세계의 데이터센터용 CDU 시장 : 유형별, 냉각 유형별, 최종사용자별, 지역별, 예측(-2032년)

The global data center coolant distribution units market is projected to grow from USD 1.05 billion in 2025 to USD 7.74 billion by 2032, at a CAGR of 33.0% during the forecast period.

Coolant distribution units act as an important component in liquid cooling systems, connecting the facility-level cooling infrastructure with the IT equipment to efficiently remove heat at the source. They support the delivery of precision cooling, higher rack densities, and optimized energy use. This makes them a preferred solution in next-generation data centers. Consequently, this fuels the rapid growth of the global coolant distribution units market in hyperscale, colocation, enterprise, and edge facilities.

"FDU segment to register highest CAGR during forecast period"

The Floor-Mounted Distribution Unit (FDU) segment is expected to grow at the fastest CAGR during the forecast period due to increasing deployments of high-density racks in hyperscale and enterprise data centers. FDUs offer high cooling capacity, scalability, and the ability to support large IT loads, making them ideal for facilities that perform AI, HPC, and cloud-intensive workloads. They are designed to connect closely with facility-level chilled water systems, which makes them well-suited for precise and reliable heat removal. Large investments in data centers across North America, Europe, and Asia-Pacific, combined with a shift toward energy-efficient and sustainable cooling solutions, have driven the adoption of FDUs.

"Direct to Chip Cooling segment to record highest CAGR during forecast period"

The Direct to Chip Cooling segment is projected to grow at the highest CAGR during the forecast period, driven by its ability to remove heat directly from high-performance processors and GPUs used in AI workloads, HPC, and advanced cloud computing setups. The efficiency of direct to chip cooling solutions surpasses traditional air cooling for thermal management at the source, supporting higher-density racks and overall system performance. The growth of this segment is largely due to the rise of AI-powered data centers, large-scale HPC deployments, and digital transformation initiatives by enterprises. Regions such as North America, Europe, and Asia-Pacific are further boosting adoption, with hyperscale and colocation providers investing heavily in liquid-cooling infrastructure. Direct to chip cooling technologies align with global sustainability and energy-efficiency goals. Besides reducing power consumption, DTC cooling improves operational reliability, making it one of the most in-demand cooling technologies in next-generation data centers.

Hyperscale data centers to record highest CAGR during forecast period"

The Hyperscale Data Center segment is expected to grow at the highest CAGR during the forecast period, driven by rapid expansion in AI, HPC, big data applications, and significant investments from global cloud providers. Traditional air-cooling methods are proving inadequate as hyperscale data centers operate with high rack densities and power demands. Therefore, hyperscale operators are adopting more coolant distribution units to enable efficient liquid cooling, optimize energy use, and ensure reliable heat management for thousands of servers. Regions such as North America, Europe, and Asia-Pacific are leading the way in adoption, as operators aim to scale up while meeting sustainability goals. Coolant distribution units are becoming a crucial technology for next-generation hyperscale data centers, effectively supporting improved thermal efficiency and lowering operating costs.

"North America to account for maximum market share during forecast period"

North America is expected to hold the largest share of the data center coolant distribution units market during the forecast period, primarily due to the well-established ecosystem of hyperscale, colocation, and enterprise data centers. The US is one of the top countries for cloud adoption and AI-driven infrastructure and hosts some of the major liquid-cooling companies, such as Google, Microsoft, Amazon, and Meta, which heavily invest in developing and adopting liquid-cooling technologies for applications requiring higher rack densities and energy efficiency. Additionally, the strong regulatory focus on sustainability and carbon reduction, along with the availability of advanced cooling technologies and robust infrastructure, further strengthen North America's position in this market. Favorable investment trends, rapid digitalization of sectors, and early adoption of next-generation liquid-cooling technology ensure that North America will continue to dominate the data center coolant distribution units market throughout the forecast period.

Profile break-up of primary participants for the report:

• By Company Type: Tier 1 - 40%, Tier 2 - 35%, and Tier 3 - 25%
• By Designation: C-level- 30%, Director Level- 40%, and Others - 30%
• By Region: North America - 25%, Europe - 30%, Asia Pacific - 35%, South America - 5%, and Middle East & Africa - 5%

Schneider Electric (France), Vertiv Group Corp. (US), Delta Electronics, Inc. (Taiwan), nVent (US), and DCX Liquid Cooling Systems (Poland) are some of the major players in the data center coolant distribution units market. These companies have adopted strategies such as product launches, acquisitions, collaborations, and expansion to grow their market share and revenue.

