세계의 유리 인터포저 시장 규모, 점유율, 동향 분석 : 웨이퍼 사이즈별, 용도별, 기판 기술별, 최종 용도 산업별, 지역별 전망과 예측(2025-2032년)

The Global Glass Interposers Market size is expected to reach $303.45 million by 2032, rising at a market growth of 12.1% CAGR during the forecast period.

Key Highlights:

• The Asia Pacific market dominated Global Glass Interposers Market in 2024, accounting for a 47.9% revenue share in 2024.
• The U.S. market is projected to maintain its leadership in North America, reaching a market size of USD 31.71 million by 2032.
• Among the Wafer Size, the 300 mm segment dominated the global market, contributing a revenue share of 59.11% in 2024.
• In terms of Application, 2.5D Packaging segment are expected to lead the global market, with a projected revenue share of 50.48% by 2032.
• The Through-Glass Vias (TGV) segment emerged as the leading Substrate Technology in 2024, capturing a 59.65% revenue share, and is projected to retain its dominance during the forecast period.
• The Consumer Electronics segment In End Use is poised to grow at the market in 2032 with 33.78% revenue share, and is projected to maintain its dominant position throughout the forecast period.

Glass interposers evolved as a game-changer for 2.5D semiconductor packing, due to its superior thermal capabilities, enhanced mechanical robustness, and signal integrity. Market giants such as Intel and Samsung Electronics are speeding their R&D, patent registration, and market deployment initiatives, with applications across the industries such as AI, telecommunication, automotive, and high-performance computers (HPC). Furthermore, Samsung is trying to achieve a transition from silicon to glass interposers by 2028 with the help of parallel-path innovation plan. The company is also collaborating with Chemtronics, Corning, and Philoptics. Similarly, Intel dominates in patent holdings, covering domains like photonic integration, hybrid bonding, and thermally conductive via shields, with the association of players like Huawei, SJ Semi, Absolics.

Furthermore, strategic partnerships, material and tooling collaborations, and the growing use of technology in areas like automotive and telecom are all driving the commercialization of the industry. As per the Semiconductor Industry Association (SIA), global semiconductor sales were $179.7 billion during the second quarter of 2025, an increase of 7.8% compared to Q1. This growth is driving the growth of the glass interposers market. In addition, glass interposers work best in mmWave applications and high-heat environments, enabling their use in ADAS and base stations. Moreover, silicon interposers are still the most popular, but a small group of companies-Intel, Samsung, Corning, Toppan, Absolics, and SJ Semi-are becoming leaders in technology and ecosystem control through patents and early production capacity. Glass interposers are ready for quick adoption because of aggressive global R&D, growing IP portfolios, and ecosystem lock-in strategies. This means that next-generation semiconductor packaging standards are about to change.

Market Share Analysis

COVID 19 Impact Analysis

The breakout of COVID-19 substantially impacted the global glass interposers industry because of its ramifications in terms of supply chains, deferment of R&D operations, as well as disruption of production activity in main semiconductor centers like Taiwan, South Korea, as well as America. Lockdowns as well as production halts provided a scarcity of core material like ultra-flat glass substrates, stifling the advancement of developmental prototypes. The glass interposer industry was setback temporarily due to disruption of global supplies as well as time lost in semiconductor production due to the outbreak of COVID-19.

Wafer Size Outlook

Based on Wafer Size, the market is segmented into 300 mm, 200 mm, and Less than 200 mm. The 200 mm segment attained a 27.7% revenue share in the market in 2024. It is a preferred choice for mid-tier applications that don't require the scale of 300 mm wafers but still demand reliable functionality. Industries like automotive electronics, IoT devices, and industrial automation benefit from the affordability and compatibility of this wafer size.

Application Outlook

Based on Application, the market is segmented into 2.5D Packaging, 3D Packaging, and Fan-Out Packaging. The 3D Packaging segment recorded 35.1% revenue share in the market in 2024. It is used in high-end processors, memory modules, and applications where miniaturization and performance are essential. The approach enhances system speed and power efficiency, which is vital in compact and mobile platforms.

