무선 충전 IC 시장 : 기술별, 규격별, 출력 전력별, 주파수별, 용도별, 최종사용자별 - 세계 예측(2026-2032년)

The Wireless Charging IC Market was valued at USD 4.00 billion in 2025 and is projected to grow to USD 4.27 billion in 2026, with a CAGR of 7.28%, reaching USD 6.55 billion by 2032.

A strategic orientation to how semiconductor integration, thermal management, and interoperability requirements are reshaping wireless charging IC design and commercialization

The wireless charging integrated circuit landscape sits at the intersection of semiconductor innovation, power management evolution, and cross-industry electrification. Developments in system-on-chip integration, enhanced power conversion topologies, and tighter interoperability testing have elevated ICs from supporting components into strategic differentiators for device manufacturers. As product designers prioritize sleeker form factors, faster charging experiences, and improved thermal performance, the IC layer determines not only technical feasibility but also certification speed and user experience consistency.

Concurrently, convergence between consumer electronics, automotive systems, wearable accessories, and healthcare devices has broadened the design constraints that IC architects must address. Power output flexibility, dynamic foreign-object detection, and multi-coil management increasingly define competitive offerings. Supply chain considerations are likewise critical: the choice of foundry, packaging technologies, and sourcing for passive components influences time-to-market and cost predictability. As a result, firms that combine system-level expertise with IC-level innovation secure advantageous positions in specification discussions and partner negotiations.

This executive summary synthesizes the most consequential shifts affecting wireless charging ICs, examines tariff and trade impacts, dissects segment-specific dynamics and regional drivers, and concludes with actionable recommendations for product leaders and procurement teams aiming to reduce risk while accelerating product differentiation.

How integration trends, multi-protocol expectations, and certification imperatives are redefining supplier collaboration and design priorities in wireless charging ICs

Recent years have seen transformative shifts that alter how companies design, certify, and deploy wireless charging ICs across end markets. First, the transition from single-function power devices to integrated solutions combining power management, communication stacks, and safety monitors has reduced board-level complexity and enabled more compact transmitter and receiver modules. This shift has encouraged closer collaboration between system architects and IC vendors to align on coil-control algorithms and power handshaking.

Second, standards convergence and fragmentation have progressed in parallel. While legacy standards remain in use, multi-profile devices increasingly require ICs that can handle multiple protocols and power profiles within a single silicon solution. This evolution motivates silicon vendors to incorporate adaptable firmware and field-upgradeable capability to extend product lifespans and support post-deployment enhancements. Third, device-level expectations for faster charge times and improved efficiency have prompted novel approaches to thermal dissipation and EMI control within packaged ICs, influencing package choices and board-layout guidelines.

Finally, the ecosystem surrounding wireless power has matured, with greater emphasis on certification ecosystems, cross-disciplinary testing facilities, and co-development arrangements. As a result, time-to-certification and interoperability assurance have become strategic performance indicators for suppliers and OEMs, forcing earlier alignment on compliance testing and design-for-certification practices.

Operational and sourcing responses to changing tariff environments that compel semiconductor suppliers and OEMs to reconsider supply chain geographies and inventory strategies

Tariff actions announced in recent policy cycles have introduced layered complexity into sourcing and cost structures for semiconductor components used in wireless charging systems. Trade measures that affect finished goods, subassemblies, and certain semiconductor packaging materials can lead vendors to reevaluate supplier footprints, reconsider third-party test house locations, and alter logistics strategies to mitigate duty exposure. For companies that rely on multi-regional supply chains, these tariffs create incentives to localize certain stages of production or to qualify alternative suppliers outside affected jurisdictions.

Beyond immediate cost implications, tariffs influence longer-term decisions about contractual terms, inventory strategies, and product roadmaps. For example, extended lead times driven by rerouted supply chains can push firms to secure additional qualification runs or invest in buffer inventories for critical passive components and ICs. Moreover, the cumulative policy environment encourages diversification of manufacturing partners and increased scrutiny of bilateral trade policies that could disrupt raw material flows or semiconductor substrate availability.

Importantly, affected stakeholders are responding through a mix of operational tactics: adjusting bill-of-materials sourcing, accelerating designs that reduce reliance on tariffed components, and initiating supplier consolidation where feasible. These responses aim to preserve technical performance and regulatory compliance while buffering commercial teams from margin erosion and schedule slippage caused by shifting tariff regimes.

