반도체 첨단 기판 시장 : 예측(2025-2030년)

The global semiconductor advanced substrate market is expected to grow at a CAGR of 8.65% during the forecast period between 2025 and 2030.

The printed circuit boards (PCBs) and semiconductor chips are connected by an advanced semiconductor substrate, which serves as a baseboard. It has great heat dissipation performance and is cost-effective, strong, lightweight, and energy-efficient. Additionally, it boosts PCB functionality and dimensional control, reduces overall PCB weight, and offers excellent dependability and exceptional electrical qualities. Because of this, it is now commonly employed to create miniaturized electrical goods with the newest features.

Market Trends:

• Growing demand for miniaturization in the semiconductor industry: The semiconductor advanced substrate market is being driven by the increasing trend of miniaturization, fueled by rapid technological advancements. These innovations have enabled the integration of multiple functionalities onto a single platform, catering to diverse applications. The expansion of computing, networking, communications, and consumer electronics has heightened the need for compact, reliable semiconductor devices. This, in turn, has increased the demand for materials used in producing high-performance semiconductor components.
• Additionally, portable electronic devices require smaller and thinner packaging solutions to save space and reduce costs. Enhancing electrical performance to minimize noise interference is particularly critical for highly integrated, high-speed applications in sectors like aerospace and consumer electronics.
• Rising adoption in IoT equipment manufacturing: The global surge in IoT adoption across consumer and industrial sectors is driving demand for specialized chipsets. Vendors are developing chipsets specifically designed for IoT applications, with key players including Altair, Huawei, Intel, Qualcomm, Samsung, and Sierra. As the number of IoT devices continues to grow, the demand for chips used in IoT development is expected to rise significantly. Alongside chip miniaturization, innovations aimed at reducing energy consumption will be a key focus for manufacturers, further propelling the growth of the semiconductor advanced substrate market.
• Regional market segmentation: The semiconductor advanced substrate market is segmented into the Americas, Europe, the Middle East and Africa, and Asia Pacific. Asia Pacific is expected to dominate the market during the forecast period, with Taiwan playing a significant role due to its large number of manufacturers and substantial investments in the semiconductor industry. Major producers such as ASE Group, Unimicron, and Kinsus are headquartered in Taiwan and operate at high production rates. Taiwan's IC industry boasts a comprehensive supply chain, spanning upstream design, downstream IDM, IC packaging, and testing, supported by a skilled workforce. The country is also advancing in 5G infrastructure development. For example, Chunghwa Telecom Co., Ltd. has announced plans to accelerate 5G base station deployment, aiming for 96% population coverage nationwide.

Some of the major players covered in this report include ASE Group, Fujitsu Limited, Ibiden Co. Ltd., Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd., TTM Technologies Inc., Unimicron Technology Corporation, among others.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

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Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The Semiconductor Advanced Substrate Market is analyzed into the following segments:

By Type

• Advanced IC Substrate
• FC BGA
• FC CSP
• Substrate-like-PCB
• Embedded Die

By Packaging Type

• System in Package(SiP)
• Quad Flat Package (QFP)
• Ball Grid Array (BG)
• Chip Scale Packaging( CSP)
• Others

By Application

• Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Others

By Geography

• Americas
• § US
• Europe, the Middle East, and Africa
• § Germany
• § Netherlands
• § Others
• Asia Pacific
• § China
• § Japan
• § Taiwan
• § South Korea
• § Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study

1.4. Market Segmentation

• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base and Forecast Years Timeline
• 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

• 2.1. Research Design
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Key Findings
• 3.2. Analyst View

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. The Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY TYPE

• 5.1. Introduction
• 5.2. Advanced IC Substrate
  • 5.2.1. FC BGA
  • 5.2.2. FC CSP
• 5.3. Substrate-like-PCB (SLP)
• 5.4. Embedded Die

6. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY PACKAGING TYPE

• 6.1. Introduction
• 6.2. System in Package (SiP)
• 6.3. Quad Flat Package (QFP)
• 6.4. Ball Grid Array (BG)
• 6.5. Chip Scale Packaging (CSP)
• 6.6. Others

7. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY APPLICATION

• 7.1. Introduction
• 7.2. Consumer Electronics
• 7.3. Automotive and Transportation
• 7.4. IT and Telecom
• 7.5. Others

8. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY GEOGRAPHY

• 8.1. Global Overview
• 8.2. Americas
  • 8.2.1. US
• 8.3. Europe, Middle East, and Africa
  • 8.3.1. Germany
  • 8.3.2. Netherlands
  • 8.3.3. Others
• 8.4. Asia-Pacific
  • 8.4.1. China
  • 8.4.2. Japan
  • 8.4.3. Taiwan
  • 8.4.4. South Korea
  • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 9.1. Major Players and Strategy Analysis
• 9.2. Market Share Analysis
• 9.3. Mergers, Acquisitions, Agreements, and Collaborations
• 9.4. Competitive Dashboard

10. COMPANY PROFILES

• 10.1. ASE Group
• 10.2. Fujitsu Limited
• 10.3. Ibiden Co. Ltd.
• 10.4. Kinsus Interconnect Technology Corp.
• 10.5. Korea Circuit Co. Ltd.
• 10.6. KYOCERA Corporation
• 10.7. LG Innotek Co. Ltd.
• 10.8. Nan Ya PCB Co. Ltd.
• 10.9. TTM Technologies Inc.
• 10.10. Unimicron Technology Corporation