Research Coverage

The report defines, segments, and estimates the size of the data center coolant distribution units market based on type, cooling type, end user, and region. It strategically profiles key players and thoroughly analyzes their market share and core competencies. It also monitors and examines competitive developments, such as new product development, collaborations, partnerships, acquisitions, and expansions that they undertake in the market.

Reasons to Buy the Report

The report is intended to help both market leaders and new entrants by providing close estimates of revenue figures for the data center coolant distribution units and their segments. It aims to assist stakeholders in understanding the market's competitive landscape, gaining insights to strengthen their business positions, and developing effective go-to-market strategies. Additionally, it enables stakeholders to understand market trends and provides information on key drivers, restraints, challenges, and opportunities.

The report provides insights into the following points:

• Analysis of critical drivers (Growth of high-density AI & HPC workloads), restraints (High capital investments), opportunities (AI-based cooling control and predictive optimization), and challenges (precision control and flow management complexity) influencing the growth of the data center coolant distribution units.
• Product Development/Innovation: Detailed insights into upcoming technologies, research & development activities in the data center coolant distribution units.
• Market Development: Comprehensive information about lucrative markets - the report analyzes the data center coolant distribution units across varied regions.
• Market Diversification: Exhaustive information about new products, various types, untapped geographies, recent developments, and investments in the data center coolant distribution units.
• Competitive Assessment: Comprehensive analysis of market shares, growth strategies, and product offerings of leading companies such as DCX Liquid Cooling Systems (Poland), nVent (US), NIDEC CORPORATION (Japan), Schneider Electric (France), Vertiv Group Corp (US), KAORI HEAT TREATMENT CO., LTD. (Taiwan), Shenzhen Envicool Technology Co., Ltd. (China), Boyd (US), Delta Electronics Inc. (Taiwan), Coolcentric (US), Hewlett Packard Enterprise Development LP (US), LiquidStack Holding B.V. (US), Shanghai Venttech Refrigeration Equipment Co., Ltd. (China), Chilldyne Inc. (US), COOLIT SYSTEMS (Canada), Trane (Ireland), Munters Group AB (Sweden), Lenovo (China), Super Micro Computer Inc. (US), STULZ GMBH (Germany), Rittal GmbH & Co. KG (Germany), LITE-ON Technology Corporation (Taiwan), FlaktGroup (Germany), and Nautilus Data Technologies (US) in the data center coolant distribution units.

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS & EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
  • 1.3.4 CURRENCY CONSIDERED
• 1.4 LIMITATIONS
• 1.5 STAKEHOLDERS

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • 2.1.1 SECONDARY DATA
    • 2.1.1.1 Key data from secondary sources
  • 2.1.2 PRIMARY DATA
    • 2.1.2.1 Key data from primary sources
    • 2.1.2.2 Breakdown of interviews with experts
• 2.2 MATRIX CONSIDERED FOR DEMAND-SIDE ANALYSIS
• 2.3 MARKET SIZE ESTIMATION
  • 2.3.1 BOTTOM-UP APPROACH
  • 2.3.2 TOP-DOWN APPROACH
• 2.4 CALCULATION FOR SUPPLY-SIDE ANALYSIS
• 2.5 GROWTH FORECAST
• 2.6 DATA TRIANGULATION
• 2.7 RESEARCH ASSUMPTIONS
• 2.8 RESEARCH LIMITATIONS
• 2.9 RISK ASSESSMENT

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES IN DATA CENTER COOLANT DISTRIBUTION UNITS MARKET
• 4.2 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY COOLING TYPE
• 4.3 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY END USE
• 4.4 NORTH AMERICA: DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY TECHNOLOGY AND COUNTRY
• 4.5 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY KEY COUNTRY

