전자기기용 접착제 시장 보고서 : 동향, 예측 및 경쟁 분석(-2035년)

Electronics Adhesive Market

The future of the global electronics adhesive market looks promising with opportunities in the printed circuit board and semiconductor packaging markets. The global electronics adhesive market is expected to reach an estimated $10.3 billion by 2035 from $6.2 billion in 2027 with a CAGR of 6.5% from 2027 to 2035. The major drivers for this market are the increasing demand for smaller & lightweight electronic devices, the rising use of adhesives in semiconductor and pcb assembly application, and the growing need for thermal management and heat-resistant adhesives solution.

• Lucintel forecasts that, within the product type category, thermally conductive adhesives is expected to witness higher growth over the forecast period due to the increasing heat dissipation in electronic devices.
• Within the application category, printed circuit board is expected to witness higher growth over the forecast period due to the rising demand for compact electronic circuit designs.
• In terms of regions, APAC will remain the largest region over the forecast period due to the strong electronics manufacturing and industrial expansion ecosystem.

Emerging Trends in Electronics Adhesive Market

Between 2025 and 2027, various trends will emerge in the electronics adhesives market, including focus on materials that facilitate miniaturization and thermal management, and reduce emission and energy consumption, as well as efforts to enhance repairability. Moreover, growing interest in electronics adhesives is observed in segments beyond the mobile electronics market, including electric vehicles and rural data centers, advanced electronic packages and wearable electronics.

• Sustainability: Continued emphasis on lowering VOC content in electronics manufacturing and achieving carbon neutrality in products (especially in the EU, starting from 2025) will pressurize suppliers to Henkel's 2030 goals. As a result, OEMs will evaluate suppliers based on Scope 3 emissions.
• Advanced Packaging: The industry will focus on adhesives with higher thermo-mechanical stability and electrical reliability to manage chip warpage.
• Thermal Management: As EVs and Data Centers become more electrified and integrated, there will be a greater need to manage and control temperature. This will create a demand for adhesives and other TIMs with higher thermal conductivity.
• Automation: Plants are focusing on end-to-end automation, with electronic components manufacturers setting targets of less than 10 seconds per cycle. Automation requires adhesives with a high level of process control. In the next 3-5 years, expectation is that customers will require adhesives that are engineered to work with automated dispensing systems.
• Regional Supply: In the next 2-3 years, there will be increased investment in semiconductor and battery manufacturing in the US, India and SE Asia. These investments are expected to create a more regional supply of adhesives and encourage local dual sourcing. There is a developing trend for customers to utilize multiple suppliers in various regions to improve supply chain resilience.

Adhesive manufacturers need to utilize application engineering to pair system level thinking to address customer needs in different geographies. This will help differentiate offerings from the competition.

Recent Developments in the Electronics Adhesive Market

Electronics Adhesives Market is projected to grow between 2025 to 2027, predominantly driven by semiconductors, advanced packaging, electric vehicles, and miniaturized electronics. Thermally conductive adhesives are expected to gain traction, especially in electronics manufacturing. Raw material regulations and the pace of new technology cycles in the electronics industry create a demand for a continuous supply of approved materials.

• Fab Investments: TSMC's investment in the US (up to $165 billion by March 2025) accelerates the need for package and interconnect materials, as well as other fab materials, in the region.
• Packaging Investments: Advanced packaging, as well as other technologies related to chip integration, creates a demand for adhesives in packaging and other applications. ASE's investment in advanced packaging (up to $7 billion by April 2025) creates a demand for adhesives in similar technologies.
• Localization of EV Supplies: Localizing the supply chain for EVs creates a similar demand for other materials used in the supply chain. LG and GM localizing the supply of EV batteries (30 GWh by January 2025) creates a demand for adhesives used in EV batteries, as well as other materials in the supply chain.
• Sustainable Formulation Shift: Henkel showcased new silicone and thermally conductive materials at Productional China (April 2025). The new materials feature lower volatile emissions and enhanced compliance with RoHS and other directives. Consequently, the materials facilitate easier and lower cost manufacturing process management.
• Government-Funded Semiconductor Initiatives: The CHIPS and Science Act of 2024 provided up to $6.6 billion to TSMC's Arizona facility, and similar initiatives will fund many other fabs. The localization of advanced semiconductor manufacturing will create opportunities for the localization of related supporting and enabling technologies and equipment.

