블록 아웃 수지 시장 : 유형별, 제품 형태별, 용도별, 최종 용도 산업별 - 세계 예측(2026-2032년)

The Block-Out Resin Market was valued at USD 2.56 billion in 2025 and is projected to grow to USD 2.77 billion in 2026, with a CAGR of 8.57%, reaching USD 4.56 billion by 2032.

Comprehensive introductory overview of block-out resin functions, chemistry considerations, product forms, and application-driven specification priorities in modern electronics manufacturing

Block-out resin plays a foundational role in printed circuit board production and protective coating processes, serving as a selective mask, insulator, and contaminant barrier across a broad range of substrate architectures. In practice, formulations are selected to meet adhesion, thermal stability, and dielectric performance requirements that differ by application; flexible PCBs demand materials tolerant of repeated bending and thermal cycling while multilayer constructions require resins compatible with lamination and via-filling processes. At the same time, resin chemistries such as acrylics, epoxies, phenolics, and urethanes each offer distinct processing windows and end-use behaviors that influence procurement and production choices.

Beyond chemistry, product form-whether supplied as a liquid for ease of application and rework or as a powder for heat-activated processing and particulate control-affects downstream handling, equipment needs, and occupational safety measures. End-use industry drivers further inform specification priorities: aerospace and defense emphasize certification, traceability, and long-term reliability; automotive applications increasingly demand thermal endurance and chemical resistance for electrified powertrains; consumer electronics prioritize low outgassing, miniaturization compatibility, and high-throughput processing for devices like PCs, smartphones, tablets, and wearables; and telecommunication infrastructure requires performance under continuous operation in varied environmental conditions. Together, these technical and commercial pressures define the contours of resin selection and formulation strategy across the supply chain.

Analysis of the major technological, regulatory, and supply-side transformations reshaping block-out resin requirements and competitive priorities across industries

The block-out resin landscape is undergoing conspicuous transformation driven by converging technological, regulatory, and supply-side forces that are redefining product requirements and commercial models. Advances in flexible and rigid-flex PCB architectures are elevating the need for resins that combine enhanced mechanical resilience with predictable dielectric properties, prompting formulators to optimize crosslink density, elongation characteristics, and cure profiles to support high-density interconnects and bendable assemblies. Simultaneously, the proliferation of electric vehicles and the intensification of aerospace electronics certification demands are pushing developers toward higher-performance chemistries that withstand elevated temperatures and aggressive chemical exposure.

On the production front, automation and inline process control are shifting quality emphasis from manual inspection to in-situ validation of coating thickness, cure completeness, and contamination control. Regulatory developments related to restricted substances and product stewardship are motivating suppliers to reformulate toward lower-emitting, more recyclable options while maintaining performance. At the same time, digitalization across procurement and R&D-from integrated formulation databases to predictive maintenance for coating lines-is improving speed-to-market for new resin grades and enabling closer alignment between resin performance attributes and OEM application needs. Taken together, these shifts are making formulation agility, compliance readiness, and supply chain transparency the primary competitive differentiators for suppliers and converters alike.

Examination of how 2025 tariff adjustments collectively altered supply strategies, compliance practices, and procurement risk management for resin producers and downstream users

The cumulative impact of trade policy changes implemented in 2025 has introduced new complexities for resin procurement, supply chain architecture, and cost management across the electronics value chain. Tariff adjustments affecting upstream raw materials and finished resin imports have created incentive structures for firms to re-evaluate sourcing geographies, to accelerate qualification of secondary suppliers, and to pursue bilateral procurement agreements that mitigate exposure to variable duties. In response, many manufacturers have enhanced supply chain visibility by mapping multi-tier suppliers and instituting tighter inventory controls to buffer against duty-driven price volatility and to preserve production continuity.

Operationally, the tariff environment has prompted a reassessment of vertical integration strategies, with some formulators considering closer partnerships or strategic investments in resin precursor production to control input availability and compliance pathways. Compliance teams have had to sharpen harmonized system code classification and certificate-of-origin practices to avoid misclassification risks and to leverage available duty mitigation tools such as tariff preference programs where applicable. The cumulative effect has been a greater emphasis on contractual flexibility, the adoption of scenario-based sourcing plans, and the acceleration of local sourcing initiatives in regions where duty exposure is lower, all while maintaining the technical specifications required by high-reliability applications in aerospace, automotive, and telecommunications.

