FFC 및 FPC 기판 커넥터 시장 : 예측(2024-2029년)

The FFC And FPC Circuit Board Connector market is projected to grow at a CAGR of 8.79% from estimated value of US$1,604.555 million in 2024 to US$2,444.664 million in 2029.

FFC (Flexible Flat Cable) and FPC (Flexible Printed Circuit) connections are electronic device connectors that link flexible flat cables or printed circuits to printed circuit boards (PCBs) or other electronic components.

FFC connections link flexible flat cables (ribbon cables) to electronic equipment such as printed circuit boards. They are generally employed in situations requiring limited space or bending flexibility. They are widely used in consumer electronics, including computers, printers, scanners, cameras, and mobile devices, for internal connections and signal transfer.

FPC connections are required for attaching FPC boards to electronic components, providing proper electrical communication. They are utilized in a variety of electronic products, including smartphones, tablets, wearables, automotive electronics, medical devices, and industrial machinery. These connections provide dependable signal transmission and power distribution in small, adaptable designs.

Market Drivers

• Miniaturization and space-saving are contributing to the global FFC and FPC Circuit board connector market growth

The demand for smaller, lighter electronic equipment in areas such as consumer electronics, automotive, healthcare, and aerospace demands compact, space-saving parts. FFC and FPC connections have a flat, flexible, and thin form factor, making them appropriate for applications that need limited space and assist miniaturization goals in wearable devices.

According to data from the United States International Trade Commission US exports of electronic products increased from 286,145 million USD in 2021 to 302,850 million USD in 2022.

Among various products available in the market, one is the AFOAH, a multi-jacket optical cable constructed of PE and nylon that contains up to 60 optical fibers in water-blocked loose tubes with solid polyethylene fillers. It is built to endure extreme circumstances such as rodents and dampness, having a glass-reinforced plastic center strength part.

Overall, FFC and FPC connectors are gaining market share as a result of their miniaturization and space-saving capabilities, which cater to the growing demand for smaller, lighter, and more efficient electronic devices. Their continued emphasis on compact designs and innovative applications is anticipated to encourage further adoption.

• Increasing speed data transmission is contributing to the global FFC and FPC circuit board connector market growth

FFC and FPC connectors are designed to support high-speed data transmission rates, making them suitable for use in high-performance electronic systems. They are used in applications such as displays, cameras, data storage devices, and consumer electronics where reliable and high-speed signal integrity is essential.

One of the products is the Q2(TM) robust high-speed connectors that have Edge Rate(R) contacts, deeper insertion depths, and robust designs for contact protection during mating and unmating. They offer a maximum NRZ performance of 25 Gbps, are two-stage hot-pluggable, have an integrated ground/power plane, are insulated, and have a power combo option.

Researchers from DTU and Chalmers University of Technology have achieved the world's first transmission of over 1 petabit per second using a single laser and optical chip. The team successfully transmitted 1.8 Pbit/s, twice the total global Internet traffic, making them the first to achieve this feat.

Overall, the global FFC and FPC connection market is growing as a result of technological improvements, the industry's need for quicker, more reliable data transfer, data-intensive applications, and the requirement for small, high-density interconnect solutions.

Market Restraints

• Complexity in manufacturing and assembly hamper the market growth

FFC and FPC connector production and assembly methods can be more sophisticated than those used in conventional connectors. Handling flexible materials, precise alignment, and specialized equipment for termination and soldering may necessitate knowledge and investment in production facilities, which might be prohibitive for smaller businesses or startups.

Global Ffc And Fpc circuit board connector market is segmented based on different types-

The global FFC And Fpc Circuit board connector market is segmented based on different types into below 30 contacts, 30-60 contacts, and above 60 contacts. FFC and FPC connections with less than 30 contacts are perfect for providing easy connectivity solutions in tiny electronic devices such as smartphones, digital cameras, handheld gadgets, IoT sensors, and portable medical equipment, resulting in compact designs and low connection needs.

FFC and FPC connections with 30-60 contacts are appropriate for moderate connectivity applications in electronic devices such as laptops, tablets, game consoles, automotive electronics, industrial control systems, and communication devices. They provide a balance of size, complexity, and capability.