Regional Outlook

Region-wise, the market is segmented into North America, Europe, Asia-Pacific, LAMEA. The Asia Pacific segment Registered 47.9% revenue share in the market in 2024, owing to its strong semiconductor manufacturing base, high-volume consumer electronics production, and widespread infrastructure development. The glass interposers market is growing quickly in North America and Europe thanks to strong research and development, early commercialization, and a focus on high-performance computing (HPC), AI, and photonics. Intel and Corning lead the way in the U.S., which is a major center for innovation. Europe, on the other hand, uses its knowledge of automotive electronics to make 5G base stations and ADAS modules. The regional supply chain is getting stronger thanks to collaborative ecosystems with suppliers of glass substrates and tools.

Samsung, TSMC, and regional OSATs are making big investments in South Korea, Japan, Taiwan, and China, making the Asia Pacific region the biggest growth center. Partnerships with material suppliers and the ability to quickly make prototypes are speeding up the process of bringing products to market, especially for AI and HPC packaging. LAMEA is slowly gaining ground, with opportunities in telecom, 5G infrastructure, and automotive electronics, especially in the Middle East and South Africa, thanks to technology transfer from big companies around the world.

Recent Strategies Deployed in the Market

• May-2025: Corning Incorporated teamed up with Broadcom to advance next-gen AI data center capabilities using Corning's innovative glass substrates. These substrates enable ultra-high bandwidth and energy-efficient interconnects essential for advanced chip packaging. The collaboration marks a major step in scaling glass interposers for high-performance computing and AI workloads.
• Aug-2024: Schott AG unveiled a new low-loss glass engineered for high-frequency semiconductor packaging. With a dielectric constant of 4.0 and dielectric loss of just 0.0021 at 10 GHz, it enhances signal integrity and efficiency in 5G/6G, RF, and chip interposers-boosting performance, reliability, and energy savings for cutting-edge semiconductor devices.
• Mar-2023: Dai Nippon Printing Co., Ltd. unveiled a Glass Core Substrate (GCS) with high-density Through-Glass Vias (TGV), engineered to replace traditional resin substrates in advanced semiconductor packaging. Designed for fine-pitch wiring, high aspect-ratio vias (9+), and scalable panel production, it promises enhanced performance and large-area applicability.
• Oct-2022: PLANOPTIK AG unveiled an Advanced Connectivity Technology (ACT) that produces copper-metallized glass interposers up to 300 mm with through-glass vias as small as 100 µm. These 200-1000 µm thick wafers support integrated RDL and enable high-frequency, low-loss 3D connectivity-ideal for 5G, radar, imaging sensors, and beyond.
• Jul-2022: 3DGS Inc. unveiled its pure-play, volume-ready glass foundry using APEX photosensitive glass, offering low-loss, high-Q RF performance in compact interposers. The scalable LC-IPD process and design-to-production flow support 0.1-10 GHz applications, including 2.5D/3D packaging, antennas, and RF filters-boosting glass interposer adoption for heterogeneous integration.

List of Key Companies Profiled

• Corning Incorporated
• AGC Inc.
• Schott AG (Carl-Zeiss-Stiftung)
• Dai Nippon Printing Co., Ltd.
• Tecnisco, LTD. (Disco Corporation)
• Samtec, Inc.
• RENA Technologies GmbH
• PLANOPTIK AG
• 3DGS Inc.
• Workshop of Photonics

Global Glass Interposers Market Report Segmentation

By Wafer Size

• 300 mm
• 200 mm
• Less than 200 mm

By Application

• 2.5D Packaging
• 3D Packaging
• Fan-Out Packaging

By Substrate Technology

• Through-Glass Vias (TGV)
• Redistribution Layer (RDL)-First/Last
• Glass Panel Level Packaging (PLP)

By End Use Industry

• Consumer Electronics
• Telecommunications
• Automotive
• Defense & Aerospace
• Healthcare
• Other End Use Industry

By Geography

• North America
  • US
  • Canada
  • Mexico
  • Rest of North America
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
• LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Table of Contents

Chapter 1. Market Scope & Methodology

• 1.1 Market Definition
• 1.2 Objectives
• 1.3 Market Scope
• 1.4 Segmentation
  • 1.4.1 Global Glass Interposers Market, by Wafer Size
  • 1.4.2 Global Glass Interposers Market, by Application
  • 1.4.3 Global Glass Interposers Market, by Substrate Technology
  • 1.4.4 Global Glass Interposers Market, by End Use Industry
  • 1.4.5 Global Glass Interposers Market, by Geography
• 1.5 Methodology for the research

