaturization. The current landscape is marked by disruptive innovations that are pushing the limits of silicon technology, encouraging a proactive transition towards next-generation SoCs that are more adaptable, secure, and scalable. This evolution is redefining competitive dynamics and opening new strategic avenues for market players poised to lead in this increasingly digital and interconnected environment.

Deep Dive into Segmentation Insights of the SoC Market

An in-depth understanding of the market segmentation offers valuable insights into the various dimensions that define the SoC industry. When examining the market on the basis of type, three main areas emerge: analog, digital, and mixed signal categories. Each classification offers unique benefits, catering to different application requirements and performance specifications. Analog systems often focus on signal processing, while digital components emphasize computing and data management. The integrated mixed signal solutions bridge the gap between the two, providing versatile functionality that meets diverse industry needs.

The landscape further diversifies when viewed through the lens of integration types. Here, market analysis segregates solutions into full custom integration, semicustom integration, and standard cell approaches. Each integration type reflects different levels of design complexity and customization, influencing the overall performance and cost-effectiveness of SoC implementations. Full custom integration offers maximum optimization for performance but at a higher design complexity. Semicustom integration provides a balanced approach, combining flexibility with a degree of standardization, while standard cell methodologies focus on efficiency and rapid deployment.

Application-based segmentation also plays a critical role in delineating market opportunities. In this framework, industries such as automotive, consumer electronics, industrial, and telecommunications & data center become focal points. Within the automotive sector, studies encapsulate advanced driver assistance systems, infotainment systems, and powertrain electronics. The consumer electronics category spans across home appliances, smartphones, tablets, and wearables, reflecting the high demand for personal and connected devices. Moreover, the industrial sector is further dissected into energy management and industrial automation, showcasing a trend toward smarter, more efficient operational frameworks in heavy machinery and process industries.

This multi-dimensional segmentation not only highlights the inherent complexities of the SoC market but also underscores the adaptability required by manufacturers and developers. As different sectors call for specialized SoC capabilities, the nuanced segmentation approach provides critical intelligence that fuels strategic decision-making and technological adaptation.

Based on Type, market is studied across Analog, Digital, and Mixed Signal.

Based on Integration Type, market is studied across Full Custom Integration, Semicustom Integration, and Standard Cell.

Based on Application, market is studied across Automotive, Consumer Electronics, Industrial, and Telecommunications & Data Center. The Automotive is further studied across Advanced Driver Assistance Systems, Infotainment Systems, and Powertrain Electronics. The Consumer Electronics is further studied across Home Appliances, Smartphones, Tablets, and Wearables. The Industrial is further studied across Energy Management and Industrial Automation.

Critical Regional Insights Shaping Market Trends

Analyzing the SoC market from a regional perspective reveals significant variations in growth drivers, investment patterns, and technological adoption. The Americas continue to lead with robust research and development ecosystems that position the region at the forefront of cutting-edge semiconductor innovation. This environment nurtures the creation of advanced SoC solutions that cater to diverse applications ranging from high-performance computing to consumer electronics.

In the region covering Europe, the Middle East, and Africa, there is a strong emphasis on regulatory standards, sustainable energy practices, and strategic industrial collaborations. These factors have fostered a unique market dynamic in which traditional manufacturing excellence converges with digital transformation initiatives. The region is poised to capitalize on emerging trends, particularly in automotive and industrial automation, providing fertile ground for novel SoC designs that meet stringent quality and performance benchmarks.

Asia-Pacific emerges as a powerhouse in both production and consumption of semiconductor products. With rapid urbanization and a slew of innovation hubs, countries in this region are investing heavily in next-generation technologies. The burgeoning consumer electronics market, paired with a thriving industrial sector, drives significant upgrades in SoC requirements. This has encouraged localized advancements and sustained partnerships that are pushing the technological envelope. Across these regions, distinct yet interlinked market attributes are driving SoC adoption, laying the groundwork for a future characterized by technological synergy and expansive growth.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Companies Driving Market Innovation and Competition

A competitive landscape marked by industry pioneers and emerging disruptors frames the current state of the SoC market. Renowned companies such as Advanced Micro Devices, Inc. and Analog Devices, Inc. have set the benchmark in innovation by consistently pushing the envelope of what is possible with SoC designs. Alongside these industry leaders, organizations like AMBARELLA, Inc., Apple Inc., and Arm Holdings PLC contribute to a highly competitive arena where technological advancements rapidly translate into market advantages.