U.S. banking primarily targeted Semiconductor and Battery manufacturing facilities in 2024. Consequently, adhesives and materials suppliers aligned to these facilities should enjoy healthy and growing customer bases. Packaging materials directly impact the number of good units (yield) manufactured and reliability of the final product. Specializing in a customer's adhesives need and jointly located engineering and manufacturing resources should provide a sustainable competitive edge.

Strategic Growth Opportunities in the Electronics Adhesive Market

Demand is increasing for tiny, temperature-controlled, electrically powered, and automated devices. Along with rising Semiconductor investment and more stringent environmental regulations, this will drive new business opportunities by the late 2020s. According to Lucintel, increasing demand will be for high performance specialty materials rather than generic bonding agents.

• Thermal Management: Artificial Intelligence (AI) data centers consist of hundreds to thousands of interconnected computer modules. TSMC has announced plans to spend $38-42 billion on future modules. Like the previous investment by Intel, advanced modules will require materials with high thermal and electrical energy management.
• Automotive: Electric vehicles (EVs) require high performance adhesives to assemble drives, inverters and other systems. Suppliers of specialty adhesives have the opportunity to secure new business with automakers.
• End-use Materials: The need for electronics manufacturing materials without solvents and halogens, and for materials that are recyclable, has been increasing. Beginning in June 2025, smartphones will be required to comply with the Eco-design rules of the European Union. Ultimately, the selection of a supplier will be determined by the provider's ability to disclose the chemistry and the lifecycle data of the material.
• Local Production: Simultaneously with the increase in fab and assembly plants of electronics and semiconductors, there will be an increased need for local service and support in formulation and dispensing of materials. The estimated $165 billion investment by TSMC in Arizona will attract other fabs. Supporting material companies who collocate their technical service teams with fabs and assembly plants will be rewarded with increased business.
• Dispensing: Miniaturized electronics packages increase the use of microelectronic and electromechanical systems. Dispensing and curing of adhesives for these packages require advanced process control. The investment by the electronics industry to further automate and integrate manufacturing processes will continue. Suppliers integrating adhesives and dispensing equipment will be rewarded with increased business.

Continued investments in automation and integration in the manufacturing of electronics and semiconductors will give an edge to suppliers of dispensing and adhesive systems. Long term contracts to supply these systems for the manufacture of electronics and semiconductors will be awarded to suppliers who demonstrate process and chemical knowhow, and who can defend their prices.

Electronics Adhesive Market Drivers and Challenges

Different trends including changes in technology and the economy as well as environmental concerns and regulations dictate the growth and development of the electronics adhesives market. The use of electronic devices, equipment and systems in various sectors is increasing due to innovations in manufacturing smaller and more efficient electronics. Rising consumer awareness and demands have led manufacturers to focus on the sustainability of their products and the supply chain. These factors increase costs and extend lead times. Lucintel's report analyses how trends in miniaturization, increasing electrification of vehicles and integration of electronics in various systems, and the rise of smart devices will impact the use of adhesives in various markets. In order to succeed, companies will need to ensure that their products fulfill regulatory requirements, are efficient and reliable.

The factors responsible for driving this market include:

• More Demanding Electronics: Smaller electronic components require adhesives with better electrical and thermal performance. In January 2025, the latest smart phones were made with even smaller, more complex, multilayer assemblies. The increasing use of adhesives in place of mechanical fasteners can help minimize component weight and improve resistance to environmental stress. Over the next five years, expected advances in miniaturized sensors, medical devices, and wearable electronics will create greater need for adhesives with rapid cure times and higher strength and stability. Adhesive suppliers that focus on performance and miniaturization will likely be successful in the market.
• Growing Use of Electric Vehicles: Besides traditional fastening and bonding of electric vehicle components, structural adhesives are used for reinforcing body panels and other components. The increasing demand for lighter weight vehicles and improved crash protection creates opportunities for adhesives in place of other fastening systems. Advances in battery systems and electronics in electric vehicles create opportunities for specialty adhesives with electrical and thermal conductivity and chemical barrier properties.
• Sustainability and Material Innovation: Various adhesive technologies are becoming available as sustainability becomes more important. Some of these adhesive technologies are solvent-free, bio-based, low emission, recyclable, and dependable. Producers of electronics in Europe have started to investigate ways to make their products more in line with the EU circular economy standards. In order to increase the circularity of a product, the producers must consider the design of the product to increase the ease of repair and the degree of material recovery. Furthermore, adhesives that accelerate the curing time of the adhesive and reduce the energy consumption of the machine are gaining more attention. In the next three to five years, sustainability will influence which products are bought and produced.
• Smart Manufacturing and Automation: Several trends in manufacturing have positively impacted the use of adhesives. These trends are increased use of automation, better consistency of adhesives, and reduced process time. The use of adhesives that allow faster cycle times and reduce energy consumption are expected to gain more popularity in the next three to five years. Furthermore, the adaptation of new machinery to improve factory automation and reduce waste is expected.
• Telecommunications and Data Infrastructure: Increasing reliance on cloud and data centers, as well as Artificial Intelligence (AI) and 5G technologies, has heightened demand for adhesives in various components of the telecom and data infrastructure. During the period under review, certain data center customers requested higher computing density systems that created more thermal loads. Adhesives enabled the integration of heat sinks in these systems and protected adjacent sensitive components. Within the foreseeable future, regulatory requirements and market demands would stimulate the adoption and provision of high integrity, low outgassing, and thermally conducting adhesive products for Artificial Intelligence and Edge Computing, as well as advanced telecommunications.