Chapter 2. Market at a Glance

• 2.1 Key Highlights

Chapter 3. Market Overview

• 3.1 Introduction
  • 3.1.1 Overview
    • 3.1.1.1 Market Composition and Scenario
• 3.2 Key Factors Impacting the Market
  • 3.2.1 Market Drivers
  • 3.2.2 Market Restraints
  • 3.2.3 Market Opportunities
  • 3.2.4 Market Challenges

Chapter 4. Competition Analysis - Global

• 4.1 Market Share Analysis, 2024
• 4.2 Recent Strategies Deployed in Glass Interposers Market
• 4.3 Porter Five Forces Analysis

Chapter 5. Market Trends Global Glass Interposers Market

Chapter 6. State of Competition Glass Interposers Market

Chapter 7. PLC (Product Life Cycle) Glass Interposers Market

Chapter 8. Market Consolidation - Glass Interposers Market

Chapter 9. Value Chain Analysis of Glass Interposers Market

Chapter 10. Key Customer Criteria - Glass Interposers Market

Chapter 11. Global Glass Interposers Market by Wafer Size

• 11.1 Global 300 mm Market by Region
• 11.2 Global 200 mm Market by Region
• 11.3 Global Less than 200 mm Market by Region

Chapter 12. Global Glass Interposers Market by Application

• 12.1 Global 2.5D Packaging Market by Region
• 12.2 Global 3D Packaging Market by Region
• 12.3 Global Fan-Out Packaging Market by Region

Chapter 13. Global Glass Interposers Market by Substrate Technology

• 13.1 Global Through-Glass Vias (TGV) Market by Region
• 13.2 Global Redistribution Layer (RDL)-First/Last Market by Region
• 13.3 Global Glass Panel Level Packaging (PLP) Market by Region

Chapter 14. Global Glass Interposers Market by End Use Industry

• 14.1 Global Consumer Electronics Market by Region
• 14.2 Global Telecommunications Market by Region
• 14.3 Global Automotive Market by Region
• 14.4 Global Defense & Aerospace Market by Region
• 14.5 Global Healthcare Market by Region
• 14.6 Global Other End Use Industry Market by Region