5 MARKET OVERVIEW

• 5.1 MARKET DYNAMICS
  • 5.1.1 DRIVERS
    • 5.1.1.1 Growth of high-density AI & HPC workloads
    • 5.1.1.2 Demand for modular and edge data centers
    • 5.1.1.3 Sustainability and energy efficiency mandates
  • 5.1.2 RESTRAINTS
    • 5.1.2.1 High capital investment
    • 5.1.2.2 Incompatibility with legacy data center infrastructure
  • 5.1.3 OPPORTUNITIES
    • 5.1.3.1 Integration with waste heat recovery systems
    • 5.1.3.2 Innovation in nanofluids and next-generation coolants
    • 5.1.3.3 AI-based cooling control and predictive optimization
  • 5.1.4 CHALLENGES
    • 5.1.4.1 Precision control and flow management complexity
    • 5.1.4.2 Integration with diverse cooling architectures

6 INDUSTRY TRENDS

• 6.1 PORTER'S FIVE FORCES ANALYSIS
  • 6.1.1 THREAT OF NEW ENTRANTS
  • 6.1.2 THREAT OF SUBSTITUTES
  • 6.1.3 BARGAINING POWER OF BUYERS
  • 6.1.4 BARGAINING POWER OF SUPPLIERS
  • 6.1.5 INTENSITY OF COMPETITIVE RIVALRY
• 6.2 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 6.2.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 6.2.2 BUYING CRITERIA
• 6.3 VALUE CHAIN ANALYSIS
  • 6.3.1 RAW MATERIAL SUPPLIERS
  • 6.3.2 COMPONENT MANUFACTURERS
  • 6.3.3 SYSTEM ASSEMBLERS/COOLANT DISTRIBUTION UNITS MANUFACTURERS
  • 6.3.4 OEMS/SYSTEM INTEGRATORS
  • 6.3.5 END USE
• 6.4 ECOSYSTEM ANALYSIS
• 6.5 TECHNOLOGY ANALYSIS
  • 6.5.1 KEY TECHNOLOGY
    • 6.5.1.1 Direct-to-Chip Liquid Cooling (D2C)
    • 6.5.1.2 Two-Phase Liquid Cooling
  • 6.5.2 ADJACENT TECHNOLOGY
    • 6.5.2.1 Immersion Cooling Systems
    • 6.5.2.2 Rear Door Heat Exchangers (RDHx)
  • 6.5.3 COMPLEMENTARY TECHNOLOGY
    • 6.5.3.1 Advanced Thermal Interface Materials
    • 6.5.3.2 Thermal Interface Materials (TIMs)
• 6.6 CASE STUDY ANALYSIS
  • 6.6.1 IMPACT OF COOLANT DISTRIBUTION DESIGN ON SERVER-LEVEL THERMAL MANAGEMENT IN DATA CENTERS
    • 6.6.1.1 Objective
    • 6.6.1.2 Solution Statement
  • 6.6.2 COMMISSIONING OF LIQUID-TO-AIR COOLANT DISTRIBUTION UNITS FOR DIRECT-TO-CHIP DATA CENTER COOLING
    • 6.6.2.1 Objective
    • 6.6.2.2 Solution Statement
• 6.7 PATENT ANALYSIS
  • 6.7.1 METHODOLOGY
• 6.8 PRICING ANALYSIS
  • 6.8.1 AVERAGE SELLING PRICE TREND OF DATA CENTER IMMERSION COOLING FLUIDS, BY REGION, 2024
  • 6.8.2 AVERAGE SELLING PRICE TREND OF DATA CENTER COOLANT DISTRIBUTION UNITS, BY KEY PLAYER, 2024
  • 6.8.3 AVERAGE SELLING PRICE TREND OF DATA CENTER COOLANT DISTRIBUTION UNITS, BY TYPE, 2024
• 6.9 REGULATORY LANDSCAPE
  • 6.9.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
• 6.10 KEY CONFERENCES & EVENTS IN 2025
• 6.11 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 6.12 GLOBAL MACROECONOMIC OUTLOOK
  • 6.12.1 GDP
• 6.13 INVESTMENT AND FUNDING SCENARIO
• 6.14 IMPACT OF 2025 US TARIFF
  • 6.14.1 INTRODUCTION
• 6.15 KEY TARIFF RATES
• 6.16 PRICE IMPACT ANALYSIS
• 6.17 IMPACT ON COUNTRY/REGION
  • 6.17.1 US
  • 6.17.2 EUROPE
  • 6.17.3 ASIA PACIFIC
• 6.18 IMPACT ON END-USE INDUSTRIES
• 6.19 IMPACT OF AI/GEN AI
  • 6.19.1 INTRODUCTION
  • 6.19.2 SURGE IN THERMAL LOAD FROM AI INFRASTRUCTURE
  • 6.19.3 AI-ENHANCED COOLANT DISTRIBUTION UNITS INTELLIGENCE AND CONTROL
  • 6.19.4 PREDICTIVE MAINTENANCE AND FAULT DETECTION
  • 6.19.5 GENERATIVE AI IN COOLANT DISTRIBUTION UNITS DESIGN AND SIMULATION
  • 6.19.6 DCIM INTEGRATION AND SMART COOLING ORCHESTRATION
  • 6.19.7 COOLANT DISTRIBUTION UNITS MARKET OPPORTUNITY ALIGNED WITH AI DEMAND