Other significant players including Broadcom Inc., Efinix, Inc., Esperanto Technologies, Espressif Systems, and Fujitsu Limited have carved out unique niches through focused product strategies and agile development processes. In addition, major global entities such as Huawei Investment & Holding Co., Ltd., Infineon Technologies AG, and Intel Corporation continuously leverage their vast resources to maintain strategic leadership.

Supporting this diverse ecosystem, companies like Kneron, Inc., Marvell Technology, Inc., Microchip Technology Incorporated, Novatek Microelectronics Corp., and NVIDIA Corporation are driving innovation through the integration of new features and performance enhancements. Influential semiconductor giants like NXP Semiconductors N.V., Qualcomm Technologies, Inc., QUICKLOGIC CORPORATION, Realtek Semiconductor Corp., Renesas Electronics Corporation, Samsung Electronics Co. Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, and UNISOC (Shanghai) Technology Co., Ltd. are expanding the boundaries of design and efficiency. Collectively, these companies shape the competitive and technological contours of the SoC market, sustaining a dynamic environment where continuous improvement is both imperative and evident.

The report delves into recent significant developments in the System on Chip Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., AMBARELLA, INC., Analog Devices, Inc., Apple Inc., Arm Holdings PLC, Broadcom Inc., Efinix, Inc., Esperanto Technologies, Espressif Systems, Fujitsu Limited, Huawei Investment & Holding Co., Ltd., InCore, Infineon Technologies AG, Intel Corporation, Kneron, Inc., Marvell Technology, Inc., Microchip Technology Incoporated, Novatek Microelectronics Corp., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Technologies, Inc., QUICKLOGIC CORPORATION, Realtek Semiconductor Corp, Renesas Electronics Corporation, Samsung Electronics Co. Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, and UNISOC (Shanghai) Technology Co., Ltd.. Actionable Recommendations for Industry Leaders

For industry leaders navigating the rapidly evolving SoC landscape, the path forward demands a proactive and strategic approach. It is crucial to invest in research and development focused on integrating advanced materials, enhancing design methodologies, and leveraging emerging technologies such as artificial intelligence and machine learning. These initiatives will not only streamline product performance but also address the growing demands for rapid, energy-efficient processing capabilities.

Leaders should prioritize collaborative innovation by forming strategic partnerships with academic institutions, research laboratories, and technology start-ups. Such relationships can catalyze new product development and accelerate the time-to-market for next-generation SoC solutions. Furthermore, the adoption of flexible integration strategies that encompass full custom, semicustom, and standard cell approaches can empower organizations to better align with diverse industry needs and cost targets.

It is also essential to remain adaptive in response to regulatory changes and shifts in global market trends. By closely monitoring advancements in regional markets and satisfying localized customer requirements, companies can ensure sustained competitiveness. Embracing digital transformation and smart manufacturing technologies will be key in optimizing supply chains and reducing operational bottlenecks.

Finally, rigorous investment in cybersecurity measures is critical to protect intellectual property and maintain trust among consumers. In summary, industry leaders should adopt a holistic strategy that balances innovation, strategic partnerships, regulatory compliance, and operational excellence to thrive in the highly competitive SoC market.

Conclusion: Navigating the Evolving SoC Market Landscape

In conclusion, the SoC market represents a vibrant and dynamic segment of the semiconductor industry, characterized by rapid technological advancements and evolving competitive structures. As consumer demands and industrial applications continue to become more sophisticated, the integration of analog, digital, and mixed signal solutions on a single chip will be central to future innovations. Detailed segmentation based on type, integration methodology, and application highlights the multifaceted nature of the market, while regional analysis underscores the importance of adapting strategies to local market dynamics.

Industry leaders are challenged to remain vigilant in an environment defined by transformative shifts and relentless competition. By embracing innovation and cultivating agility, organizations can harness the full potential of emerging trends and secure a competitive advantage. Ultimately, staying informed and adaptive will be essential for capitalizing on new opportunities and mitigating risks inherent in this evolving market landscape.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising adoption of SoCs for its power efficiency and cost-effectiveness
      • 5.1.1.2. Increasing integration of IoT devices in automobiles
      • 5.1.1.3. Bolstering demand for smart consumer electronics
    • 5.1.2. Restraints
      • 5.1.2.1. Issues associated with semiconductor shortages and supply chain disruptions
      • 5.1.2.2. Substantial R&D investment required to manufacture SoCs
    • 5.1.3. Opportunities
      • 5.1.3.1. Growing government investment in the domestic semiconductor industry
      • 5.1.3.2. Expansion of 5G technologies across the globe
    • 5.1.4. Challenges
      • 5.1.4.1. Adhering to strict environmental standards and regulations in semiconductor manufacturing
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: High preferences for mixed-signal SoCs to ensure smooth communication between analog sensors and digital processors
    • 5.2.2. Integration Type: Deployment of standard cell integration in consumer electronics and cloud computing infrastructures
    • 5.2.3. Application: Growing demand for SoCs in data centers, characterized by the quest for high data-processing speeds and energy efficiency
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. System on Chip Market, by Type