Chapter 15. Global Glass Interposers Market by Region

• 15.1 North America Glass Interposers Market
  • 15.1.1 Market
  • 15.1.2 Drivers
  • 15.1.3 Market Restraints
  • 15.1.4 Market Opportunities
  • 15.1.5 Market Challenges
  • 15.1.6 Market Trends North America Glass Interposers Market
  • 15.1.7 State of Competition North America Glass Interposers Market
  • 15.1.8 North America Glass Interposers Market by Wafer Size
    • 15.1.8.1 North America 300 mm Market by Country
    • 15.1.8.2 North America 200 mm Market by Country
    • 15.1.8.3 North America Less than 200 mm Market by Country
  • 15.1.9 North America Glass Interposers Market by Application
    • 15.1.9.1 North America 2.5D Packaging Market by Country
    • 15.1.9.2 North America 3D Packaging Market by Country
    • 15.1.9.3 North America Fan-Out Packaging Market by Country
  • 15.1.10 North America Glass Interposers Market by Substrate Technology
    • 15.1.10.1 North America Through-Glass Vias (TGV) Market by Country
    • 15.1.10.2 North America Redistribution Layer (RDL)-First/Last Market by Country
    • 15.1.10.3 North America Glass Panel Level Packaging (PLP) Market by Country
  • 15.1.11 North America Glass Interposers Market by End Use Industry
    • 15.1.11.1 North America Consumer Electronics Market by Country
    • 15.1.11.2 North America Telecommunications Market by Country
    • 15.1.11.3 North America Automotive Market by Country
    • 15.1.11.4 North America Defense & Aerospace Market by Country
    • 15.1.11.5 North America Healthcare Market by Country
    • 15.1.11.6 North America Other End Use Industry Market by Country
  • 15.1.12 North America Glass Interposers Market by Country
    • 15.1.12.1 US Glass Interposers Market
      • 15.1.12.1.1 US Glass Interposers Market by Wafer Size
      • 15.1.12.1.2 US Glass Interposers Market by Application
      • 15.1.12.1.3 US Glass Interposers Market by Substrate Technology
      • 15.1.12.1.4 US Glass Interposers Market by End Use Industry
    • 15.1.12.2 Canada Glass Interposers Market
      • 15.1.12.2.1 Canada Glass Interposers Market by Wafer Size
      • 15.1.12.2.2 Canada Glass Interposers Market by Application
      • 15.1.12.2.3 Canada Glass Interposers Market by Substrate Technology
      • 15.1.12.2.4 Canada Glass Interposers Market by End Use Industry
    • 15.1.12.3 Mexico Glass Interposers Market
      • 15.1.12.3.1 Mexico Glass Interposers Market by Wafer Size
      • 15.1.12.3.2 Mexico Glass Interposers Market by Application
      • 15.1.12.3.3 Mexico Glass Interposers Market by Substrate Technology
      • 15.1.12.3.4 Mexico Glass Interposers Market by End Use Industry
    • 15.1.12.4 Rest of North America Glass Interposers Market
      • 15.1.12.4.1 Rest of North America Glass Interposers Market by Wafer Size
      • 15.1.12.4.2 Rest of North America Glass Interposers Market by Application
      • 15.1.12.4.3 Rest of North America Glass Interposers Market by Substrate Technology
      • 15.1.12.4.4 Rest of North America Glass Interposers Market by End Use Industry
• 15.2 Europe Glass Interposers Market
  • 15.2.1 Market Drivers
  • 15.2.2 Market Restraints
  • 15.2.3 Market Opportunities
  • 15.2.4 Market Challenges
  • 15.2.5 Market Trends Europe Glass Interposers Market
  • 15.2.6 State of Competition Europe Glass Interposers Market
  • 15.2.7 Europe Glass Interposers Market by Wafer Size
    • 15.2.7.1 Europe 300 mm Market by Country
    • 15.2.7.2 Europe 200 mm Market by Country
    • 15.2.7.3 Europe Less than 200 mm Market by Country
  • 15.2.8 Europe Glass Interposers Market by Application
    • 15.2.8.1 Europe 2.5D Packaging Market by Country
    • 15.2.8.2 Europe 3D Packaging Market by Country
    • 15.2.8.3 Europe Fan-Out Packaging Market by Country
  • 15.2.9 Europe Glass Interposers Market by Substrate Technology
    • 15.2.9.1 Europe Through-Glass Vias (TGV) Market by Country
    • 15.2.9.2 Europe Redistribution Layer (RDL)-First/Last Market by Country
    • 15.2.9.3 Europe Glass Panel Level Packaging (PLP) Market by Country
  • 15.2.10 Europe Glass Interposers Market by End Use Industry
    • 15.2.10.1 Europe Consumer Electronics Market by Country
    • 15.2.10.2 Europe Telecommunications Market by Country
    • 15.2.10.3 Europe Automotive Market by Country
    • 15.2.10.4 Europe Defense & Aerospace Market by Country
    • 15.2.10.5 Europe Healthcare Market by Country
    • 15.2.10.6 Europe Other End Use Industry Market by Country
  • 15.2.11 Europe Glass Interposers Market by Country
    • 15.2.11.1 Germany Glass Interposers Market
      • 15.2.11.1.1 Germany Glass Interposers Market by Wafer Size
      • 15.2.11.1.2 Germany Glass Interposers Market by Application
      • 15.2.11.1.3 Germany Glass Interposers Market by Substrate Technology
      • 15.2.11.1.4 Germany Glass Interposers Market by End Use Industry
    • 15.2.11.2 UK Glass Interposers Market