The challenges facing this market include:

• Volatility in Raw Material Costs: Adjustment in the costs of petrochemical feedstocks and logistical disruptions impact the prices of specialty chemicals used in the formulation of adhesives. As a result, adhesive manufacturers are forced to reprice their products or postpone the launch of new products. During the period under review, raw material price uncertainties hindered international chemical and raw material supply and negatively impacted manufacturing cost planning. Raw material price volatility is expected to continue in the near term. Therefore, adhesives manufacturers must have multiple raw material and supplier sources to enable regional and product line differentiation.
• Complex Regulation and Reliability Requirements: Starting in July 2025, many companies required extensive qualification of materials used in the manufacture of safety critical electronics. Qualification of materials typically takes a great deal of time and significantly adds to the cost of developing a new product. There is a general expectation that the products being designed will operate at higher temperatures and under greater stress. It is likely that manufacturers will need to invest significantly in their facilities and services to provide the testing necessary to validate the reliability of their products.
• Regulatory and Recycling Constraints: Complex regulations for cross-border transportation of waste, raw materials, and semi-finished goods. Constraints for the treatment, storage, and disposal of hazardous waste. Increasing legislative requirements for packaging and electronic waste. In August 2025, the EU extended its RoHS directive to restrict 10 more materials in electrical and electronic devices. Manufacturers are required to examine the materials used in their supplies. There are higher costs and potential losses in the market associated with a product's inability to comply with regulations.

The demand for electronic adhesives is increasing with the expansion of the electronics industry and the development of new adhesives to overcome the limitations of traditional materials. The reduction of product sizes and greater emphasis on environmental friendliness of products, e.g. low outgassing, elevated thermal conductivity, or better adhesion to various substrates. More stringent laws will also increase the cost of producing and/or modifying electronic products. Leading companies will emphasize local production, expand their compliance business, and provide application-related services. Future outlook for the industry is positive. Long-term success will depend on companies' abilities to manufacture innovative products that integrate advancements in miniaturization and other adhesive-related technology, and are environmentally friendly at competitive prices.

List of Electronics Adhesive Market Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies electronics adhesive market companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the electronics adhesive market companies profiled in this report include-

• Henkel AG
• 3M Company
• Arkema SA
• Hitachi Chemical
• H.B. Fuller
• Kyocera Chemical Corporation
• Parker Hannifin Corporation

Electronics Adhesive Market by Segment

The study includes a forecast for the global electronics adhesive market by product type, product form, polymer type, application, and region.

Electronics Adhesive Market by Product Type [Value ($M) from 2019 to 2035]:

• Thermally Conductive Adhesives
• Electrically Conductive Adhesives
• Others

Electronics Adhesive Market by Product Form [Value ($M) from 2019 to 2035]:

• Paste
• Liquid
• Film

Electronics Adhesive Market by Polymer Type [Value ($M) from 2019 to 2035]:

• Epoxy Based Electronics Adhesive
• Silicone Based Electronics Adhesive
• Acrylic Based Electronics Adhesive
• Polyurethane Based Electronics Adhesive
• Others

Electronics Adhesive Market by Application [Value ($M) from 2019 to 2035]:

• Printed Circuit Board
• Semiconductor Packaging

Electronics Adhesive Market by Region [Value ($M) from 2019 to 2035]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Electronics Adhesive Market

The electronics adhesive market is expected to be impacted by semiconductor localization and advanced packaging and by EV manufacturing, between 2022 and 2027. Regional production will continue to primarily define market potential. More recently, increases in capacity by semiconductor manufacturing companies and their suppliers, as well as technology and business alliances, and government-sponsored initiatives along the semiconductor supply chain, have gained pace.