Segment-driven engineering and commercialization insights revealing how application, end-user, technology, standard, power output, and frequency choices shape IC requirements

Segmentation frames product development and go-to-market approaches by clarifying where technical trade-offs and commercial opportunities intersect. When applications are considered, the market is studied across Automotive, Smartphone, Tablet, and Wearable, with wearables further distinguished by earbuds, fitness band, and smartwatch, which highlights how size, duty cycle, and power envelope drive IC feature sets. In terms of end users, the landscape spans Automotive, Consumer Electronics, Healthcare, and Industrial, reflecting distinct certification regimes, reliability expectations, and environmental stressors that shape IC design choices.

From a technology perspective, solutions are classified into Inductive Charging, Resonant Charging, and RF Charging, each presenting unique frequency considerations, coupling behaviors, and efficiency profiles that impact controller complexity and analog front-end design. Standard distinctions include A4WP, PMA, and Qi, with Qi further divided into Baseline Profile and Extended Power Profile, underscoring the need for backward compatibility and power scaling within silicon architectures. Power output segmentation-5W To 15W, Above 15W, and Up To 5W, with Above 15W split into 15W To 30W and Above 30W-drives thermal design, detection mechanisms, and converter topologies at the IC level. Finally, frequency bands such as 110-205 kHz, 13.56 MHz, and 6.78 MHz impose different RF component requirements and EMC mitigation strategies for IC vendors.

Taken together, these segmentation axes reveal the interplay between use case requirements and silicon trade-offs, informing how suppliers prioritize integration, firmware flexibility, safety monitors, and certification support to serve diverse OEM needs.

How Americas, Europe Middle East & Africa, and Asia-Pacific regional dynamics uniquely influence product design priorities, certification pacing, and supplier strategies

Regional dynamics create differentiated demand signals and regulatory contexts that directly influence wireless charging IC roadmaps and commercialization tactics. In the Americas, emphasis centers on consumer convenience, rapid adoption cycles in smartphones and accessories, and a growing automotive electrification agenda that raises expectations for multi-device charging and robust EMI suppression. Local certification frameworks and procurement habits encourage suppliers to emphasize interoperability and automotive-grade reliability to win OEM engagements.

Across Europe, the Middle East & Africa, regulatory harmonization and sustainability targets elevate energy-efficiency metrics and end-of-life considerations, prompting designers to optimize standby consumption and support extended power profiles for a broader array of devices. The standards landscape and public infrastructure initiatives also influence deployment choices for resonant and inductive systems in public spaces. In the Asia-Pacific region, manufacturing density, close proximity to major OEMs, and rapid consumer adoption catalyze innovation in compact form factors, cost-optimized silicon, and high-volume qualification programs. The concentration of assembly and test capabilities here often accelerates sample cycles and iterative design validation.

Understanding these regional nuances enables suppliers to tailor packaging, firmware localization, and certification roadmaps while prioritizing supply chain resilience and partner ecosystems that align with each region's regulatory and commercial priorities.

Competitive differentiation through integrated silicon, certification support, and manufacturing partnerships that reduce OEM integration risk and enable multi-market reach

Competitive positioning among companies in the wireless charging IC space reflects a balance of system expertise, manufacturing partnerships, IP breadth, and support services. Leading firms increasingly differentiate through integrated feature sets that combine robust power conversion, intelligent thermal controls, and flexible communication stacks capable of supporting multiple standards. Firms that provide strong developer support-detailed reference designs, test vectors, and firmware update paths-often reduce OEM integration risk, which accelerates adoption of their silicon.

Partnership strategies also shape company strength. Those with deep foundry relationships and advanced packaging capabilities can offer smaller, thermally efficient modules that appeal to wearables and thin-form consumer devices. Conversely, vendors focusing on automotive or industrial sectors prioritize extended temperature ranges, functional safety compliance, and longer product life cycles. Across the board, companies that invest in interoperability testing labs and third-party certification support provide compelling value propositions, because they reduce time and cost for OEMs navigating complex standard landscapes.

Finally, firms that maintain transparent roadmaps and clear migration paths between power profiles or frequency implementations make it easier for customers to plan multi-generational device families, enhancing vendor stickiness and long-term partnerships.