      • 15.2.11.2.1 UK Glass Interposers Market by Wafer Size
      • 15.2.11.2.2 UK Glass Interposers Market by Application
      • 15.2.11.2.3 UK Glass Interposers Market by Substrate Technology
      • 15.2.11.2.4 UK Glass Interposers Market by End Use Industry
    • 15.2.11.3 France Glass Interposers Market
      • 15.2.11.3.1 France Glass Interposers Market by Wafer Size
      • 15.2.11.3.2 France Glass Interposers Market by Application
      • 15.2.11.3.3 France Glass Interposers Market by Substrate Technology
      • 15.2.11.3.4 France Glass Interposers Market by End Use Industry
    • 15.2.11.4 Russia Glass Interposers Market
      • 15.2.11.4.1 Russia Glass Interposers Market by Wafer Size
      • 15.2.11.4.2 Russia Glass Interposers Market by Application
      • 15.2.11.4.3 Russia Glass Interposers Market by Substrate Technology
      • 15.2.11.4.4 Russia Glass Interposers Market by End Use Industry
    • 15.2.11.5 Spain Glass Interposers Market
      • 15.2.11.5.1 Spain Glass Interposers Market by Wafer Size
      • 15.2.11.5.2 Spain Glass Interposers Market by Application
      • 15.2.11.5.3 Spain Glass Interposers Market by Substrate Technology
      • 15.2.11.5.4 Spain Glass Interposers Market by End Use Industry
    • 15.2.11.6 Italy Glass Interposers Market
      • 15.2.11.6.1 Italy Glass Interposers Market by Wafer Size
      • 15.2.11.6.2 Italy Glass Interposers Market by Application
      • 15.2.11.6.3 Italy Glass Interposers Market by Substrate Technology
      • 15.2.11.6.4 Italy Glass Interposers Market by End Use Industry
    • 15.2.11.7 Rest of Europe Glass Interposers Market
      • 15.2.11.7.1 Rest of Europe Glass Interposers Market by Wafer Size
      • 15.2.11.7.2 Rest of Europe Glass Interposers Market by Application
      • 15.2.11.7.3 Rest of Europe Glass Interposers Market by Substrate Technology
      • 15.2.11.7.4 Rest of Europe Glass Interposers Market by End Use Industry
• 15.3 Asia Pacific Glass Interposers Market
  • 15.3.1 Market Drivers
  • 15.3.2 Market Restraints
  • 15.3.3 Market Opportunities
  • 15.3.4 Market Challenges
  • 15.3.5 Market Trends - Asia Pacific Glass Interposers Market
  • 15.3.6 State of Competition Asia Pacific Glass Interposers Market
  • 15.3.7 Asia Pacific Glass Interposers Market by Wafer Size
    • 15.3.7.1 Asia Pacific 300 mm Market by Country
    • 15.3.7.2 Asia Pacific 200 mm Market by Country
    • 15.3.7.3 Asia Pacific Less than 200 mm Market by Country
  • 15.3.8 Asia Pacific Glass Interposers Market by Application
    • 15.3.8.1 Asia Pacific 2.5D Packaging Market by Country
    • 15.3.8.2 Asia Pacific 3D Packaging Market by Country
    • 15.3.8.3 Asia Pacific Fan-Out Packaging Market by Country
  • 15.3.9 Asia Pacific Glass Interposers Market by Substrate Technology
    • 15.3.9.1 Asia Pacific Through-Glass Vias (TGV) Market by Country
    • 15.3.9.2 Asia Pacific Redistribution Layer (RDL)-First/Last Market by Country
    • 15.3.9.3 Asia Pacific Glass Panel Level Packaging (PLP) Market by Country
  • 15.3.10 Asia Pacific Glass Interposers Market by End Use Industry
    • 15.3.10.1 Asia Pacific Consumer Electronics Market by Country
    • 15.3.10.2 Asia Pacific Telecommunications Market by Country
    • 15.3.10.3 Asia Pacific Automotive Market by Country
    • 15.3.10.4 Asia Pacific Defense & Aerospace Market by Country
    • 15.3.10.5 Asia Pacific Healthcare Market by Country
    • 15.3.10.6 Asia Pacific Other End Use Industry Market by Country
  • 15.3.11 Asia Pacific Glass Interposers Market by Country
    • 15.3.11.1 China Glass Interposers Market
      • 15.3.11.1.1 China Glass Interposers Market by Wafer Size
      • 15.3.11.1.2 China Glass Interposers Market by Application
      • 15.3.11.1.3 China Glass Interposers Market by Substrate Technology
      • 15.3.11.1.4 China Glass Interposers Market by End Use Industry
    • 15.3.11.2 Japan Glass Interposers Market
      • 15.3.11.2.1 Japan Glass Interposers Market by Wafer Size
      • 15.3.11.2.2 Japan Glass Interposers Market by Application
      • 15.3.11.2.3 Japan Glass Interposers Market by Substrate Technology
      • 15.3.11.2.4 Japan Glass Interposers Market by End Use Industry
    • 15.3.11.3 India Glass Interposers Market
      • 15.3.11.3.1 India Glass Interposers Market by Wafer Size
      • 15.3.11.3.2 India Glass Interposers Market by Application
      • 15.3.11.3.3 India Glass Interposers Market by Substrate Technology
      • 15.3.11.3.4 India Glass Interposers Market by End Use Industry
    • 15.3.11.4 South Korea Glass Interposers Market
      • 15.3.11.4.1 South Korea Glass Interposers Market by Wafer Size
      • 15.3.11.4.2 South Korea Glass Interposers Market by Application
      • 15.3.11.4.3 South Korea Glass Interposers Market by Substrate Technology
      • 15.3.11.4.4 South Korea Glass Interposers Market by End Use Industry
    • 15.3.11.5 Singapore Glass Interposers Market