  • 6.1. Introduction
  • 6.2. Analog
  • 6.3. Digital
  • 6.4. Mixed Signal

7. System on Chip Market, by Integration Type

  • 7.1. Introduction
  • 7.2. Full Custom Integration
  • 7.3. Semicustom Integration
  • 7.4. Standard Cell

8. System on Chip Market, by Application

  • 8.1. Introduction
  • 8.2. Automotive
    • 8.2.1. Advanced Driver Assistance Systems
    • 8.2.2. Infotainment Systems
    • 8.2.3. Powertrain Electronics
  • 8.3. Consumer Electronics
    • 8.3.1. Home Appliances
    • 8.3.2. Smartphones
    • 8.3.3. Tablets
    • 8.3.4. Wearables
  • 8.4. Industrial
    • 8.4.1. Energy Management
    • 8.4.2. Industrial Automation
  • 8.5. Telecommunications & Data Center

9. Americas System on Chip Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific System on Chip Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa System on Chip Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Qorvo's innovative SoC solution revolutionizing the smart home device market ecosystem
    • 12.3.2. SiMa.ai's MLSoC Modalix drives multi-modal intelligence with a power-efficient edge platform
    • 12.3.3. BigEndian Semiconductors secures USD 3 million investment to drive India's presence in the global SoC market
    • 12.3.4. Strategic merger of SK Telecom's AI chip unit sets the stage for innovation in system on chip advancements
    • 12.3.5. L&T's strategic acquisition of SiliConch Systems to enhance semiconductor capabilities and market presence
    • 12.3.6. Mindgrove revolutionizes India's market with indigenous microcontroller for better OEM efficiency
    • 12.3.7. AMD revolutionizes AI-driven embedded systems with enhanced Versal Gen 2 adaptive SoC portfolio
    • 12.3.8. Strategic alliance between HCLTech and CAST to drive innovation in custom chip solutions for diverse industries
    • 12.3.9. Strategic investment by Taisys boosts India's automotive semiconductor industry with USD 100 million for OneChip platform innovation
    • 12.3.10. Intel and Cadence forge strategic alliance to enhance advanced SoC design for AI, HPC, and mobile applications
  • 12.4. Strategy Analysis & Recommendation
    • 12.4.1. Qualcomm Inc.
    • 12.4.2. Broadcom Limited
    • 12.4.3. Samsung Electronics Co. Ltd.
    • 12.4.4. Intel Corporation

Companies Mentioned

  • 1. Advanced Micro Devices, Inc.
  • 2. AMBARELLA, INC.
  • 3. Analog Devices, Inc.
  • 4. Apple Inc.
  • 5. Arm Holdings PLC
  • 6. Broadcom Inc.
  • 7. Efinix, Inc.
  • 8. Esperanto Technologies
  • 9. Espressif Systems
  • 10. Fujitsu Limited
  • 11. Huawei Investment & Holding Co., Ltd.
  • 12. InCore
  • 13. Infineon Technologies AG
  • 14. Intel Corporation
  • 15. Kneron, Inc.
  • 16. Marvell Technology, Inc.
  • 17. Microchip Technology Incoporated
  • 18. Novatek Microelectronics Corp.
  • 19. NVIDIA Corporation
  • 20. NXP Semiconductors N.V.
  • 21. Qualcomm Technologies, Inc.
  • 22. QUICKLOGIC CORPORATION
  • 23. Realtek Semiconductor Corp
  • 24. Renesas Electronics Corporation
  • 25. Samsung Electronics Co. Ltd.
  • 26. STMicroelectronics N.V.
  • 27. Taiwan Semiconductor Manufacturing Company Limited
  • 28. Texas Instruments Incorporated
  • 29. UNISOC (Shanghai) Technology Co., Ltd.
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