Practical strategic moves for product and procurement leaders to secure supply continuity, accelerate certification, and future-proof wireless charging IC implementations

Industry leaders should pursue a set of actionable measures to protect margins, accelerate innovation, and de-risk product launches. First, embed cross-functional governance between product, firmware, and compliance teams early in development cycles to align IC selection with coil design, EMC targets, and certification timelines. Early alignment reduces rework and shortens validation cycles while ensuring that safety and interoperability checks are baked into architecture choices. Second, diversify supplier relationships for both silicon and critical passives to lower exposure to tariff-driven disruptions and single-source failures, and develop qualification playbooks that allow rapid onboarding of alternate vendors.

Third, invest in field-upgradable firmware and modular reference designs so that device firmware can respond to protocol updates or new power profiles without wholesale hardware redesigns. This approach improves product longevity and preserves R&D investments. Fourth, prioritize investments in integrated thermal and EMI mitigation within IC packages and board layouts, particularly for higher power outputs where thermal throttling and interference can undermine user experience. Fifth, align commercial negotiation strategies with lead-time realities, securing capacity commitments and clear escalation paths with suppliers to preserve production continuity.

Taken together, these actions establish a disciplined route from specification to certification and help companies maintain competitive velocity even amid shifting policy and standards landscapes.

Mixed-methods research combining practitioner interviews, standards analysis, and technical feature mapping to ensure practical and technically grounded insights for wireless charging IC decision makers

The research underpinning these insights combines qualitative engagement with industry stakeholders, technical document analysis, and comparative feature mapping of silicon offerings. Primary inputs included structured interviews with product engineers, firmware architects, and procurement leads across automotive, consumer electronics, healthcare, and industrial applications, which illuminated real-world integration challenges and priorities. Secondary analysis entailed reviewing technical standards documentation, regulatory compliance requirements, and published interoperability test procedures to contextualize certification constraints and firmware requirements.

Technical feature mapping compared controller topologies, integrated functions such as foreign-object detection and dynamic power scaling, and analog front-end choices across representative IC families. Supply chain analysis incorporated public trade policy announcements, observed shifts in sourcing patterns, and supplier capacity disclosures to assess operational risk vectors. Wherever possible, cross-validation was applied by triangulating interview findings with publicly available technical papers and implementation notes from standard-setting bodies to ensure factual accuracy.

This mixed-methods approach underscores a balance between technical fidelity and commercial applicability, ensuring recommendations are grounded in operational realities and engineering constraints relevant to decision makers.

A concise synthesis of the technical, commercial, and regulatory levers that will determine which suppliers and OEMs capture long-term value in wireless charging ICs

In sum, the wireless charging IC sector is maturing from component-focused offerings toward holistic silicon solutions that reconcile power efficiency, multi-protocol interoperability, and certification readiness. This evolution reflects the convergence of multiple drivers: tighter device form factors, higher expectations for thermal and EMI performance, and regulatory and trade conditions that compel diversified sourcing and agile product planning. The most successful suppliers will be those that offer modular, field-upgradeable silicon with strong developer support, proven compliance pathways, and resilient manufacturing relationships.

For OEMs and system integrators, success hinges on early alignment across engineering, compliance, and procurement functions, as well as on selecting partners who can demonstrably reduce integration risk and accelerate certification. By emphasizing firmware flexibility, supplier diversification, and integrated thermal and EMC solutions, stakeholders can navigate current policy and standards complexity while positioning products for rapid adoption across consumer, automotive, healthcare, and industrial segments.

Ultimately, pragmatic engineering choices combined with disciplined commercial strategies will determine who captures long-term value as wireless charging becomes a standard expectation across an expanding set of devices and use cases.

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Definition
• 1.3. Market Segmentation & Coverage
• 1.4. Years Considered for the Study
• 1.5. Currency Considered for the Study
• 1.6. Language Considered for the Study
• 1.7. Key Stakeholders

2. Research Methodology

• 2.1. Introduction
• 2.2. Research Design
  • 2.2.1. Primary Research
  • 2.2.2. Secondary Research
• 2.3. Research Framework
  • 2.3.1. Qualitative Analysis
  • 2.3.2. Quantitative Analysis
• 2.4. Market Size Estimation
  • 2.4.1. Top-Down Approach
  • 2.4.2. Bottom-Up Approach
• 2.5. Data Triangulation
• 2.6. Research Outcomes
• 2.7. Research Assumptions
• 2.8. Research Limitations

3. Executive Summary

• 3.1. Introduction
• 3.2. CXO Perspective
• 3.3. Market Size & Growth Trends
• 3.4. Market Share Analysis, 2025
• 3.5. FPNV Positioning Matrix, 2025
• 3.6. New Revenue Opportunities
• 3.7. Next-Generation Business Models
• 3.8. Industry Roadmap