      • 15.3.11.5.1 Singapore Glass Interposers Market by Wafer Size
      • 15.3.11.5.2 Singapore Glass Interposers Market by Application
      • 15.3.11.5.3 Singapore Glass Interposers Market by Substrate Technology
      • 15.3.11.5.4 Singapore Glass Interposers Market by End Use Industry
    • 15.3.11.6 Malaysia Glass Interposers Market
      • 15.3.11.6.1 Malaysia Glass Interposers Market by Wafer Size
      • 15.3.11.6.2 Malaysia Glass Interposers Market by Application
      • 15.3.11.6.3 Malaysia Glass Interposers Market by Substrate Technology
      • 15.3.11.6.4 Malaysia Glass Interposers Market by End Use Industry
    • 15.3.11.7 Rest of Asia Pacific Glass Interposers Market
      • 15.3.11.7.1 Rest of Asia Pacific Glass Interposers Market by Wafer Size
      • 15.3.11.7.2 Rest of Asia Pacific Glass Interposers Market by Application
      • 15.3.11.7.3 Rest of Asia Pacific Glass Interposers Market by Substrate Technology
      • 15.3.11.7.4 Rest of Asia Pacific Glass Interposers Market by End Use Industry
• 15.4 LAMEA Glass Interposers Market
  • 15.4.1 Market Drivers
  • 15.4.2 Market Restraints
  • 15.4.3 Market Opportunities
  • 15.4.4 Market Challenges
  • 15.4.5 Market Trends - LAMEA Glass Interposers Market
  • 15.4.6 State of Competition - LAMEA Glass Interposers Market
  • 15.4.7 LAMEA Glass Interposers Market by Wafer Size
    • 15.4.7.1 LAMEA 300 mm Market by Country
    • 15.4.7.2 LAMEA 200 mm Market by Country
    • 15.4.7.3 LAMEA Less than 200 mm Market by Country
  • 15.4.8 LAMEA Glass Interposers Market by Application
    • 15.4.8.1 LAMEA 2.5D Packaging Market by Country
    • 15.4.8.2 LAMEA 3D Packaging Market by Country
    • 15.4.8.3 LAMEA Fan-Out Packaging Market by Country
  • 15.4.9 LAMEA Glass Interposers Market by Substrate Technology
    • 15.4.9.1 LAMEA Through-Glass Vias (TGV) Market by Country
    • 15.4.9.2 LAMEA Redistribution Layer (RDL)-First/Last Market by Country
    • 15.4.9.3 LAMEA Glass Panel Level Packaging (PLP) Market by Country
  • 15.4.10 LAMEA Glass Interposers Market by End Use Industry
    • 15.4.10.1 LAMEA Consumer Electronics Market by Country
    • 15.4.10.2 LAMEA Telecommunications Market by Country
    • 15.4.10.3 LAMEA Automotive Market by Country
    • 15.4.10.4 LAMEA Defense & Aerospace Market by Country
    • 15.4.10.5 LAMEA Healthcare Market by Country
    • 15.4.10.6 LAMEA Other End Use Industry Market by Country
  • 15.4.11 LAMEA Glass Interposers Market by Country
    • 15.4.11.1 Brazil Glass Interposers Market
      • 15.4.11.1.1 Brazil Glass Interposers Market by Wafer Size
      • 15.4.11.1.2 Brazil Glass Interposers Market by Application
      • 15.4.11.1.3 Brazil Glass Interposers Market by Substrate Technology
      • 15.4.11.1.4 Brazil Glass Interposers Market by End Use Industry
    • 15.4.11.2 Argentina Glass Interposers Market
      • 15.4.11.2.1 Argentina Glass Interposers Market by Wafer Size
      • 15.4.11.2.2 Argentina Glass Interposers Market by Application
      • 15.4.11.2.3 Argentina Glass Interposers Market by Substrate Technology
      • 15.4.11.2.4 Argentina Glass Interposers Market by End Use Industry
    • 15.4.11.3 UAE Glass Interposers Market
      • 15.4.11.3.1 UAE Glass Interposers Market by Wafer Size
      • 15.4.11.3.2 UAE Glass Interposers Market by Application
      • 15.4.11.3.3 UAE Glass Interposers Market by Substrate Technology
      • 15.4.11.3.4 UAE Glass Interposers Market by End Use Industry
    • 15.4.11.4 Saudi Arabia Glass Interposers Market
      • 15.4.11.4.1 Saudi Arabia Glass Interposers Market by Wafer Size
      • 15.4.11.4.2 Saudi Arabia Glass Interposers Market by Application
      • 15.4.11.4.3 Saudi Arabia Glass Interposers Market by Substrate Technology
      • 15.4.11.4.4 Saudi Arabia Glass Interposers Market by End Use Industry
    • 15.4.11.5 South Africa Glass Interposers Market
      • 15.4.11.5.1 South Africa Glass Interposers Market by Wafer Size
      • 15.4.11.5.2 South Africa Glass Interposers Market by Application
      • 15.4.11.5.3 South Africa Glass Interposers Market by Substrate Technology
      • 15.4.11.5.4 South Africa Glass Interposers Market by End Use Industry
    • 15.4.11.6 Nigeria Glass Interposers Market
      • 15.4.11.6.1 Nigeria Glass Interposers Market by Wafer Size
      • 15.4.11.6.2 Nigeria Glass Interposers Market by Application
      • 15.4.11.6.3 Nigeria Glass Interposers Market by Substrate Technology
      • 15.4.11.6.4 Nigeria Glass Interposers Market by End Use Industry
    • 15.4.11.7 Rest of LAMEA Glass Interposers Market
      • 15.4.11.7.1 Rest of LAMEA Glass Interposers Market by Wafer Size
      • 15.4.11.7.2 Rest of LAMEA Glass Interposers Market by Application
      • 15.4.11.7.3 Rest of LAMEA Glass Interposers Market by Substrate Technology
      • 15.4.11.7.4 Rest of LAMEA Glass Interposers Market by End Use Industry