High-resolution segmentation analysis linking application architecture, resin chemistry, end-use verticals, and product form choice to formulation and commercialization imperatives

A rigorous segmentation approach reveals divergent technical priorities and procurement behaviors across application types, resin chemistries, end-use industries, and product forms that shape development and go-to-market strategies. When evaluated by application, flexible printed circuit boards demand resins that balance flexibility and adhesion, particularly for rigid-flex variants, whereas multilayer printed circuit boards impose distinct lamination and interlayer compatibility needs that differ between above-four-layer constructions and two- to four-layer architectures; single-layer boards by contrast prioritize cost-effective processing and straightforward application techniques. Differences across resin types are equally consequential: acrylic formulations are often favored for their clarity and ease of processing, epoxy systems for structural strength and thermal resistance, phenolic chemistries for certain heat and flame-retardant attributes, and urethanes for toughness and abrasion resistance, each guiding the selection process depending on performance and processing requirements.

End-use segmentation further modifies priorities: aerospace applications place an outsized emphasis on traceability, certification, and long-term reliability with subsegments in commercial aircraft and defense driving distinct approval paths; automotive customers require materials compatible with both conventional vehicle environments and the heightened thermal and dielectric demands of electric vehicle power electronics; consumer electronics buyers seek low-profile, fast-curing resins suitable for PCs, smartphones, tablets, and wearables where miniaturization and throughput are critical; telecommunication customers focus on durability for continuous operation across mobile infrastructure and networking equipment. Product form selection between liquid and powder formats interacts with these considerations, influencing application methods, cure regimes, packaging, and occupational health protocols. Integrating segmentation insights into product roadmaps and sales messaging enables suppliers to align formulation trade-offs with the exacting requirements of each application and end customer type.

Regional analysis of supply chain hubs, regulatory drivers, and customer expectations across the Americas, Europe Middle East & Africa, and Asia-Pacific

Regional dynamics continue to exert a pronounced influence on supply chains, regulatory compliance, and customer expectations across distinct economic zones. In the Americas, demand patterns are shaped by advanced electronics manufacturing hubs, a strong automotive supply chain presence, and a regulatory environment that emphasizes trade compliance and environmental stewardship; these factors encourage suppliers to maintain local inventory buffers and to provide robust technical support to OEMs and electronics assemblers. Europe, Middle East & Africa presents a heterogeneous landscape where stringent chemical and safety regulations coexist with high-reliability aerospace and industrial electronics clusters, creating demand for certified, traceable formulations and regionally tailored documentation packages.

Asia-Pacific remains the principal manufacturing nexus for consumer electronics and a fast-growing center for electric vehicle supply chains, driving a continuous need for scalable production capabilities, cost-competitive sourcing, and rapid qualification cycles for new resin grades. This region also places heightened importance on process automation and integration with contract manufacturers. Across all regions, differences in tariff regimes, local content requirements, and logistical infrastructure influence supplier strategies for regional hubs, while proximity to key customers and access to specialized testing facilities remain decisive factors in where new capacity and technical service centers are established.

Insight into how leading chemistry suppliers and formulators are using innovation, integration, and service models to secure competitive advantage across high-reliability applications

Leading companies in the block-out resin value chain are differentiating through a combination of technical innovation, expanded service models, and strategic commercial positioning. R&D investment is concentrated on tailoring formulations to meet heightened performance demands for flexible and multilayer PCB applications, improving cure kinetics for throughput gains, and reducing hazardous constituents to anticipate regulatory changes. Several firms are strengthening downstream engagement by offering co-development arrangements with OEMs and contract manufacturers, providing application engineering support, training programs, and in-line process validation services that reduce qualification timelines and enhance customer retention.

Commercially, top-tier suppliers are pursuing selective integration strategies and partnerships to secure critical feedstocks and to improve continuity under shifting tariff and trade conditions. Quality systems and certification programs are being emphasized for aerospace and automotive qualification pathways, and intellectual property related to specialty chemistries and proprietary curing technologies is increasingly leveraged as a competitive moat. At the same time, a subset of companies is exploring modular product platforms and configurable resin formulations that enable rapid customization for specific application geometries and environmental profiles, thereby accelerating adoption in high-growth segments while containing development cost.