4. Market Overview

• 4.1. Introduction
• 4.2. Industry Ecosystem & Value Chain Analysis
  • 4.2.1. Supply-Side Analysis
  • 4.2.2. Demand-Side Analysis
  • 4.2.3. Stakeholder Analysis
• 4.3. Porter's Five Forces Analysis
• 4.4. PESTLE Analysis
• 4.5. Market Outlook
  • 4.5.1. Near-Term Market Outlook (0-2 Years)
  • 4.5.2. Medium-Term Market Outlook (3-5 Years)
  • 4.5.3. Long-Term Market Outlook (5-10 Years)
• 4.6. Go-to-Market Strategy

5. Market Insights

• 5.1. Consumer Insights & End-User Perspective
• 5.2. Consumer Experience Benchmarking
• 5.3. Opportunity Mapping
• 5.4. Distribution Channel Analysis
• 5.5. Pricing Trend Analysis
• 5.6. Regulatory Compliance & Standards Framework
• 5.7. ESG & Sustainability Analysis
• 5.8. Disruption & Risk Scenarios
• 5.9. Return on Investment & Cost-Benefit Analysis

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. Wireless Charging IC Market, by Technology

• 8.1. Inductive Charging
• 8.2. Resonant Charging
• 8.3. Rf Charging

9. Wireless Charging IC Market, by Standard

• 9.1. A4Wp
• 9.2. Pma Standard
• 9.3. Qi Standard
  • 9.3.1. Baseline Profile
  • 9.3.2. Extended Power Profile

10. Wireless Charging IC Market, by Power Output

• 10.1. 5W To 15W
• 10.2. Above 15W
  • 10.2.1. 15W To 30W
  • 10.2.2. Above 30W
• 10.3. Up To 5W

11. Wireless Charging IC Market, by Frequency

• 11.1. 110-205 Khz
• 11.2. 13.56 Mhz
• 11.3. 6.78 Mhz

12. Wireless Charging IC Market, by Application

• 12.1. Automotive
• 12.2. Smartphone
• 12.3. Tablet
• 12.4. Wearable
  • 12.4.1. Earbuds
  • 12.4.2. Fitness Band
  • 12.4.3. Smartwatch

13. Wireless Charging IC Market, by End User

• 13.1. Automotive
• 13.2. Consumer Electronics
• 13.3. Healthcare
• 13.4. Industrial

14. Wireless Charging IC Market, by Region

• 14.1. Americas
  • 14.1.1. North America
  • 14.1.2. Latin America
• 14.2. Europe, Middle East & Africa
  • 14.2.1. Europe
  • 14.2.2. Middle East
  • 14.2.3. Africa
• 14.3. Asia-Pacific

15. Wireless Charging IC Market, by Group

• 15.1. ASEAN
• 15.2. GCC
• 15.3. European Union
• 15.4. BRICS
• 15.5. G7
• 15.6. NATO

16. Wireless Charging IC Market, by Country

• 16.1. United States
• 16.2. Canada
• 16.3. Mexico
• 16.4. Brazil
• 16.5. United Kingdom
• 16.6. Germany
• 16.7. France
• 16.8. Russia
• 16.9. Italy
• 16.10. Spain
• 16.11. China
• 16.12. India
• 16.13. Japan
• 16.14. Australia
• 16.15. South Korea

17. United States Wireless Charging IC Market

18. China Wireless Charging IC Market

19. Competitive Landscape

• 19.1. Market Concentration Analysis, 2025
  • 19.1.1. Concentration Ratio (CR)
  • 19.1.2. Herfindahl Hirschman Index (HHI)
• 19.2. Recent Developments & Impact Analysis, 2025
• 19.3. Product Portfolio Analysis, 2025
• 19.4. Benchmarking Analysis, 2025
• 19.5. Analog Devices, Inc.
• 19.6. Broadcom Inc.
• 19.7. Infineon Technologies AG
• 19.8. Integrated Device Technology, Inc.
• 19.9. Microchip Technology Incorporated
• 19.10. NXP Semiconductors N.V.
• 19.11. onsemi Corporation
• 19.12. Qualcomm Incorporated
• 19.13. ROHM Co., Ltd.
• 19.14. Samsung Electronics Co., Ltd.
• 19.15. STMicroelectronics N.V.
• 19.16. Texas Instruments Incorporated