Chapter 16. Company Profiles

• 16.1 Corning Incorporated
  • 16.1.1 Company Overview
  • 16.1.2 Financial Analysis
  • 16.1.3 Segmental and Regional Analysis
  • 16.1.4 Research & Development Expenses
  • 16.1.5 Recent strategies and developments:
    • 16.1.5.1 Partnerships, Collaborations, and Agreements:
  • 16.1.6 SWOT Analysis
• 16.2 AGC, Inc.
  • 16.2.1 Company Overview
  • 16.2.2 Financial Analysis
  • 16.2.3 Segmental Analysis
  • 16.2.4 Research & Development Expenses
  • 16.2.5 SWOT Analysis
• 16.3 Schott AG (Carl-Zeiss-Stiftung)
  • 16.3.1 Company Overview
  • 16.3.2 Financial Analysis
  • 16.3.3 Segmental and Regional Analysis
  • 16.3.4 Research & Development Expenses
  • 16.3.5 Recent strategies and developments:
    • 16.3.5.1 Product Launches and Product Expansions:
  • 16.3.6 SWOT Analysis
• 16.4 Dai Nippon Printing Co., Ltd.
  • 16.4.1 Company Overview
  • 16.4.2 Financial Analysis
  • 16.4.3 Segmental and Regional Analysis
  • 16.4.4 Research & Development Expenses
  • 16.4.5 Recent strategies and developments:
    • 16.4.5.1 Product Launches and Product Expansions:
• 16.5 Tecnisco, LTD. (Disco Corporation)
  • 16.5.1 Company Overview
  • 16.5.2 Financial Analysis
• 16.6 Samtec, Inc.
  • 16.6.1 Company Overview
  • 16.6.2 SWOT Analysis
• 16.7 RENA Technologies GmbH
  • 16.7.1 Company Overview
• 16.8 PLANOPTIK AG
  • 16.8.1 Company Overview
  • 16.8.2 Financial Analysis
  • 16.8.3 Research & Development Expenses
  • 16.8.4 Recent strategies and developments:
    • 16.8.4.1 Product Launches and Product Expansions:
• 16.9 3DGS Inc.
  • 16.9.1 Company Overview
  • 16.9.2 Recent strategies and developments:
    • 16.9.2.1 Product Launches and Product Expansions:
• 16.10. Workshop of Photonics
  • 16.10.1 Company Overview

Chapter 17. Winning Imperatives of Glass Interposers Market