Clear, actionable strategic initiatives for suppliers to enhance resilience, accelerate product qualification, and align commercial models with evolving customer demands

Industry leaders can take decisive, actionable steps to strengthen resilience, capture value, and align product roadmaps with evolving customer requirements. First, prioritize multi-source procurement strategies and supplier qualification programs that reduce single-point-of-failure risk for critical precursors while maintaining strict quality and traceability standards required by aerospace and automotive customers. Concurrently, invest in formulation agility by expanding pilot-scale capabilities and by implementing digital tools that accelerate lab-to-line transfer and reduce time consumed in qualification cycles. These investments should be paired with deeper technical partnerships with OEMs and contract manufacturers to co-develop resin grades optimized for flexible and multilayer PCB processes.

Operationally, enhance tariff and compliance readiness through dedicated trade compliance resources and scenario planning that integrate duty exposure into procurement decisions. Strengthen after-sales technical support, including on-site application assistance and performance benchmarking, to shorten qualification timelines and increase switching costs for customers. Finally, accelerate sustainability initiatives by reducing volatile organic compound emissions, improving packaging efficiency, and developing recyclability pathways; these efforts not only mitigate regulatory risk but also respond to procurement preferences among major OEMs. A coordinated program that combines supply diversification, product innovation, compliance rigor, and customer-centric service will position firms to capitalize on structural growth opportunities and to weather policy-induced disruptions.

Description of the multi-method research approach integrating primary interviews, lab validation, technical review, and supply chain mapping to underpin practical recommendations

This research synthesizes primary engagement, laboratory validation, and structured secondary review to ensure conclusions are evidence-based and actionable. Primary inputs included structured interviews with formulation scientists, procurement leads at electronics manufacturers, quality engineers in aerospace and automotive programs, and senior supply chain managers; these conversations illuminated real-world performance priorities, qualification hurdles, and procurement constraints. Laboratory validation comprised comparative assessments of representative resin chemistries and product forms under typical cure regimes to evaluate adhesion, thermal stability, and mechanical properties relevant to flexible and multilayer printed circuit board assemblies.

Secondary review encompassed technical literature, regulatory documentation, patent filings, and supplier technical data sheets to verify material properties, processing parameters, and compliance pathways. Supply chain mapping traced multi-tier raw material flows and tariff exposure points to inform sourcing recommendations. Segmentation was applied across application types-flexible PCB including rigid flex, multilayer PCB across above-four-layer and two-to-four-layer constructions, and single layer PCB-resin chemistries including acrylic, epoxy, phenolic, and urethane, end-use industries with aerospace, automotive, consumer electronics, electronics manufacturing, and telecommunication subsegments, and product form distinctions between liquid and powder. Findings were triangulated across data sources and validated through peer review to reduce bias and to ensure practical relevance for decision-makers.

Conclusive synthesis highlighting formulation adaptability, supply chain resilience, and sustainability as the triad of strategic priorities for resin suppliers and buyers

In synthesis, the block-out resin domain is positioned at the intersection of evolving application architectures, stricter regulatory regimes, and shifting trade dynamics that together demand heightened technical flexibility and supply chain discipline. Suppliers who invest in formulation adaptability-delivering chemistries optimized for flexible, rigid-flex, and multilayer PCB architectures-will better meet the divergent needs of aerospace, automotive, consumer electronics, and telecommunications customers. Equally important is the development of service capabilities that accelerate qualification and embed suppliers more deeply into OEM development cycles.

Operational resilience is now as strategically important as product performance. Firms that adopt multi-sourced procurement, refine tariff and compliance playbooks, and expand regional support capabilities can mitigate the operational impacts of policy shifts and logistical disruption. Finally, sustainability and regulatory foresight offer both risk mitigation and competitive differentiation as buyers increasingly incorporate environmental and compliance criteria into supplier selection. Together, these priorities form a pragmatic roadmap for stakeholders seeking to strengthen their position across the evolving electronics ecosystem.

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Definition
• 1.3. Market Segmentation & Coverage
• 1.4. Years Considered for the Study
• 1.5. Currency Considered for the Study
• 1.6. Language Considered for the Study
• 1.7. Key Stakeholders

2. Research Methodology

• 2.1. Introduction
• 2.2. Research Design
  • 2.2.1. Primary Research
  • 2.2.2. Secondary Research
• 2.3. Research Framework
  • 2.3.1. Qualitative Analysis
  • 2.3.2. Quantitative Analysis
• 2.4. Market Size Estimation
  • 2.4.1. Top-Down Approach
  • 2.4.2. Bottom-Up Approach
• 2.5. Data Triangulation
• 2.6. Research Outcomes
• 2.7. Research Assumptions
• 2.8. Research Limitations