• United States: With semiconductor localization, the US will gain a competitive advantage with the location of multiple TSMC fabs and a large packaging facility (funded by the CHIPS Act), and will attract R&D and production facilities of other semiconductor companies. Leading electronics adhesive companies (i.e. Henkel, 3M, and Dow) will also gain local production.
• China: With the continued focus on localization of the semiconductor and EV industries, further local production of adhesives (i.e. H.B. Fuller) will also gain local production. Similarly, the Chinese Government's 2025 Work Program will also further localize IC and EV production.
• Germany: Investment in manufacturing: In August 2023, Infineon announced a €5 billion investment to construct a semiconductor fabrication facility in Dresden, Germany, using 300mm wafers. There are ongoing efforts by suppliers in the packaging, automotive and adjacent industries to qualify materials in support of this project. Once operational, this fab will aid in meeting the growing market demand for power electronics.
• India: Semiconductor Inc.: With government support, Tata Electronics has approved a semiconductor fab (February 2024) in Dholera, Gujarat, worth ₹91,000 crore, and an electronics assembly and testing facility (February 2023) in Assam worth ₹27,000 crore. The fabs will create an Indian customer base for semiconductor packaging and assembly, as well as thermally conductive adhesives.
• Japan: In April 2025, Rapidus is expected to begin operations with a 2nm pilot line at the IIM-1 facility in Hokkaido, and proto types are expected by mass production in 2027. The program, funded by 900 billion Yen, will create a market for advanced packaging and interconnect materials.

Features of the Global Electronics Adhesive Market

• Market Size Estimates: electronics adhesive market size estimation in terms of value ($M).
• Trend and Forecast Analysis: Market trends (2019 to 2026) and forecast (2027 to 2035) by various segments and regions.
• Segmentation Analysis: electronics adhesive market size by various segments, such as by product type, product form, polymer type, application, and region in terms of value ($M).
• Regional Analysis: electronics adhesive market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
• Growth Opportunities: Analysis of growth opportunities in different product type, product form, polymer type, application, and regions for the electronics adhesive market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape of the electronics adhesive market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

If you are looking to expand your business in this or adjacent markets, then contact us. We have done hundreds of strategic consulting projects in market entry, opportunity screening, due diligence, supply chain analysis, M & A, and more.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the electronics adhesive market by product type (thermally conductive adhesives, electrically conductive adhesives, and others), product form (paste, liquid, and film), polymer type (epoxy based electronics adhesive, silicone based electronics adhesive, acrylic based electronics adhesive, polyurethane based electronics adhesive, and others), application (printed circuit board and semiconductor packaging), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Market Overview

• 2.1 Background and Classifications
• 2.2 Supply Chain

3. Market Trends & Forecast Analysis

• 3.1 Macroeconomic Trends and Forecasts
• 3.2 Industry Drivers and Challenges
• 3.3 PESTLE Analysis
• 3.4 Patent Analysis
• 3.5 Regulatory Environment

4. Global Electronics Adhesive Market by Product Type

• 4.1 Overview
• 4.2 Attractiveness Analysis by Product Type
• 4.3 Thermally Conductive Adhesives : Trends and Forecast (2019 to 2035)
• 4.4 Electrically Conductive Adhesives : Trends and Forecast (2019 to 2035)
• 4.5 Others : Trends and Forecast (2019 to 2035)

5. Global Electronics Adhesive Market by Product Form

• 5.1 Overview
• 5.2 Attractiveness Analysis by Product Form
• 5.3 Paste : Trends and Forecast (2019 to 2035)
• 5.4 Liquid : Trends and Forecast (2019 to 2035)
• 5.5 Film : Trends and Forecast (2019 to 2035)

6. Global Electronics Adhesive Market by Polymer Type

• 6.1 Overview
• 6.2 Attractiveness Analysis by Polymer Type
• 6.3 Epoxy Based Electronics Adhesive : Trends and Forecast (2019 to 2035)
• 6.4 Silicone Based Electronics Adhesive : Trends and Forecast (2019 to 2035)
• 6.5 Acrylic Based Electronics Adhesive : Trends and Forecast (2019 to 2035)
• 6.6 Polyurethane Based Electronics Adhesive : Trends and Forecast (2019 to 2035)
• 6.7 Others : Trends and Forecast (2019 to 2035)