7 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY TYPE

• 7.1 INTRODUCTION
• 7.2 IN-ROW COOLANT DISTRIBUTION UNITS
  • 7.2.1 SPACE-SAVING COOLING SOLUTION WITH TARGETED EFFICIENCY TO SUPPORT HIGH-DENSITY DATA CENTER GROWTH
• 7.3 IN-RACK COOLANT DISTRIBUTION UNITS
  • 7.3.1 RACK-INTEGRATED COOLING FOR PRECISION FLOW CONTROL IN HIGH-DENSITY DATA CENTERS
• 7.4 FACILITY DISTRIBUTION UNITS
  • 7.4.1 HIGH-CAPACITY COOLING INFRASTRUCTURE FOR FACILITY-WIDE LIQUID-COOLED DATA CENTERS

8 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY COOLING TYPE

• 8.1 INTRODUCTION
• 8.2 DIRECT TO CHIP COOLING
  • 8.2.1 COMPACT COOLING ARCHITECTURE ACCELERATES INTEGRATION IN HIGH-DENSITY RACKS
• 8.3 IMMERSION COOLING
  • 8.3.1 IMMERSION COOLING ARCHITECTURE ACCELERATING DEPLOYMENT IN HIGH-DENSITY COMPUTE ENVIRONMENTS

9 DATA CENTER COOLANT DISTRIBUTION MARKET, BY END USE

• 9.1 INTRODUCTION
• 9.2 COLOCATION PROVIDERS
  • 9.2.1 ENABLING FLEXIBLE COOLING FOR MULTI-TENANT HIGH-DENSITY ENVIRONMENTS
• 9.3 ENTERPRISES
  • 9.3.1 HYBRID COOLING TRANSITIONS ACCELERATING ADOPTION
• 9.4 HYPERSCALE DATA CENTERS
  • 9.4.1 IMMERSION AND DIRECT-TO-CHIP ARCHITECTURES ACCELERATING DEMAND

10 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY PROCESS

• 10.1 INTRODUCTION
• 10.2 LIQUID-TO-LIQUID COOLANT DISTRIBUTION UNITS
  • 10.2.1 RISING ADOPTION OF IMMERSION AND DIRECT LIQUID COOLING TECHNOLOGIES
• 10.3 LIQUID-TO-AIR COOLANT DISTRIBUTION UNITS
  • 10.3.1 INCREASING NEED FOR FLEXIBLE AND MODULAR COOLING IN EDGE COMPUTING AND COLOCATION FACILITIES

11 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY CAPACITY

• 11.1 INTRODUCTION
• 11.2 SMALL-SCALE COOLANT DISTRIBUTION UNITS
  • 11.2.1 RISE OF EDGE COMPUTING AND IOT EXPANSION DRIVE MARKET
• 11.3 MEDIUM-SCALE COOLANT DISTRIBUTION UNITS
  • 11.3.1 RISING ADOPTION OF HYBRID IT AND CLOUD-FIRST STRATEGIES
• 11.4 LARGE-SCALE COOLANT DISTRIBUTION UNITS
  • 11.4.1 INCREASING DEMAND FOR AI PROCESSING, CLOUD EXPANSION, AND HPC WORKLOADS REQUIRING EXTREME COOLING CAPACITY