These connectors with more than 60 connections can support a greater number of signals, data channels, or connections, making them ideal for sophisticated electronic systems, high-resolution displays, multipurpose devices, medical imaging, and aerospace applications.

North America is anticipated to hold a significant share of the global FFC And Fpc Circuit board connector market

North America, notably the United States, is a center of electronics innovation. Large producers, suppliers, and developers of FFC and FPC connectors contribute to the country's worldwide market domination via technological skills and infrastructure.

North American companies are focused on innovation, customization, and R&D to produce new FFC and FPC connection solutions that will help them compete in the worldwide market by improving materials, designs, signal integrity, and high-speed data transfer.

Overall, North America is likely to lead the FFC and FPC connector markets because of technological developments, industry diversity, strong manufacturing capabilities, an inventive culture, and demand from important industries.

Key Developments

• February 2024 - Samtec's EdgeRate(R) board-to-board connections range then included a greater density mated set and a lower-profile 5 mm mated height (ERF6 & ERM6 Series). These connections are appropriate for 56 Gbps PAM4 rugged mezzanine applications like as industrial, embedded vision, instrumentation, monitoring, drones, and robotics.
• November 2023 - DigiKey collaborated with Ambiq to offer their ultra-low power semiconductors, including Apollo4 Blue Plus, which supports Bluetooth(R) Low Energy, graphics, and audio on IoT endpoints. This low dynamic power microcontroller allows designers of next-generation wearables and battery-powered smart products to speed up innovation.

Company Products

• QUAD LC ADAPTER- Molex's quad LC adapter is a high-density solution that has four LC ports to accommodate numerous connections. It is available in snap-mount or screw-mount installation techniques, with independent shutters for eye protection. It is available with Phosphor Bronze or Zirconia Ceramic alignment sleeves and may be used to replace the duplex SC adapter.
• SUPERNOVA(TM) LOW- SUPERNOVA(TM) LOW one-piece compression connectors are durable, high-shock, and vibration-resistant interposers with strong designs, mechanical hold downs, screw downs, and a low profile in a variety of pitch sizes. They are ideal for low-cost board stacking, module-to-board, and LGA interfaces, as they reduce thermal expansion.

Market Segmentation

By Type

• Below 30 Contacts
• 30-60 Contacts
• Above 60 Contacts

By End-User

• Automotive
• Consumer Electronics
• Household Appliances
• Others

By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• UK
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Israel
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Indonesia
• Taiwan
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base and Forecast Years Timeline
• 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis
• 4.5. Analyst View

5. FFC AND FPC CIRCUIT BOARD CONNECTOR MARKET BY TYPE

• 5.1. Introduction
• 5.2. Below 30 Contacts
  • 5.2.1. Market opportunities and trends
  • 5.2.2. Growth prospects
  • 5.2.3. Geographic lucrativeness
• 5.3. 30-60 Contacts
  • 5.3.1. Market opportunities and trends
  • 5.3.2. Growth prospects
  • 5.3.3. Geographic lucrativeness
• 5.4. Above 60 Contacts
  • 5.4.1. Market opportunities and trends
  • 5.4.2. Growth prospects
  • 5.4.3. Geographic lucrativeness

6. FFC AND FPC CIRCUIT BOARD CONNECTOR MARKET BY END-USER

• 6.1. Introduction
• 6.2. Automotive
  • 6.2.1. Market opportunities and trends
  • 6.2.2. Growth prospects
  • 6.2.3. Geographic lucrativeness
• 6.3. Consumer Electronics
  • 6.3.1. Market opportunities and trends
  • 6.3.2. Growth prospects
  • 6.3.3. Geographic lucrativeness
• 6.4. Household Appliances
  • 6.4.1. Market opportunities and trends
  • 6.4.2. Growth prospects
  • 6.4.3. Geographic lucrativeness
• 6.5. Others
  • 6.5.1. Market opportunities and trends
  • 6.5.2. Growth prospects
  • 6.5.3. Geographic lucrativeness