7. Global Electronics Adhesive Market by Application

• 7.1 Overview
• 7.2 Attractiveness Analysis by Application
• 7.3 Printed Circuit Board : Trends and Forecast (2019 to 2035)
• 7.4 Semiconductor Packaging : Trends and Forecast (2019 to 2035)

8. Regional Analysis

• 8.1 Overview
• 8.2 Global Electronics Adhesive Market by Region

9. North American Electronics Adhesive Market

• 9.1 Overview
• 9.2 North American Electronics Adhesive Market by Product Type
• 9.3 North American Electronics Adhesive Market by Application
• 9.4 The United States Electronics Adhesive Market
• 9.5 Canadian Electronics Adhesive Market
• 9.6 Mexican Electronics Adhesive Market

10. European Electronics Adhesive Market

• 10.1 Overview
• 10.2 European Electronics Adhesive Market by Product Type
• 10.3 European Electronics Adhesive Market by Application
• 10.4 German Electronics Adhesive Market
• 10.5 French Electronics Adhesive Market
• 10.6 Italian Electronics Adhesive Market
• 10.7 Spanish Electronics Adhesive Market
• 10.8 The United Kingdom Electronics Adhesive Market

11. APAC Electronics Adhesive Market

• 11.1 Overview
• 11.2 APAC Electronics Adhesive Market by Product Type
• 11.3 APAC Electronics Adhesive Market by Application
• 11.4 Chinese Electronics Adhesive Market
• 11.5 Indian Electronics Adhesive Market
• 11.6 Japanese Electronics Adhesive Market
• 11.7 South Korean Electronics Adhesive Market
• 11.8 Indonesian Electronics Adhesive Market

12. ROW Electronics Adhesive Market

• 12.1 Overview
• 12.2 ROW Electronics Adhesive Market by Product Type
• 12.3 ROW Electronics Adhesive Market by Application
• 12.4 Middle Eastern Electronics Adhesive Market
• 12.5 South American Electronics Adhesive Market
• 12.6 African Electronics Adhesive Market

13. Competitor Analysis

• 13.1 Product Portfolio Analysis
• 13.2 Operational Integration
• 13.3 Porter's Five Forces Analysis
  • Competitive Rivalry
  • Bargaining Power of Buyers
  • Bargaining Power of Suppliers
  • Threat of Substitutes
  • Threat of New Entrants
• 13.4 Market Share Analysis

14. Opportunities & Strategic Analysis

• 14.1 Value Chain Analysis
• 14.2 Growth Opportunity Analysis
  • 14.2.1 Growth Opportunity by Product Type
  • 14.2.2 Growth Opportunity by Product Form
  • 14.2.3 Growth Opportunity by Polymer Type
  • 14.2.4 Growth Opportunity by Application
  • 14.2.5 Growth Opportunity by Region
• 14.3 Emerging Trends in the Global Electronics Adhesive Market
• 14.4 Strategic Analysis
  • 14.4.1 New Product Development
  • 14.4.2 Certification and Licensing
  • 14.4.3 Mergers, Acquisitions, Agreements, Collaborations, and Joint Ventures

15. Company Profiles of the Leading Players Across the Value Chain

• 15.1 Competitive Analysis Overview
• 15.2 Henkel AG
  • Company Overview
  • Electronics Adhesive Market Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 15.3 3M Company
  • Company Overview
  • Electronics Adhesive Market Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 15.4 Arkema SA
  • Company Overview
  • Electronics Adhesive Market Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 15.5 Hitachi Chemical
  • Company Overview
  • Electronics Adhesive Market Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 15.6 H.B Fuller
  • Company Overview
  • Electronics Adhesive Market Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 15.7 Kyocera Chemical Corporation
  • Company Overview
  • Electronics Adhesive Market Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing
• 15.8 Parker Hannifin Corporation
  • Company Overview
  • Electronics Adhesive Market Business Overview
  • New Product Development
  • Merger, Acquisition, and Collaboration
  • Certification and Licensing

16. Appendix

• 16.1 List of Figures
• 16.2 List of Tables
• 16.3 Research Methodology
• 16.4 Disclaimer
• 16.5 Copyright
• 16.6 Abbreviations and Technical Units
• 16.7 About Us
• 16.8 Contact Us