3. Executive Summary

• 3.1. Introduction
• 3.2. CXO Perspective
• 3.3. Market Size & Growth Trends
• 3.4. Market Share Analysis, 2025
• 3.5. FPNV Positioning Matrix, 2025
• 3.6. New Revenue Opportunities
• 3.7. Next-Generation Business Models
• 3.8. Industry Roadmap

4. Market Overview

• 4.1. Introduction
• 4.2. Industry Ecosystem & Value Chain Analysis
  • 4.2.1. Supply-Side Analysis
  • 4.2.2. Demand-Side Analysis
  • 4.2.3. Stakeholder Analysis
• 4.3. Porter's Five Forces Analysis
• 4.4. PESTLE Analysis
• 4.5. Market Outlook
  • 4.5.1. Near-Term Market Outlook (0-2 Years)
  • 4.5.2. Medium-Term Market Outlook (3-5 Years)
  • 4.5.3. Long-Term Market Outlook (5-10 Years)
• 4.6. Go-to-Market Strategy

5. Market Insights

• 5.1. Consumer Insights & End-User Perspective
• 5.2. Consumer Experience Benchmarking
• 5.3. Opportunity Mapping
• 5.4. Distribution Channel Analysis
• 5.5. Pricing Trend Analysis
• 5.6. Regulatory Compliance & Standards Framework
• 5.7. ESG & Sustainability Analysis
• 5.8. Disruption & Risk Scenarios
• 5.9. Return on Investment & Cost-Benefit Analysis

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. Block-Out Resin Market, by Type

• 8.1. Acrylic
• 8.2. Epoxy
• 8.3. Phenolic
• 8.4. Urethane

9. Block-Out Resin Market, by Product Form

• 9.1. Liquid
• 9.2. Powder

10. Block-Out Resin Market, by Application

• 10.1. Flexible PCB
• 10.2. Multilayer PCB
  • 10.2.1. Above Four Layer
  • 10.2.2. Two To Four Layer
• 10.3. Single Layer PCB

11. Block-Out Resin Market, by End Use Industry

• 11.1. Aerospace
  • 11.1.1. Commercial Aircraft
  • 11.1.2. Defense
• 11.2. Automotive
  • 11.2.1. Conventional Vehicles
  • 11.2.2. Electric Vehicles
• 11.3. Consumer Electronics
  • 11.3.1. PCs
  • 11.3.2. Smartphones
  • 11.3.3. Tablets
  • 11.3.4. Wearables
• 11.4. Electronics Manufacturing
• 11.5. Telecommunication
  • 11.5.1. Mobile Infrastructure
  • 11.5.2. Networking Equipment

12. Block-Out Resin Market, by Region

• 12.1. Americas
  • 12.1.1. North America
  • 12.1.2. Latin America
• 12.2. Europe, Middle East & Africa
  • 12.2.1. Europe
  • 12.2.2. Middle East
  • 12.2.3. Africa
• 12.3. Asia-Pacific

13. Block-Out Resin Market, by Group

• 13.1. ASEAN
• 13.2. GCC
• 13.3. European Union
• 13.4. BRICS
• 13.5. G7
• 13.6. NATO

14. Block-Out Resin Market, by Country

• 14.1. United States
• 14.2. Canada
• 14.3. Mexico
• 14.4. Brazil
• 14.5. United Kingdom
• 14.6. Germany
• 14.7. France
• 14.8. Russia
• 14.9. Italy
• 14.10. Spain
• 14.11. China
• 14.12. India
• 14.13. Japan
• 14.14. Australia
• 14.15. South Korea

15. United States Block-Out Resin Market

16. China Block-Out Resin Market

17. Competitive Landscape

• 17.1. Market Concentration Analysis, 2025
  • 17.1.1. Concentration Ratio (CR)
  • 17.1.2. Herfindahl Hirschman Index (HHI)
• 17.2. Recent Developments & Impact Analysis, 2025
• 17.3. Product Portfolio Analysis, 2025
• 17.4. Benchmarking Analysis, 2025
• 17.5. Akzo Nobel N.V.
• 17.6. Arkema S.A.
• 17.7. BASF SE
• 17.8. Covestro AG
• 17.9. Dow Inc.
• 17.10. Eastman Chemical Company
• 17.11. Evonik Industries AG
• 17.12. Huntsman Corporation
• 17.13. Robnor ResinLab
• 17.14. Solvay S.A.
• 17.15. Wacker Chemie AG