7. FFC AND FPC CIRCUIT BOARD CONNECTOR MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. By Type
  • 7.2.2. By End-user
  • 7.2.3. By Country
    • 7.2.3.1. United States
      • 7.2.3.1.1. Market Trends and Opportunities
      • 7.2.3.1.2. Growth Prospects
    • 7.2.3.2. Canada
      • 7.2.3.2.1. Market Trends and Opportunities
      • 7.2.3.2.2. Growth Prospects
    • 7.2.3.3. Mexico
      • 7.2.3.3.1. Market Trends and Opportunities
      • 7.2.3.3.2. Growth Prospects
• 7.3. South America
  • 7.3.1. By Type
  • 7.3.2. By End-user
  • 7.3.3. By Country
    • 7.3.3.1. Brazil
      • 7.3.3.1.1. Market Trends and Opportunities
      • 7.3.3.1.2. Growth Prospects
    • 7.3.3.2. Argentina
      • 7.3.3.2.1. Market Trends and Opportunities
      • 7.3.3.2.2. Growth Prospects
    • 7.3.3.3. Others
      • 7.3.3.3.1. Market Trends and Opportunities
      • 7.3.3.3.2. Growth Prospects
• 7.4. Europe
  • 7.4.1. By Type
  • 7.4.2. By End-user
  • 7.4.3. By Country
    • 7.4.3.1. Germany
      • 7.4.3.1.1. Market Trends and Opportunities
      • 7.4.3.1.2. Growth Prospects
    • 7.4.3.2. France
      • 7.4.3.2.1. Market Trends and Opportunities
      • 7.4.3.2.2. Growth Prospects
    • 7.4.3.3. United Kingdom
      • 7.4.3.3.1. Market Trends and Opportunities
      • 7.4.3.3.2. Growth Prospects
    • 7.4.3.4. Spain
      • 7.4.3.4.1. Market Trends and Opportunities
      • 7.4.3.4.2. Growth Prospects
    • 7.4.3.5. Others
      • 7.4.3.5.1. Market Trends and Opportunities
      • 7.4.3.5.2. Growth Prospects
• 7.5. Middle East and Africa
  • 7.5.1. By Type
  • 7.5.2. By End-user
  • 7.5.3. By Country
    • 7.5.3.1. Saudi Arabia
      • 7.5.3.1.1. Market Trends and Opportunities
      • 7.5.3.1.2. Growth Prospects
    • 7.5.3.2. UAE
      • 7.5.3.2.1. Market Trends and Opportunities
      • 7.5.3.2.2. Growth Prospects
    • 7.5.3.3. Israel
      • 7.5.3.3.1. Market Trends and Opportunities
      • 7.5.3.3.2. Growth Prospects
    • 7.5.3.4. Others
      • 7.5.3.4.1. Market Trends and Opportunities
      • 7.5.3.4.2. Growth Prospects
• 7.6. Asia Pacific
  • 7.6.1. By Type
  • 7.6.2. By End-user
  • 7.6.3. By Country
    • 7.6.3.1. China
      • 7.6.3.1.1. Market Trends and Opportunities
      • 7.6.3.1.2. Growth Prospects
    • 7.6.3.2. Japan
      • 7.6.3.2.1. Market Trends and Opportunities
      • 7.6.3.2.2. Growth Prospects
    • 7.6.3.3. India
      • 7.6.3.3.1. Market Trends and Opportunities
      • 7.6.3.3.2. Growth Prospects
    • 7.6.3.4. South Korea
      • 7.6.3.4.1. Market Trends and Opportunities
      • 7.6.3.4.2. Growth Prospects
    • 7.6.3.5. Indonesia
      • 7.6.3.5.1. Market Trends and Opportunities
      • 7.6.3.5.2. Growth Prospects
    • 7.6.3.6. Taiwan
      • 7.6.3.6.1. Market Trends and Opportunities
      • 7.6.3.6.2. Growth Prospects
    • 7.6.3.7. Others
      • 7.6.3.7.1. Market Trends and Opportunities
      • 7.6.3.7.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisition, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. Molex
• 9.2. Hirose (HRS)
• 9.3. Panasonic
• 9.4. Samtec
• 9.5. Omron Electronic Components
• 9.6. Kyocera
• 9.7. TE Connectivity
• 9.8. GCT (Global Connector Technology)
• 9.9. Avx Interconnect
• 9.10. Amphenol Icc
• 9.11. Wurth Elektronik