12 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY DATA CENTER TYPE

• 12.1 INTRODUCTION
• 12.2 SMALL & MID-SIZED DATA CENTERS
  • 12.2.1 INCREASING ADOPTION OF EDGE DATA CENTERS, CLOUD SERVICES BY SMES, AND RISING DEPLOYMENT OF MODULAR DATA CENTERS
• 12.3 LARGE DATA CENTERS
  • 12.3.1 GROWTH OF HYPERSCALE CLOUD PROVIDERS, AI-DRIVEN WORKLOADS, AND 5G NETWORK EXPANSIONS DRIVES THE MARKET GROWTH

13 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET, BY REGION

• 13.1 INTRODUCTION
• 13.2 NORTH AMERICA
  • 13.2.1 US
    • 13.2.1.1 AI infrastructure and sustainability mandates driving growth
  • 13.2.2 CANADA
    • 13.2.2.1 Sustainability policies and modern data center design to drive market
  • 13.2.3 MEXICO
    • 13.2.3.1 Rising infrastructure demands and policy initiatives propelling market
• 13.3 ASIA PACIFIC
  • 13.3.1 CHINA
    • 13.3.1.1 Policy pressure and infrastructure demands driving market
  • 13.3.2 SOUTH KOREA
    • 13.3.2.1 Digital infrastructure growth and green policies to propel market
  • 13.3.3 JAPAN
    • 13.3.3.1 Urban constraints and high-power server demand
  • 13.3.4 INDIA
    • 13.3.4.1 Power constraints and digital growth accelerating market
  • 13.3.5 MALAYSIA
    • 13.3.5.1 Digital economy growth and government initiatives
  • 13.3.6 SINGAPORE
    • 13.3.6.1 Strategic policy and land constraints accelerating coolant distribution unit adoption
  • 13.3.7 AUSTRALIA
    • 13.3.7.1 Overcoming energy and climate challenges to drive market
  • 13.3.8 REST OF ASIA PACIFIC
• 13.4 EUROPE
  • 13.4.1 GERMANY
    • 13.4.1.1 Strict regulations and high energy costs accelerate adoption
  • 13.4.2 UK
    • 13.4.2.1 Digital infrastructure growth and green policies to propel market
  • 13.4.3 FRANCE
    • 13.4.3.1 Thermal regulation policies and low-carbon infrastructure regulations driving market
  • 13.4.4 ITALY
    • 13.4.4.1 Smart energy policies and development of new data centers to drive market
  • 13.4.5 SPAIN
    • 13.4.5.1 Digital expansion and climate goals driving demand
  • 13.4.6 REST OF EUROPE
• 13.5 MIDDLE EAST & AFRICA
  • 13.5.1 GCC COUNTRIES
    • 13.5.1.1 Saudi Arabia
      • 13.5.1.1.1 Mega projects and digital transformation fueling growth
    • 13.5.1.2 Rest of GCC countries
  • 13.5.2 SOUTH AFRICA
    • 13.5.2.1 Data center expansions accelerating growth
  • 13.5.3 REST OF MIDDLE EAST & AFRICA
• 13.6 SOUTH AMERICA
  • 13.6.1 BRAZIL
    • 13.6.1.1 Data center growth and green innovation driving market
  • 13.6.2 REST OF SOUTH AMERICA

14 COMPETITIVE LANDSCAPE

• 14.1 INTRODUCTION
• 14.2 KEY PLAYER STRATEGIES/RIGHT TO WIN
• 14.3 REVENUE ANALYSIS
  • 14.3.1 REVENUE ANALYSIS OF KEY PLAYERS
• 14.4 MARKET SHARE ANALYSIS, 2024
  • 14.4.1 MARKET SHARE ANALYSIS
  • 14.4.2 RANKING OF KEY MARKET PLAYERS, 2024
• 14.5 BRAND/PRODUCT COMPARISON
• 14.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 14.6.1 STARS
  • 14.6.2 EMERGING LEADERS
  • 14.6.3 PERVASIVE PLAYERS
  • 14.6.4 PARTICIPANTS
  • 14.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024
    • 14.6.5.1 Company footprint
    • 14.6.5.2 Region footprint
    • 14.6.5.3 Type footprint
    • 14.6.5.4 Application footprint
    • 14.6.5.5 Process footprint
    • 14.6.5.6 Capacity footprint
    • 14.6.5.7 Data center type footprint
• 14.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024
  • 14.7.1 PROGRESSIVE COMPANIES
  • 14.7.2 RESPONSIVE COMPANIES
  • 14.7.3 DYNAMIC COMPANIES
  • 14.7.4 STARTING BLOCKS
  • 14.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024
    • 14.7.5.1 Detailed list of key startups/SMES
    • 14.7.5.2 Competitive benchmarking of key startups/SMEs
• 14.8 COMPETITIVE SCENARIO
  • 14.8.1 PRODUCT LAUNCHES
  • 14.8.2 DEALS
  • 14.8.3 EXPANSIONS
• 14.9 COMPANY VALUATION AND FINANCIAL METRICS

15 COMPANY PROFILES

• 15.1 MAJOR PLAYERS
  • 15.1.1 DCX LIQUID COOLING SYSTEMS
    • 15.1.1.1 Business overview
    • 15.1.1.2 Products offered
    • 15.1.1.3 MnM view
      • 15.1.1.3.1 Right to win
      • 15.1.1.3.2 Strategic choices
      • 15.1.1.3.3 Weaknesses and competitive threats
  • 15.1.2 NVENT
    • 15.1.2.1 Business overview
    • 15.1.2.2 Products offered
    • 15.1.2.3 Recent developments
      • 15.1.2.3.1 Product launches
      • 15.1.2.3.2 Deals
      • 15.1.2.3.3 Expansions
    • 15.1.2.4 MnM view
      • 15.1.2.4.1 Right to win
      • 15.1.2.4.2 Strategic choices
      • 15.1.2.4.3 Weaknesses and competitive threats
  • 15.1.3 SCHNEIDER ELECTRIC
    • 15.1.3.1 Business overview
    • 15.1.3.2 Products offered
    • 15.1.3.3 Recent developments
      • 15.1.3.3.1 Deals
      • 15.1.3.3.2 Expansions
    • 15.1.3.4 MnM view
      • 15.1.3.4.1 Key strengths
      • 15.1.3.4.2 Strategic choices
      • 15.1.3.4.3 Weaknesses and competitive threats
  • 15.1.4 VERTIV GROUP CORP.
    • 15.1.4.1 Business overview
    • 15.1.4.2 Products offered
    • 15.1.4.3 Recent developments
      • 15.1.4.3.1 Product launches
      • 15.1.4.3.2 Deals
    • 15.1.4.4 MnM view
      • 15.1.4.4.1 Key strengths
      • 15.1.4.4.2 Strategic choices
      • 15.1.4.4.3 Weaknesses and competitive threats
  • 15.1.5 DELTA ELECTRONICS, INC.
    • 15.1.5.1 Business overview
    • 15.1.5.2 Products offered
    • 15.1.5.3 MnM view
      • 15.1.5.3.1 Key strengths
      • 15.1.5.3.2 Strategic choices
      • 15.1.5.3.3 Weaknesses and competitive threats
  • 15.1.6 NIDEC CORPORATION
    • 15.1.6.1 Business overview
    • 15.1.6.2 Products offered
    • 15.1.6.3 Recent developments
  • 15.1.7 KAORI HEAT TREATMENT CO., LTD.
    • 15.1.7.1 Business overview
    • 15.1.7.2 Products offered
  • 15.1.8 SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
    • 15.1.8.1 Business overview
    • 15.1.8.2 Products offered
    • 15.1.8.3 Recent developments
      • 15.1.8.3.1 Deals
  • 15.1.9 BOYD.
    • 15.1.9.1 Business overview
    • 15.1.9.2 Products offered
    • 15.1.9.3 Recent developments
      • 15.1.9.3.1 Product launches
  • 15.1.10 COOLCENTRIC
    • 15.1.10.1 Business overview
    • 15.1.10.2 Products offered
  • 15.1.11 HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    • 15.1.11.1 Business overview
    • 15.1.11.2 Products offered
  • 15.1.12 LIQUIDSTACK HOLDING B.V.
    • 15.1.12.1 Business overview
    • 15.1.12.2 Products offered
    • 15.1.12.3 Recent developments
      • 15.1.12.3.1 Product launches
      • 15.1.12.3.2 Expansions
  • 15.1.13 SHANGHAI VENTTECH REFRIGERATION EQUIPMENT CO., LTD.
    • 15.1.13.1 Business overview
    • 15.1.13.2 Products offered
  • 15.1.14 CHILLDYNE, INC.
    • 15.1.14.1 Business overview
    • 15.1.14.2 Products offered
  • 15.1.15 COOLIT SYSTEMS.
    • 15.1.15.1 Business overview
    • 15.1.15.2 Products offered
    • 15.1.15.3 Recent developments
      • 15.1.15.3.1 Product launches
      • 15.1.15.3.2 Deals
      • 15.1.15.3.3 Expansions
  • 15.1.16 MUNTERS GROUP AB
    • 15.1.16.1 Business overview
    • 15.1.16.2 Products offered
    • 15.1.16.3 Recent developments
      • 15.1.16.3.1 Deals
  • 15.1.17 TRANE TECHNOLOGIES PLC
    • 15.1.17.1 Business overview
    • 15.1.17.2 Products offered
    • 15.1.17.3 Recent developments
      • 15.1.17.3.1 Product launches
  • 15.1.18 SUPER MICRO COMPUTER, INC
    • 15.1.18.1 Business overview
    • 15.1.18.2 Products offered
  • 15.1.19 LENOVO
    • 15.1.19.1 Business overview
    • 15.1.19.2 Products offered
    • 15.1.19.3 Recent developments
      • 15.1.19.3.1 Deals
  • 15.1.20 STULZ GMBH
    • 15.1.20.1 Business overview
    • 15.1.20.2 Products offered
    • 15.1.20.3 Recent developments
      • 15.1.20.3.1 Product launches
      • 15.1.20.3.2 Expansions
  • 15.1.21 RITTAL GMBH & CO. KG
    • 15.1.21.1 Business overview
    • 15.1.21.2 Products offered
    • 15.1.21.3 Recent developments
      • 15.1.21.3.1 Product launches
  • 15.1.22 LITE-ON TECHNOLOGY CORPORATION
    • 15.1.22.1 Business overview
    • 15.1.22.2 Products offered
    • 15.1.22.3 Recent developments
      • 15.1.22.3.1 Product launches
  • 15.1.23 FLAKTGROUP
    • 15.1.23.1 Business overview
    • 15.1.23.2 Products offered
    • 15.1.23.3 Recent developments
      • 15.1.23.3.1 Product launches
  • 15.1.24 NAUTILUS DATA TECHNOLOGIES
    • 15.1.24.1 Business overview
    • 15.1.24.2 Products offered
    • 15.1.24.3 Recent developments
      • 15.1.24.3.1 Product launches
• 15.2 OTHER PLAYERS
  • 15.2.1 NORTEK AIR SOLUTIONS, LLC.
  • 15.2.2 JETCOOL TECHNOLOGIES INC
  • 15.2.3 ENVIRONMENTAL AIR SYSTEMS
  • 15.2.4 LENNOX
  • 15.2.5 EXCOOL LTD.
  • 15.2.6 AIREDALE INTERNATIONAL AIR CONDITIONING LTD.
  • 15.2.7 ATTOM TECHNOLOGY
  • 15.2.8 LNEYA THERMO REFRIGERATION CO., LTD.
  • 15.2.9 CANATEC PTE LTD.

16 ADJACENT AND RELATED MARKETS

• 16.1 INTRODUCTION
• 16.2 LIMITATIONS
• 16.3 DATA CENTER COOLANT DISTRIBUTION UNITS MARKET INTERCONNECTED MARKET
• 16.4 DATA CENTER COOLING MARKET: GLOBAL FORECAST TO 2030
  • 16.4.1 MARKET DEFINITION
  • 16.4.2 MARKET OVERVIEW
    • 16.4.2.1 Solution
    • 16.4.2.2 Services
• 16.5 IMMERSION COOLING MARKET: GLOBAL FORECAST TO 2031
  • 16.5.1 MARKET DEFINITION
  • 16.5.2 MARKET OVERVIEW
    • 16.5.2.1 Single-phase immersion cooling
    • 16.5.2.2 Two-phase immersion cooling

17 APPENDIX

• 17.1 DISCUSSION GUIDE
• 17.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 17.3 CUSTOMIZATION OPTIONS
• 17.4 RELATED REPORTS
• 17.5 AUTHOR DETAILS